Form 20-F
UNITED STATES
SECURITIES AND EXCHANGE
COMMISSION
Washington, D.C. 20549
FORM 20-F
REGISTRATION STATEMENT PURSUANT
TO SECTION 12(b) OR (g)
OF THE SECURITIES EXCHANGE ACT
OF 1934
o
OR
ANNUAL REPORT PURSUANT TO
SECTION 13 OR 15(d)
OF THE SECURITIES EXCHANGE ACT
OF 1934
x
For the fiscal year ended
September 30, 2007
OR
TRANSITION REPORT PURSUANT TO
SECTION 13 OR 15(d)
OF THE SECURITIES EXCHANGE ACT
OF 1934
For the transition period from
to
.
o
OR
SHELL COMPANY REPORT PURSUANT TO
SECTION 13 OR 15(d)
OF THE SECURITIES EXCHANGE ACT
OF 1934
o
Date of event requiring this shell company report
.
Commission file
number: 1-15000
Infineon Technologies
AG
(Exact name of Registrant as
specified in its charter)
Federal Republic of
Germany
(Jurisdiction of incorporation or
organization)
Am Campeon 1-12,
D-85579 Neubiberg
Federal Republic of
Germany
(Address of principal executive
offices)
Securities registered or to be
registered pursuant to Section 12(b) of the Act:
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Name of each exchange
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Title of each class
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on which registered
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American Depositary Shares, each representing
one ordinary share, notional value 2.00 per share
Ordinary shares, notional value 2.00 per share*
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New York Stock Exchange
New York Stock Exchange
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* |
Listed, not for trading or quotation purposes, but only in
connection with the registration of American Depositary Shares
pursuant to the requirements of the Securities and Exchange
Commission
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Securities registered or to be registered pursuant to
Section 12(g) of the Act: None
Securities for which there is a reporting obligation pursuant to
Section 15(d) of the Act: None
Indicate the number of outstanding shares of each of the
issuers classes of capital or common stock as of the close
of the period covered by the annual report. 749,728,635 ordinary
shares, notional value 2.00 per share
Indicate by check mark if the registrant is a well-known
seasoned issuer, as defined in Rule 405 of the Securities
Act.
Yes
x
No
o
If this report is an annual or transition report, indicate by
check mark if the registrant is not required to file reports
pursuant to Section 13 or 15(d) of the Securities Exchange
Act of 1934.
Yes
o
No
x
Note Checking the box above will not relieve any
registrant required to file reports pursuant to Section 13
or 15(d) of the Securities Exchange Act of 1934 from their
obligations under those Sections.
Indicate by check mark whether the registrant (1) has filed
all reports required to be filed by Section 13 or 15(d) of
the Securities Exchange Act of 1934 during the preceding
12 months (or for such shorter period that the registrant
was required to file such reports), and (2) has been
subject to such filing requirements for the past 90 days.
Yes
x
No
o
Indicate by check mark whether the registrant is a large
accelerated filer, an accelerated filer, or a non-accelerated
filer. See definition of accelerated filer and large
accelerated filer in
Rule 12b-2
of the Exchange Act. (Check one):
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Large
accelerated filer
x
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Accelerated
filer
o
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Non-accelerated
filer
o
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Indicate by check mark which financial statement item the
registrant has elected to follow.
Item 17
o
Item 18
x
If this is an annual report, indicate by check mark whether the
registrant is a shell company (as defined in
Rule 12b-2
of the Exchange Act).
Yes
o
No
x
(APPLICABLE ONLY TO ISSUERS INVOLVED IN BANKRUPTCY PROCEEDINGS
DURING THE PAST FIVE YEARS)
Indicate by check mark whether the registrant has filed all
documents and reports required to be filed by Sections 12,
13 or 15(d) of the Securities Exchange Act of 1934 subsequent to
the distribution of securities under a plan confirmed by a court.
Yes
o
No
o
INFINEON
TECHNOLOGIES AG
ANNUAL REPORT ON
FORM 20-F
FOR THE FISCAL YEAR
ENDED
SEPTEMBER 30, 2007
CROSS
REFERENCES TO
FORM 20-F
i
PRESENTATION
OF FINANCIAL AND OTHER INFORMATION
Our consolidated financial statements are prepared in accordance
with accounting principles generally accepted in the United
States (U.S. GAAP). Our consolidated financial
statements are expressed in Euro. In this annual report,
references to Euro or are to Euro
and references to U.S. dollars or $
are to United States dollars. For convenience, this annual
report contains translations of Euro amounts into
U.S. dollars at the rate of 1.00 = $1.4219, the noon
buying rate of the Federal Reserve Bank of New York for Euro on
September 28, 2007. The noon buying rate for Euro on
December 6 ,
2007 was 1.00 =
$1.4638. Our fiscal year ends on September 30 of each year. References to
any fiscal year refer to the year ended September 30 of the
calendar year specified. In this annual report, references to:
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our company are to Infineon Technologies AG; and
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we, us or Infineon are to
Infineon Technologies AG and, unless the context otherwise
requires, to its subsidiaries including Qimonda, and its
predecessor, the former semiconductor group of Siemens
AG; and
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Qimonda are to Qimonda AG and its subsidiaries, and
its predecessor, the former memory products segment of Infineon.
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This annual report contains market data that has been prepared
or reported by Gartner Inc. and its unit Dataquest, Inc.
(together Gartner Dataquest), Frost &
Sullivan, IC Insights, Inc. (IC Insights), iSuppli
Corporation (iSuppli), IMS Research, Strategy
Analytics, Inc. (Strategy Analytics), and World
Semiconductor Trade Statistics (WSTS).
Amounts presented in tabular format may not add up due to
rounding.
Special terms used in the semiconductor industry are defined in
the glossary.
Forward-Looking
Statements
This annual report contains forward-looking statements.
Statements that are not historical facts, including statements
about our beliefs and expectations, are forward-looking
statements. These statements are based on current plans,
estimates and projections, and you should not place too much
reliance on them. Forward-looking statements speak only as of
the date they are made, and we undertake no obligation to update
any of them in light of new information or future events.
Forward-looking statements involve inherent risks and
uncertainties. We caution you that a number of important factors
could cause actual results or outcomes to differ materially from
those expressed in any forward-looking statement. These factors
include those identified under the heading Risk
Factors and elsewhere in this annual report.
Use of
Non-U.S.
GAAP Financial Measures
This document contains
non-U.S. GAAP
financial measures.
Non-U.S. GAAP
financial measures are measures of our historical or future
performance, financial position or cash flows that contain
adjustments that exclude or include amounts that are included or
excluded, as the case may be, from the most directly comparable
measure calculated and presented in accordance with
U.S. GAAP in our consolidated financial statements.
Earnings before interest and taxes (EBIT) is an
example of a
non-U.S. GAAP
financial measure. For descriptions of these
non-U.S. GAAP
financial measures and the adjustments made to the most directly
comparable U.S. GAAP financial measures to obtain them,
please refer to Operating and Financial Review.
Principal
Business Address
Our principal business address is Am Campeon 1-12, D-85579
Neubiberg, Federal Republic of Germany.
iii
SELECTED
CONSOLIDATED FINANCIAL DATA
You should read the following selected consolidated financial
data in conjunction with our consolidated financial statements,
the related notes and Operating and Financial
Review, all of which appear elsewhere in this annual
report.
We have derived the selected consolidated statement of
operations and cash flow data for the 2003 through 2007 fiscal
years and the selected consolidated balance sheet data at
September 30, 2003 through 2007 from our consolidated
financial statements, which have been prepared in accordance
with U.S. GAAP and audited by KPMG Deutsche
Treuhand-Gesellschaft Aktiengesellschaft
Wirtschaftsprüfungsgesellschaft, an independent registered
public accounting firm.
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For the years ended September
30,(1)
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2003
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2004
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2005
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2006
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2007
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2007(2)(3)
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(in millions, except per share data)
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Selected Consolidated Statement of Operations data
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Net sales
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6,152
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7,195
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6,759
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7,929
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7,682
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$
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10,923
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Cost of goods sold
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4,614
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4,670
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4,909
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5,854
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6,092
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8,662
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Gross profit
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1,538
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2,525
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1,850
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2,075
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1,590
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2,261
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Research and development expenses
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1,089
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1,219
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1,293
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1,249
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1,169
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1,662
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Selling, general and administrative expenses
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679
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718
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655
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751
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700
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995
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Restructuring
charges(4)
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29
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17
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78
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23
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45
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64
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Other operating expense, net
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85
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257
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92
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108
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46
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66
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Operating income (loss)
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(344
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314
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(268
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(56
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(370
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(526
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Interest expense, net
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(52
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(41
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(9
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(92
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(33
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(46
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Equity in earnings (losses) of associated companies, net
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18
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(14
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57
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78
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117
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166
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Gain (loss) on subsidiaries and associated company share
issuance,
net(5)
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(2
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2
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19
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Other non-operating income (expense), net
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21
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(64
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26
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(33
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13
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18
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Minority interests
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8
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18
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2
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(23
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19
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27
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Income (loss) before income taxes
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(351
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215
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(192
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(107
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(254
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(361
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Income tax (expense) benefit
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(84
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(154
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(120
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(161
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(79
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(112
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Loss before extraordinary loss
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(435
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61
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(312
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(268
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(333
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(473
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Extraodinary loss, net of tax
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(35
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(50
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Net income (loss)
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(435
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61
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(312
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(268
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(368
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$
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(523
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Basic and diluted earnings (loss) per share:
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Net (loss) income before extraordinary loss
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(0.60
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0.08
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(0.42
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(0.36
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(0.45
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$
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(0.64
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Net (loss) income
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(0.60
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0.08
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(0.42
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(0.36
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(0.49
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$
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(0.70
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Weighted average shares outstanding basic (millions)
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721
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735
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748
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748
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749
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749
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Weighted average shares outstanding diluted
(millions)
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721
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737
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748
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748
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749
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749
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Selected Consolidated Balance Sheet data
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Cash and cash equivalents
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969
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608
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1,148
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2,040
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1,819
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$
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2,586
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Marketable securities
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1,784
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1,938
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858
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615
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475
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675
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Working capital (deficit), excluding cash and cash equivalents
and marketable securities
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419
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(124
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)
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186
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(279
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)
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137
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196
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Total assets
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10,875
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10,864
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10,284
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11,185
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10,679
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15,184
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Short-term debt and current maturities
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149
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571
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99
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797
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336
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478
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Long-term debt, excluding current portion
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2,343
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1,427
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1,566
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1,208
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1,376
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1,957
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Shareholders equity
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5,666
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5,978
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5,629
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5,315
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4,914
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6,987
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Selected Consolidated Cash Flow
data(6)
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Net cash provided by operating activities
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731
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1,857
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1,090
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1,003
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1,207
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1,716
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Net cash used in investing activities
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(1,522
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)
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(1,809
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(289
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)
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(853
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)
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(867
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)
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(1,233
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)
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Depreciation and amortization expenses
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1,437
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|
1,320
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|
|
|
1,316
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|
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|
1,405
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|
|
|
1,276
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$
|
1,814
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Notes
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(1)
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Columns may not add up due to rounding.
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(2)
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Unaudited.
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(3)
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Converted from Euro into U.S. dollars at an exchange rate of
1 = $1.4219, which was the noon buying rate on
September 28, 2007.
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(4)
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These charges relate to the implementation of cost-reduction
programs.
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(5)
|
In 2003, ProMOS Technologies, Inc. (ProMOS)
initiated a share repurchase program. In 2004, Inotera Memories,
Inc. (Inotera) distributed employee bonuses in the
form of shares. As a result of these share issuances
(repurchases), our interest was diluted (increased), while our
proportional share of the shareholders equity of these
companies increased (decreased). In 2006 Inotera completed an
initial public offering on the Taiwanese Stock Exchange and a
public offering on the Luxembourg Stock Exchange. As a result of
these transactions, we recognized a non-operating gain of
72 million, which was partially offset by a
non-operating loss of 53 million resulting from the
dilution of our interest in Qimonda following its initial public
offering on the New York Stock Exchange.
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(6)
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Dividends received from associated companies, previously
reported as part of cash flows from investing activities in the
consolidated statements of cash flows, have been reclassified to
cash flows from operating activities.
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1
OPERATING
AND FINANCIAL REVIEW
This discussion and analysis of our consolidated financial
condition and results of operations should be read in
conjunction with our audited consolidated financial statements
and other financial information included elsewhere in this
annual report. Our audited consolidated financial statements
have been prepared on the basis of a number of assumptions more
fully explained in Note 1 (Description of Business and
Basis of Presentation) and Note 2 (Summary of Significant
Accounting Policies) to our audited consolidated financial
statements appearing elsewhere in this annual report.
Overview
of the 2007 Fiscal Year
In our 2007 fiscal year, which ended September 30, both the
global economy generally and the semiconductor market (other
than for memory products) were slightly stronger than in the
prior year. Nevertheless, our results of operations were
negatively affected by the strength of the Euro (primarily
against the U.S. dollar) and by continued pricing pressure,
particularly in our Qimonda segment.
The following were the key developments in our business during
the 2007 fiscal year:
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Despite unfavorable currency exchange rates and pricing
pressure, we were able to maintain net sales in our combined
logic segments at approximately the same level as in the 2006
fiscal year. In fact, our Automotive, Industrial &
Multimarket segment was able to significantly increase net sales
in the 2007 fiscal year despite wide pricing pressure.
Furthermore, during the 2007 fiscal year, our Communication
Solutions segment began to compensate for the decrease in
revenues in the wireless business that had resulted from the
insolvency of BenQs German subsidiary in the 2006 fiscal
year. This was achieved by increased shipments of complete
mobile phone platform solutions to other leading customers.
Overall, our net sales decreased by 3 percent, from
7,929 million in the 2006 fiscal year to
7,682 million in the 2007 fiscal year, primarily due
to a 29 percent decline in DRAM prices and the weakening of
the U.S. dollar against the Euro, which resulted in a
207 million decrease in net sales in our Qimonda
segment.
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EBIT in our Automotive, Industrial & Multimarket
segment further improved primarily due to an increase in net
sales. Also, in our Communication Solutions segment, EBIT
continued to improve despite a further decline in net sales, as
no significant charges were recognized and further cost
reduction measures were successfully implemented. The
unfavorable market conditions in our Qimonda segment and the
loss we incurred from further sales of our interest in Qimonda
negatively impacted our results of operations in the 2007 fiscal
year. Our net loss increased by 37 percent, from
268 million in the 2006 fiscal year to
368 million in the 2007 fiscal year. Earnings before
interest and taxes (EBIT) were negative 15 million in
the 2006 fiscal year and negative 256 million in the
2007 fiscal year.
|
|
|
|
Our cash flow from operations increased from
1,003 million in the 2006 fiscal year to
1,207 million in the 2007 fiscal year.
|
|
|
|
In October 2006, we announced our plan to focus our mobile
communication activities on business with recently acquired and
future customers following the insolvency of BenQs German
subsidiary. As a result, during the 2007 fiscal year we
successfully increased shipments of complete mobile phone
platform solutions to several leading customers, including LG
Electronics Inc., Seoul, Korea (LG), Panasonic
Mobile Communications Co. Ltd., Yokohama, Japan
(Panasonic) and ZTE Corporation, Shenzhen, China
(ZTE).
|
|
|
|
In addition, we announced that Nokia Oyj, Espoo, Finland
(Nokia), selected our single-chip solution
E-GOLDtmvoice
for selected future entry level mobile phones, that Ericsson
Mobile Platforms, a business unit of Ericsson AB,
Stockholm, Sweden, selected our RF transceiver
SMARTi®
3G for their U310 and U360 EDGE/HSDPA platforms and that we
signed an agreement with Motorola Inc., Schaumburg, Illinois,
USA, to develop a 3G RF transceiver.
|
|
|
|
In April 2007, we entered into a definitive agreement with Avago
Technologies, Ltd., San José, California, USA
(Avago) under which Avago acquired our Polymer
Optical Fiber (POF) business, based in Regensburg,
Germany.
|
2
|
|
|
|
|
During 2007, we announced two acquisitions to further strengthen
our activities in communication fields. In June 2007, we entered
into an agreement with Texas Instruments Inc. (TI)
to acquire its DSL Customer Premises Equipment (CPE)
business. The transaction closed in the fourth quarter of the
2007 fiscal year. In August 2007, we announced the planned
acquisition of the mobility products business of LSI Corporation
(LSI). The transaction closed in October 2007.
|
|
|
|
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|
In September 2007, we executed a combined capital markets
offering to further reduce our equity interest in Qimonda. One
part of the transaction was a secondary sale by us of
28.75 million Qimonda American Depositary Shares
(ADSs), reducing our interest in Qimonda to
77.5 percent. In addition, Infineon Technologies Investment
B.V., a wholly owned subsidiary of Infineon Technologies AG,
issued exchangeable subordinated notes supported by a share
lending agreement. The notes are exchangeable for Qimonda ADSs
during the exchange period through maturity on August 31,
2010. If all noteholders were to exercise their exchange rights,
we would deliver an aggregate of 20.5 million Qimonda ADSs
for the redemption of the exchangeable subordinated
notes equivalent to approximately 6 percent of
Qimondas share capital.
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|
|
|
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|
In August 2007, we and International Business Machines
Corporation, New York, USA (IBM) signed an agreement
in principle to divest our respective shares in ALTIS
Semiconductor S.N.C., Essonnes, France (ALTIS) via a
sale to Advanced Electronic Systems AG (AES). Under
the terms of the agreement in principle, AES will purchase the
equity, which includes the real estate and technology assets of
ALTIS, from us and IBM, and AES agreed to maintain the level of
industrial activity of ALTIS. Pursuant to the agreement, we will
enter into a two-year supply contract with ALTIS, and IBM and we
will license certain manufacturing process technologies to AES
for use by ALTIS. The agreement is subject to governmental and
regulatory approval and works council consultation.
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|
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|
We strengthened our research and development
(R&D) activities through a strategic
cooperation for the development of automotive electronics with
Hyundai Motor Company (Hyundai) and the expansion of
our R&D center in Singapore to better serve the growing
demand for products in the energy efficiency, communications and
security areas.
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|
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|
As part of our ongoing efforts to improve our production
processes and expand our production capabilities, we:
|
|
|
|
|
|
continued to invest in our first Asian-based front-end power
fabrication facility located in Kulim
Hi-Tech
Park, Malaysia. The maximum capacity will be approximately
100,000 wafer starts per month using 200-millimeter wafers. At
the end of the 2007 fiscal year aggregate capital expenditures
to date were 379 million and the production was
running at 30,000 wafer starts per month. The new facility
produces power and logic chips used in industrial and automotive
power applications;
|
|
|
|
qualified our 65-nanometer technology at several manufacturing
partners and began transfer of our 45-nanometer technology to
one of our manufacturing partners;
|
|
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|
extended our joint development agreements with IBM and its
development and manufacturing partners to the 32-nanometer
generation. This agreement builds on the success of earlier
joint development and manufacturing agreements at 65-nanometer
and 45-nanometer;
|
|
|
|
we signed a memorandum of understanding (MoU) with
Hindustan Semiconductor Manufacturing Corporation
(HSMC), a newly established semiconductor company,
whereby HSMC would license our leading-edge 130-nanometer CMOS
process technology. This MoU will help build a foundation for
the production of integrated circuits for mobile phones, ID
cards and automotives in India for the Indian market.
|
3
|
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|
We continued to invest heavily in research and development and
achieved a number of significant milestones and product
developments during the year:
|
Energy Efficiency
|
|
|
|
|
the presentation of the
HybridPACKtm
power module technology, using the IGBT (Insulated Gate Bipolar
Transistor) chip technology, which increases energy efficiency
of hybrid drives;
|
|
|
|
the introduction of
CIPOStm
(Control Integrated Power System) modules, a new family of
highly integrated intelligent power modules that contain nearly
all of the semiconductor components required to drive
electronically controlled variable-speed electric motors,
designed to enable energy-efficient operation of consumer
appliances such as washing machines and air conditioners,
offering efficiencies of up to 94 percent;
|
|
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|
the announcement of an 8-bit embedded flash microcontroller
product family, XC866Hot, that is qualified for high-temperature
applications of up to +140°C, diminishing cooling
requirements and thus reducing overall system cost in high
temperature applications such as motor controls for heating and
furnace systems, and electronic controls embedded inside motor
drives;
|
Security
|
|
|
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|
the selection of our 32-bit security chip card flash
microcontroller family as a winner of the 2006 Sesames Award in
the category of Best Hardware for the unique combination of
high-security and flash memory at the Cartes Trade Show in Paris;
|
|
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Infineon supplied secure memories and microcontrollers to
government ID projects worldwide such as E-Passports in USA,
Scandinavia and Hong Kong. By this, Infineon holds a leading
position in the Government ID market.
|
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the announcement of a new software suite version for the
management of computers using Trusted Platform Modules
(TPM) in enterprise environments, which builds a
comprehensive and Windows Vista ready secure solution compliant
with the Trusted Computing Groups (TCG) 1.2
specification;
|
Communications
|
|
|
|
|
the introduction of the
S-GOLD®radio,
a single-chip solution for EDGE mobile phones. The
S-GOLD®radio
significantly reduces system component count, the modem printed
circuit board area and the overall engineering bill-of-material;
|
|
|
|
the presentation of two new single-chip RF CMOS transceivers,
the
SMARTi®
PM+ and
SMARTi®
UE for EDGE and multi-mode 3G mobile phones, respectively;
|
|
|
|
the introduction of Amazon-SE, a new ADSL2+
system-on-a-chip
solution for DSL modems and routers that will help drive
broadband penetration in emerging markets.
|
Qimonda
Qimonda likewise achieved a number of significant milestones
during the 2007 fiscal year,
including:
|
|
|
|
|
the validation of Qimondas DDR3 Memory components and
modules on Intel reference platforms;
|
|
|
|
the announcement of an agreement with SanDisk Corporation
(SanDisk) to jointly develop and manufacture MCPs
(Multi-Chip Packages) utilizing SanDisks NAND flash and
controllers, and Qimondas low power mobile DRAM;
|
|
|
|
the sampling of ultra-low power 512 Mbit Mobile-RAM for
mobile applications. Qimonda uses a specifically designed
75-nanometer low-power trench technology platform that is the
basis for an entire Mobile DRAM product family in this node. The
new Mobile-RAM is available as DDR and SDR via bond option and
comes with two interfaces (x16/x32) and a single/dual sided pad
out to fit any component, MCP, or system in package
(SIP);
|
4
|
|
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|
|
the announcement of plans to build a new DRAM module
manufacturing facility in Johor, Malaysia. The overall
investment for this new DRAM module manufacturing facility,
including IT integration, infrastructure and equipment, is
expected to total up to 150 million over the next
five years;
|
|
|
|
the announcement of plans to build a new 300-millimeter
front-end manufacturing facility in Singapore. Depending on the
growth and development of the world semiconductor market,
Qimonda plans to invest approximately 2 billion in
the site over the next five years. With 20,000 square
meters of clean room space, the new fab is expected to add
60,000 wafer starts per month to Qimondas overall
front-end capacity when fully ramped.
|
We design, develop, manufacture and market a broad range of
semiconductors and complete system solutions used in a wide
variety of microelectronic applications, including computer
systems, telecommunications systems, consumer goods, automotive
products, industrial automation and control systems, and chip
card applications. Our products include standard commodity
components, full-custom devices, semi-custom devices, and
application-specific components for memory, analog, digital, and
mixed-signal applications. We have operations, investments, and
customers located mainly in Europe, Asia and North America.
Our business is organized into three principal operating
segments serving various markets in the semiconductor industry:
|
|
|
|
|
Our Automotive, Industrial & Multimarket segment
designs, develops, manufactures and markets semiconductors and
complete system solutions primarily for use in automotive,
industrial and security applications, and applications with
customer-specific product requirements.
|
|
|
|
Our Communication Solutions segment designs, develops,
manufactures and markets a wide range of ICs, other
semiconductors and complete system solutions for wireline and
wireless communication applications.
|
|
|
|
Our majority-owned subsidiary Qimonda designs memory
technologies and develops, manufactures, and markets a large
variety of memory products on a module, component and chip level.
|
We have two additional segments for reporting purposes, our
Other Operating Segments, which includes remaining activities
for certain product lines that have been disposed of, as well as
other business activities, and our Corporate and Eliminations
segment, which contains items not allocated to our operating
segments, such as certain corporate headquarters costs,
strategic investments, unabsorbed excess capacity and
restructuring costs.
The
Semiconductor Industry and Factors that Impact Our
Business
Our business and the semiconductor industry generally are highly
cyclical and are characterized by constant and rapid
technological change, rapid product obsolescence and price
erosion, evolving standards, short product life-cycles and wide
fluctuations in product supply and demand. Although these
factors affect all segments of our business, they are especially
pronounced for Qimonda, are increasingly true for our
Communication Solutions segment, and have the least impact on
our Automotive, Industrial & Multimarket segment.
Cyclicality
The industrys cyclicality results from a complex set of
factors, including, in particular, fluctuations in demand for
the end products that use semiconductors and fluctuations in the
manufacturing capacity available to produce semiconductors. This
cyclicality is especially pronounced in the memory portion of
the industry. Semiconductor manufacturing facilities (so-called
fabrication facilities, or fabs) can take several
years to plan, construct, and begin operations. Semiconductor
manufacturers have in the past made capital investments in plant
and equipment during periods of favorable market conditions, in
response to anticipated demand growth for semiconductors. If
more than one of these newly built fabs
5
comes on-line at about the same time, the supply of chips to the
market can be vastly increased. Without sustained growth in
demand, this cycle has typically led to manufacturing
over-capacity and oversupply of products, which in turn has led
to sharp drops in semiconductor prices. When prices drop,
manufacturers have in the past cut back on investing in new
fabs. As demand for chips grows over time, without additional
fabs coming on-line, prices tend to rise, leading to a new cycle
of investment. The semiconductor industry has generally been
slow to react to declines in demand, due to its
capital-intensive nature and the need to make commitments for
equipment purchases well in advance of planned expansion.
We and Qimonda attempt to mitigate the impact of cyclicality by
investing in manufacturing capacities throughout the cycle and
entering into alliances and foundry manufacturing arrangements
that provide flexibility in responding to changes in the cycle.
We believe that Qimonda, in particular, can improve its gross
margin by focusing on two key areas: the continuous improvement
of cost structure and productivity through the introduction of
advanced memory process technologies and the development and
marketing of a broader range of memory products, focusing
particularly on higher margin and less volatile applications
such as infrastructure, high-end graphics, consumer and mobile
applications.
Substantial
Capital and R&D Expenditures
Semiconductor manufacturing is very capital-intensive. The
manufacturing capacities that are essential to maintain a
competitive cost position require large capital investments. The
top 10 capital spenders in the industry, of which we rank number
9 according to IC Insights, account for more than
60 percent of the industrys projected 2007 capital
spending budgets. Manufacturing processes and product designs
are based on leading-edge technologies that require considerable
research and development expenditures. A high percentage of the
cost of operating a fab is fixed; therefore, increases or
decreases in capacity utilization can have a significant effect
on profitability.
Because pricing, for DRAM products in particular, is
market-driven and largely beyond our and Qimondas control,
a key factor for Qimonda in achieving and maintaining
profitability is to continually lower its
per-unit
costs by reducing total costs and by increasing unit production
output through productivity improvements.
To reduce total costs, we and Qimonda also aim to share the
costs of research and development and manufacturing facilities
with third parties, either by establishing alliances or through
the use of foundry facilities for manufacturing. We believe that
cooperation in alliances for R&D, as well as manufacturing
and foundry partnerships, provide us with a number of important
benefits, including the sharing of risks and costs, reductions
in our own capital requirements, acquisitions of technical
know-how, and access to additional production capacities.
Qimonda, for example, is developing future DRAM technologies
with feature sizes of 58-nanometer together with Nanya
Technology Corporation (Nanya). In addition, Qimonda
has established foundry relationships with partners in Asia,
including Semiconductor Manufacturing International Corporation,
Beijing, China (SMIC) and Winbond Electronics Corp.,
Taichung, Taiwan (Winbond), to increase its
manufacturing capacities, and therefore its potential revenues,
without investing in additional manufacturing assets. In our
logic business, our principal alliances are with IBM, Chartered
Semiconductor Manufacturing Ltd., Singapore (Chartered
Semiconductor) and Samsung Electronics Co. Ltd., Seoul,
Korea (Samsung) for CMOS development and
manufacturing at 65-nanometer and 45-nanometer process
technologies. In May 2007, we extended the joint development
agreements with IBM and its development and manufacturing
partners to include the 32-nanometer generation. Further, we
have established foundry relationships with United
Microelectronics Corporation, Taipei, Taiwan (UMC)
for 130-nanometer and 90-nanometer manufacturing.
We expect to continue to increase unit production output through
improvements in manufacturing, which is achieved by producing
chips with smaller structure sizes (more bits per chip) and by
producing more chips per silicon wafer (by using larger wafers).
For DRAM process technology, the majority of Qimondas
capacity is based on 90-nanometer structure sizes. In addition,
80- and 75-nanometer technologies are currently in
ramp-up at
Qimonda. Qimonda has extended its 300-millimeter capacity share
during the 2007 fiscal year with the continuous ramp-up of the
facilities of Inotera Memories Inc. Taoyuan, Taiwan
(Inotera), its joint venture with Nanya, and the
ramp-up of
foundry capacities at SMIC in Beijing, China, Winbond in
Taichung, Taiwan, and Qimondas own facility in Richmond,
Virginia, USA.
6
Qimonda plans to further extend the share of its memory
production on 300-millimeter wafers with the continuous
ramp-up of
the 300-millimeter line in Richmond. In addition, Qimonda has
announced plans to start the construction of a new
300-millimeter manufacturing facility in Singapore.
In our logic business, a substantial portion of our capacity is
based on 130-nanometer structure sizes. Our 130-nanometer logic
process technology, with up to eight layers of copper
metallization, is in full production at several manufacturing
sites, including our Dresden facility. Additional 130-nanometer
process options have been developed to fulfill the needs of
specialty applications. Also, our 90-nanometer logic technology
is in production. The 65-nanometer technology has been qualified
at several manufacturing sites, and the 45-nanometer technology
is already undergoing transfer to one of our manufacturing
partners.
Within our logic segments, about half of the fab capacity is
used for the manufacture of power semiconductors used in
automotive and industrial applications. We have manufacturing
sites in Regensburg, Germany, in Villach, Austria and are
currently
ramping-up
our new fab in Kulim, Malaysia. We continue to focus on
innovation for power semiconductors, introducing power copper
metallization and special processes to fabricate ever thinner
wafers to optimize electrical resistance.
With our planned additional investment in the Kulim power
manufacturing facility, we will increase our manufacturing
capacity mainly for automotive and industrial power products by
up to 100,000 wafer starts per month using 200-millimeter
wafers. At full capacity, this manufacturing facility is
expected to employ more than 1,500 people.
Technological
Development and Competition
Sales prices per unit are volatile and generally decline over
time due to technological developments and competitive pressure.
DRAM products, in particular, are to a large extent commodities.
Since most specifications are standardized, customers can switch
between suppliers on short notice. This leads to strong
competition within the market, especially for standard DRAM
products for PC applications, and causes manufacturers to pass
cost savings on to their customers in an effort to gain market
share. Logic products are generally not commodities, but rather
have a certain degree of application specification. Although
generally less volatile than those for commodity memory
products, unit sales prices for logic products typically decline
over time as technological developments occur.
We aim to offset the effects of declining unit sales prices on
total net sales by optimizing product mix, by increasing unit
sales volume and by continually reducing
per-unit
production costs. The growth in volume depends in part on
productivity improvements in manufacturing. By moving to
ever-smaller structure sizes, the number of functional elements
has historically doubled approximately every two years. In the
area of DRAM products, this trend, often referred to as
Moores Law, has led to an average growth rate of
bit-volumes of between 40 percent and 45 percent per
year and, assuming constant costs per square inch of silicon, to
an approximately 30 percent cost reduction per bit per year.
Seasonality
Our sales are affected by seasonal and cyclical influences, with
sales historically strongest in our fourth fiscal quarter and
weakest in our first fiscal quarter. These short cycles are
influenced by longer cycles that are a response to innovative
technical solutions from our customers that incorporate our
products. The short-term and mid-term cyclicality of our sales
reflects the supply and demand fluctuations for the products
that contain our semiconductors. If anticipated sales or
shipments do not occur when expected, expenses and inventory
levels in a given quarter can be disproportionately high, and
our results of operations for that quarter, and potentially for
future quarters, may be adversely affected.
Product
Development Cycles
For logic products, the cycle for test, evaluation and adoption
of our products by customers before the start of volume
production can range from several months to more than one year.
Due to this lengthy cycle, we may experience significant delays
from the time we incur expenses for research and development,
marketing efforts, and investments in inventory, to the time we
generate corresponding revenue, if any.
7
Development cycles affect memory products to a lesser extent due
to the higher degree of standardization for memory products.
Acquisition
and Divestiture Strategy
A key element of our business strategy is to seek to reduce the
time required to develop new technologies and products and bring
them to market, and to optimize our existing product offerings,
market coverage, engineering workforce, and technological
capabilities. We plan to continue to evaluate strategic
opportunities as they arise, including business combination
transactions, strategic relationships, capital investments, and
the purchase or sale of assets.
Intellectual
Property
Due to the high-technology nature of the semiconductor industry,
intellectual property (IP), meaning intangible
assets relating to proprietary technology, is of significant
importance. We do not record assets on our balance sheet for
self-developed IP. Only IP licensed from others or acquired
through a business acquisition is reflected on our balance
sheet, and reduced through amortization over its expected useful
life. The value of such acquired IP is often complex and
difficult to estimate. We also derive modest revenues from the
licensing of our IP, generally pursuant to cross licensing
arrangements.
Challenges
that Lie Ahead
Going forward, our success will remain highly dependent on our
ability to stay at the leading edge of technology development,
and to continue to optimize our product portfolio. We must
achieve both objectives to ensure that we have the flexibility
to react to fluctuations in market demand for different types of
semiconductor products. We believe that the ability to offer and
the flexibility to manufacture a broad portfolio of products
will be increasingly important to our long-term success in many
markets within the semiconductor industry. Establishing and
maintaining advantageous technology, development and
manufacturing alliances, including the use of third-party
foundries, and continuing our efforts to broaden our product
portfolio will make it easier for us to respond to changes in
market conditions and to improve our financial performance.
Semiconductor
Market Conditions in the 2007 Fiscal Year
The growth of the semiconductor market decelerated through the
first three quarters of the 2007 calendar year following growth
of 9 percent in the 2006 calendar year, according to WSTS.
In November 2007, WSTS predicted a growth rate of 4 percent
for the full 2007 calendar year. According to WSTS, sales in
North America are expected to decrease by 5 percent in the
2007 calendar year. The semiconductor market in Asia/Pacific
(excluding Japan) is expected to increase by 7 percent; the
Japanese market is expected to grow by 5 percent; and the
European market is expected to increase by 3 percent. Sales
of non-memory products (logic chips, analog, and discretes),
which accounted for 77 percent of the entire market in the
first nine months of the 2007 calendar year, are predicted to
grow by 4 percent compared with the 2006 calendar year.
Sales of memory products are predicted to grow by 2 percent
compared with the 2006 calendar year. Gartner Dataquest predicts
worldwide growth in the 2007 calendar year of 9 percent for
semiconductors in the automotive business. Sales of
semiconductors for industrial electronics are predicted to grow
by 4 percent, for communication (wireless and wireline) by
1 percent, for data processing by 4 percent and for
consumer electronics by 7 percent.
8
Results of
Operations as a Percentage of Net Sales
The following table presents the various line items in our
consolidated statements of operations expressed as percentages
of net sales.
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
For the years ended September
30,(1)
|
|
|
|
2005
|
|
|
2006
|
|
|
2007
|
|
|
Net sales
|
|
|
100.0
|
%
|
|
|
100.0
|
%
|
|
|
100.0
|
%
|
Cost of goods sold
|
|
|
(72.6
|
)
|
|
|
(73.8
|
)
|
|
|
(79.3
|
)
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Gross profit
|
|
|
27.4
|
|
|
|
26.2
|
|
|
|
20.7
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Research and development expenses
|
|
|
(19.1
|
)
|
|
|
(15.8
|
)
|
|
|
(15.2
|
)
|
Selling, general and administrative expenses
|
|
|
(9.7
|
)
|
|
|
(9.5
|
)
|
|
|
(9.1
|
)
|
Restructuring charges
|
|
|
(1.2
|
)
|
|
|
(0.3
|
)
|
|
|
(0.6
|
)
|
Other operating expense, net
|
|
|
(1.4
|
)
|
|
|
(1.4
|
)
|
|
|
(0.6
|
)
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Operating loss
|
|
|
(4.0
|
)
|
|
|
(0.8
|
)
|
|
|
(4.8
|
)
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Interest expense, net
|
|
|
(0.1
|
)
|
|
|
(1.2
|
)
|
|
|
(0.4
|
)
|
Equity in earnings of associated companies, net
|
|
|
0.9
|
|
|
|
1.0
|
|
|
|
1.5
|
|
Gain on subsidiaries and associated company share issuance, net
|
|
|
0.0
|
|
|
|
0.2
|
|
|
|
0.0
|
|
Other non-operating income (expense), net
|
|
|
0.4
|
|
|
|
(0.4
|
)
|
|
|
0.2
|
|
Minority interests
|
|
|
0.0
|
|
|
|
(0.3
|
)
|
|
|
0.2
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Loss before income taxes
|
|
|
(2.8
|
)
|
|
|
(1.5
|
)
|
|
|
(3.3
|
)
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Income tax expense
|
|
|
(1.8
|
)
|
|
|
(2.0
|
)
|
|
|
(1.0
|
)
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Loss before extraordinary loss
|
|
|
(4.6
|
)
|
|
|
(3.5
|
)
|
|
|
(4.3
|
)
|
Extraordinary loss, net of tax
|
|
|
0.0
|
|
|
|
0.0
|
|
|
|
(0.5
|
)
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Net loss
|
|
|
(4.6
|
)%
|
|
|
(3.5
|
)%
|
|
|
(4.8
|
)%
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
(1) |
Columns may not add up due to rounding.
|
Reorganization
Our current organizational structure became effective on
May 1, 2006, following the legal separation of our memory
products business into the stand-alone legal company Qimonda.
The results of prior periods have been reclassified to conform
to the current period presentation, as well as to facilitate
analysis of current and future operating segment information. As
a result of the reorganization, certain corporate overhead
expenses are no longer apportioned to Qimonda and are instead
allocated to Infineons logic segments.
We operate primarily in three major operating segments, two of
which are application focused: Automotive,
Industrial & Multimarket, and Communication Solutions;
and one of which is product focused: Qimonda. Further, certain
of our remaining activities for product lines sold, for which
there are no continuing contractual commitments subsequent to
the divestiture date, as well as new business activities also
meet the FASB Statement of Financial Accounting Standards
(SFAS) No. 131 Disclosure about
Segments of an Enterprise and Related Information
definition of an operating segment, but do not meet the
requirements of a reportable segment as specified in
SFAS No. 131. Accordingly, these segments are combined
and disclosed in the Other Operating Segments
category pursuant to SFAS No. 131.
Following the completion of the Qimonda carve-out, the Other
Operating Segments also include net sales and earnings that
Infineons 200-millimeter production facility in Dresden
records from the sale of wafers to Qimonda under foundry
agreements. The Corporate and Eliminations segment reflects the
elimination of these intra-group net sales and earnings.
Certain amounts in the prior years have been reclassified to
conform to the current year presentation. Dividends received
from associated companies, previously reported as part of cash
flows from investing
9
activities in the consolidated statements of cash flows, have
been reclassified to cash flows from operating activities. The
consolidated results of operations and overall cash flows have
not been affected by these reclassifications.
Net
Sales
We generate our revenues primarily from the sale of our
semiconductor products and systems solutions. Our semiconductor
products include two main categories of semiconductors:
|
|
|
|
|
Our logic products, which include a wide array of chips and
components used in electronic applications ranging from wireless
and wireline communication systems, chip cards, automotive
electronics and industrial applications.
|
|
|
|
Our memory products, such as DRAM products, which are used in
computers and other electronic devices.
|
We made the majority of our product sales in the 2007 fiscal
year through our direct sales force, with approximately
24 percent of net sales from our logic segments and
approximately 12 percent of Qimondas net sales
derived from sales made through distributors.
We derive our license revenue from royalties and license fees
earned on technology that we own and license to third parties.
This enables us to recover a portion of our research and
development expenses, and also often allows us to gain access to
manufacturing capacity at foundries through joint licensing and
capacity reservation arrangements.
Our net sales fluctuate in response to a mix of factors,
including the following:
|
|
|
|
|
The market prices for our products, particularly our memory
products;
|
|
|
|
Our overall product mix and sales volumes;
|
|
|
|
The stage of our products in their respective life
cycles; and
|
|
|
|
The effects of competition and competitive pricing strategies.
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
For the years ended September 30,
|
|
|
|
2005
|
|
|
2006
|
|
|
2007
|
|
|
|
( in millions, except percentages)
|
|
|
Net sales
|
|
|
6,759
|
|
|
|
7,929
|
|
|
|
7,682
|
|
Changes
year-on-year
|
|
|
|
|
|
|
17
|
%
|
|
|
(3
|
)%
|
Of which:
|
|
|
|
|
|
|
|
|
|
|
|
|
License income
|
|
|
175
|
|
|
|
29
|
|
|
|
28
|
|
% of net sales
|
|
|
3
|
%
|
|
|
0
|
%
|
|
|
0
|
%
|
Effect of foreign exchange over prior year
|
|
|
(177
|
)
|
|
|
142
|
|
|
|
(174
|
)
|
% of net sales
|
|
|
(3
|
)%
|
|
|
2
|
%
|
|
|
(2
|
)%
|
Impact of acquisitions over prior year
|
|
|
2
|
|
|
|
40
|
|
|
|
16
|
|
% of net sales
|
|
|
0
|
%
|
|
|
0
|
%
|
|
|
0
|
%
|
In the 2007 fiscal year, net sales decreased primarily as a
result of the continued revenue decrease in the wireless
business of the Communication Solutions segment and by the
decline of DRAM prices of 29 percent in the Qimonda
segment. These effects were not fully offset by volume growth,
particularly for automotive and industrial power applications.
In the 2006 fiscal year, net sales increased primarily as a
result of higher demand for memory products, especially for
graphics, mobile and consumer DRAM, as well as healthy growth in
the Automotive, Industrial & Multimarket segment,
particularly in the automotive and industrial power applications
businesses. The decrease in license income in the 2006 fiscal
year was mainly driven by the non-recurring license fees from
ProMOS recognized in the 2005 fiscal year. The strength of the
Euro (primarily against the U.S. dollar) during the 2007
fiscal year negatively impacted net sales, whereas net sales in
the 2006 fiscal year were positively impacted by the effect of
foreign exchange rates. The effect of foreign exchange over the
prior year is calculated as the estimated change in current year
sales if the average exchange rate for the preceding year is
applied as a constant rate in the current year. The increase in
net sales from entities we acquired since the beginning of the
prior year reflects
10
primarily the inclusion of a full-year consolidation of sales in
the year after the initial acquisition. Net sales for the 2007
fiscal year include the effect of the TI DSL Customer Premises
Equipment (CPE) acquisition starting August 1,
2007. The main effect in the 2006 fiscal year resulted from the
initial consolidation of ALTIS as of December 31, 2005.
Net Sales by
Segment
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
For the years ended September 30,
|
|
|
|
2005
|
|
|
2006
|
|
|
2007
|
|
|
|
( in millions, except percentages)
|
|
|
Automotive, Industrial & Multimarket
|
|
|
2,516
|
|
|
|
37
|
%
|
|
|
2,839
|
|
|
|
36
|
%
|
|
|
3,017
|
|
|
|
39
|
%
|
Communication
Solutions(1)
|
|
|
1,391
|
|
|
|
21
|
|
|
|
1,205
|
|
|
|
15
|
|
|
|
1,051
|
|
|
|
14
|
|
Other Operating
Segments(2)
|
|
|
285
|
|
|
|
4
|
|
|
|
310
|
|
|
|
4
|
|
|
|
219
|
|
|
|
3
|
|
Corporate and
Eliminations(3)
|
|
|
(258
|
)
|
|
|
(4
|
)
|
|
|
(240
|
)
|
|
|
(3
|
)
|
|
|
(213
|
)
|
|
|
(3
|
)
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Subtotal
|
|
|
3,934
|
|
|
|
58
|
|
|
|
4,114
|
|
|
|
52
|
|
|
|
4,074
|
|
|
|
53
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Qimonda
|
|
|
2,825
|
|
|
|
42
|
|
|
|
3,815
|
|
|
|
48
|
|
|
|
3,608
|
|
|
|
47
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Total
|
|
|
6,759
|
|
|
|
100
|
%
|
|
|
7,929
|
|
|
|
100
|
%
|
|
|
7,682
|
|
|
|
100
|
%
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
(1)
|
Includes inter-segment sales of 30 million for fiscal
year ended September 30, 2007, and none in the 2005 and
2006 fiscal years, from sales of wireless communication
applications to Qimonda.
|
|
(2)
|
Includes inter-segment sales of 273 million,
256 million and 189 million for fiscal
years ended September 30, 2005, 2006 and 2007,
respectively, from sales of wafers from Infineons
200-millimeter facility in Dresden to Qimonda under foundry
agreements.
|
|
(3)
|
Includes the elimination of inter-segment sales of
273 million, 256 million and
219 million for fiscal years ended September 30,
2005, 2006 and 2007, respectively.
|
|
|
|
|
|
Automotive, Industrial & Multimarket
In the 2006 fiscal year, the segment experienced
healthy growth as sales volumes increased, particularly for
automotive and industrial power applications, more than
offsetting ongoing pricing pressure caused by technological
developments and competition. We experienced strong pricing
pressure in the market for chipcard ICs throughout the 2006
fiscal year. Despite continued segment wide pricing pressure we
were able to increase net sales in the 2007 fiscal year. The
sales growth was mainly driven by continuing strong demand for
high power products in industrial applications, an increase of
sales for energy efficient devices in industrial and multimarket
applications and increasing demand for government ID
applications.
|
|
|
|
Communication Solutions In the 2006 fiscal
year, net sales in the Communication Solutions segment declined
year-on-year
due to a decrease in revenues in the wireless business mainly
due to a continued decline in demand for baseband products, as
well as ongoing pricing pressure. This decline was partly
compensated by a strong increase in revenues in the wireline
business. The decline in net sales in the 2007 fiscal year was
primarily caused by a continued decrease in revenues in the
wireless business mainly driven by the insolvency of BenQs
German subsidiary as well as ongoing pricing pressure that could
not be compensated by increased shipments of complete mobile
phone platform solutions to leading customers such as LG,
Panasonic, and ZTE. In addition, revenues in the wireline
business declined mainly due to the phase-out of our fiber
optics business during the 2006 fiscal year.
|
|
|
|
Qimonda Net sales in the 2006 fiscal year
increased compared to the previous year mainly due to increased
bit shipments and a favorable U.S. dollar/Euro exchange
rate. The higher bit shipments resulted from the
ramp-up of
Qimondas 300-millimeter manufacturing facility in
Richmond, the conversion of an increasing share of capacities to
90-nanometer technology, and access to additional capacities of
Qimondas joint venture partners and foundry partners, as
well as the overall demand growth in the DRAM market and
Qimondas successful diversification in new market
segments, particularly with graphic DRAM products. These
positive effects were partly offset by price declines in the
DRAM market. The majority of Qimondas memory products
sales reflected 512 Mbit DRAMs in the 2006 fiscal year. Net
sales in the 2007 fiscal year decreased by
207 million, or 5 percent, compared to the prior
year, primarily due to the 29 percent decline in DRAM
prices and the weakening in the U.S. dollar/Euro exchange
rate. Offsetting these effects in part were higher bit
|
11
|
|
|
|
|
shipments, which increased 44 percent. In the 2007 fiscal
year, considerable progress was made with Qimondas
diversification strategy by increasing the share of net sales of
infrastructures, graphics, mobile and consumer DRAMs, which
generally command higher and more stable prices than standard
DRAMs. The share of net sales from DRAMs for these products
increased to 60 percent in the 2007 fiscal year as compared
to 51 percent in the 2006 fiscal year.
|
The following graph shows the average monthly market prices for
DRAM (expressed in 512 Mbit equivalents), as reported by
WSTS, for the three years ended September 30, 2007.
DRAM Price
Development
The 2007 fiscal year was characterized by steep price declines
for DRAM products. After remaining stable until the end of
December 2006, prices declined significantly thereafter. We
believe that a part of this price decline, especially towards
the end of March 2007, was driven by seasonal demand weakness,
the effects of an earlier
build-up of
inventories at original equipment manufacturers
(OEMs) ahead of the introduction of the new Windows
Vista computer operating system, and capacity conversions from
NAND to DRAM by some competitors. During the three months ended
June 30, 2007, the price decline continued and was
amplified by strong DRAM output growth across the industry,
driven, we believe, mostly by capacity increases and technology
conversions to more efficient technologies. In the three months
ended September 30, 2007, prices initially showed signs of
improvement, but then resumed their decline and were ultimately
on average at the same low level as during the previous three
months.
|
|
|
|
|
Other Operating Segments Net sales in the
2005, 2006, and 2007 fiscal years were mainly inter-segment
sales of wafers from Infineons 200-millimeter facility in
Dresden to Qimonda under foundry agreements which are eliminated
in the Corporate and Eliminations segment.
|
12
Net Sales by
Region and Customer
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
For the years ended September 30,
|
|
|
|
2005
|
|
|
2006
|
|
|
2007
|
|
|
|
( in millions, except percentages)
|
|
|
Germany
|
|
|
1,354
|
|
|
|
20
|
%
|
|
|
1,327
|
|
|
|
17
|
%
|
|
|
1,164
|
|
|
|
15
|
%
|
Other Europe
|
|
|
1,210
|
|
|
|
18
|
|
|
|
1,360
|
|
|
|
17
|
|
|
|
1,218
|
|
|
|
16
|
|
North America
|
|
|
1,504
|
|
|
|
22
|
|
|
|
2,126
|
|
|
|
27
|
|
|
|
1,887
|
|
|
|
25
|
|
Asia/Pacific
|
|
|
2,223
|
|
|
|
33
|
|
|
|
2,498
|
|
|
|
31
|
|
|
|
2,632
|
|
|
|
34
|
|
Japan
|
|
|
332
|
|
|
|
5
|
|
|
|
461
|
|
|
|
6
|
|
|
|
661
|
|
|
|
9
|
|
Other
|
|
|
136
|
|
|
|
2
|
|
|
|
157
|
|
|
|
2
|
|
|
|
120
|
|
|
|
1
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Total
|
|
|
6,759
|
|
|
|
100
|
%
|
|
|
7,929
|
|
|
|
100
|
%
|
|
|
7,682
|
|
|
|
100
|
%
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
In the 2006 fiscal year, our net sales increased in nearly every
region, primarily due to higher demand for semiconductor
products, in particular for specialty memory products in the
consumer electronics and game-console businesses in North
America. In the 2007 fiscal year, we experienced a decrease of
247 million in net sales primarily due to general
pricing pressure in the Communication Solutions and Qimonda
segments. The regional sales decrease in Germany is primarily
due to the insolvency of BenQs German subsidiary and lower
DRAM sales, while the sales increase in the Asia/Pacific region
was driven by higher sales volumes, particularly in the
Automotive, Industrial & Multimarket and Communication
Solutions segments.
The net sales in our Automotive, Industrial &
Multimarket segment increased in all regions, with a
particularly strong increase in Asia/Pacific and North America.
The number of customers in this segment remained stable in the
2007 fiscal year. The top 20 customers in this segment accounted
for approximately 62 percent of the segments sales in
the 2007 fiscal year.
In the Communication Solutions segment, we have seen a further
shift of net sales from Europe and North America to the
Asia/Pacific region in the 2007 fiscal year. Our top 20
customers in this segment accounted for over 70 percent of
its net sales in the 2007 fiscal year.
In the 2007 fiscal year, net sales of Qimonda declined overall
due to lower average selling prices, which could not be offset
by higher bit shipments. Qimondas net sales increased in
Asia, due to OEM customers shifting their production to that
region, and increased particularly in Japan due to a growth in
sales of specialty memory products to consumer electronics and
graphics applications. Sales in North America declined
correspondingly. Qimondas top 20 customers accounted for
nearly 77 percent of its net sales in the 2007 fiscal year.
Cost of Goods
Sold and Gross Margin
Our cost of goods sold consists principally of:
|
|
|
|
|
Direct materials, which consist principally of raw wafer costs;
|
|
|
|
Labor costs;
|
|
|
|
Overhead, including maintenance of production equipment,
indirect materials, utilities and royalties;
|
|
|
|
Depreciation and amortization;
|
|
|
|
Subcontracted expenses for assembly and test services;
|
|
|
|
Production support, including facilities, utilities, quality
control, automated systems and management functions; and
|
|
|
|
Foundry production costs.
|
In addition to factors that affect our revenue, our gross margin
is impacted by:
|
|
|
|
|
Factory utilization rates and related idle capacity costs;
|
|
|
|
Amortization of purchased intangible assets;
|
|
|
|
Product warranty costs;
|
13
|
|
|
|
|
Provisions for excess or obsolete inventories; and
|
|
|
|
Government grants, which are recognized over the remaining
useful life of the related manufacturing assets.
|
We include in cost of goods sold the cost of inventory purchased
from our joint ventures and other associated and related
companies such as ALTIS (consolidated since December 31,
2005) and Inotera. Our purchases from these associated and
related companies amounted to 615 million in the 2005
fiscal year, 575 million in the 2006 fiscal year, and
593 million in the 2007 fiscal year.
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
For the years ended September 30,
|
|
|
|
2005
|
|
|
2006
|
|
|
2007
|
|
|
|
( in millions, except percentages)
|
|
|
Cost of goods sold
|
|
|
4,909
|
|
|
|
5,854
|
|
|
|
6,092
|
|
Changes
year-on-year
|
|
|
|
|
|
|
19
|
%
|
|
|
4
|
%
|
% of net sales
|
|
|
73
|
%
|
|
|
74
|
%
|
|
|
79
|
%
|
Gross margin
|
|
|
27
|
%
|
|
|
26
|
%
|
|
|
21
|
%
|
In the 2006 fiscal year our gross margin worsened slightly
compared to the 2005 fiscal year due to the lower gross margin
of the Qimonda segment primarily as a result of lower levels of
license income and strong pricing pressure for DDR2 memories in
the first quarter of the 2006 fiscal year. This effect was
largely offset by improved gross margin in the Automotive,
Industrial & Multimarket and the Communication
Solutions segments, particularly due to lower idle capacity
costs. Our gross margin decreased in the 2007 fiscal year,
primarily as a result of a strong deterioration of the gross
margin in the Qimonda segment, resulting from exchange rate
effects, DRAM price development in the 2007 year, and
inventory devaluations. The gross margin in our other segments
remained broadly unchanged from the prior year.
|
|
|
|
|
Automotive, Industrial & Multimarket
In the 2006 fiscal year, our gross margin
increased mainly due to a reduction in idle capacity costs. The
gross margin remained on the same level in the 2007 fiscal year,
as pricing pressure and certain corporate overhead expenses that
resulted from the Qimonda carve out were compensated with
productivity measures.
|
|
|
|
Communication Solutions In the 2006 fiscal
year, gross margin improved, mainly as a result of lower idle
capacity costs and the successful implementation of productivity
measures, which more than offset the inventory write-downs
resulting from the insolvency of BenQs German subsidiary.
In the 2007 fiscal year, the gross margin of this segment
remained stable.
|
|
|
|
Qimonda The gross margin decreased slightly
during the 2006 fiscal year, primarily as a result of the lower
level of license income. The Qimonda gross margin was under
particular pressure early in the 2006 fiscal year when pricing
pressure was higher, and improved later in the fiscal year. The
gross margin decreased from 20 percent in the 2006 fiscal
year to 6 percent in the 2007 fiscal year, primarily due to
lower average selling prices, the weakening of the
U.S. dollar, and inventory write downs of
85 million. These negative effects could not be
offset by lower production costs per unit resulting from
increased manufacturing productivity.
|
Research and
Development Expenses
Research and development (R&D) expenses
consist primarily of salaries and benefits for research and
development personnel, materials costs, depreciation and
maintenance of equipment used in our research and development
efforts, and contracted technology development costs. R&D
expenses also include our joint technology development
arrangements with partners such as Nanya and IBM.
14
We continue to focus our investments on the development of
leading-edge manufacturing technologies and products with high
potential for growth and profitability.
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
For the years ended September 30,
|
|
|
|
|
2005
|
|
|
2006
|
|
|
|
2007
|
|
|
|
|
( in millions, except percentages)
|
|
|
|
Research and development expenses
|
|
|
1,293
|
|
|
|
1,249
|
|
|
|
|
1,169
|
|
|
Changes
year-on-year
|
|
|
|
|
|
|
(3
|
)
|
%
|
|
|
(6
|
)
|
%
|
% of net sales
|
|
|
19
|
%
|
|
|
16
|
|
%
|
|
|
15
|
|
%
|
Government subsidies
|
|
|
50
|
|
|
|
67
|
|
|
|
|
115
|
|
|
% of net sales
|
|
|
1
|
%
|
|
|
1
|
|
%
|
|
|
1
|
|
%
|
Some of our R&D projects qualify for subsidies from local
and regional governments where we do business. If the criteria
to receive a grant are met, the subsidies received reduce
R&D expenses over the project term as expenses are incurred.
|
|
|
|
|
Automotive, Industrial & Multimarket
In the 2006 fiscal year, R&D expenses
remained approximately on the same level as in the 2005 fiscal
year in absolute terms and slightly decreased as a percentage of
net sales. In the 2007 fiscal year, R&D expenses remained
stable as a percentage of net sales and slightly increased in
absolute terms mainly driven by automotive and industrial
applications.
|
|
|
|
Communication Solutions In the 2006 fiscal
year, R&D expenses declined in absolute terms but remained
stable as a percentage of net sales as the effect of previously
implemented efficiency programs was realized. In the 2007 fiscal
year, R&D expenses continued to decline in absolute terms
and remained stable as a percentage of net sales, reflecting the
implementation of cost reduction measures in response to the
insolvency of BenQs German subsidiary.
|
|
|
|
Qimonda In the 2006 fiscal year, R&D
expenses increased in absolute terms due to Qimondas
effort to strengthen its development capabilities with respect
to next-generation memory technologies and the further
diversification of its portfolio of memory products, but
decreased as a percentage of net sales due to the growth in net
sales. In the 2007 fiscal year, R&D expenses decreased due
to the completion of R&D work on 80-nanometer and
75-nanometer technology platforms earlier in the 2007 fiscal
year, and the focus on production support research before
development efforts on 58-nanometer technology platform took off
towards the end of the 2007 fiscal year. Qimonda also initiated
cost saving measures in order to increase the productivity of
development efforts.
|
Selling,
General and Administrative (SG&A) Expenses
Selling expenses consist primarily of salaries and benefits for
personnel engaged in sales and marketing activities, costs of
customer samples, other marketing incentives, and related
marketing expenses.
General and administrative expenses consist primarily of
salaries and benefits for administrative personnel,
non-manufacturing related overhead costs, consultancy, legal and
other fees for professional services, recruitment and training
expenses.
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
For the years ended September 30,
|
|
|
|
|
2005
|
|
|
2006
|
|
|
2007
|
|
|
|
|
( in millions, except percentages)
|
|
|
|
Selling, general and administrative expenses
|
|
|
655
|
|
|
|
751
|
|
|
|
700
|
|
|
Changes
year-on-year
|
|
|
|
|
|
|
15
|
%
|
|
|
(7
|
)
|
%
|
% of net sales
|
|
|
10
|
%
|
|
|
9
|
%
|
|
|
9
|
|
%
|
Selling and administrative expenses in the 2006 fiscal year
increased primarily due to charges of 28 million
incurred in connection with the insolvency of BenQs German
subsidiary, expenses of 16 million related to the
formation and carve-out of Qimonda, and stock-based compensation
costs of 12 million. In the 2007 fiscal year, selling
and administrative expenses decreased in absolute terms as
15
a result of cost saving measures and the non-recurrence of the
unusual charges from the 2006 fiscal year. As a percentage of
net sales, selling and administrative expenses remained
unchanged in 2007.
Other
Items Affecting Earnings
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
For the years ended September 30,
|
|
|
|
|
2005
|
|
|
2006
|
|
|
|
2007
|
|
|
|
|
( in millions, except percentages)
|
|
|
|
Restructuring charges
|
|
|
78
|
|
|
|
23
|
|
|
|
|
45
|
|
|
% of net sales
|
|
|
1
|
%
|
|
|
0
|
|
%
|
|
|
1
|
|
%
|
Other operating expense, net
|
|
|
92
|
|
|
|
108
|
|
|
|
|
46
|
|
|
% of net sales
|
|
|
1
|
%
|
|
|
1
|
|
%
|
|
|
1
|
|
%
|
Equity in earnings of associated companies, net
|
|
|
57
|
|
|
|
78
|
|
|
|
|
117
|
|
|
% of net sales
|
|
|
1
|
%
|
|
|
1
|
|
%
|
|
|
2
|
|
%
|
Gain on subsidiaries and associated company
share issuance, net
|
|
|
|
|
|
|
19
|
|
|
|
|
|
|
|
% of net sales
|
|
|
0
|
%
|
|
|
0
|
|
%
|
|
|
0
|
|
%
|
Other non-operating income (expense), net
|
|
|
26
|
|
|
|
(33
|
)
|
|
|
|
13
|
|
|
% of net sales
|
|
|
0
|
%
|
|
|
0
|
|
%
|
|
|
0
|
|
%
|
Extraordinary loss, net of tax
|
|
|
|
|
|
|
|
|
|
|
|
(35
|
)
|
|
% of net sales
|
|
|
0
|
%
|
|
|
0
|
|
%
|
|
|
0
|
|
%
|
Restructuring Charges. During the 2005 fiscal
year, we announced restructuring measures aimed at reducing
costs, downsizing certain portions of our workforce, and
consolidating certain functions and operations. As part of the
restructuring measures, we agreed upon plans to terminate
approximately 350 employees. The terminations were
primarily the result of the close down of fiber optics
operations in Germany and the United States, and were completed
in the 2006 fiscal year. In addition, we took measures to
restructure our chip manufacturing within the manufacturing
cluster Munich-Perlach, Regensburg and Villach. Production from
Munich-Perlach was transferred primarily to Regensburg and to a
lesser extent to Villach. Manufacturing at Munich-Perlach was
phased out in March 2007. As part of the restructuring, we
reduced our workforce by approximately 600 employees.
During the 2006 fiscal year, we announced restructuring plans to
downsize our workforce at ALTIS and at our chip card back-end
activities in order to maintain competitiveness and reduce cost.
As part of these restructuring measures, we agreed upon plans to
terminate approximately 390 employees and recorded
restructuring charges in the 2007 fiscal year. During the 2007
fiscal year, we took further restructuring measures, mainly in
response to the insolvency of one of our largest mobile phone
customers, BenQ Mobile GmbH & Co. OHG, and in order to
further streamline certain research and development locations.
Approximately 280 jobs are affected worldwide, thereof
approximately 120 in the German locations Munich, Salzgitter and
Nuremberg. A large portion of these restructuring measures have
been completed during the 2007 fiscal year. The Infineon
Complexity Reduction program (ICoRe) was launched in
the first quarter of the 2007 fiscal year to reduce costs and
seek added efficiencies by optimizing process flows. This
program is expected to have only limited impact on our workforce.
Other Operating Expense, net. In the 2005
fiscal year, other operating expense, net included a net charge
of 96 million resulting primarily from the
reorganization of certain communication businesses and goodwill
and other intangible assets impairment charges. In the 2006
fiscal year, other operating expense, net consisted mainly of
goodwill and intangible assets impairment charges of
38 million, antitrust related charges of
23 million, the settlement of litigation with Tessera
of 37 million, and a loss of 12 million in
connection with our sale of Qimonda ADSs following its initial
public offering. In the 2007 fiscal year, other operating
expense, net consisted primarily of gains from the sale of the
POF business of 17 million and from the sale of the
Sci-Worx business of 3 million, and losses of
84 million from the sale of an additional
28.75 million Qimonda ADSs.
Equity in Earnings of Associated Companies,
net. Our principal associated company is
currently Inotera. Inotera is a DRAM manufacturer and our equity
in its earnings has been sensitive to fluctuations in
16
the price of DRAM and is reflected in the results of Qimonda. In
each of the 2005, 2006 and 2007 fiscal years, Inotera
contributed the majority of our equity in earnings from
associated companies, reflecting the start of volume production
by that joint venture in the 2005 fiscal year. In the 2007
fiscal year, equity in earnings of associated companies, net
were 117 million.
Gain on Subsidiaries and Associated Company Share Issuance,
net. In August 2006, Qimonda successfully
completed an initial public offering on the New York Stock
Exchange of 42 million ADSs, together with 6.3 million
ADSs from Infineon in an over-allotment option, at a price of
US$13 per share. We realized a non-operating loss of
53 million from the dilution of our interest in
Qimonda in connection with its initial public offering.
In March and May 2006, Inotera successfully completed an initial
public offering on the Taiwanese Stock Exchange of
200 million ordinary shares and a public offering on the
Luxembourg Stock Exchange of 40 million global depositary
shares (representing 400 million ordinary shares), each at
an issuance price of NT$33 per ordinary share. As a result of
these transactions, we recognized a non-operating gain of
72 million.
Other Non-Operating Income (Expense),
net. Other non-operating income and expense
consists of various items in different periods not directly
related to our principal operations, including gains and losses
on sales of marketable securities. In the 2005 fiscal year,
other non-operating income, net included 40 million
related to net gains from foreign currency derivatives and
foreign currency transactions and a gain of
13 million realized on the sale of our venture
capital activities, partially offset by investment-related
impairment charges of 29 million. In the 2006 fiscal
year, other non-operating expense, net consisted mainly of
31 million related to net losses from foreign
currency derivatives and foreign currency transactions and
investment-related impairment charges of 13 million.
In the 2007 fiscal year, other non-operating income, net
included primarily gains and losses from financial instruments
transactions.
Extraordinary Loss, net of tax. During the
quarter ended March 31, 2007, we entered into agreements
with Molstanda Vermietungsgesellschaft mbH
(Molstanda) and a financial institution. Molstanda
is the owner of a parcel of land located in the vicinity of our
headquarters south of Munich. Pursuant to FASB Interpretation
No. 46 (revised December 2003), Consolidation of
Variable Interest Entities an Interpretation of ARB
No. 51 (FIN 46R), we determined
that Molstanda is a variable interest entity since it does not
have sufficient equity to demonstrate that it could finance its
activities without additional financial support, and as a result
of the agreements we became its primary beneficiary.
Accordingly, we consolidated the assets and liabilities of
Molstanda beginning in the second quarter of the 2007 fiscal
year. Since Molstanda is not considered a business pursuant to
FIN 46R, the 35 million excess in fair value of
liabilities assumed and consolidated of 76 million,
over the fair value of the newly consolidated identifiable
assets of 41 million, was recorded as an
extraordinary loss during the second quarter of the 2007 fiscal
year. Due to our cumulative loss situation no tax benefit was
provided on this loss. We subsequently acquired the majority of
the outstanding capital of Molstanda during the fourth quarter
of the 2007 fiscal year. In August 2007, we entered into an
agreement to sell part of the acquired parcel of land to a third
party developer-lessor in connection with the construction and
lease of Qimondas new headquarters office in the south of
Munich.
17
Earnings
Before Interest and Taxes (EBIT)
We define EBIT as earnings (loss) before interest and taxes. Our
management uses EBIT as a measure to establish budgets and
operational goals, to manage our business and to evaluate its
performance. We report EBIT information because we believe that
it provides investors with meaningful information about our
operating performance and especially about the performance of
our separate operating segments. Because many operating
decisions, such as allocations of resources to individual
projects, are made on a basis for which the effects of financing
the overall business and of taxation are of marginal relevance,
we find a metric that excludes the effects of interest on
financing and tax expense useful. In addition, in measuring
operating performance, particularly for the purpose of making
internal decisions, such as those relating to personnel matters,
it is useful for us to consider a measure that excludes items
over which the individuals being evaluated have minimal control,
such as enterprise-level taxation and financing. EBIT is
determined from the consolidated statements of operations as
follows:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
For the years ended September 30,
|
|
|
|
2005
|
|
|
2006
|
|
|
2007
|
|
|
|
( in millions)
|
|
|
Net loss
|
|
|
(312
|
)
|
|
|
(268
|
)
|
|
|
(368
|
)
|
Add: Income tax expense
|
|
|
120
|
|
|
|
161
|
|
|
|
79
|
|
Interest expense, net
|
|
|
9
|
|
|
|
92
|
|
|
|
33
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
EBIT
|
|
|
(183
|
)
|
|
|
(15
|
)
|
|
|
(256
|
)
|
|
|
|
|
|
|
|
|
|
|
|
|
|
EBIT of our separate reporting segments were as follows:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
For the years ended September 30,
|
|
|
|
2005
|
|
|
2006
|
|
|
2007
|
|
|
|
( in millions)
|
|
|
Automotive, Industrial & Multimarket
|
|
|
134
|
|
|
|
246
|
|
|
|
300
|
|
Communication Solutions
|
|
|
(295
|
)
|
|
|
(231
|
)
|
|
|
(160
|
)
|
Other Operating Segments
|
|
|
4
|
|
|
|
4
|
|
|
|
(12
|
)
|
Corporate and Eliminations
|
|
|
(137
|
)
|
|
|
(236
|
)
|
|
|
(177
|
)
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Subtotal
|
|
|
(294
|
)
|
|
|
(217
|
)
|
|
|
(49
|
)
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Qimonda(1)
|
|
|
111
|
|
|
|
202
|
|
|
|
(207
|
)
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Total
|
|
|
(183
|
)
|
|
|
(15
|
)
|
|
|
(256
|
)
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
(1) |
EBIT of Qimonda for the period following its IPO are reported
net of minority interests results.
|
EBIT reflects the combined effects of the following EBIT
developments of our reporting segments:
|
|
|
|
|
Automotive, Industrial & Multimarket
The EBIT improvement in the 2006 fiscal year was
mainly due to higher sales volumes and improved gross margin,
partially offset by continued strong price pressure especially
in the automotive and chipcard businesses, costs related to
product transfers in connection with the phase-out of production
at Munich-Perlach, and costs incurred in connection with our
production site in Kulim, Malaysia. In the 2007 fiscal year,
EBIT further improved due to an increase in net sales and
despite being negatively impacted by additional corporate
expense allocations subsequent to the Qimonda carve out. In
addition, a 17 million gain was realized from the
sale of our POF business in June 2007 to Avago, which also had a
positive impact on EBIT in the 2007 fiscal year.
|
|
|
|
Communication Solutions In the 2006 fiscal
year, EBIT was negatively impacted by charges aggregating
91 million, primarily in connection with allowances
recorded in response to the insolvency of BenQs German
subsidiary. Despite these charges, EBIT improved in the 2006
fiscal year mainly due to lower idle capacity costs and the
implementation of cost reduction measures. In the 2007 fiscal
year, EBIT continued to improve despite a further decline in net
sales, as no significant charges were recognized and further
cost reduction measures were successfully implemented.
|
18
|
|
|
|
|
Qimonda In the 2006 fiscal year, EBIT
increased primarily due to sales volume growth, higher bit
shipments and a favorable U.S. dollar/Euro exchange rate
compared to the 2005 fiscal year. In the 2007 fiscal year, EBIT
decreased significantly primarily due to deteriorating
conditions in the DRAM market and inventory write-downs,
resulting from negative DRAM price development and the weakening
of the U.S. dollar with respect to the Euro.
|
|
|
|
Other Operating Segments EBIT in the 2005
fiscal year was positively impacted by a gain of
13 million realized on the sale of our venture
capital activities. EBIT in the 2006 fiscal year remained
unchanged compared to the 2005 fiscal year. In the 2007 fiscal
year, EBIT was negatively impacted by a downward adjustment of
transfer prices resulting from the 200-millimeter wafer supply
agreement between Infineon and Qimonda.
|
|
|
|
Corporate and Elimination EBIT declined in
the 2006 fiscal year mainly due to aggregate charges of
approximately 80 million incurred in connection with
the formation of Qimonda, the dilution of our interest in
Qimonda following its IPO, and our sale of Qimonda shares in
that offering. In the 2007 fiscal year, EBIT of this segment was
positively impacted by a reduction in idle production capacities
at ALTIS compared to the 2006 fiscal year, a revision to accrued
personnel costs of 22 million, and a decrease in
stock option expenses of 13 million. On the other
hand, we incurred a loss of 84 million from the sale
of an additional 28.75 million Qimonda ADSs in the 2007
fiscal year, which was recorded in this segment. Also,
restructuring expenses increased by 22 million in
comparison to the 2006 fiscal year.
|
Interest
Expense, Net
We derive interest income primarily from cash and cash
equivalents and marketable securities. Interest expense is
primarily attributable to bank loans and
convertible/exchangeable notes, and is net of interest
capitalized on manufacturing facilities under construction.
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
For the years ended September 30,
|
|
|
2005
|
|
2006
|
|
2007
|
|
|
( in millions, except percentages)
|
|
Interest expense, net
|
|
|
(9
|
)
|
|
|
|
(92
|
)
|
|
|
|
(33
|
)
|
|
% of net sales
|
|
|
0
|
|
%
|
|
|
(1
|
)
|
%
|
|
|
0
|
|
%
|
Interest expense in the 2005, 2006 and 2007 fiscal years relates
principally to the convertible subordinated notes that we issued
in February 2002 and in June 2003. The increase in interest
expense, net in the 2006 fiscal year primarily reflects the
drawdown of US$345 million under our syndicated credit
facility to finance the expansion of Qimondas Richmond
manufacturing facility and a reduction in income from interest
rate swaps resulting from increased variable interest rates and,
to a lesser extent, interest on outstanding tax obligations and
a reduction in capitalized interest. In February 2007, we
redeemed the remaining outstanding principal of the convertible
subordinated notes issued in 2002, which resulted in a decrease
in interest expense in the 2007 fiscal year.
Income
Taxes
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
For the years ended September 30,
|
|
|
|
|
2005
|
|
|
2006
|
|
|
2007
|
|
|
|
|
( in millions, except percentages)
|
|
|
|
Income tax expense
|
|
|
(120
|
)
|
|
|
(161
|
)
|
|
|
(79
|
)
|
|
% of net sales
|
|
|
(2
|
)%
|
|
|
(2
|
)%
|
|
|
(1
|
)
|
%
|
Effective tax rate
|
|
|
(63
|
)%
|
|
|
(150
|
)%
|
|
|
(31
|
)
|
%
|
Generally, deferred tax assets in tax jurisdictions that have a
three-year cumulative loss are subject to a valuation allowance
excluding the impact of forecasted future taxable income. In the
2005, 2006, and 2007 fiscal years we continued to have a
three-year cumulative loss in certain tax jurisdictions and,
accordingly, we recorded increases to the valuation allowance of
192 million, 292 million, and
19
226 million in those periods, respectively. We assess
our deferred tax asset position on a regular basis. Our ability
to realize benefits from our deferred tax assets is dependent on
our ability to generate future taxable income sufficient to
utilize tax loss carry-forwards or tax credits before
expiration. We expect to continue to recognize no tax benefits
in these jurisdictions until we have ceased to be in a
cumulative loss position for the preceding three-year period.
Net
Loss
In the 2005 fiscal year, the net loss incurred resulted
primarily from the combination of lower revenues and gross
margin, long-term asset impairments, restructuring measures and
tax expense. In the 2006 fiscal year, the net loss incurred was
primarily due to charges resulting from allowances recorded in
response to the insolvency of BenQs German subsidiary,
losses recognized in connection with the initial public offering
of Qimonda, and the settlement of litigation. In addition, in
the 2006 fiscal year we began to recognize the fair value of
employee stock options in earnings, which further contributed to
the net loss incurred. In the 2007 fiscal year, the most
significant factor contributing to the increase in net loss was
the significant deterioration in EBIT of Qimonda, from positive
202 million in the 2006 fiscal year to negative
207 million in the 2007 fiscal year, which resulted
from the deterioration in memory product prices and a weaker
U.S. dollar, and a consequent significant decrease in
Qimondas gross margin. Also contributing to the net loss
incurred in the 2007 fiscal year were the loss of
84 million resulting from the sale of an additional
28.75 million Qimonda ADSs, restructuring charges of
45 million, and the extraordinary loss of
35 million resulting from the consolidation of
Molstanda.
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
As of September 30,
|
|
|
|
|
|
|
|
|
|
|
% Change
|
|
|
|
|
2006
|
|
|
2007
|
|
|
year-on-year
|
|
|
|
|
( in millions, except percentages)
|
|
|
|
Current assets
|
|
|
5,681
|
|
|
|
5,278
|
|
|
|
(7
|
)
|
%
|
Non-current assets
|
|
|
5,504
|
|
|
|
5,401
|
|
|
|
(2
|
)
|
%
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Total assets
|
|
|
11,185
|
|
|
|
10,679
|
|
|
|
(5
|
)
|
%
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Current liabilities
|
|
|
3,305
|
|
|
|
2,847
|
|
|
|
(14
|
)
|
%
|
Non-current liabilities
|
|
|
1,725
|
|
|
|
1,885
|
|
|
|
9
|
|
%
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Total liabilities
|
|
|
5,030
|
|
|
|
4,732
|
|
|
|
(6
|
)
|
%
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Minority Interests
|
|
|
840
|
|
|
|
1,033
|
|
|
|
23
|
|
%
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Shareholders equity
|
|
|
5,315
|
|
|
|
4,914
|
|
|
|
(8
|
)
|
%
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
As of September 30, 2007, our total assets and current
assets decreased in comparison to the prior year end, primarily
due to decreased trade accounts receivable and decreased cash
and cash equivalents. Trade accounts receivable decreased
primarily as a result of the decrease in fourth quarter sales by
452 million to 1,838 million compared with
the fourth quarter of the 2006 fiscal year. The decrease of cash
and cash equivalents resulted primarily from the redemption
during the 2007 fiscal year of convertible subordinated notes
due 2007 in the principal outstanding amount of
640 million.
Non-current assets decreased slightly at the end of the 2007
fiscal year compared with the prior year end, as capital
expenditures were more than offset by depreciation,
amortization, and impairment charges during the year.
Total liabilities and current liabilities decreased as of
September 30, 2007 compared with the prior year end, mainly
due to the redemption of convertible subordinated notes due 2007
in the principal outstanding amount of 640 million.
The increase in non-current liabilities is primarily due to the
issuance during the 2007 fiscal year of subordinated notes
exchangeable for Qimonda ADSs in the principal amount of
215 million. The increase in minority interests
resulted primarily from the sale of an additional
28.75 million Qimonda ADSs, for net proceeds of
216 million.
20
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
As of September 30,
|
|
|
|
|
2005
|
|
|
|
2006
|
|
|
|
2007
|
|
|
|
Non-current asset
intensity(1)
|
|
|
56
|
|
%
|
|
|
49
|
|
%
|
|
|
51
|
|
%
|
Current asset
intensity(2)
|
|
|
44
|
|
%
|
|
|
51
|
|
%
|
|
|
49
|
|
%
|
Degree of wear of fixed
assets(3)
|
|
|
67
|
|
%
|
|
|
72
|
|
%
|
|
|
72
|
|
%
|
Depreciation rate of fixed
assets(4)
|
|
|
11
|
|
%
|
|
|
10
|
|
%
|
|
|
9
|
|
%
|
Inventory
intensity(5)
|
|
|
10
|
|
%
|
|
|
11
|
|
%
|
|
|
11
|
|
%
|
Inventory
turnover(6)
|
|
|
6.8
|
|
|
|
|
7.1
|
|
|
|
|
6.4
|
|
|
Inventory turnover in
days(7)
|
|
|
53
|
|
|
|
|
50
|
|
|
|
|
57
|
|
|
Days sales
outstanding(8)
|
|
|
53
|
|
|
|
|
50
|
|
|
|
|
50
|
|
|
Equity
ratio(9)
|
|
|
55
|
|
%
|
|
|
48
|
|
%
|
|
|
46
|
|
%
|
Return on
equity(10)
|
|
|
(5
|
)
|
%
|
|
|
(5
|
)
|
%
|
|
|
(7
|
)
|
%
|
Return on
assets(11)
|
|
|
(3
|
)
|
%
|
|
|
(2
|
)
|
%
|
|
|
(3
|
)
|
%
|
Equity-to-fixed-assets
ratio(12)
|
|
|
150
|
|
%
|
|
|
141
|
|
%
|
|
|
135
|
|
%
|
Debt-to-equity
ratio(13)
|
|
|
30
|
|
%
|
|
|
38
|
|
%
|
|
|
35
|
|
%
|
The aforementioned financial condition ratios are calculated as
follows:
|
|
|
(1) |
|
Non-current asset intensity =
non-current assets / total assets
|
|
(2) |
|
Current asset intensity = current
assets / total assets
|
|
(3) |
|
Degree of wear of fixed assets =
accumulated depreciation on fixed assets / historical costs of
fixed assets at the end of the fiscal year
|
|
(4) |
|
Depreciation rate of fixed assets =
annual depreciation of fixed assets / historical costs of fixed
assets at the end of the fiscal year
|
|
(5) |
|
Inventory intensity = inventory /
total assets
|
|
(6) |
|
Inventory turnover = annual net
sales / average inventory
|
|
(7) |
|
Inventory turnover in days =
average inventory x 360 days / annual net sales
|
|
(8) |
|
Days sales outstanding = average
accounts receivable x 360 days / annual net sales
|
|
(9) |
|
Equity ratio = equity / total assets
|
|
(10) |
|
Return on equity = net income
(loss) for the year / average equity
|
|
(11) |
|
Return on assets = net income
(loss) for the year / average total assets
|
|
(12) |
|
Equity-to-fixed-assets ratio =
equity / property, plant and equipment
|
|
(13) |
|
Debt-to-equity ratio = (short-term
debt + long-term debt) / equity
|
|
|
|
The average of a balance sheet
position is calculated as the arithmetic average of the amount
as of the balance sheet dates of the current and the prior years.
|
In the 2006 fiscal year, our equity ratio decreased principally
due to the net loss during the year. At September 30, 2006,
our equity ratio was 48 percent, a 7 percentage point
decrease from September 30, 2005. At September 30,
2007, our equity ratio was 46 percent, a 2 percentage
point decrease from September 30, 2006, principally due to
the net loss incurred.
In the 2006 fiscal year, the return on equity remained unchanged
at negative 5 percent and the return on assets improved to
negative 2 percent due to a smaller net loss and increased
total assets compared to the 2005 fiscal year. In the 2007
fiscal year, the return on equity decreased to negative
7 percent and the return on assets decreased to negative
3 percent, due to a higher net loss and decreased total
assets compared to the 2006 fiscal year.
The equity-to-fixed-assets ratio decreased to 141 percent
in the 2006 fiscal year from 150 percent in the prior year
as a result of the net loss. In the 2007 fiscal year, the
equity-to-fixed-assets ratio further decreased to
135 percent, mainly as a result of the net loss.
In the 2006 fiscal year, the increase in debt-to-equity ratio to
38 percent, compared to 30 percent in the 2005 fiscal
year, was mainly attributable to the drawdown of
US$345 million under our syndicated credit facility during
the 2006 fiscal year to finance the expansion of our Richmond
manufacturing facility. In the 2007 fiscal year, the
debt-to-equity ratio decreased to 35 percent, primarily due
to the full redemption of the
21
principal outstanding amount of 640 million of
convertible subordinated notes, partially offset by the issuance
of 215 million in exchangeable subordinated notes due
in 2010.
Cash
Flow
Our consolidated statements of cash flows show the sources and
uses of cash and cash equivalents during the reported periods.
They are of key importance for the evaluation of our financial
position.
Cash flows from investing and financing activities are both
indirectly determined based on payments and receipts. Cash flows
from operating activities are determined indirectly from net
loss. The changes in balance sheet items have been adjusted for
the effects of foreign currency exchange fluctuations and for
changes in the scope of consolidation. Therefore, they do not
conform to the corresponding changes in the respective balance
sheet line items.
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
For the years ended September 30,
|
|
|
|
2005
|
|
|
2006
|
|
|
2007
|
|
|
|
( in millions)
|
|
|
Net cash provided by operating activities
|
|
|
1,090
|
|
|
|
1,003
|
|
|
|
1,207
|
|
Net cash used in investing
activities(1)
|
|
|
(289
|
)
|
|
|
(853
|
)
|
|
|
(867
|
)
|
Net cash provided by (used in) financing activities
|
|
|
(266
|
)
|
|
|
762
|
|
|
|
(521
|
)
|
Cash and cash equivalents at end of year
|
|
|
1,148
|
|
|
|
2,040
|
|
|
|
1,819
|
|
|
|
(1)
|
In the 2006 fiscal year the amount
includes a 119 million cash increase as a result of
the initial consolidation of ALTIS.
|
Cash provided by operating activities in the 2007 fiscal year
resulted mainly from the net loss of 368 million,
which is net of non-cash charges for depreciation and
amortization of 1,276 million and impairment charges
of 40 million. Cash provided by operating activities
was positively impacted by a decrease of trade accounts
receivable and other current assets of 386 million,
and negatively impacted by an increase in inventories and a
decrease in other current liabilities aggregating to
185 million.
Cash used in investing activities in the 2007 fiscal year mainly
reflects capital expenditures of 1,375 million,
principally to expand and equip our manufacturing facilities in
Kulim, Malacca, Batam, Villach and Regensburg in the logic
segments and the DRAM manufacturing facilities in Richmond,
Dresden and Porto, as well as net proceeds from net sales of
marketable securities of 133 million, proceeds from
sale of business activities and interests in subsidiaries of
273 million, and cash inflows of
156 million from a sale and leaseback transaction of
200-millimeter equipment that Qimonda entered into in September
2007.
Cash used in financing activities in the 2007 fiscal year
principally relates to the redemption of convertible
subordinated notes due 2007 in the principal outstanding amount
of 640 million, which was in part offset by the
proceeds of the issuance of 215 million in
exchangeable subordinated notes due 2010.
Free Cash
Flow
We define free cash flow as cash from operating and investing
activities excluding purchases or sales of marketable
securities. Since we hold a substantial portion of our available
monetary resources in the form of readily available marketable
securities, and operate in a capital-intensive industry, we
report free cash flow to provide investors with a measure that
can be used to evaluate changes in liquidity after taking
capital expenditures into account. It is not intended to
represent the residual cash flow available for
22
discretionary expenditures, since debt service requirements or
other non-discretionary expenditures are not deducted. The free
cash flow is determined as follows from the consolidated
statements of cash flows:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
For the years ended September 30,
|
|
|
|
2005
|
|
|
2006
|
|
|
2007
|
|
|
|
( in millions)
|
|
|
Net cash provided by operating activities
|
|
|
1,090
|
|
|
|
1,003
|
|
|
|
1,207
|
|
Net cash used in investing
activities(1)
|
|
|
(289
|
)
|
|
|
(853
|
)
|
|
|
(867
|
)
|
Sales of marketable securities, net
|
|
|
(1,082
|
)
|
|
|
(238
|
)
|
|
|
(133
|
)
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Free cash flow
|
|
|
(281
|
)
|
|
|
(88
|
)
|
|
|
207
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
(1) |
In the 2006 fiscal year, the amount includes a
119 million cash increase as a result of the initial
consolidation of ALTIS.
|
Net Cash
Position
The following table presents our gross and net cash positions
and the maturity of debt. It is not intended to be a forecast of
cash available in future periods.
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Payments due by period
|
|
|
|
|
|
Less
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
than
|
|
1-2
|
|
|
2-3
|
|
|
3-4
|
|
|
4-5
|
|
|
After
|
|
As of September 30, 2007
|
|
Total
|
|
1 year
|
|
years
|
|
|
years
|
|
|
years
|
|
|
years
|
|
|
5 years
|
|
|
|
( in millions)
|
|
|
Cash and cash equivalents
|
|
|
1,819
|
|
|
1,819
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Marketable securities
|
|
|
475
|
|
|
475
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Gross cash position
|
|
|
2,294
|
|
|
2,294
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Less
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Long-term debt
|
|
|
1,376
|
|
|
|
|
|
207
|
|
|
|
1,002
|
|
|
|
95
|
|
|
|
26
|
|
|
|
46
|
|
Short-term debt and current maturities
|
|
|
336
|
|
|
336
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Total financial debt
|
|
|
1,712
|
|
|
336
|
|
|
207
|
|
|
|
1,002
|
|
|
|
95
|
|
|
|
26
|
|
|
|
46
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Net cash position
|
|
|
582
|
|
|
1,958
|
|
|
(207
|
)
|
|
|
(1,002
|
)
|
|
|
(95
|
)
|
|
|
(26
|
)
|
|
|
(46
|
)
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Our gross cash position representing cash and cash
equivalents, plus marketable securities decreased to
2,294 million at September 30, 2007, compared
with 2,655 million at the prior year end. The
decrease was mainly due to the net effect of the redemption of
convertible subordinated notes due 2007 in the principal
outstanding amount of 640 million and the proceeds
from the issuance of 215 million in subordinated
notes due 2010 exchangeable for Qimonda ADSs.
Long-term debt principally consists of convertible and
exchangeable subordinated notes that were issued in order to
strengthen our liquidity position and allow us more financial
flexibility in conducting our business operations. The total
outstanding convertible and exchangeable notes as of
September 30, 2007 amounted to 915 million.
On February 6, 2002, we issued 1,000 million in
convertible subordinated notes due 2007 at par in an
underwritten offering to institutional investors in Europe.
During the 2004 fiscal year we redeemed 360 million
of these notes. On February 6, 2007, we redeemed the
remaining notes at the principal outstanding amount of
640 million.
On June 5, 2003, we issued 700 million in
convertible subordinated notes due 2010 at par in an
underwritten offering to institutional investors in Europe. The
notes are convertible, at the option of the holders of the
notes, into a maximum of 68.4 million ordinary shares of
our company, at a conversion price of 10.23 per share
through maturity.
On September 26, 2007, we issued 215 million in
exchangeable subordinated notes due 2010 at par in an
underwritten offering to institutional investors in Europe. The
notes are unsecured and accrue interest at 1.375 percent per
year. The notes are exchangeable for a maximum of
20.5 million Qimonda ADSs, at an exchange price of
10.48 per ADS at any time during the exchange period
through maturity, corresponding to an exchange premium of
35 percent.
23
Our net cash position meaning cash and cash
equivalents, plus marketable securities, less total financial
debt decreased by 68 million to
582 million at September 30, 2007, compared with
650 million at September 30, 2006, principally
due to dividend payments to minority interest holders.
To secure our cash position and to keep flexibility with regards
to liquidity, we have implemented a policy with risk limits for
the amounts deposited with respect to the counterparty, credit
rating, sector, duration, credit support and type of instrument.
We require capital in our 2008 fiscal year to:
|
|
|
|
|
Finance our operations;
|
|
|
|
Make scheduled debt payments;
|
|
|
|
Settle contingencies if they occur; and
|
|
|
|
Make planned capital expenditures.
|
We expect to meet these requirements through:
|
|
|
|
|
Cash flows generated from operations;
|
|
|
|
Cash on hand and securities we can sell; and
|
|
|
|
Available credit facilities.
|
As of September 30, 2007, we require funds for the 2008
fiscal year aggregating 1,658 million, consisting of
336 million for short-term debt payments and
1,322 million for commitments. In addition, we may
need up to 150 million for currently known and
estimable contingencies. We also plan to invest between
approximately 1.1 billion and 1.2 billion
in capital expenditures. We have a gross cash position of
2,294 million as of September 30, 2007, and also
the ability to draw funds from available credit facilities of
946 million.
Commitments
and Contingencies
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Payments Due/Expirations by Period
|
|
|
|
|
Less
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
than
|
|
1-2
|
|
2-3
|
|
3-4
|
|
4-5
|
|
After
|
As of September 30,
2007(1)(2)
|
|
Total
|
|
1 year
|
|
years
|
|
years
|
|
years
|
|
years
|
|
5 years
|
|
|
( in millions)
|
|
Contractual commitments:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Operating lease payments
|
|
|
870
|
|
|
90
|
|
|
78
|
|
|
65
|
|
|
62
|
|
|
57
|
|
|
518
|
Unconditional purchase commitments
|
|
|
1,212
|
|
|
1,161
|
|
|
29
|
|
|
11
|
|
|
6
|
|
|
1
|
|
|
4
|
Other commitments
|
|
|
77
|
|
|
71
|
|
|
2
|
|
|
2
|
|
|
1
|
|
|
1
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Total commitments
|
|
|
2,159
|
|
|
1,322
|
|
|
109
|
|
|
78
|
|
|
69
|
|
|
59
|
|
|
522
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Other contingencies:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Guarantees(3)
|
|
|
209
|
|
|
25
|
|
|
22
|
|
|
1
|
|
|
14
|
|
|
30
|
|
|
117
|
Contingent government
grants(4)
|
|
|
462
|
|
|
125
|
|
|
40
|
|
|
56
|
|
|
171
|
|
|
30
|
|
|
40
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Total contingencies
|
|
|
671
|
|
|
150
|
|
|
62
|
|
|
57
|
|
|
185
|
|
|
60
|
|
|
157
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
(1)
|
Certain payments of obligations or expiration of commitments
that are based on the achievement of milestones or other events
that are not date-certain are included for purposes of this
table, based on our estimate of the reasonably likely timing of
payments or expirations in each particular case. Actual outcomes
could differ from those estimates.
|
|
(2)
|
Product purchase commitments associated with capacity
reservation agreements are not included in this table, since the
purchase prices are based, in part, on future market prices, and
are accordingly not quantifiable at September 30, 2007.
Purchases under such agreements aggregated
1,165 million for the year ended September 30,
2007.
|
|
(3)
|
Guarantees are mainly issued for the payment of import duties,
rentals of buildings and contingent obligations related to
government grants received.
|
|
(4)
|
Contingent government grants refer to amounts previously
received, related to the construction and financing of certain
production facilities, which are not guaranteed otherwise and
could be refundable if the total project requirements are not
met.
|
The above table should be read together with note 35 to our
consolidated financial statements for the year ended
September 30, 2007.
24
Off-Balance
Sheet Arrangements
We issue guarantees in the normal course of business, mainly for
the payment of import duties, rentals of buildings and
contingent obligations related to government grants received. As
of September 30, 2007, the undiscounted amount of potential
future payments for guarantees was 209 million.
Capital
Expenditures
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
For the years ended September 30,
|
|
|
|
2005
|
|
|
2006
|
|
|
2007
|
|
|
|
( in millions)
|
|
|
Non-memory
businesses(1)
|
|
|
442
|
|
|
|
567
|
|
|
|
496
|
|
Qimonda
|
|
|
926
|
|
|
|
686
|
|
|
|
879
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Total
|
|
|
1,368
|
|
|
|
1,253
|
|
|
|
1,375
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
(1) |
Includes elimination of inter-segment transfers of
149 million, 37 million and
2 million for fiscal years ended September 30,
2005, 2006 and 2007, respectively.
|
Depending on our business situation we currently expect to
invest between approximately 1.1 billion and
1.2 billion in capital expenditures in the 2008
fiscal year, principally for our manufacturing facilities in
Richmond, Virginia, and Kulim, Malaysia. We also constantly seek
to improve productivity and upgrade technology at existing
facilities, especially in Dresden, Germany. As of
September 30, 2007, 361 million of this amount
was committed and included in unconditional purchase
commitments. Due to the lead times between ordering and delivery
of equipment, a substantial amount of capital expenditures
typically is committed well in advance. Approximately
60 percent of these expected capital expenditures will be
made in the front-end and back-end facilities of Qimonda.
Credit
Facilities
We have established both short- and long-term credit facilities
with a number of different financial institutions in order to
meet our anticipated funding requirements. These facilities,
which aggregate 1,620 million, of which
946 million remained available at September 30,
2007, comprise the following:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
As of September 30, 2007
|
|
|
|
Nature of financial
|
|
|
|
Aggregate
|
|
|
|
|
|
|
|
Term
|
|
institution commitment
|
|
Purpose/intended use
|
|
facility
|
|
|
Drawn
|
|
|
Available
|
|
|
|
|
|
|
|
( in millions)
|
|
|
Short-term
|
|
firm commitment
|
|
working capital, guarantees
|
|
|
164
|
|
|
|
127
|
|
|
|
37
|
|
Short-term
|
|
no firm commitment
|
|
working capital, cash management
|
|
|
336
|
|
|
|
28
|
|
|
|
308
|
|
Long-term(1)
|
|
firm commitment
|
|
general corporate purposes
|
|
|
766
|
|
|
|
165
|
|
|
|
601
|
|
Long-term(1)
|
|
firm commitment
|
|
project finance
|
|
|
354
|
|
|
|
354
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Total
|
|
|
|
|
|
|
1,620
|
|
|
|
674
|
|
|
|
946
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
(1) |
Including current maturities.
|
In September 2004, we executed a US$400/400 million
syndicated credit facility with a five-year term, which was
subsequently reduced to US$345/300 million in August
2006. The facility consists of two tranches. Tranche A is a
term loan intended to finance the expansion of the Richmond,
Virginia, manufacturing facility. In January 2006, we drew
US$345 million under Tranche A, on the basis of a
repayment schedule that foresees equal installments falling due
in March and September each year. At September 30, 2007,
US$235 million was outstanding under Tranche A.
Tranche B, which is a 300 million multicurrency
revolving facility to be used for general corporate purposes,
remained available and undrawn at September 30, 2007. The
facility has customary financial covenants, and drawings bear
interest at market-related rates that are linked to financial
performance. The lenders of this credit facility
25
have been granted a negative pledge relating to the future
financial indebtedness of our company with certain permitted
encumbrances. In September 2007, we extended our credit lines by
300 million in additional short-term bilateral
commitments from lenders of the facility described above under
the same terms and conditions applicable to Tranche B.
In September 2007, Qimonda entered into a sale and leaseback
transaction of 200-millimeter equipment. The four-year lease is
accounted for as a capital lease, whereby the present value of
the lease payments is reflected as a capital lease obligation.
At September 30, 2007, we were in compliance with our debt
covenants under the relevant facilities.
We plan to fund our working capital and capital requirements
from cash provided by operations, available funds, bank loans,
government subsidies and, if needed, the issuance of additional
debt or equity securities. We have also applied for governmental
subsidies in connection with certain capital expenditure
projects, but can provide no assurance that such subsidies will
be granted on a timely basis or at all. We can provide no
assurance that we will be able to obtain additional financing
for our research and development, working capital or investment
requirements or that any such financing, if available, will be
on terms favorable to us.
Taking into consideration the financial resources available to
us, including our internally generated funds and currently
available banking facilities, we believe that we will be in a
position to fund our capital requirements in the 2008 fiscal
year.
Pension Plan
Funding
Our projected pension benefit obligation, which considers future
compensation increases, amounted to 469 million at
September 30, 2007, compared to 518 million at
September 30, 2006. The fair value of plan assets as of
September 30, 2007 was 412 million, compared to
320 million as of September 30, 2006.
The actual return on plan assets between the last measurement
dates amounted to 9.6 percent, or 27 million,
for domestic (German) plans and 9.8 percent, or
4 million, for foreign plans, compared to the
expected return on plan assets for that period of
6.1 percent for domestic plans and 6.9 percent for
foreign plans. We have estimated the return on plan assets for
the next fiscal year to be 6.5 percent, or
24 million, for domestic plans and 7.0 percent,
or 3 million, for foreign plans.
At September 30, 2006 and 2007, the combined funding status
of our pension plans reflected an under-funding of
198 million and 57 million, respectively.
Due to the significant improvement of the combined funding
status of our pension plans, we intend to make lower
contributions to our pension plans during the 2008 fiscal year,
compared to those made during the 2007 fiscal year.
Our investment approach with respect to the pension plans
involves employing a sufficient level of flexibility to capture
investment opportunities as they occur, while maintaining
reasonable parameters to ensure that prudence and care are
exercised in the execution of the investment program. The
pension plans assets are invested with several investment
managers. The plans employ a mix of active and passive
investment management programs. Considering the duration of the
underlying liabilities, a portfolio of investments of plan
assets in equity securities, debt securities and other assets is
targeted to maximize the long-term return on plan assets for a
given level of risk. Investment risk is monitored on an ongoing
basis through periodic portfolio reviews, meetings with
investment managers and liability measurements. Investment
policies and strategies are periodically reviewed to ensure the
objectives of the plans are met considering any changes in
benefit plan design, market conditions or other material items.
Our asset allocation targets for pension plan assets are based
on our assessment of business and financial conditions,
demographic and actuarial data, funding characteristics, related
risk factors, market sensitivity analyses and other relevant
factors. The overall allocation is expected to help protect the
plans level of funding while generating sufficiently
stable real returns (i.e., net of inflation) to meet current and
future benefit payment needs. Due to active portfolio
management, the asset allocation may differ from the
26
target allocation up to certain limits. As a matter of policy,
our pension plans do not invest in Infineon or Qimonda shares.
Financial
Instruments
We periodically enter into derivatives, including foreign
currency forward and option contracts as well as interest rate
swap agreements. The objective of these transactions is to
reduce the impact of interest rate and exchange rate
fluctuations on our foreign currency denominated net future cash
flows. We do not enter into derivatives for trading or
speculative purposes.
The following table indicates the composition of our workforce
by function and region at the end of the fiscal years indicated.
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
As of September 30,
|
|
|
|
2005
|
|
|
2006
|
|
|
2007
|
|
|
Function:
|
|
|
|
|
|
|
|
|
|
|
|
|
Production
|
|
|
25,114
|
|
|
|
29,641
|
|
|
|
30,210
|
|
Research & Development
|
|
|
7,401
|
|
|
|
7,745
|
|
|
|
8,339
|
|
Sales & Marketing
|
|
|
2,016
|
|
|
|
2,101
|
|
|
|
2,223
|
|
Administrative
|
|
|
1,909
|
|
|
|
2,164
|
|
|
|
2,307
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Total
|
|
|
36,440
|
|
|
|
41,651
|
|
|
|
43,079
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Region:
|
|
|
|
|
|
|
|
|
|
|
|
|
Germany
|
|
|
16,119
|
|
|
|
15,736
|
|
|
|
15,223
|
|
Europe
|
|
|
5,482
|
|
|
|
7,244
|
|
|
|
7,739
|
|
North America
|
|
|
3,193
|
|
|
|
3,295
|
|
|
|
3,536
|
|
Asia/Pacific
|
|
|
11,451
|
|
|
|
15,148
|
|
|
|
16,365
|
|
Japan
|
|
|
158
|
|
|
|
187
|
|
|
|
216
|
|
Other
|
|
|
37
|
|
|
|
41
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Total
|
|
|
36,440
|
|
|
|
41,651
|
|
|
|
43,079
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Of the total workforce, 9,606, 11,802 and 13,481 as of
September 30, 2005, 2006 and 2007, respectively, were
employees of Qimonda.
In the 2005 and 2006 fiscal years, our headcount increased
principally due to the expansion of manufacturing capacities in
Malaysia and China. The increase of our headcount in Europe
during the 2006 fiscal year resulted mainly from the first-time
consolidation of ALTIS as of December 31, 2005. In the 2007
fiscal year, the number of employees in our logic segments
decreased in Germany primarily as a result of the phase out of
manufacturing at Munich-Perlach, and the restructuring program
initiated following the insolvency of BenQs German
subsidiary, but increased in the Asia/Pacific region due to
expansion of production in Kulim, Malaysia, and research and
development in Malaysia and China. With respect to Qimonda, its
number of employees increased by approximately 1,700 principally
due to capacity increases especially in the production areas in
Suzhou, Porto and Dresden.
Critical
Accounting Policies
Our results of operations and financial condition are dependent
upon accounting methods, assumptions and estimates that we use
as a basis for the preparation of our consolidated financial
statements. We have identified the following critical accounting
policies and related assumptions, estimates and uncertainties,
which we believe are essential to understanding the underlying
financial reporting risks and the impact that these accounting
methods, assumptions, estimates and uncertainties have on our
reported financial results.
27
Revenue
Recognition
We generally market our products to a wide variety of customers
and a network of distributors. Our policy is to record revenue
when persuasive evidence of an arrangement exists, the price is
fixed or determinable, shipment is made and collectibility is
reasonably assured. We record reductions to revenue for
estimated product returns and allowances for discounts and price
protection, based on actual historical experience, at the time
the related revenue is recognized. We establish reserves for
sales discounts, price protection allowances and product returns
based upon our evaluation of a variety of factors, including
industry demand. This process requires the exercise of
substantial judgments in evaluating the above-mentioned factors
and requires material estimates, including forecasted demand,
returns and industry pricing assumptions.
In future periods, we may be required to accrue additional
provisions due to (1) deterioration in the semiconductor
pricing environment, (2) reductions in anticipated demand
for semiconductor products or (3) lack of market acceptance
for new products. If these or other factors result in a
significant adjustment to sales discount and price protection
allowances, they could significantly impact our future operating
results.
We have entered into licensing agreements for our technology in
the past, and anticipate that we will increase our efforts to
monetize the value of our technology in the future. As with
certain of our existing licensing agreements, any new licensing
arrangements may include capacity reservation agreements with
the licensee. Such transactions could represent multiple element
arrangements pursuant to SEC Staff Accounting Bulletin
(SAB) 104, Revenue Recognition,
and Emerging Issues Task Force (EITF) Issue
No. 00-21,
Revenue Arrangements with Multiple Elements.
The process of determining the appropriate revenue recognition
in such transactions is highly complex and requires significant
judgment, which includes evaluating material estimates in the
determination of fair value and the level of our continuing
involvement.
Recoverability
of Long-Lived Assets
Our business is extremely capital-intensive, and requires a
significant investment in property, plant and equipment. Due to
rapid technological change in the semiconductor industry, we
anticipate the level of capital expenditures to be significant
in future periods. During the 2007 fiscal year, we spent
1,375 million on purchases of property, plant and
equipment. At September 30, 2007, the carrying value of our
property, plant and equipment was 3,647 million. We
have acquired other businesses, which resulted in the generation
of significant amounts of long-lived intangible assets,
including goodwill. At September 30, 2007, we had
long-lived intangible assets of 232 million.
In accordance with the provisions of Financial Accounting
Standards Board (FASB) Statement of Financial
Accounting Standards (SFAS) No. 142,
Goodwill and Other Intangible Assets, we test
goodwill and indefinite life intangible assets for impairment at
least once a year.
We also review long-lived assets, including intangible assets,
for impairment when events or changes in circumstances indicate
that the carrying value of an asset may not be recoverable.
Recoverability of assets to be held and used is measured by a
comparison of the carrying value of an asset to future net cash
flows expected to be generated by the asset. If such assets are
considered to be impaired, the impairment recognized is measured
by the amount by which the carrying value of the assets exceeds
the fair value of the assets. Estimated fair value is generally
based on either appraised value or discounted estimated future
cash flows. Considerable management judgment is necessary to
estimate discounted future cash flows.
We tested goodwill for impairment and recognized impairment
charges of 18 million and 7 million during
the fiscal years ended September 30, 2005 and 2006,
respectively. The goodwill impairment charges in the 2006 fiscal
year related primarily to our acquisition of Savan and Sci-Worx,
while the impairment charges in the 2005 fiscal year related
primarily to goodwill arising from our acquisition of ADMtek
Inc. in 2004. We did not recognize any material goodwill
impairment charges in the 2007 fiscal year.
28
Valuation of
Inventory
Historically, the semiconductor industry has experienced periods
of extreme volatility in product demand and in industry
capacity, resulting in significant price fluctuations. Since
semiconductor demand is concentrated in such highly-volatile
industries as wireless communications, wireline communications
and the computer industry, this volatility can be extreme. This
volatility has also resulted in significant fluctuations in
price within relatively short time-frames. The average daily
spot market price for 512 Mbit DRAM as reported
by DRAMeXchange fell from US$6.36 on December 29, 2006 to
US$1.70 on May 22, 2007, a drop of 73.3 percent in
less than five months. We believe that a part of this price
decline, especially towards the end of March 2007, was driven by
seasonal demand weakness, the effects of an earlier
build-up of
inventories at OEMs ahead of the introduction of the new Windows
Vista computer operating system, and capacity conversions from
NAND to DRAM by some competitors, following severe price erosion
in the NAND flash area. During the three months ended
June 30, 2007, the price decline continued and was
amplified by strong DRAM output growth across the industry,
driven, we believe, mostly by capacity increases and technology
conversions to more efficient technologies. Although prices for
DRAM products improved slightly in July 2007 as compared to June
2007, in August 2007 market prices resumed the decline and the
average daily spot market price for 512 Mbit
DRAM as reported by DRAMeXchange declined to US$1.45 on
September 27, 2007.
As a matter of policy, we value inventory at the lower of cost
or market price. We review the recoverability of inventory based
on regular monitoring of the size and composition of inventory
positions, current economic events and market conditions,
projected future product demand, and the pricing environment.
This evaluation is inherently judgmental and requires material
estimates, including both forecasted product demand and pricing
environment, both of which may be susceptible to significant
change. At September 30, 2007, total inventory was
1,217 million.
In future periods, write-downs of inventory may be necessary due
to (1) reduced semiconductor demand in the industries we
serve, including the computer industry and the wireless and
wireline communications industries, (2) technological
obsolescence due to rapid developments of new products and
technological improvements, or (3) changes in economic or
other events and conditions that impact the market price for our
products. These factors could result in adjustments to the
valuation of inventory in future periods, and significantly
impact our future operating results.
Recoverability
of Long-Term Investments
We have made a series of investments in companies that are
principally engaged in the research and development, design, and
manufacture of semiconductors and related products. At
September 30, 2007, the carrying value of our long-term
investments totaled 652 million.
Our accounting policy is to record an impairment of investments
when the decline in fair value below carrying value is
other-than-temporary. We assess declines in the value of
investments to determine whether such decline is
other-than-temporary, thereby rendering the investment impaired.
This assessment is made by considering available evidence
including changes in general market conditions, specific
industry and investee data, the length of time and the extent to
which the fair value has been less than cost, and our intent and
ability to hold the investment for a period of time sufficient
to allow for any anticipated recovery in fair value. We did not
incur any material impairment charges of long-term investments
in the 2007 fiscal year as a result of such impairment tests.
At September 30, 2007, our most significant long-term
investment was Qimondas investment in Inotera, which is a
publicly traded joint venture with Nanya.
The high cyclicality in the semiconductor industry could
adversely impact the operations of these investments and their
ability to generate future net cash flows. Furthermore, to the
extent that these investments are not publicly traded, further
judgments and estimates are required to determine their fair
value. As a result, potential impairment charges to write-down
such investments to net realizable value could adversely affect
our future operating results.
29
While we have recognized all declines that are believed to be
other-than-temporary, it is reasonably possible that individual
investments in our portfolio may experience an
other-than-temporary decline in value in the future if the
underlying investee experiences poor operating results or the
global equity markets experience future broad declines in value.
Realization of
Deferred Tax Assets
At September 30, 2007, total net deferred tax assets were
598 million. Included in this amount are the tax
benefits of net operating loss and credit carry-forwards of
approximately 456 million, net of the valuation
allowance. These tax loss and credit carry-forwards generally do
not expire under current law.
We evaluate our deferred tax asset position and the need for a
valuation allowance on a regular basis. The assessment requires
the exercise of judgment on the part of our management with
respect to, among other things, benefits that could be realized
from available tax strategies and future taxable income, as well
as other positive and negative factors. The ultimate realization
of deferred tax assets is dependent upon our ability to generate
the appropriate character of future taxable income sufficient to
utilize loss carry-forwards or tax credits before their
expiration. Since we have incurred a cumulative loss in certain
tax jurisdictions over the three-year period ended
September 30, 2007, the impact of forecasted future taxable
income is excluded from such an assessment. For these tax
jurisdictions, the assessment was therefore based only on the
benefits that could be realized from available tax strategies
and the reversal of temporary differences in future periods.
As a result of this assessment, we increased the deferred tax
asset valuation allowance in the 2006 and 2007 fiscal years by
292 million and 226 million, respectively,
in order to reduce the deferred tax asset to an amount that is
more likely than not expected to be realized in the future. We
expect to continue to recognize low levels of deferred tax
benefits in the 2008 fiscal year, until such time as taxable
income is generated in tax jurisdictions that would enable us to
utilize our tax loss carry-forwards in those jurisdictions.
The recorded amount of total deferred tax assets could be
reduced if our estimates of projected future taxable income and
benefits from available tax strategies are lowered, or if
changes in current tax regulations are enacted that impose
restrictions on the timing or extent of our ability to utilize
tax loss and credit carry-forwards in the future.
Purchase
Accounting
We have acquired businesses, including the DSL CPE business of
TI in the 2007 fiscal year. This acquisition did not result in
any in-process research and development costs, but generated
long-lived intangible assets and goodwill.
Accounting for business combinations requires the allocation of
the purchase price to identifiable tangible and intangible
assets and liabilities based upon their fair value. The
allocation of purchase price is highly judgmental, and requires
the extensive use of estimates and fair value assumptions, which
can have a significant impact on operating results.
Pension Plan
Accounting
Our pension benefit costs are determined in accordance with
actuarial computations using the
projected-unit-credit
method, which rely on assumptions including discount rates and
expected return on plan assets. Discount rates are established
based on prevailing market rates for high-quality fixed-income
instruments that, if the pension benefit obligation were settled
at the measurement date, would provide the necessary future cash
flows to pay the benefit obligation when due. The expected
return on plan assets assumption is determined on a uniform
basis, considering long-term historical returns, asset
allocation, and future estimates of long-term investment
returns. Other key assumptions for our pension costs are based
on current market conditions. A significant variation in one or
more of these underlying assumptions could have a material
effect on the measurement of our long-term obligation.
30
We account for our pension-benefit liabilities and related
postretirement benefit costs pursuant to SFAS No. 87,
Employers Accounting for Pensions. We
offer defined benefit pension plans, which generally specify the
amount of pension benefit that each employee will receive for
services performed during a specified period of employment. The
amount of the employers periodic contribution to a defined
benefit pension plan is based on the total pension benefits that
could be earned by all eligible participants.
Generally, if our total contribution to our pension plans for
the period is not equal to the amount of net periodic pension
cost as determined by the provisions of SFAS No. 87,
we recognize the difference either as a liability or as an
asset. Effective September 30, 2007, we adopted the
recognition provision of SFAS No. 158,
Employers Accounting for Defined Benefit Pension
and Other Postretirement Plans an amendment of FASB
Statements No. 87, 88, 106, and 132(R), whereby
we recognize the over-funded or under-funded status of our
defined benefit postretirement plans as an asset or liability in
our consolidated balance sheet. Changes in funded status will be
recognized in the year in which the changes occur through other
comprehensive income.
Consolidated Balance Sheets. Defined
benefit plans determine the entitlements of their beneficiaries.
The net present value of the total fixed benefits for service
already rendered is represented by the actuarially calculated
accumulated benefit obligation (ABO).
An employees final benefit entitlement at regular
retirement age may be higher than the fixed benefits at the
measurement date due to future compensation or benefit
increases. The net present value of this ultimate future benefit
entitlement for service already rendered is represented by the
projected benefit obligation (PBO), which is
actuarially calculated with consideration for future
compensation increases.
The pension liabilities are equal to the PBO when the
assumptions used to calculate the PBO such as discount rate,
compensation increase rate and projected future pension
increases are achieved. In the case of funded plans, the market
value of the external assets is offset against the benefit
obligations. The net liability or asset recorded on the
consolidated balance sheets is equal to the under- or
over-funding of the PBO in this case, when the expected return
on plan assets is subsequently realized.
Differences between actual experience and the assumptions made
for the compensation increase rate and projected future pension
increases, as well as the differences between actual and
expected returns on plan assets, generally result in the
unrecognized actuarial gains or losses, which are reflected as a
separate component of shareholders equity.
Consolidated Statements of
Operations. The recognized expense related to
pension plans and similar commitments in the consolidated
statements of operations is referred to as net periodic pension
cost (NPPC) and consists of several separately
calculated and presented components, including service cost,
which is the actuarial net present value of the part of the PBO
for the service rendered in the respective fiscal year; the
interest cost for the expense derived from the addition of
accrued interest on the PBO at the end of the preceding fiscal
year on the basis of the identified discount rate; and the
expected return on plan assets in the case of funded benefit
plans. Actuarial gains and losses, resulting for example from an
adjustment of the discount rate, and asset gains and losses,
resulting from a deviation of actual and expected return on plan
assets, are included in the net pension cost for the fiscal year
if, as of the beginning of the fiscal year, the unrecognized net
gains or losses exceed 10 percent of the greater of the
projected benefit obligation or the market value of the plan
assets. The amortization is the excess divided by the average
remaining service period of active employees expected to receive
benefits under the plan.
In the consolidated statements of operations, NPPC is allocated
among functional costs (cost of sales, research and development
expenses, selling and general administrative expenses),
according to the function of the employee groups accruing
benefits.
In the consolidated statements of operations, NPPC expenses
before income taxes for our pension plans for the fiscal years
ended September 30, 2005, 2006 and 2007, were
28 million, 37 million and
41 million, respectively.
31
The consolidated balance sheets include the following
significant components related to pension plans and similar
commitments:
|
|
|
|
|
|
|
|
|
|
|
As of September 30,
|
|
|
|
2006
|
|
|
2007
|
|
|
|
( in millions)
|
|
|
Accumulated other comprehensive income
|
|
|
87
|
|
|
|
42
|
|
Less income tax effect
|
|
|
|
|
|
|
3
|
|
|
|
|
|
|
|
|
|
|
Accumulated other comprehensive income, net of income taxes
|
|
|
87
|
|
|
|
45
|
|
|
|
|
|
|
|
|
|
|
Non-current pension assets
|
|
|
|
|
|
|
60
|
|
Current pension liabilities
|
|
|
|
|
|
|
5
|
|
Non-current pension liabilities
|
|
|
134
|
|
|
|
111
|
|
Consolidated Statements of Cash
Flows. We make payments directly to the
participants in the case of unfunded benefit plans and the
payments are included in net cash used in operating activities.
For funded pension plans, the participants are paid by the
external pension fund and accordingly these payments are cash
neutral to us. In this case, our regular funding (service cost)
and supplemental cash contributions result in net cash used in
operating activities.
In the consolidated statements of cash flows, our principal
pension and other postretirement benefits resulted in net cash
used in operating activities of 4 million,
5 million and 8 million in the fiscal
years ended September 30, 2005, 2006 and 2007, respectively.
Pension benefits Sensitivity
Analysis. A one percentage point change in
the established assumptions used for the calculation of the NPPC
for the 2008 fiscal year would result in the following impact on
the NPPC for the 2008 fiscal year:
|
|
|
|
|
|
|
|
|
|
|
Effect on net periodic pension costs
|
|
|
|
One percentage
|
|
|
One percentage
|
|
|
|
increase
|
|
|
decrease
|
|
|
|
( in millions)
|
|
|
Discount rate
|
|
|
(5
|
)
|
|
|
3
|
|
Rate of compensation increase
|
|
|
3
|
|
|
|
(4
|
)
|
Rate of projected future pension increases
|
|
|
1
|
|
|
|
(2
|
)
|
Expected return on plan assets
|
|
|
(4
|
)
|
|
|
4
|
|
Increases and decreases in the discount rate, rate of
compensation increase and rate of projected future pension
increases which are used in determining the PBO do not have a
symmetrical effect on NPPC primarily due to the compound
interest effect created when determining the present value of
the future pension benefit. If more than one of the assumptions
were changed simultaneously, the impact would not necessarily be
the same as would be the case if only one assumption were
changed in isolation.
For a discussion of our current funding status and the impact of
these critical assumptions, see note 32 to our consolidated
financial statements for the year ended September 30, 2007.
Contingencies
We are subject to various legal actions and claims, including
intellectual property matters, that arise in and outside the
normal course of business. Current proceedings are described
under the heading Business Legal Matters.
We regularly assess the likelihood of any adverse outcome or
judgments related to these matters, as well as estimating the
range of possible losses and recoveries. Liabilities, including
accruals for significant litigation costs, related to legal
proceedings are recorded when it is probable that a liability
has been incurred and the associated amount of the loss can be
reasonably estimated. Where the estimated amount of loss is
within a range of amounts and no amount within the range is a
better estimate than any other amount or the range cannot be
estimated, the minimum amount is accrued. Accordingly, we have
accrued
32
a liability and charged operating income in the accompanying
consolidated financial statements related to certain asserted
and unasserted claims existing as of each balance sheet date. As
additional information becomes available, any potential
liability related to these actions is assessed and the estimates
are revised, if necessary. These accrued liabilities would be
subject to change in the future based on new developments in
each matter, or changes in circumstances, which could have a
material impact on our results of operations, financial position
and cash flows.
Recent
Accounting Pronouncements
In June 2006, the FASB issued Interpretation No. 48,
Accounting for Uncertainty in Income Taxes
an Interpretation of FASB Statement 109
(FIN 48), which defines the threshold for
recognizing the benefits of tax return positions in the
financial statements as more-likely-than-not to be
sustained by the taxing authority. The recently issued
literature also provides guidance on the derecognition,
measurement and classification of income tax uncertainties,
along with any related interest and penalties. FIN 48 also
includes guidance concerning accounting for income tax
uncertainties in interim periods and increases the level of
disclosures associated with any recorded income tax uncertainty.
The differences between the amounts recognized in the statements
of financial position prior to the adoption of FIN 48 and
the amounts reported after adoption will be accounted for as a
cumulative-effect adjustment recorded to the beginning balance
of retained earnings. The provisions of FIN 48 are
effective for us as of October 1, 2007. We are in the
process of determining the impact, if any, that the adoption of
FIN 48 will have on our companys consolidated
financial position and results of operations.
In September 2006, the FASB released SFAS No. 157,
Fair Value Measurements, which provides
guidance for using fair value to measure assets and liabilities.
SFAS No. 157 defines fair value, establishes a
framework for measuring fair value in generally accepted
accounting principles, and expands disclosures about fair value
measurements. The standard also responds to investors
requests for more information about the extent to which
companies measure assets and liabilities at fair value, the
information used to measure fair value, and the effect that fair
value measurements have on earnings. SFAS No. 157 will
apply whenever another standard requires (or permits) assets or
liabilities to be measured at fair value. The standard does not
expand the use of fair value to any new circumstances.
SFAS No. 157 is effective for our company in the
fiscal year beginning on October 1, 2008, and interim
periods within that fiscal year. We will adopt
SFAS No. 157 on October 1, 2008 on a prospective
basis.
In September 2006, the FASB issued SFAS No. 158,
Employers Accounting for Defined Benefit Pension
and Other Postretirement Plans an amendment of FASB
Statements No. 87, 88, 106, and 132(R), which
requires an employer to recognize the overfunded or underfunded
status of a defined benefit postretirement plan (other than a
multiemployer plan) as an asset or liability in its statement of
financial position and to recognize changes in that funded
status in the year in which the changes occur through
comprehensive income of a business entity or changes in
unrestricted net assets of a not-for-profit organization
(Recognition Provision). We adopted the Recognition
Provision of SFAS No. 158 as of the end of the fiscal year
ended September 30, 2007. The incremental effects of the
implementation of the Recognition Provision on the individual
line items in the September 30, 2007 consolidated balance
sheet are shown in note 32 to our consolidated financial
statements. SFAS No. 158 also requires an employer to
measure the funded status of a plan as of the date of its
year-end statement of financial position, with limited
exceptions (Measurement Date Provision). We
currently measure the funded status of our plans annually on
June 30. The Measurement Date Provision is effective for
our company as of the end of the fiscal year ending
September 30, 2009. We do not expect the change in the
annual measurement date to September 30 to have a
significant impact on our consolidated financial position and
results of operations.
In February 2007, the FASB issued SFAS No. 159,
The Fair Value Option for Financial Assets and
Financial Liabilities including an amendment of FASB
Statement No. 115. SFAS No. 159 permits
entities to choose to measure certain financial assets and
liabilities and other eligible items at fair value, which are
not otherwise currently required to be measured at fair value.
Under SFAS No. 159, the decision to measure items at
fair value is made at specified election dates on an irrevocable
instrument-by-instrument
basis. Entities electing the fair value option would be required
to recognize changes in fair value in
33
earnings and to expense upfront cost and fees associated with
the item for which the fair value option is elected. Entities
electing the fair value option are required to distinguish on
the face of the statement of financial position, the fair value
of assets and liabilities for which the fair value option has
been elected and similar assets and liabilities measured using
another measurement attribute. If elected,
SFAS No. 159 is effective as of the beginning of the
first fiscal year that begins after November 15, 2007, with
earlier adoption permitted as of the beginning of a fiscal year
provided that the entity also early adopts all of the
requirements of SFAS No. 157. We are currently
evaluating whether to elect the option provided for in this
standard.
International
Financial Reporting Standards (IFRS)
Pursuant to a regulation of the European Union (the
EU) and the German Commercial Code, we will be
required to report our consolidated financial statements in
accordance with International Financial Reporting Standards
(IFRS) no later than for the fiscal year ending
September 30, 2008.
We will prepare our first IFRS consolidated statements as of
September 30, 2008 as required by the EU and the German
Commercial Code. As of the date of this report, we have
substantially completed the identification of differences
between U.S. GAAP and IFRS with respect to accounting
standards that were final and effective as of September 30,
2007. However, the impact of the adoption of IFRS on our company
will be subject to the issuance of final versions of IFRS
standards that currently have draft status, and the degree of
convergence achieved between U.S. GAAP and IFRS by the date
of adoption. Accordingly, we are not yet in a position to
provide a complete quantitative analysis of the impact that the
adoption of IFRS will have on our consolidated financial
statements.
The primary differences between U.S. GAAP and IFRS
standards that were final and effective as of September 30,
2007, which would have impacted our companys consolidated
financial statements as of and for the year ended
September 30, 2007, are the following:
|
|
|
|
|
Under U.S. GAAP, development costs are expensed as
incurred. IFRS requires capitalization and amortization of
development costs when specific criteria are met.
|
|
|
|
Our convertible and exchangeable subordinated notes are
accounted for differently under U.S. GAAP and IFRS. Under
U.S. GAAP, the convertible and exchangeable subordinated
notes are recorded in their entirety as debt and accreted to
face value through maturity. In contrast to U.S. GAAP,
under IFRS the convertible and exchangeable notes are considered
hybrid financial instruments that require bifurcation into a
debt component which is accreted through maturity, and a
conversion right component which is classified as equity.
|
|
|
|
Employee benefits are accounted for differently under
U.S. GAAP and IFRS. We currently intend to adopt the so
called SoRIE approach (Statement of Recognized Income and
Expense) under IAS 19, Employee
Benefits, for accounting for pension and other post
employment benefits. Under the SoRIE approach, the funded status
of defined benefit plans is recognized in the consolidated
balance sheets, and actuarial gains and losses are recorded in a
consolidated statement of recognized income and
expense which is presented in lieu of a statement in
changes of equity. Unlike U.S. GAAP, under the IFRS
application of the SoRIE approach there is no recycling of
actuarial gains and losses previously recorded in the statement
of other comprehensive income (loss) through the consolidated
statements of operations in subsequent periods.
|
|
|
|
The adjustments described above will also result in differences
between the carrying amount of assets and liabilities in the
consolidated financial statements and their tax bases, which
will give rise to additional deferred tax assets and
liabilities. Furthermore, there are additional differences
between U.S. GAAP and IFRS in areas of accounting such as
deferred tax treatment of intra-group transfers and temporary
differences arising at the initial recognition of certain assets
and liabilities.
|
The above listing of differences between U.S. GAAP and IFRS
standards that are expected to impact our company is not
intended to be all-inclusive. We caution you that a number of
important factors could cause actual results or outcomes to
differ materially from those expressed above.
34
Quantitative
and Qualitative Disclosure about Market Risk
The following discussion should be read in conjunction with
notes 2, 33 and 34 to our consolidated financial statements
for the year ended September 30, 2007.
Market risk is the risk of loss related to adverse changes in
market prices of financial instruments, including those related
to commodity prices, foreign exchange rates and interest rates.
We are exposed to various financial market risks in the ordinary
course of business transactions, primarily resulting from
changes in commodity prices, foreign exchange rates and interest
rates. We enter into diverse financial transactions with
multiple counterparties to limit such risks. Derivative
instruments are used only for hedging purposes and not for
trading or speculative purposes.
Commodity
Price Risk
A significant portion of the business of Qimonda is exposed to
fluctuations in market prices for standard DRAM products. For
these products, the sales price responds to market forces in a
way similar to that of other commodities. This price volatility
can be extreme and has resulted in significant fluctuations
within relatively short time-frames. Qimonda attempts to
mitigate the effects of volatility by continuously improving its
cost position, by entering into new strategic partnerships and
by focusing its product portfolio on application-specific
products that are subject to less volatility, such as DRAM
products for infrastructure, graphics, mobile and consumer
applications.
We are also exposed to commodity price risks with respect to raw
materials used in the manufacture of our products. We seek to
minimize these risks through our sourcing policies (including
the use of multiple sources, where possible) and our operating
procedures. We do not use derivative financial instruments to
manage any exposure to fluctuations in commodity prices
remaining after the operating measures we describe above.
Foreign
Exchange and Interest Risk
Although we prepare our consolidated financial statements in
Euro, major portions of our sales volumes as well as costs
relating to the design, production and manufacturing of products
are denominated in U.S. dollars. As a multinational
company, our activities in markets around the world create cash
flows in a number of different currencies. Exchange rate
fluctuations may have substantial effects on our sales, our
costs and our overall results of operations.
35
The table below provides information about our derivative
financial instruments that are sensitive to changes in foreign
currency exchange and interest rates as of the end of our 2007
fiscal year. For foreign currency exchange forward contracts
related to certain sale and purchase transactions and debt
service payments denominated in foreign currencies, the table
presents the notional amounts and the weighted average
contractual foreign exchange rates. At September 30, 2007,
our foreign currency forward contracts mainly had terms up to
one year. Our interest rate swaps expire in 2008. We do not
enter into derivatives for trading or speculative purposes.
Derivative
Financial Instruments
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Average
|
|
|
|
|
|
|
|
|
|
contractual
|
|
|
Fair value
|
|
|
|
Contract amount
|
|
|
forward
|
|
|
September 28,
|
|
|
|
buy/(sell)
|
|
|
exchange rate
|
|
|
2007
|
|
|
|
( in millions)
|
|
|
|
|
|
( in millions)
|
|
|
Foreign currency forward contracts:
|
|
|
|
|
|
|
|
|
|
|
|
|
U.S. dollar
|
|
|
356
|
|
|
|
1.34147
|
|
|
|
(20
|
)
|
U.S. dollar
|
|
|
(735
|
)
|
|
|
1.37113
|
|
|
|
25
|
|
Japanese yen
|
|
|
73
|
|
|
|
157.56630
|
|
|
|
(2
|
)
|
Japanese yen
|
|
|
(17
|
)
|
|
|
159.56780
|
|
|
|
|
|
Singapore dollar
|
|
|
24
|
|
|
|
2.07241
|
|
|
|
|
|
Great Britain pound
|
|
|
6
|
|
|
|
2.10100
|
|
|
|
|
|
Malaysian ringgit
|
|
|
83
|
|
|
|
4.74346
|
|
|
|
(2
|
)
|
Malaysian ringgit
|
|
|
(3
|
)
|
|
|
4.78000
|
|
|
|
|
|
Norwegian krone
|
|
|
7
|
|
|
|
7.94509
|
|
|
|
|
|
Norwegian krone
|
|
|
(2
|
)
|
|
|
7.92011
|
|
|
|
|
|
Other currencies
|
|
|
1
|
|
|
|
|
|
|
|
|
|
Interest rate swaps
|
|
|
700
|
|
|
|
n/a
|
|
|
|
(10
|
)
|
Other
|
|
|
231
|
|
|
|
n/a
|
|
|
|
20
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Fair value, net
|
|
|
|
|
|
|
|
|
|
|
11
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Our policy with respect to limiting short-term foreign currency
exposure generally is to economically hedge at least
75 percent of our estimated net exposure for a minimum
period of two months in advance and, depending on the nature of
the underlying transactions, a significant portion for the
periods thereafter. Part of our foreign currency exposure cannot
be mitigated due to differences between actual and forecasted
amounts. We calculate this net exposure on a cash-flow basis
considering balance sheet items, actual orders received or made
and all other planned revenues and expenses.
We record our derivative instruments according to the provisions
of SFAS No. 133, Accounting for Derivative
Instruments and Hedging Activities, as amended.
SFAS No. 133 requires all derivative instruments to be
recorded on the balance sheet at their fair value. Gains and
losses resulting from changes in the fair values of those
derivatives are accounted for depending on the use of the
derivative instrument and whether it qualifies for hedge
accounting. Our economic hedges are generally not considered
hedges under SFAS No. 133. Under our economic hedging
strategy we report derivatives at fair value in our consolidated
financial statements, with changes in fair values recorded in
earnings.
In the 2007 fiscal year, foreign exchange transaction losses
were 47 million and were offset by gains from our
economic hedge transactions of 39 million, resulting
in net foreign exchange losses of 8 million. This
compares to foreign exchange losses of 65 million,
fully offset by economic hedge transactions of
65 million in the 2006 fiscal year. A large portion
of our manufacturing, selling and marketing, general and
administrative, and research and development expenses are
incurred in currencies other than the Euro, primarily the
U.S. dollar and Japanese yen. Fluctuations in the exchange
rates of these currencies to the Euro had an effect on
profitability in the 2005, 2006 and 2007 fiscal years.
36
Interest Rate
Risk
We are exposed to interest rate risk through our debt
instruments, fixed term deposits and loans. During the 2003
fiscal year, we issued convertible subordinated notes and in the
2007 fiscal year we issued subordinated notes exchangeable for
Qimonda shares. Due to the high volatility of our core business
and to maintain high operational flexibility, we keep a
substantial amount of cash and marketable securities. These
assets are mainly invested in instruments with contractual
maturities ranging from three to twelve months, bearing interest
at short-term rates. To reduce the risk caused by changes in
market interest rates, we attempt to align the duration of the
interest rates of our debts and current assets by the use of
interest rate derivatives.
Fluctuating interest rates have an impact on parts of each of
our marketable securities, debt obligations and standby lines of
credit. We make use of derivative instruments such as interest
rate swaps to hedge against adverse interest rate developments.
We have entered into interest rate swap agreements that
primarily convert the fixed interest rate on our convertible
subordinated notes to a variable interest rate based on the
relevant European Interbank Offering Rate (EURIBOR).
Industry
Environment and Outlook
Most analysts expect the semiconductor market growth to
accelerate in 2008. WSTS, for instance, projects the market to
grow on the basis of the U.S. dollar by 9 percent in
2008 (2007: 4 percent), and then by 6 percent in 2009
(WSTS projection, November 2007). Automotive and industrial
applications, and within those particularly solutions to
increase energy efficiency and security, continue to account for
a large portion of this growth. Cell phones continue to drive
growth in the wireless communications business, boosted by the
shift to UMTS technology. Analysts expect the wireline
communications business to be positively influenced by the
market for broadband and home network equipment. This business
is expected to contribute positively to growth. PCs remain the
driving force behind the data technology arena. The new
applications of nearly all new PCs serve to increase hardware
requirements and thus the demand for a large number of
components. The area of entertainment and consumer electronics
is also expected to grow over the next two years.
Outlook for
Infineon excluding Qimonda
Significant planning assumptions: When
preparing this outlook, we made certain important planning
assumptions for Infineon excluding Qimonda. In particular, we
assumed a U.S. dollar/Euro exchange rate of 1.40 in our
business excluding Qimonda. If the U.S. dollar remains
weaker than estimated, it would further negatively impact our
results of operations. Furthermore, all projections made herein
exclude the effect of any non-ordinary gains or losses that may
be incurred, since the amount of such non-ordinary gains or
losses cannot be reliably estimated. We can only identify
significant events which could lead to non-ordinary gains or
losses. These include, among others, gains or losses that may be
realized from potential sales of Qimonda shares or other
investments and activities, impairments of investments or other
long-term assets, as well as gains or losses resulting from
general restructuring measures. Finally, it should be noted that
subsequent to the initial public offering of our majority-owned
subsidiary Qimonda, forecasts for this segment are prepared by
Qimonda, and are presented separately in this report. We believe
that the individual analysis of our memory products business is
also meaningful with respect to the price development of our
shares. We believe that the results of Qimonda will have a
significant impact on the price development of our shares for as
long as we continue to hold a significant equity interest in
Qimonda.
Net Sales of Infineon excluding Qimonda: Based
on our current plans, we expect net sales for Infineon excluding
Qimonda in the 2008 fiscal year, consisting of the segments
Automotive, Industrial & Multimarket, Communication
Solutions, Other Operating Segments and Corporate &
Eliminations, to increase by up to ten percent compared to the
2007 fiscal year. In Automotive, Industrial &
Multimarket, we expect sales to be down slightly in the 2008
fiscal year relative to the 2007 fiscal year. Within that,
healthy growth rates in the industrial business should continue
despite adverse effects from the deconsolidation of
37
our high power bipolar activities. We expect roughly stable
sales within our automotive business. Sales in the
Security & ASIC business should decline given a full
year of lower turnover levels for hard-disk ICs due to weak
demand from our main customer in this business and a full year
of lower sales levels in chip card ICs given deliberate
portfolio adjustments with less emphasis on SIM card products.
Finally, the overall adverse development of the exchange rate of
the U.S. dollar against the Euro in the 2007 fiscal year
will have a negative effect on the revenue development of the
Automotive, Industrial & Multimarket segment. Sales
for our Communication Solutions segment are expected to increase
strongly in the 2008 fiscal year compared to the 2007 fiscal
year. The growth is expected to be driven primarily by strong
demand for our mobile phone products. In addition, consolidation
effects will have a positive impact on total sales. We expect a
full years revenue from the DSL CPE activities of TI that
we acquired on July 31, 2007. In addition, our acquisition
of the mobile phone activities of LSI closed on October 24,
2007. We expect a sales contribution of between
200 million and 250 million from the LSI
business. Finally, we expect the net sales contribution of Other
Operating Segments and Corporate & Eliminations to be
negligible.
In the 2008 fiscal year and beyond, demand for our products is
expected to be driven by three strong overriding challenges for
society that we help address: Energy Efficiency, Communications
and Security. As natural resources become scarce, as the costs
of energy generation and energy consumption continue to rise,
and as environmental awareness continues to increase, people and
businesses are seeking to economize on energy usage. Our
semiconductor solutions, particularly in our automotive and our
industrial businesses, enable improved energy efficiency. At the
same time, people want to communicate and have access to the
internet in any place and at any time. We contribute to this
trend through our products and solutions in our Communication
Solutions segment. Finally, as there are more and more complex
means to access data anywhere and at any time, the need to
secure data and protect intellectual property is growing.
Likewise, the need to securely authenticate and identify users
and travelers continues to grow. We cater to this trend in our
Security and ASIC activities within our Automotive,
Industrial & Multimarket segment. All in all, we
anticipate continuing industry growth and expect our revenues in
such an environment to continue to increase relative to the 2008
fiscal year.
EBIT of Infineon excluding Qimonda: In the
2007 fiscal year, reported EBIT for Infineon excluding Qimonda
was (49) million. Included in EBIT in the 2007 fiscal
year were positive effects of 53 million, of which
29 million related to a revision of accrued personnel
cost and 20 million related to the sale of our
subsidiary Sci-Worx and the sale of our POF activities. Included
in EBIT in the 2007 fiscal year were also charges of
(181) million, of which (84) million arose
from the sale of part of our interest in Qimonda and
(80) million were related to various restructuring
measures affecting, among others, our ALTIS manufacturing
facility in France and the streamlining of our R&D
locations, and an asset write-down. In our 2009 fiscal year, we
expect an EBIT margin before non-ordinary gains and losses for
Infineon excluding Qimonda of approximately 10 percent, and
we plan to make meaningful progress towards this goal in our
2008 fiscal year.
In our Automotive, Industrial & Multimarket segment,
we reported EBIT of 300 million for the 2007 fiscal
year. Included therein were gains of 20 million
relating primarily to the sale of our POF activities, and losses
of 4 million from asset impairments. We currently
expect EBIT excluding non-ordinary gains and losses to decrease
slightly in the 2008 fiscal year in comparison to the 2007
fiscal year. Our EBIT will continue to benefit from ongoing
productivity increases and the ongoing ramp-up of our
manufacturing facility in Kulim, Malaysia. Such positive effects
are likely to be more than offset by negative effects resulting
from the unfavorable development of the U.S. dollar to Euro
exchange rate relative to the 2007 fiscal year, and from normal
price reductions that we grant our customers. In the
Communication Solutions segment, we reported EBIT of
(160) million in the 2007 fiscal year. The balance of
non-ordinary gains and losses included in this EBIT was
negligible. In the 2008 fiscal year, production
ramp-ups at
new customers will have a positive effect on EBIT. We still
expect the EBIT in the wireless business within Communication
Solutions to break-even in the first quarter of our 2008 fiscal
year. Overall in Communication Solutions, despite significant
headwinds generated by the unfavourable development of the
U.S. dollar to Euro exchange rate relative to the 2007
fiscal year, we are aiming for positive EBIT before non-ordinary
gains and losses in the 2008 fiscal year. This projection
already includes the impact of the acquisitions of the DSL
38
Customer Premises Equipment activities of TI and the mobile
phone activities of LSI. For both activities combined, we expect
to incur a low to mid double digit million Euro amount per annum
in amortization of intangible assets resulting from the
purchases of these businesses. We have included such
amortization amounts into our EBIT projection for the
Communication Solutions segment. In our Other Operating Segments
and Corporate & Eliminations combined, we reported
EBIT of (189) million for the 2007 fiscal year.
Included in this EBIT were positive effects amounting to
25 million relating mainly to a revision of accrued
personnel cost. Also included in this EBIT figure were charges
of (173) million, of which (84) million
arose from the sale of a portion of our interest in Qimonda, and
(80) million were related to various restructuring
measures affecting, for example, our ALTIS manufacturing
facility in France and the streamlining of our R&D
locations, and an asset write-down. We currently estimate the
aggregate EBIT of Other Operating Segments and
Corporate & Eliminations to be in the region of
(50) million for the 2008 fiscal year prior to
inclusion of non-ordinary gains and losses.
As stated above, we are targeting an EBIT margin of
10 percent for Infineon excluding Qimonda for the 2009
fiscal year prior to inclusion of non-ordinary gains and losses.
Within that, we believe that EBIT margins in both the
Automotive, Industrial & Multimarket and the
Communication Solutions segments will have room for improvement
relative to the 2008 fiscal year. EBIT in the Communication
Solutions segment will continue to include amortization of
intangible assets in the low to mid double digit million Euro
range per annum resulting from the acquisitions of the DSL
customer premises equipment activities and the mobile phone
products activities from TI and LSI, respectively. We expect
EBIT in Other Operating Segments and Corporate &
Eliminations combined to remain comparable to the levels seen in
the 2008 fiscal year.
Fixed assets investment and depreciation for Infineon
excluding Qimonda: We are pursuing a
differentiated manufacturing strategy for our Automotive,
Industrial & Multimarket and Communication Solutions
segments. In the context of this strategy, we will continue to
invest in manufacturing capacities for special processes, in
particular in the power semiconductor arena. In contrast, we do
not plan to invest in our own manufacturing capacities starting
with 65-nanometer structure sizes for the standard semiconductor
manufacturing process, so called CMOS technology. We anticipate
that our annual fixed assets capital investment will be within
the 400 million to 500 million range in
the 2008 fiscal year, and approximately 500 million
per year thereafter. In the 2008 fiscal year, depreciation
expense is expected to fall between 550 million and
600 million. In subsequent fiscal years we expect
annual depreciation expense to decrease further.
Expenditures for research & development for
Infineon excluding Qimonda: We expect
expenditures for research and development for Infineon excluding
Qimonda in the 2008 fiscal year to increase slightly compared to
the 2007 fiscal year, driven primarily by the impact of the
consolidation of the acquired businesses for DSL customer
premises equipment and mobile phone ICs. We expect slight
increases in R&D expenditures in our Automotive,
Industrial & Multimarket segment, predominantly in the
automotive and the industrial businesses. The introduction of
new products and the widening of the existing product portfolio
within automotive power, sensors and controls and power
management are examples of areas of emphasis within research and
development. Similarly, R&D expenses in the Communication
Solutions segment are likely to increase slightly relative to
the 2007 fiscal year. However, excluding the consolidation
effect of the two purchased businesses, we expect that R&D
expenses would decline slightly. This is due to efficiency gains
and cost reduction measures initiated after the insolvency of
one of our major customers taking effect for a full fiscal year
in 2008. The slight increase in overall Communication
Solutions R&D expenses expected for the 2008 fiscal
year results solely from the consolidation of the acquired
activities for DSL customer premises equipment and mobile phone
ICs. In the Communication Solutions segment, our R&D
spending is focused for example on developing next generation
system-on-a-chip
products and system solutions for the mobile phone as well as
the broadband access market. Another important area of our
R&D activities is process technologies that we develop in
alliances with several partners and consortia in order to
maintain a competitive technology roadmap at an affordable cost
level. Beyond the 2008 fiscal year, slight increases in
expenditures for R&D are possible, in line with anticipated
sales increases.
39
Qimonda
Segment
Qimondas revenues are a function of the bit volume it
ships and the selling price it achieves for its products. While
Qimonda has an influence over its production growth, through
capacity additions and productivity improvements, its sales
volume depends on the extent to which its product offerings
match market demand. Qimondas selling prices are a
function of the supply and demand relationship in the DRAM
market. These market forces are beyond Qimondas control
and, accordingly, it cannot reliably estimate what these future
sales prices, and the resulting revenues and the contribution to
its earnings will be.
In the first quarter of the 2008 fiscal year, Qimonda expects
its bit production to grow by approximately 5 percent,
mainly due to productivity improvements from the ongoing
conversion to 80-nanometer and
75-nanometer
technologies and including effects from declining 200-millimeter
capacities.
For the 2008 fiscal year, Qimonda expects bit demand to be
driven by the continued strong growth for DRAM in graphics,
consumer and communication applications, by price elasticity and
the move to higher density modules in the PC market. For the
2008 fiscal year, Qimonda estimates an increase in bit
production of approximately 50 percent. Qimonda targets the
share of its bit shipments for non-PC applications to be more
than 50 percent for the full fiscal year.
Qimonda is continuously taking steps to reduce its
cost-per-bit
in manufacturing, such as the introduction of advanced process
technologies featuring smaller die-sizes, the
ramp-up of
more productive 300-millimeter capacities and other cost saving
and productivity improvement measures. By the end of the first
quarter of the 2008 fiscal year, Qimonda expects more than
50 percent of its manufacturing capacity to be using
80-nanometer and smaller die sizes, and Qimonda is targeting to
increase this share to approximately 75 percent by the end
of the second quarter.
Qimonda expects to make capital expenditures in the 2008 fiscal
year ranging between 650 million and
750 million. In the years thereafter, its aim is to
have capital expenditures of approximately 15 percent to
25 percent of revenues on average over the DRAM cycle.
Depreciation and amortization during the 2008 fiscal year is
estimated to range between 700 million and
800 million, and for the years thereafter to be in
line with capital expenditures.
Research and development expenses are anticipated to be between
450 million and 490 million for the 2008
fiscal year, and approximate 10 percent of sales on average
over the DRAM cycle for the years thereafter.
On October 2, 2007, Sony Corporation and Qimonda announced
that they had signed an agreement to found the joint venture
Qreatic Design. The scope of the joint venture is the design of
high-performance, low power, embedded and customer specific
DRAMs for consumer and graphic applications. According to the
agreement, the 50:50 joint venture is intended to start with up
to 30 specialists from Sony and Qimonda, bringing together their
engineering expertise for the mutual benefit of both companies.
Qreatic Design, which will be located in Tokyo, Japan, is
planned to start operations by the end of calendar year 2007,
subject to regulatory approvals and other closing conditions,
and to substantially expand its capacities by hiring additional
designers.
On October 8, 2007, Qimonda entered into a rental agreement
for a new headquarters office south of Munich, Germany. The
agreement provides for the construction of a building by a
third-party developer-lessor, and includes a 15 year
non-cancelable lease term, which is expected to start in early
2010. Qimonda has an option to extend the lease for two
5 year periods at similar lease terms to the initial
non-cancelable lease term. The minimum rental payments aggregate
96 million over the initial lease term. The lease
provides for rent escalation in line with market-based increases
in rent. The agreement will be accounted for as an operating
lease with monthly lease payments expensed on a straight-line
basis over the lease term.
40
On October 15, 2007, the court entered an order denying the
motions to dismiss in the Unisys and the DRAM Claims Liquidation
Trust case with prejudice. On October 29, 2007, we answered
the Unisys complaint, denying liability and asserting a number
of affirmative defenses. On November 1, 2007, we answered
the DRAM Claims Liquidation Trust complaint, denying liability
and asserting a number of affirmative defenses.
On October 24, 2007, we completed our acquisition of the
mobility products business of LSI.
On October 25, 2007, 1.25 million Qimonda ADSs that
had been borrowed by an affiliate of J.P. Morgan Securities
Inc. in connection with the exchangeable subordinated notes due
2010 were returned to us.
On October 31, 2007,
Wi-LAN Inc.
filed suit in the U.S. District Court for the Eastern
District of Texas against Westell Technolgies, Inc. and 16 other
defendants, including Infineon Technologies AG and Infineon
Technologies North America Corp. The complaint alleges
infringement of 3 U.S. patents by certain wireless products
compliant with the IEEE 802.11 standards and certain ADSL
products compliant with the ITU G.992 standards, in each case
supplied by certain of the defendants.
On November 30, 2007, Qimonda cancelled its agreement with
Infineon for the production of wafers at Infineons Dresden
production facility. The agreement will terminate on
March 1, 2008.
On November 30, 2007, we completed the sale of a 40 percent
interest in our subsidiary Bipolar to Siemens.
41
You should carefully consider the risks described below
before making an investment decision. The occurrence of any of
the following events could harm us. If these events occur, the
trading price of our companys shares could decline, and
you may lose all or part of your investment. Additional risks
not currently known to us or that we now deem immaterial may
also harm us and affect your investment.
Risks related to
the semiconductor industry
We operate in
a highly cyclical industry and our business could suffer from
periodic downturns.
The semiconductor industry is highly cyclical and has suffered
significant economic downturns at various times. These downturns
have involved periods of production overcapacity, oversupply,
lower prices and lower revenues. The markets for memory products
have been especially volatile. In addition, average selling
prices for our products, particularly Qimondas standard
memory products, can fluctuate significantly from quarter to
quarter or month to month.
Following a severe downturn in 2001, worldwide sales of all
semiconductor products grew by 28 percent in 2004,
7 percent in 2005 and 9 percent in 2006. WSTS
estimates growth of approximately 4 percent for the full
2007 calendar year.
There can be no assurance that the market will continue to grow
in the near term, that the growth rates experienced in recent
past periods will be attainable again in the coming years, or
that we will be successful in managing any future downturn or
substantial decline in average selling prices, any of which
could have a material adverse effect on our results of
operations and financial condition.
Industry
overcapacity could require us to lower our prices, particularly
for Qimondas memory products.
Both semiconductor companies with their own manufacturing
facilities and semiconductor foundries, which manufacture
semiconductors designed by others, have added significant
capacity in recent years and are expected to continue to do so.
In the past, the net increases of supply sometimes exceeded
demand requirements, leading to oversupply situations and
downturns in the industry.
The average spot market price for 512 Mbit DDR2
DRAM as reported by DRAMeXchange fell in the first nine months
of the 2007 calendar year from $6.36 to $1.45, a drop of
77 percent. Downturns have severely hurt the profitability
of the industry in general, including the DRAM business of
Qimonda. Given the volatility of the semiconductor industry, we
are likely to face downturns in the future, which would likely
have similar effects. Fluctuations in the rate at which industry
capacity grows relative to the growth rate in demand for
semiconductor products may in the future put pressure on our
average selling prices and hurt our results of operations.
The
semiconductor industry, particularly in the memory products
arena, is characterized by intense competition, which could
reduce our sales or put continued pressure on our
prices.
The semiconductor industry is highly competitive, particularly
in the memory products arena, and has been characterized by
rapid technological change, short product lifecycles, high
capital expenditures, intense pricing pressure from major
customers, periods of oversupply and continuous advancements in
process technologies and manufacturing facilities. Our
subsidiary Qimonda competes globally with other major DRAM
suppliers, including Samsung, Micron Technology Inc., Hynix
Semiconductor Inc., Elpida Memory Inc. and Nanya, which is its
joint venture partner in Inotera Memories, Inc. Some of
Qimondas competitors have substantially greater capital,
human and other resources and manufacturing capacities, more
efficient cost structures, higher brand recognition, larger
customer bases and more diversified product lines than Qimonda
has. Competitors with greater resources and more diversified
operations may have long-term advantages, including the ability
to better withstand future downturns in the DRAM market
42
and to finance research and development activities. In addition,
unfair price competition, government support or trade barriers
by or for the benefit of our competitors would adversely affect
Qimondas competitive position.
To compete successfully in the DRAM market, Qimonda must:
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design and develop new products and introduce them in a timely
manner;
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develop and successfully implement improved manufacturing
process technologies to reduce its per-megabit costs; and
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broaden its DRAM customer base, to reduce its dependence on a
small number of customers and position itself to increase its
market share.
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Other factors affecting Qimondas ability to compete
successfully are largely beyond Qimondas control. These
include:
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the extent to which and the pace at which customers incorporate
its memory products into their devices;
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whether electronics manufacturers design their products to use
DRAM configurations or new types of memory products that Qimonda
does not offer;
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the number and nature of its competitors; and
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general economic conditions.
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Increased competitive pressure or the relative weakening of
Qimondas competitive position caused by these factors, or
other developments Qimonda has not anticipated, could materially
and adversely affect Qimondas and our business financial
condition and results of operations.
A mismatch
between the specific DRAM chips Qimonda or the DRAM industry
generally are producing and the platforms for which equipment
manufacturers require DRAMs can lead to declining prices for the
DRAMs Qimonda produces and consequently to material inventory
write-downs.
Which DRAMs are required by the market at any particular time
depends on the platforms the manufacturers of PCs and other
electronic devices are using in their products at that time. In
general, DRAMs are designed, manufactured and assembled into
modules for use on a specified platform or logic chipset and its
associated interfaces. If DRAM manufacturers are producing DRAMs
for which there is not enough demand because the supply of the
related platforms is low, the supply of these DRAMs may exceed
the demand for them, causing prices for the affected DRAM
products to fall.
Given the significant risk of demand and supply mismatches
characteristic of our industry, Qimonda may find it necessary to
write down the carrying value of inventories in the future
depending on market conditions. Any such write-downs could have
a material adverse effect on our business, financial condition
and results of operations.
Risks related to
our operations
We may not be
able to protect our proprietary intellectual property and may be
accused of infringing the intellectual property rights of
others.
Our success depends on our ability to obtain patents, licenses
and other intellectual property rights covering our products and
our design and manufacturing processes. The process of seeking
patent protection can be long and expensive. Patents may not be
granted on currently pending or future applications or may not
be of sufficient scope or strength to provide us with meaningful
protection or commercial advantage. In addition, effective
copyright and trade secret protection may be unavailable or
limited in some countries, and our trade secrets may be
vulnerable to disclosure or misappropriation by employees,
contractors and other persons.
43
Competitors may also develop technologies that are protected by
patents and other intellectual property rights. These
technologies may therefore either be unavailable to us or be
made available to us only on unfavorable terms and conditions.
Litigation, which could require significant financial and
management resources, may be necessary to enforce our patents or
other intellectual property rights or to defend against claims
of infringement of intellectual property rights brought against
us by others. Lawsuits may have a material adverse effect on our
business. We may be forced to stop producing substantially all
or some of our products or to license the underlying technology
upon economically unfavorable terms and conditions or we may be
required to pay damages for the prior use of third party
intellectual property. See Business Legal
Matters for a description of current claims and
proceedings.
Our results
may suffer if we are not able to match our production capacity
to demand.
It is difficult to predict growth in the markets we serve,
making it hard to estimate requirements for production capacity.
If the market does not grow as we have anticipated, we risk
underutilization of our facilities. This may also result in
future write-offs of inventories and losses on products for
which demand is lower than current forecasts may indicate.
During periods of increased demand we may not have sufficient
capacity to meet customer orders. Such constraints affect our
customers ability to deliver products in accordance with
their planned manufacturing schedules, straining relationships
with affected customers. During periods of industry overcapacity
and declining selling prices, customers do not generally order
products as far in advance of the scheduled shipment date as
they do during periods when our industry is operating closer to
capacity.
In the past we have responded to fluctuations in industry
capacity and demand by adapting production levels, closing
existing production facilities, opening new production
facilities or entering into strategic alliances, which in many
cases resulted in significant expenditures. We have also
purchased an increasing number of processed wafers from
semiconductor foundries to meet higher levels of demand and have
incurred higher cost of goods sold as a result. In order to
expand or reduce our production capacity in the future, we may
have to spend substantial amounts, which could hurt our results
of operations.
Qimonda may be
unable to reduce its per megabit manufacturing costs at the same
rate as in the past.
Historically, Qimondas financial results have benefited
from period-to-period decreases in per bit manufacturing costs
achieved through improvements in manufacturing processes,
including increases in wafer sizes and reductions in structure
geometries. In future periods, Qimonda may be unable to reduce
its per bit manufacturing costs or to reduce these costs at
historical rates due to strategic product diversification
decisions affecting product mix, continued increases in the
complexity of manufacturing processes, changes in process
technologies or the introduction of products that may inherently
require relatively larger chip sizes. Per bit manufacturing
costs may also be affected by the relatively smaller production
quantities and shorter product lifecycles of certain specialty
memory products.
Fluctuation in
the mix of products sold may adversely affect our financial
results.
With our wide range of products we achieve different gross
margins. Our financial results depend therefore in part on the
portfolio structure of our products. Fluctuation in the mix and
types of our products may also affect the extent to which we are
able to recover our fixed costs and investments that are
associated with a particular product, and as a result can
negatively impact our financial results.
Our business
could suffer from problems with manufacturing.
The semiconductor industry is characterized by the introduction
of new or enhanced products with short life cycles in a rapidly
changing technological environment. We manufacture our products
using processes that are highly complex, require advanced and
costly equipment and must continuously be modified to improve
yields and performance. Difficulties in the manufacturing
process can reduce yields or interrupt production, and as a
result of such problems we may on occasion not be able to
deliver products on time or in a cost-effective, competitive
manner.
44
We cannot foresee and prepare for every contingency. If
production at a fabrication facility is interrupted, we may not
be able to shift production to other facilities on a timely
basis or customers may purchase products from other suppliers.
In either case, the loss of revenues and damage to the
relationship with our customers could be significant. Increasing
our production capacity to reduce our exposure to potential
production interruptions would increase our fixed costs. If the
demand for our products does not increase proportionally to the
increase in production capacity, our operating results could be
harmed.
We outsource production of some of our products to third-party
suppliers, including semiconductor foundry manufacturers and
assembly and test facilities. Using third-party suppliers
exposes us to manufacturing problems experienced by those
suppliers and may be less cost-effective than manufacturing at
our own facilities.
We may be
unable to successfully integrate businesses we acquire, and may
be required to record charges related to the goodwill or other
long-term assets associated with the acquired
businesses.
We have acquired other companies, businesses and technologies
from time to time. We intend to continue to make acquisitions
of, and investments in, other companies. We face risks resulting
from the expansion of our operations through acquisitions,
including the risk that we might be unable to integrate new
businesses with our culture and strategies. We also cannot be
certain that we will be able to achieve the benefits we expect
from a particular acquisition or investment. Acquisitions may
also strain our managerial and operational resources, as the
challenge of managing new operations may divert our managers and
employees from monitoring and improving operations in our
existing businesses. Our business, financial condition and
results of operations may suffer if we fail to coordinate our
resources effectively to manage both our existing businesses and
any businesses we acquire.
We review the goodwill associated with our acquisitions for
impairment at least once a year. Changes in our expectations due
to changes in market developments which we cannot foresee have
in the past resulted in our writing off amounts associated with
the goodwill of acquired companies, and future changes may
require similar further write-offs in future periods.
If we fail to
successfully implement an optimum make-or-buy strategy, our
business could suffer from higher costs.
We intend to continue to invest in leading-edge process
technologies such as power, embedded flash and RF technologies.
At the same time, in standard CMOS below 90-nanometers, we will
continue to share risks and expand our access to leading-edge
technology through long-term strategic partnerships with other
leading industry participants and by making more extensive use
of manufacturing at silicon foundries. However, the decision to
develop our own solution or to cooperate with third party
suppliers could result in disadvantages if the assumptions for
cost developments later proved to be incorrect.
Our business
could suffer due to decreases in the volume of demand of our
customers.
Our sales volume depends significantly on the market success of
our customers in developing and selling end-products that
incorporate our products. The fast pace of technological change,
difficulties in the execution of individual projects and other
factors may limit the market success of our customers, resulting
in a decrease in the volume of demand for our products and
adversely affecting our results of operations. This risk is
particularly acute in our Communication Solutions segment, in
which we also face significant pricing and margin pressures.
New business
is often subject to a competitive selection process that can be
lengthy and uncertain and that requires us to incur significant
expenses. Even if we win and begin a product design, a customer
may decide to cancel or change its product plans, which could
cause us to generate no sales from a product and adversely
affect our results of operations.
In several of our business areas we focus on winning competitive
bid selection processes, known as design wins, to
develop products for use in our customers products. These
selection processes can be
45
lengthy and can require us to incur significant design and
development expenditures. We may not win the competitive
selection process and may never generate any revenues despite
incurring significant design and development expenditures.
If we win a product design and receive corresponding orders from
our customers, we may experience delays in generating revenues
from our products as a result of the lengthy development and
design cycle. In addition, a delay or cancellation of a
customers plans could significantly adversely affect our
financial results, as we may have incurred significant expenses
and generated no revenues. Finally, if our customers fail to
successfully market and sell their products our business,
financial condition and results of operations could be
materially adversely affected as the demand for our products
falls.
We have a
limited number of suppliers of manufacturing equipment and raw
materials, and we could suffer shortages if they were to
interrupt supply or increase prices.
Our manufacturing operations depend upon obtaining deliveries of
equipment and adequate supplies of materials on a timely basis.
We purchase equipment and materials from a number of suppliers
on a
just-in-time
basis. From time to time, suppliers may extend lead times, limit
supply to us or increase prices due to capacity constraints or
other factors. Because the equipment that we purchase is
complex, it is difficult for us to substitute one supplier for
another or one piece of equipment for another. Some materials
are only available from a limited number of suppliers. Although
we believe that supplies of the materials we use are currently
adequate, shortages could occur in critical materials, such as
silicon wafers or specialized chemicals used in production, due
to interruption of supply or increased industry demand. Our
results of operations would be hurt if we were not able to
obtain adequate supplies of quality equipment or materials in a
timely manner or if there were significant increases in the
costs of equipment or materials.
Our success
depends on our ability to recruit and retain a sufficient number
of qualified key personnel.
Our success depends significantly on the recruitment and
retention of highly skilled personnel. This includes research
and development, marketing, production management, staff
functions as well as general management staff. The competition
for such highly skilled employees is intense and the loss of the
services of key personnel without adequate replacement or the
inability to attract new qualified personnel could have a
material adverse effect on us. There can be no absolute
certainty that we will be able to successfully retain
and/or
recruit the key personnel we require.
Our business
could suffer if we do not have adequate access to
capital.
Like all semiconductor companies that operate their own
manufacturing facilities, we require significant amounts of
capital to build, expand, modernize and maintain such
facilities. Likewise, we also require significant amounts of
capital to fund research and development. We used cash in our
investing activities of 289 million in the 2005
fiscal year, 853 million in the 2006 fiscal year and
867 million in the 2007 fiscal year. Our research and
development expenses were 1,293 million in the 2005
fiscal year, 1,249 in the 2006 fiscal year and 1,169
in the 2007 fiscal year. Our capital expenditures in the 2005,
2006 and 2007 fiscal years were 1,368 million,
1,253 million and 1,375 million,
respectively. We intend to continue to invest in research and
development and manufacturing facilities, while continuing our
policy of cooperation with other semiconductor companies to
share these costs with us. Qimonda, in particular, intends to
continue to invest heavily in its manufacturing facilities,
including in the new manufacturing facility Qimonda plans to
construct in Singapore.
We believe that the carve-out of our memory products business
into the separate legal entity Qimonda, and that companys
separate stock market listing, allow both companies to gain
direct access to additional sources of capital. Nevertheless, we
or Qimonda may experience difficulties in raising the amount of
capital required for our businesses on acceptable terms due to a
number of factors, such as general market and economic
conditions, inadequate cash flow from operations or unsuccessful
asset management. Our business may be hurt if we or Qimonda are
not able to make necessary capital expenditures and finance
necessary research and development.
46
Our business
could suffer if we are not able to secure the development of new
technologies or if we cannot keep pace with the technology
development of our competition.
The semiconductor industry is characterized by rapid
technological changes. New process technologies using smaller
feature sizes and offering better performance characteristics
are introduced every one to two years. The introduction of new
technologies allows us to increase the functions per chip while
at the same time optimizing performance parameters, such as
decreasing power consumption or increasing processing speed. In
addition, the reduction of feature sizes allows us to produce
smaller chips offering the same functionality and thereby
considerably reduce the costs per function. In order to remain
competitive, it is essential that we secure the capabilities to
develop and qualify new technologies for the manufacturing of
new products. If we are unable to develop and qualify new
technologies and products, or if we devote resources to the
pursuit of technologies or products that fail to be accepted in
the marketplace or that fail to be commercially viable, our
business may suffer.
We rely on our
strategic partners and other third parties, and our business
could be harmed if they fail to perform as expected or
relationships with them were to be terminated.
As part of our strategy, we have entered into a number of
long-term strategic alliances with leading industry
participants, both to manufacture semiconductors and to develop
new manufacturing process technologies and products. If our
strategic partners encounter financial difficulty or change
their business strategies, they may no longer be able or willing
to participate in these alliances. Some of the agreements
governing our strategic alliances allow our partners to
terminate the agreement if our equity ownership changes so that
a third party gains control of our company or of a significant
portion of our companys shares. Our business could be
harmed if any of our strategic partners were to discontinue its
participation in a strategic alliance or if the alliance were to
otherwise terminate. To the extent we rely on alliances and
third-party design
and/or
manufacturing relationships, we face the risks of:
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reduced control over delivery schedules and product costs;
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manufacturing costs that are higher than anticipated;
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the inability of our manufacturing partners to develop
manufacturing methods appropriate for our products and their
unwillingness to devote adequate capacity to produce our
products;
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a decline in product reliability;
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an inability to maintain continuing relationships with our
suppliers; and
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limited ability to meet customer demand when faced with product
shortages.
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If any of these risks materialize, we could experience an
interruption in our supply chain or an increase in costs, which
could delay or decrease our revenues or adversely affect our
business, financial condition and results of operations.
Our business
could suffer as a result of volatility in different parts of the
world.
We operate globally, with numerous manufacturing, assembly and
testing facilities on three continents, including three that we
operate jointly with partners. In the 2007 fiscal year,
85 percent of our revenues were generated outside Germany
and 69 percent were generated outside Europe. Our business
is therefore subject to risks involved in international
business, including:
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negative economic developments in foreign economies and
instability of foreign governments, including the threat of war,
terrorist attacks, epidemic or civil unrest;
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changes in laws and policies affecting trade and
investment; and
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varying practices of the regulatory, tax, judicial and
administrative bodies in the jurisdictions where we operate.
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Substantial changes in any of these conditions could have an
adverse effect on our business and results of operations. Our
results of operations could also be hurt if demand for the
products made by our customers decreases due to adverse economic
conditions in any of the regions where they sell their own
products.
Threats of disease outbreaks or pandemics, such as the avian flu
and Severe Acute Respiratory Syndrome (SARS) outbreaks, in
regions where we have manufacturing sites may negatively effect
our operations by limiting the productivity of our workforce,
inhibiting transportation or the shipment of products or
reducing the ability of local suppliers to provide adequate
goods and services. Furthermore, the purchasing patterns of our
customers located in these regions may suffer if there is an
epidemic outbreak. This could negatively impact our operations.
Our operating
results may fluctuate significantly from quarter to quarter, and
as a result we may fail to meet the expectations of securities
analysts and investors, which could cause our stock price to
decline.
Our operating results have fluctuated significantly from quarter
to quarter in the past and are likely to continue to do so due
to a number of factors, many of which are not within our
control. If our operating results do not meet the expectations
of securities analysts or investors, the market price of our
ordinary shares and ADSs will likely decline. Our reported
results can be affected by numerous factors including those
described in this Risk Factors section, among them:
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the overall cyclicality of, and changing economic and market
conditions in, the semiconductor industry, as well as
seasonality in sales of consumer products into which our
products are incorporated;
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our ability to scale our operations in response to changes in
demand for our existing products and services or demand for new
products requested by our customers;
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intellectual property disputes, customer indemnification claims
and other types of litigation risks;
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the gain or loss of a key customer, design win or order;
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the timing, rescheduling or cancellation of significant customer
orders and our ability, as well as the ability of our customers,
to manage inventory; and
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additional changes in accounting rules, such as the change
requiring the recording of expenses for employee shares options
and other stock-based compensation expense, which commenced in
the 2006 fiscal year.
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Due to the foregoing factors, and the other risks discussed in
this annual report, you should not rely on quarter-to-quarter
comparisons of our operating results as an indicator of future
performance.
Our results of
operations and financial condition can be adversely impacted by
changes in exchange rates.
Our results of operations can be hurt by changes in exchange
rates, particularly between the Euro and the U.S. dollar or
the Japanese yen. In addition, the balance sheet impact of
currency translation adjustments has been, and may continue to
be, material.
Further information on foreign currency derivative and
transaction gains and losses can be found in the section headed
Operating and Financial Review Qualitative and
Quantitative Disclosure about Market
Risk Foreign Exchange and Interest Risk.
Changes in tax
regulations could result in lower earnings and cash
flows.
We operate in numerous countries throughout the world, and
therefore are subject to numerous tax regimes. Changes in tax
regulations in any applicable jurisdiction could result in
higher tax expenses and payments, and could adversely impact our
tax liabilities and deferred tax assets.
48
Environmental
laws and regulations may expose us to liability and increase our
costs.
Our operations are subject to many environmental laws and
regulations wherever we operate governing, among other things,
air emissions, wastewater discharges, the use and handling of
hazardous substances, waste disposal and the investigation and
remediation of soil and ground water contamination.
A directive in the EU imposes a take-back obligation
on manufacturers to finance the collection, recovery and
disposal of electrical and electronic equipment. Because of
unclear statutory definitions and interpretations in individual
member states, we are unable at this time to determine in detail
the consequences of this directive for us. Additional European
legislation has restricted the use of lead and other hazardous
substances in electrical and electronic equipment from July
2006. Another EU directive describes ecodesign requirements for
energy-using products, including information requirements for
components and sub-assemblies. Furthermore the European
regulatory framework for chemicals, called REACH, deals with the
registration, evaluation, authorization and restriction of
chemicals. These directives may complicate our research and
development activities and may require us to change certain of
our manufacturing processes to utilize more costly materials or
to incur substantial additional costs. In addition, in 2004, an
EU directive on environmental liability with regard to the
prevention and remedying of environmental damage became
effective. We could face increased environmental liability,
which may result in higher costs and potential damage claims.
The Chinese government restricts the use of lead and other
hazardous substances in electronic products. Because not all
implementing measures nor the key product catalog are in place,
the consequences for our company cannot currently be determined
in detail. Similar regulations on substance bans are being
proposed or implemented in various countries of the world. We
are not able at this time to estimate the amount of additional
costs that we may incur in connection with these regulations.
As with other companies engaged in similar activities, we face
inherent risks of environmental liability in our current and
historical manufacturing locations. Costs associated with future
additional environmental compliance or remediation obligations
could adversely affect our business.
For a further description of environmental issues that we face
see Business Environmental Protection and
Sustainable Management.
Products that
do not meet customer specifications or that contain, or are
perceived to contain, defects or errors or that are otherwise
incompatible with their intended end use could impose
significant costs on us.
The design and production processes for our products are highly
complex. It is possible that we may produce products that do not
meet customer specifications, contain or are perceived to
contain defects or errors, or are otherwise incompatible with
their intended uses. We may incur substantial costs in remedying
such defects or errors, which could include material inventory
write-downs. Moreover, if actual or perceived problems with
nonconforming, defective or incompatible products occur after we
have shipped the products, we might not only bear direct
liability for providing replacements or otherwise compensating
customers but could also suffer from long-term damage to our
relationship with important customers or to our reputation in
the industry generally. This could have a material adverse
effect on our business, financial condition and results of
operations.
Qimonda may
face difficulties in shifting to new memory technologies that
are not based on silicon.
In the longer term, Qimonda faces the potential risk of a
fundamental shift from the silicon-based technology on which the
memory industry has long been based. Although we do not believe
that any technology to rival silicon-based memory is likely to
prove feasible in at least the near- to medium-term, and
although Qimonda devotes resources to basic research in order to
keep abreast of a wide range of potential new memory
technologies, the fundamental technology of the semiconductor
memory business may not continue to be broadly based on current
technology. Qimonda may be unable to respond quickly
49
enough to any fundamental technological shift in the industry.
Qimondas failure to implement successfully subsequent
technology generations or respond to technology developments may
materially and adversely affect our business, financial
condition and results of operations.
We are subject
to the risk of loss due to explosion and fire because some of
the materials we use in our manufacturing processes are highly
combustible.
We use highly combustible materials such as silane and hydrogen
in our manufacturing processes and are therefore subject to the
risk of loss arising from explosion and fire which risk cannot
be completely eliminated. Although we maintain comprehensive
fire and casualty insurance up to policy limits, including
insurance for loss of property and loss of profit resulting from
business interruption, our insurance coverage may not be
sufficient to cover all of our potential losses. If any of our
fabs were to be damaged or cease operations as a result of an
explosion or fire, it could reduce our manufacturing capacity
and cause us to lose important customers.
Reductions in
the amount of government subsidies we receive or demands for
repayment could increase our reported expenses or limit our
ability to fund our capital expenditures.
As is the case with many other semiconductor companies, our
reported expenses have been reduced in recent years by various
subsidies received from governmental entities. In particular, we
have received, and expect to continue to receive, subsidies for
investment projects as well as for research and development
projects. We recognized governmental subsidies as a reduction of
R&D expenses and cost of sales in an aggregate amount of
171 million in the 2005 fiscal year,
153 million in the 2006 fiscal year and
248 million in the 2007 fiscal year. In addition, we
reduced the carrying value of fixed assets by
0 million, 49 million and
1 million during the 2005, 2006 and 2007 fiscal
years, respectively.
As the general availability of government funding is outside our
control, we cannot assure you that we will continue to benefit
from such support, that sufficient alternative funding would be
available if necessary or that any such alternative funding
would be provided on terms as favorable to us as those we
currently receive.
The application for and implementation of such subsidies often
involves compliance with extensive regulatory requirements,
including, in the case of subsidies to be granted within the
European Union, notification to the European Commission of the
contemplated grant prior to disbursement. In particular,
establishment of compliance with project-related ceilings on
aggregate subsidies defined under European Union law often
involves highly complex economic evaluations. If we fail to meet
applicable formal or informal requirements, we may not be able
to receive the relevant subsidies or may be obliged to repay
them, which could have a material adverse effect on our business.
The terms of certain of the subsidies we have received impose
conditions that may limit our flexibility to utilize the
subsidized facility as we deem appropriate, to divert equipment
to other facilities, to reduce employment at the site, or to use
related intellectual property outside the European Union. This
could impair our ability to operate our business in the manner
we believe to be most cost effective.
We are a
subject of investigations in several jurisdictions in connection
with pricing practices in the DRAM industry, and are a defendant
in civil antitrust claims in connection with these
matters.
In September 2004, we entered into a plea agreement with the
Antitrust Division of the U.S. Department of Justice (the
DOJ) in connection with its ongoing investigation of
alleged antitrust violations in the DRAM industry. Pursuant to
this plea agreement, we agreed to plead guilty to a single count
relating to the pricing of DRAM products and to pay a fine of
$160 million, payable in equal annual installments through
2009.
In April 2003 we received a request for information regarding
DRAM industry practices from the European Commission (the
Commission) and in May 2004 we received a notice of
a formal inquiry into
50
alleged DRAM industry competition law violations from the
Canadian Competition Bureau. We are cooperating with the
Commission and the Canadian Competition Bureau in their
inquiries.
Subsequent to the commencement of the DOJ investigation, a
number of purported class action lawsuits were filed against us
and other DRAM suppliers in U.S. federal courts and in
state courts in various U.S. states, as well as in
different Canadian provinces. The complaints allege violations
of U.S. federal and state or Canadian antitrust and
competition laws and seek significant damages on behalf of the
plaintiffs. In July 2006 the state attorneys general of a number
of U.S. states filed actions against us and other DRAM
suppliers in U.S. federal courts. The claims involve
allegations of DRAM price fixing and artificial price inflation
and seek to recover three times actual damages and other relief.
In connection with these matters as well as for legal expenses
relating to the securities class action described in
Business Legal Matters and in accordance
with U.S. GAAP, as of September 30, 2007 we have
accrued liabilities in the amount of 95 million.
Because these matters remain ongoing, we cannot predict at this
time whether the reserves will be adequate to cover any further
potential liabilities that we may incur.
An adverse final resolution of the matters described above could
result in significant financial liability to, and other adverse
effects upon us, which would have a material adverse effect on
our business, results of operations and financial condition.
Irrespective of the validity or the successful assertion of the
above-referenced claims, we could incur significant costs with
respect to defending against or settling such claims, which
could have a material adverse effect on our results of
operations or financial condition or cash flows. See
Business Legal Matters for a description
of these matters.
Purported
class action lawsuits have been filed against us alleging
securities fraud.
Following our announcement in September 2004 of our agreement to
plead guilty in connection with the DOJs antitrust
investigation and to pay a fine of $160 million, several
purported securities class action lawsuits have been brought
against us in two U.S. district courts. The lawsuits were
consolidated into one complaint that is pending at the
U.S. District Court for the Northern District of
California. Plaintiffs allege violations of the
U.S. securities laws and assert among other things that we
made materially false and misleading public statements about our
historical and projected financial results as well as
competitive position and manipulated the price of our
securities, thereby injuring our shareholders. Although we are
defending against these suits vigorously, a significant
settlement or negative outcome at trial could have a material
adverse effect on our financial results. See
Business Legal Matters for a description
of these matters.
We might be
faced with product liability or warranty claims.
Despite extensive quality assurance measures, such as our
Automotive Excellence program, there remains a risk that defects
may occur in our products. The occurrence of such
defects particularly in consumer areas and areas in
which personal injury could result, such as our automotive
business group could give rise to warranty claims or
to liability for damages caused by such defects. We could also
incur consequential damages and could, moreover, experience
limited acceptance of our products in the market. This could
have a material adverse effect on our business and financial
condition. In addition, customers have from time to time
notified us of potential contractual warranty claims in respect
of products supplied by us, and may do so in the future.
Siemens
exercises partial control over some of our intellectual property
rights and could use these rights to compete with
us.
In connection with our formation as a legal entity, Siemens
transferred approximately 20,000 patent rights to us. Under the
terms of these transfers and the related agreements, however,
Siemens retained the right to use those patent rights within the
scope of its business for an unlimited period of time, subject
to various restrictions in the case of patents relating to
information handling systems. A non-competition agreement
between us and Siemens, entered into in connection with our
formation as a separate company, expired in March 2004. Siemens
is no longer prevented from competing with us, and may utilize
the patent rights it retained at the time of our companys
formation to do so.
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Siemens also retained the right to assert infringement claims
against third parties with respect to approximately
15 percent of the patent rights that it transferred to us,
insofar as those patents relate to the technical field of the
Siemens groups business activities. Siemens has agreed
that it will not exercise that right against any of our
customers in respect of any part of such customers
products that contains one of our products, unless that right is
asserted for defensive purposes. Nevertheless, we can provide no
assurance that such safeguards will be sufficient to protect all
of our customers against claims by Siemens with respect to those
of their products that incorporate technology covered by the
patents at issue. It may therefore be difficult for us to sell
our products or grant licenses of such patents to third parties,
and third parties may not be able to use our products without
infringing those patents or incurring license fees to Siemens.
As the
majority shareholder in Qimonda we may be negatively impacted by
adverse developments in the business of Qimonda or declines in
the market price of its securities.
Because we will continue to fully consolidate the financial
results of Qimonda in our financial statements for so long as
Infineon remains the majority shareholder of that company,
fluctuations in Qimondas results of operations will be
reflected in our operating results. Our companys results
of operations will therefore be significantly affected by the
success or failure of the management of Qimonda and, although we
will have control over Qimonda for so long as we remain its
majority shareholder, we will not have the ability to direct its
operations on a day-to-day basis. The value of our holding in
Qimonda and our ability to realize significant cash from any
further sales of Qimonda securities held by Infineon will be
substantially dependent on the market performance of
Qimondas stock, which will in turn depend on the business
success of Qimonda and the development of the market for
semiconductor memory products, both of which are substantially
outside our control.
The carve-out
of Qimonda and its subsequent public listing may fail to produce
the long-term strategic, operational and financing benefits we
envision.
We and Qimonda believe that the carve-out of Qimonda will
continue to provide a number of strategic benefits for both
companies, including:
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increased market responsiveness through an exclusive focus on
our respective customers;
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access to separate and distinct investor bases;
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employee incentives more directly tied to the performance of the
individual companies; and
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increased flexibility to pursue strategic options.
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These benefits may not continue or may not prove to be as
significant as anticipated, which could negatively affect our
results of operations or our ability to achieve maximum value
from our remaining equity interest in Qimonda. In addition, in
executing our strategic plan to further divest our interest in
Qimonda, we may elect to sell some or all of the Qimonda shares
we continue to hold at a loss, which may adversely affect our
results of operations in the period of sale. We may also
experience unanticipated disadvantages that are not fully offset
by any resulting benefits, including a loss of synergies and
economies of scale.
52
We are one of the worlds leading semiconductor companies.
We have been at the forefront of the development, manufacture
and marketing of semiconductors for more than fifty years, first
as the Siemens Semiconductor Group and, since 1999, as an
independent company. We have been a publicly traded company
since March 2000.
We design, develop, manufacture and market a broad range of
semiconductors and complete system solutions used in a wide
variety of microelectronic applications. Our core business is
conducted through our Automotive, Industrial &
Multimarket segment and our Communication Solutions segment. Our
memory products business is conducted through our majority-owned
subsidiary, Qimonda. According to market research company
iSuppli, we were the fifth-largest semiconductor company
worldwide in the first nine months of 2007 with
our non-memory businesses alone ranked number 10 in that period
and Qimonda alone ranked number 16.
The address of our principal executive offices is: Am Campeon
1-12, D-85579, Neubiberg, Germany, and our main telephone number
is +49-89-234-0.
The principal developments during the 2007 fiscal year included
the following:
Infineon
Logic
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In February 2007, we signed an agreement with Nokia to supply
baseband and RF chips for GSM mobile handsets. The highly
integrated single-chip
E-GOLDtmvoice
will be incorporated in selected future entry-level Nokia
phones.
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In March 2007, we and Hyundai announced a strategic cooperation
for the development of automotive electronics, pursuant to which
we will develop automotive electronic system solutions for
Hyundai and Kia vehicles. Under the agreement, the companies
will also open a joint innovation center for further development
in this regard.
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In March 2007, we entered into a definitive agreement with Avago
Technologies, under which Avago acquired our POF business, based
in Regensburg, Germany. The transaction closed in the third
quarter of the 2007 fiscal year.
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In April 2007, we decided to expand our R&D operations in
Singapore with an investment of approximately
200 million. We will focus on next-generation
home-networking
technologies, Customer Premises Equipment (CPE),
Integrated Access Devices (IAD), mobile phone
platforms (ultra-low cost), Digital Video Broadcasting
(DVB) for mobile TV, digital power control for power
management, microcontroller for automotive and industrial
applications, process technologies for wafer fabrication and
packaging, and Application Specific IC (ASIC) design.
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In May 2007, we expanded technology agreements with IBM,
Chartered, Samsung and Freescale. The most recent agreement is
in effect through 2010, and includes 32-nanometer bulk
complementary metal oxide semiconductor (CMOS)
process technology and joint development of process design kits
(PDK) to support product designs in those advanced
technologies.
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In June 2007, we entered an agreement with Texas Instruments
Inc. to acquire its DSL CPE business. We plan to continue
supporting Texas Instruments Inc.s product portfolio and
existing customer designs while leveraging the acquired
experience in future product generations. The transaction closed
in the fourth quarter of the 2007 fiscal year.
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In August 2007, we entered into an agreement to acquire the
Mobility Products Group of LSI Corporation, which will further
strengthen our wireless communications business. The transaction
closed in the first quarter of the 2008 fiscal year.
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Also in August 2007, we, IBM and Advanced Electronic Systems AG
(AES) entered into an agreement under which AES will
acquire ALTIS Semiconductor S.N.C. from Infineon and IBM, each
of which currently holds a 50 percent interest. The
agreement is subject to governmental and regulatory approval,
and works-council consultation, and is expected to close in the
first quarter of the 2008 fiscal year. We further agreed to
enter into a two-year supply contract with ALTIS, and IBM and we
agreed to license key manufacturing process technologies to AES
for use by ALTIS.
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In September 2007, we entered into a joint venture agreement
with Siemens AG (Siemens), whereby we would
contribute all assets and liabilities of our high power bipolar
business (including licenses, patents, and front-end and
back-end production assets) into a newly formed legal entity
called Infineon Technologies Bipolar GmbH & Co. KG
(Bipolar) and Siemens would acquire a
40 percent interest in Bipolar for 37 million.
The transaction closed in the first quarter of the 2008 fiscal
year.
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In September 2007, we sold an additional 28.75 million
Qimonda ADSs (including the underwriters
over-allotment option) for an offering price of $10.92 per ADS,
resulting in net proceeds of 216 million. As a
result, our ownership interest in Qimonda decreased to
77.5 percent. In parallel, our fully owned subsidiary
Infineon Technologies Investment B.V. issued notes exchangeable
into ADSs of Qimonda in the amount of 215 million
(including the underwriters over-allotment option).
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In September 2007, we entered into an agreement with Motorola to
develop a new multi-mode, single-chip 3G radio frequency
(RF) transceiver based on Infineons
SMARTi®
UE chip. The new RF chip will address the growing market for 3G
services by offering maximum HSDPA and HSUPA performance,
efficient power consumption and slim design.
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Qimonda
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In March 2007, Qimonda announced plans to construct a new DRAM
module manufacturing facility in Johor, Malaysia. The overall
investment for this new facility, including IT integration,
infrastructure and equipment, is expected to total up to
150 million over the next five years.
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In April 2007, Qimonda and Spansion signed a strategic supply
agreement to deliver optimized memory subsystems to mobile
customers by combining Qimondas low-power specialty DRAM
with
Spansion®
MirrorBit®
NOR and
ORNANDtm
devices into Multi-Chip Packages (MCP) memory
solutions for mobile devices.
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In April 2007, Qimonda and SanDisk entered into an agreement to
jointly develop and manufacture MCPs utilizing SanDisks
NAND flash and controllers and Qimondas low power mobile
DRAM.
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In April 2007, Qimonda announced plans to build a new
300-millimeter front-end manufacturing facility in Singapore.
Depending on the growth and development of the world
semiconductor market, Qimonda plans to invest approximately
2 billion in the site over the next five years. The
20,000 square meter clean room space is expected to add 60,000
wafer starts per month to Qimondas overall front-end
capacity when fully ramped.
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In June 2007, Qimonda extended its foundry agreement with
Winbond. Under the terms of this agreement, Qimonda will
transfer its 75-nanometer and 58-nanometer DRAM trench
technology to Winbonds 300-millimeter facility in
Taichung, Taiwan. In return, Winbond will manufacture DRAMs for
computing applications using these technologies exclusively for
Qimonda.
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In August 2007, Qimonda expanded its foundry agreement with
SMIC. Under the terms of the agreement, Qimonda will transfer
its 80-nanometer DRAM trench technology to SMICs
300-millimeter
facility in Beijing and SMIC will manufacture DRAMs for
computing applications using this technology exclusively for
Qimonda. Furthermore, the agreement includes the option to
transfer Qimondas 75-nanometer technology to SMIC in the
future.
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In August 2007, Qimonda announced its plans to set up a new
Development Center for the development of memory products in
Suzhou, China. The additional development capacities will
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serve Qimondas target to further expand and diversify its
product portfolio. The Development Center started operations in
October 2007.
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Technical and
Product Developments
Infineon
Logic
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Our stand-alone
FlexRaytm
communication controller CIC-310 for high-speed in-vehicle
communications passed the FlexRay conformance test. We are one
of the first semiconductor suppliers to deliver high-volumes of
FlexRay-enabled microcontroller solutions in conformance with
the FlexRay protocol specification V2.1.
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We successfully ramped-up our 32bit TriCore (TM) AUDO-NG
products in our 130-nanometer embedded flash technology in the
Dresden (Germany) facility. The AUDO-NG product family
comprising of TC1796, TC1766 and further derivatives is
optimized for mid-range to highest-end powertrain applications.
With the successful ramp-up to high volume production at highest
quality, we have enabled our automotive customer base to
introduce new engine platforms at the car manufactures to
increase fuel efficiency.
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We began to supply our highly-secure contact-less smartcard
microcontrollers in connection with MasterCards PayPass
deployments in 13 countries worldwide, including Taiwan,
Malaysia, Australia and the US.
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We introduced our new miniature silicon microphone
for consumer and computer communication devices. It is
approximately one-half the size and operates on just one-third
the power of conventional microphones and contains silicon MEMS
(micro-electrical-mechanical system) technology. The new
microphone achieves the same acoustic and electrical properties
as conventional microphones, but is more rugged and exhibits
higher heat resistance.
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We announced our next-generation family of power semiconductors
used for DC/DC converter applications in computers,
telecommunications and consumer electronic devices, enabling
significant power savings.
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We introduced the first two members of our new family of
electronic power modules designed for hybrid electric vehicle
(HEV) motor drive systems: the HybridPACK1 and
HybridPACK2 power modules. These systems reduce electrical
power losses by one-fifth, enabling simpler cooling systems.
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We introduced the
SMARTi®
WiMAX, a single-chip multi-mode dual-band CMOS RF-transceiver
for WiMAX/WiFi applications that supports the entire spectrum of
licensed WiMAX frequencies, allowing for worldwide
implementation and seamless roaming using a single RF device.
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We introduced
S-GOLD®
radio, a single-chip solution for EDGE mobile phones. The
S-GOLD®
radio significantly reduces system component count, the modem
printed circuit board area and the overall engineering
bill-of-materials.
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We presented two new single-chip RF CMOS transceivers, the
SMARTi®
PM+ and
SMARTi®
UE for EDGE and multi-mode 3G mobile phones, respectively.
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We introduced Amazon-SE, a new ADSL2+ system-on-a-chip solution
for DSL modems and routers that will help drive broadband
penetration in emerging markets.
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We introduced a wireless broadband integrated access device
(IAD) reference design for Digital Home Network.
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Qimonda
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Qimonda launched the industrys first Mobile-RAM with
183MHz performance.
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Intel validated Qimondas Advanced Memory Buffer Chip,
supporting next-generation server memory.
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Qimonda introduced the industrys first quad-rank, 8GB DDR2
Fully-Buffered
Dual-In-Line
Memory Modules (FB-DIMMs), an enabling technology to
drive the next generation of multi-core server performance while
lowering server power consumption.
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Qimonda DDR3 Memory components and modules were validated on
Intel reference platforms.
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Qimonda sampled ultra-low power 512 Mbit Mobile-RAM for
mobile applications. Qimonda uses a specifically designed
75-nanometer low-power trench technology platform that is the
basis for an entire Mobile DRAM product family in this node.
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Semiconductors power, control and enable an increasing variety
of electronic products and systems. Improvements in
semiconductor process and design technologies continue to result
in ever more powerful, complex and reliable devices at a lower
cost per function. As their performance has increased and size
and costs have decreased, semiconductors have become common
components in products used in everyday life, including personal
computers, telecommunications systems, wireless handheld
devices, automotive products, industrial automation and control
systems, digital cameras, digital audio devices, digital TVs,
chip cards, security applications and game consoles.
The market for semiconductors has historically been volatile.
Supply and demand have fluctuated cyclically and have caused
pronounced fluctuations in prices and margins. Following a
severe downturn in 2001, the industry experienced a further
period of low demand and ongoing worldwide overcapacity during
2002. In 2003 and in particular in 2004, the semiconductor
market showed stronger performance. During 2005, global
semiconductor market growth slowed significantly to
7 percent. In 2006 market growth slightly accelerated to
9 percent according to WSTS. For the 2007 calendar year,
WSTS anticipates a growth rate of 4 percent for the global
semiconductor market.
Following the carve-out of our memory products business into the
separately publicly listed company Qimonda, we now focus on the
following core businesses: automotive, industrial &
multimarket and security & ASICs in our Automotive,
Industrial & Multimarket (AIM) segment and
mobile phone platforms, RF solutions, and broadband access in
our Communication Solutions (COM) segment. In
particular, we strive to achieve profitable growth in these
businesses by maintaining and expanding our leadership position
in semiconductor solutions for energy efficiency, security, and
communication.
To achieve these goals in our non-memory businesses we seek to:
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|
|
Build on our market leadership position in the field of
semiconductors, in particular by helping to improve energy
efficiency. We believe that our success to
date has been based on a deep understanding of a wide range of
applications for the automotive and industrial sectors as well
as for personal computers and other consumer devices. Our
leading position in these areas is built on high-performance
products, superior process technologies and optimized in-house
manufacturing capabilities. We see significant growth potential
for our power business, driven by high energy costs and the need
for ever longer battery lifetimes in mobile devices.
|
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Provide the technology to be connected every
day & everywhere from home, in the office
or on the way. We seek to continue to profit
from our key strengths in areas such as RF technology and
wireline access. In order to benefit from the ever-increasing
need for mobility and communication in all aspects of day-to-day
life, we intend to broaden our customer base and to focus on the
most promising solutions for future profitable growth, such as
cellular phone platforms and broadband customer premises
equipment.
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56
|
|
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Strengthen our leadership position in security
solutions. We intend to leverage our know-how
to address applications in new areas, and believe we are well
positioned to benefit from future trends like the transition to
e-passports
and the implementation of digital rights management in consumer
devices. We believe that the ever-increasing digitalization and
increasing mobility in daily life will be a key driver for our
security & safety business.
|
|
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Selectively strengthen our core businesses through
strategic acquisitions. Following the
carve-out of the Qimonda business, we have been seeking to
expand the breadth and depth of our core operations in
automotive and industrial applications and communications, in
particular through selective acquisitions of other businesses
and technologies. We anticipate that we will use a portion of
the proceeds of any further sales of Qimonda shares to pursue
additional acquisition opportunities.
|
|
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Manage carefully the mix of make-versus-buy in
manufacturing and process technology
development. We intend to continue to invest
in those process technologies where Infineon has a clear
competitive advantage such as power, embedded flash and RF
technologies. At the same time, in standard CMOS below
90-nanometer, we will continue to share risks and expand our
access to leading-edge technology through long-term strategic
partnerships with other leading industry participants. We do not
intend to invest in in-house capacity for standard-CMOS
processes below the 90-nanometer node, and we will make more
extensive use of manufacturing at silicon foundries.
|
Regarding our memory business, we strive to benefit as Qimonda
implements its strategy, including its plans to:
|
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|
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Improve its average selling prices by increasing its focus on
DRAM products for advanced infrastructure, graphics, mobile and
consumer applications.
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Leverage its technology leadership and increase its presence in
low-cost regions to continue to reduce unit costs.
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Improve profitability and return on capital throughout the
memory product industrys business cycle.
|
We aim to reduce our interest in Qimonda to less than
50 percent by no later than our 2009 general meeting of
shareholders. We will continue executing this strategy to reduce
our interest in Qimonda through secondary offerings and other
capital market measures, making any cash inflow from such sales
of shares available for selective acquisitions to strengthen our
core business or to repurchase our shares. In addition, we
intend to amend our Articles of Association at our 2008 general
meeting of shareholders to authorize a payment of dividends in
kind to our shareholders. A distribution of Qimonda shares as
dividend in kind would then be possible after our 2009 general
meeting of shareholders, provided that we have distributable
profits.
57
Products
and Applications
The following summary provides an overview of some of the more
significant products and applications, and the four largest
customers of each of our three segments, in the 2007 fiscal year.
Principal
Products, Applications and Customers
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Four
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Largest
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Customers
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in the 2007
|
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Fiscal
|
Segment
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|
Principal Products
|
|
Principal Applications
|
|
Year
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|
Automotive, Industrial & Multimarket
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|
Power semiconductors (discretes, ICs and modules), sensors and
microcontrollers (8-bit, 16-bit, 32-bit) with and without
embedded memory, silicon discretes, chip card and security ICs,
ASIC design solutions including secure ASICs, Trusted Platform
Modules
|
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Automotive: Powertrain (engine control, transmission control,
hybrid), body and convenience (comfort electronics, air
conditioning), safety and vehicle dynamics (ABS, airbag,
stability control), infotainment (wireless communication,
telematics/navigation)
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Avnet, Bosch, Siemens, Silicon Application Corporation
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Industrial & Multimarket: Power management &
supplies, lighting, drives, power generation and distribution,
industrial control, discrete commodity products (e.g., handsets)
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Security & ASICs: Chip card and security ICs (e.g.,
for mobile communication, identification, finance), platform
security for computers and in networks (i.e., Trusted Platform
Modules), hard disks, game consoles, hearing aids, computer
peripherals
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Communication Solutions
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Baseband ICs, RF transceivers, power management ICs, single chip
ICs integrating these components, mobile phone platform
solutions including software, DECT chipsets, tuner ICs,
RF-power
transistors, ICs for voice access and core access (e.g., CODECs,
SLICs, ISDN, T/E), broadband access ICs for xDSL CO/CPE, VoIP,
switch and PHY, system solutions for DSL-modems, home-gateways
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Mobile telephone systems for major standards (GSM, GPRS, EDGE,
UMTS), cordless telephone systems for major standards (WDCT,
DECT), RF connectivity solutions (e.g., Bluetooth, GPS),
cellular base stations, voice access and core access, broadband
access solutions for central office, broadband customer premises
equipment and home networking equipment
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Avnet, LG, Nokia, Siemens
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Qimonda
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Standard DRAM components (DDR, DDR2)
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Memory modules,
components-on-mainboards,
consumer devices (digital TV, set-top boxes, DVD recorders)
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Dell, HP, Kingston, Sony
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Personal system DRAM modules (Unbuffered DIMMs with and without
ECC, SO-DIMMs, Micro-DIMMs)
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Desktop computers, workstations,
entry-level
servers, notebook computers, sub-notebooks, ultra-mobile PCs
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Infrastructure DRAM modules (Registered DIMMs, FB-DIMMs,
VLP-DIMMs)
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Servers, Workstations, blade servers
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Networking, storage and industrial DRAM products
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Networking, telecom and industrial equipment, storage
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Graphics (DDR2, GDDR3)
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Graphic cards in desktop and notebook computers, game consoles
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Mobile and Consumer (Mobile-RAM, Cellular-RAM)
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|
Top- and mid-range mobile phones (2.5G/3G), PDAs, digital still
cameras, digital audio players, GPS
|
|
|
58
Automotive,
Industrial & Multimarket
The Automotive, Industrial & Multimarket segment
designs, develops, manufactures and markets semiconductors and
complete system solutions primarily for use in automotive,
industrial and security applications, in addition to
applications with customer-specific product requirements. Our
automotive and industrial business units focus on
microcontrollers and power semiconductors (which handle higher
voltage and higher current than standard semiconductors),
discrete semiconductors, modules and sensors. According to
Strategy Analytics, we were the second largest producer of ICs
for automotive electronics worldwide in 2006, with more than
9 percent of the market, and the largest in Europe. Within
the fragmented market for industrial semiconductor applications,
we focus on power management and supply, as well as drives and
power generation and distribution. IMS Research reported that we
were the number one supplier worldwide for power semiconductors
in 2006, with a market share of more than 8 percent. Our
broad portfolio addressing consumer, computing and communication
applications ranges from discrete semiconductors and power
devices to chip card and security ICs and ASIC design solutions.
Automotive
The market for semiconductors for automotive applications has
grown substantially in recent years, reflecting increased
electronic content in automotive applications in the areas of
safety, power train, body, and convenience systems. This growth
also reflects increasing substitution of mechanical devices such
as relays by semiconductors, in order to meet more demanding
reliability, space, weight, and power reduction requirements.
Our automotive team offers semiconductors and complete system
solutions in the engine management, safety and chassis, body and
convenience, and infotainment markets, in some cases including
software, to its customers. Our principal automotive products
include:
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|
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Semiconductors for power train applications, which perform
functions such as engine and transmission control and hybrid
power trains;
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Semiconductors for safety management, which manage tasks such as
the operation of airbags, anti-lock braking systems, electronic
stability systems, power steering systems and tire pressure
monitoring systems;
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Semiconductors for body and convenience systems, which include
light modules, heating, ventilation and air conditioning
systems, door modules (power windows, door locks, mirror
control) and electrical power distribution systems; and
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|
Semiconductors for infotainment, such as those used for wireless
communication and navigation/telematics.
|
According to Strategy Analytics, safety and vehicle-dynamics
systems comprise the largest portion of the market, followed by
body and convenience systems, power train applications, such as
transmission, engine and exhaust control, in-car entertainment,
and driver information.
Our automotive products include power semiconductors,
microcontrollers, discrete semiconductors and silicon sensors,
along with related technologies and packaging. To take advantage
of expected growth in the market for green vehicles,
our power competencies across all of our business units are
bundled in order to better enable us to provide semiconductor
and power module solutions for hybrid vehicles.
Time periods between design and sale of our automotive products
are relatively prolonged (three to four years) because of the
long periods required for the development of new automotive
platforms, many of which may be in different stages of
development at any time. This is one of the reasons why
automotive products tend to have relatively long life-cycles
compared to our other products. The nature of this market,
together with the need to meet demanding quality and reliability
requirements designed to ensure safe automobile operation, makes
it relatively difficult for new suppliers to enter.
59
In order to strengthen our position in all areas of automotive
electronics, we seek to further develop our strong relationships
with world-wide leading car manufacturers and their suppliers,
with a particular focus on those at the forefront in using
electronic components in cars. We also seek to further
strengthen our presence in the United States and to expand in
other geographic areas, notably Japan. We believe that our
ability to offer complete semiconductor solutions integrating
power, analog and mixed-signal ICs and sensor technology is an
important differentiating factor among companies in the
automotive market. We also believe that our strength in this
relatively stable market complements our strengths in other
markets that may be subject to greater market volatility.
We strongly emphasize high quality in our products. We have
implemented a group-wide program called Automotive
Excellencetm,
through which we aim for the goal of zero defects in
our automotive semiconductors and solutions.
Industrial &
Multimarket
The market for semiconductors for industrial applications is
highly fragmented in terms of both suppliers and customers. It
is characterized by large numbers of both standardized and
application-specific products. These products are employed in a
large number of diverse applications in industries such as
transportation, factory automation and power supplies.
Within the industrial business, we focus on two major
applications: power management & supply, and power
conversion. We provide differentiated products combining diverse
technologies to meet our customers specific needs. With
global energy demand continuing to rise and supplies generally
tightening, power semiconductors can make a major contribution
by addressing the increasing need for energy savings.
We have a strong position in power applications within
industrial and automotive segments. According to the annual
market reports of IMS Research, we have been the global market
leader for power semiconductors for the past four years, with
8.5 percent market share in 2006.
Our broad portfolio comprises power modules, small signal and
discrete power semiconductors, power management ICs and
microcontrollers. Our industrial products are used in a wide
range of applications, such as:
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Power supplies (AC/DC), divided into two main categories:
uninterruptible power supplies, such as power backbones for
Internet servers; and switched-mode power supplies for PCs,
servers and consumer electronics such as televisions and gaming
consoles, as well as battery chargers for mobile phones,
notebook computers and other handheld devices;
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DC/DC power converters for computing and communication
applications such as motherboards, telecommunications equipment
and graphic cards;
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Lighting (electronic lamp ballast and control);
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Drives for machine tools, motor controls, pumps, fans and
heating, ventilation, consumer appliances (such as washing
machines), air-conditioning systems and transportation as well
as power supplies for additional consumer appliances such as
inductive cooking;
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Industrial automation, meters and sensors;
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Power generation, especially in the fields of renewables and
power distribution systems; and
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Other industrial applications such as medical equipment.
|
Our portfolio of semiconductor discretes includes:
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AF (audio frequency) discretes (general purpose diodes and
transistors, switching diodes, digital transistors);
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RF (radio frequency) discretes (diodes, transistors, Small Scale
Integrated Circuits (SSICs), Monolithic ICs);
|
60
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HIPACtm
(High Performance Active and Passive Integration) devices
offering ESD/EMI (Electro Static Discharge/Electro Magnetic
Interference) protection and high integration in advanced
applications (e.g. in mobile communication devices); and
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SMM (Silicon MEMS Microphone): acoustical sensors based on MEMS
(Micro-Electro-Mechanical System) semiconductor technology (for
use in mobile phone applications, for example).
|
Security &
ASICs
Our chip card and security unit designs, develops, manufactures
and markets a wide range of security controllers and security
memories for chip card and security applications. According to
Frost & Sullivan, in the 2006 calendar year we
remained the market leader in ICs for smart card applications,
with a market share of 29 percent, the same as in 2005.
Our products include security memory ICs, security
microcontroller ICs for identification documents, payment cards,
SIM cards, prepaid telecom cards, access and transportation
cards, as well as radio frequency identification
(RFID) ICs for object identification and access.
The markets for our security products are characterized by an
increasing emphasis on high-security applications like
identification and payment, and by trends toward lower prices
and higher demand for embedded non-volatile memory in SIM cards.
Within our ASIC design & security business we focus on
customer-specific products integrating intellectual property
from our customers with our own IP.
These products are used in a variety of markets, with a special
focus on systems for mobility, data storage and security.
The main products of this business unit include:
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Systems on Chip (SoC) for hard disk drive
(HDD) applications;
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Products for computer and gaming peripherals (e.g., in wireless
control pads or memory sticks);
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Secure ASICs, taking advantage of our security know-how (e.g.,
for authentication or copy protection);
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Trusted Platform Module (TPM) products
(hardware-based security for trusted computing); and
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Customer designs manufactured by us on a foundry basis.
|
Many of these products are made to meet customer specifications,
and are often provided by us on a sole-source basis. As a
result, we are often able to establish long-term relationships
with customers in this area, in some cases actively supporting
the customers product roadmap.
Communication
Solutions
Our Communication Solutions segment designs, develops,
manufactures and markets a wide range of ICs, other
semiconductors and complete system solutions for wireless and
wireline communication applications. We are among the leading
players in the markets for semiconductor solutions for mobile
phones as well as wireline access networks.
Wireless
Communications
In wireless communications, our principal products include
baseband ICs, RF transceivers and
single-chip
ICs for the major standards (GSM, GPRS, EDGE, UMTS and DECT),
power management ICs,
radio-frequency
products such as Bluetooth ICs, GPS ICs, and tuner ICs, as well
as RF-power components for wireless infrastructure (base
stations). Our principal solutions include hardware system
design and software solutions for mobile telephone systems
(addressing primarily the GSM, GPRS, EDGE, and UMTS standards)
and Bluetooth as well as DECT/WDCT systems.
61
According to Gartner Dataquest, in the 2006 calendar year we
held the number seven position in subscriber RF and baseband
semiconductor devices, with a worldwide market share of
4 percent. For RF transceivers for digital subscriber
devices, we held the number two position in 2006, with a market
share of 12 percent, according to Gartner Dataquest.
The markets for products in which our cellular communication ICs
and systems are utilized are characterized by trends towards
lower cost, increasingly rapid succession of product
generations, and increased system integration. According to
Strategy Analytics, over 1 billion cellular handsets were
produced in the 2006 calendar year, compared with approximately
817 million units in 2005. This growth was to a large
extent driven by a strong demand in emerging markets. Increasing
demand for connectivity and multimedia capability is expected to
increase the IC content of mobile phones. However, despite such
increased demand, the average selling prices for cellular phone
ICs have declined in recent years. We expect that a further
price decline of entry-level handset models, often referred to
as Ultra Low Cost telephones, will generate
additional demand in emerging markets. We expect these trends to
create both opportunities and threats for suppliers of cellular
communication semiconductors and systems.
We offer products and solutions to customers in the following
principal application areas:
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GSM, or Global System for Mobile Communication, which is the de
facto wireless telephone standard in Europe and available in
more than 120 countries. GSM is a wireless mobile
telecommunication standard that includes General Packet Radio
Service (GPRS), Enhanced Data rate for GSM Evolution
(EDGE), and Universal Mobile Telecommunications
System (UMTS). We offer products and solutions such
as baseband ICs, RF transceivers, power management ICs,
single-chip ICs integrating these components, mobile software,
and reference designs addressing all of these wireless
communication standards;
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UMTS, a GSM-based standard for third-generation (3G)
broadband, packet-based transmission of text, digitized voice,
video, and multimedia at data rates up to 2 megabits per second
(Mbps). We offer complete multimedia mobile phone
platforms, RF transceivers and mobile software for UMTS and also
for the next generation HSDPA standard (High-Speed Downlink
Packet Access) that supports data rates of up to 7.2 Mbps;
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DECT (Digital Enhanced Cordless Telecommunications) and WDCT
(Worldwide Digital Cordless Telecommunications) standards for
digital cordless phones. We offer complete WDCT system solutions
for the 2.4 GHz ISM frequency band, which is available
worldwide, as well as complete DECT system solutions for the
whole range of telephone models required from the
market from
low-featured
entry models to high-featured comfort models. This includes all
necessary RF components, including low-noise transceivers and
power amplifiers, as well as all baseband components such as
residential handset and base station controllers;
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DVB (Digital Video Broadcasting), covering a number of generally
accepted protocol standards for digital television. DVB-T
(Digital Video Broadcasting Terrestrial) and DVB-H
(Digital Video Broadcasting Handhelds) are
television protocol standards that enable digital transmission
of digital content for moving reception devices, such as mobile
phones and PDAs (Personal Digital Assistants). We offer tuner
ICs for stationary, portable and mobile television receivers for
the analog (PAL, NTSC) and digital (DVB-C/T, ISDB, ATSC, DAB,
DVB-H, T-DMB, ISDB-T) TV standards;
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The Global Positioning System (GPS), a location
system based on a network of satellites. GPS is widely used in
automotive, wireless, mobile computing and consumer
applications. Together with a development partner we have
introduced the Hammerhead product family, a single-chip Assisted
Global Positioning System (A-GPS) receiver for
mobile telephones, smart phones and PDAs;
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Bluetooth, a computing and telecommunications industry
specification that allows mobile phones, computers and PDAs to
connect with each other and with home and business phones and
computers using a short-range wireless connection. We offer
BlueMoon UniCellular, a fast and energy-efficient Bluetooth-chip
which supports the Bluetooth enhanced data rate
(EDR) protocol; and
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62
Wireline
Communications
The market for wireline communications is currently
characterized by:
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|
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|
|
a growing demand for a single network offering voice, video and
data (triple play) applications, which creates
increasing demand for high performance broadband access products;
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|
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|
the convergence of voice and data networks into a single
Internet Protocol network infrastructure, which we believe will
drive demand for DSLAM/digital loop carrier
(DLC) integrated voice and data
(IVD) line-card products, particularly in the
North American market; and
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increased investment by carriers in MAN (Metropolitan Area
Network) core infrastructure to support increased data bandwidth
requirements.
|
We focus on broadband access solutions for both the central
office and the customer premises equipment (CPE). In
the market for central office applications we offer
high-performance xDSL, high-quality voice as well as
IVD solutions. In the customer-premise market we provide
low-cost Ethernet switches and Ethernet PHYs, wired and wireless
LAN NICs, low power consumption network processors and
controllers, VoIP ICs and xDSL transceivers. This portfolio of
products allows a complete, end-to-end access solution that
enables the triple play of voice, video, and data
applications.
According to Gartner Dataquest, we were the number four supplier
of application-specific wireline communication ICs worldwide in
2006, with a 5.6 percent market share. We held the number
four position in the wireline access network ICs market segment
in 2006, with a market share of 15 percent, according to
Gartner Dataquest.
The primary applications for our wireline communication products
include:
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voice access, core access and enterprise applications, e.g.,
analog line cards, ISDN, T/E, ATM and PBX;
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|
broadband access solutions for the central office, such as xDSL
line cards; and
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broadband CPE and home networking equipment such as DSL/VoIP
routers, gateways and WLAN access points.
|
During the fourth quarter of the 2007 fiscal year we acquired
the DSL CPE business of Texas Instruments, Inc. This acquisition
will enable us to combine our innovative broadband CPE roadmap
with Texas Instruments, Inc.s large DSL CPE deployment
base at major carriers worldwide.
Qimonda
Qimonda designs semiconductor memory technologies and develops,
manufactures, and markets a large variety of memory products
with various packaging and configuration options, architectures
and performance characteristics on a chip, component and module
level. Qimonda currently offers more advanced DRAM products for
infrastructure, graphics, mobile and consumer applications, as
well as standard DRAM products for PCs, notebooks and
workstations. In its 2007 fiscal year, it also offered a small
number of non-volatile NAND-compatible flash memory products,
but has recently discontinued production of those products.
63
The global market for DRAM has experienced strong cyclicality in
the past and is expected to continue to do so in the future.
Historically, the average price per bit of DRAM experienced an
annual decrease of approximately 30 percent. Price and
therefore revenue volatility depends on the relation between
supply and demand, leading to strong price declines in times of
oversupply and relative stability or even increases in times of
shortage. However, visibility for both supply and demand is
restricted and therefore market development is difficult to
predict. The table below presents revenue and bit data as well
as calendar year-over-year
price-per-bit
development for the DRAM market since 2001 (source: WSTS).
|
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Calendar Year
|
|
2001
|
|
|
2002
|
|
|
2003
|
|
|
2004
|
|
|
2005
|
|
|
2006
|
|
|
DRAM market in billion $
|
|
|
11
|
|
|
|
15
|
|
|
|
17
|
|
|
|
27
|
|
|
|
26
|
|
|
|
34
|
|
DRAM market in billion megabits
|
|
|
400
|
|
|
|
563
|
|
|
|
785
|
|
|
|
1,260
|
|
|
|
1,912
|
|
|
|
2,809
|
|
Year-over-year change average price per bit
|
|
|
(76
|
)%
|
|
|
(3
|
)%
|
|
|
(22
|
)%
|
|
|
0
|
%
|
|
|
(37
|
)%
|
|
|
(10
|
)%
|
The substantial price decline in the 2001 calendar year, which
resulted from worldwide oversupply due to strongly increased
capacity, combined with reduced demand, especially in the PC
segment, resulted in a substantial reduction in revenues from
this business. In the 2002 calendar year, prices for
Qimondas DRAM products stabilized due to increased demand
and consolidation within the industry. In the 2003 calendar year
prices dropped again due to slow demand development. In the 2004
calendar year, prices remained flat. In the 2005 calendar year,
prices declined more strongly than the historical average due to
slow demand development especially in the first half of the
year. During the 2006 calendar year, prices stabilized due to
reduced growth in DRAM supply as some DRAM manufacturers focused
capacity growth on NAND flash. In the 2007 calendar year, prices
declined severely in the first half due to seasonal demand
weakness, the effects of an earlier
build-up of
inventories at OEMs ahead of the introduction of the new Windows
Vista computer operating system, and capacity conversions from
NAND to DRAM by some competitors, following severe price erosion
in the NAND flash area. Supply growth across the industry was
strong, driven by capacity increases and technology conversions
to more efficient technologies.
DRAMs for
Infrastructure, Graphics, Mobile and Consumer
Applications
Qimonda designs, manufactures and sells technologically advanced
DRAM components and modules for use in servers, networking and
storage equipment, including specialty DRAMs for use primarily
in graphics applications, as well as in mobile and consumer
applications.
Infrastructure
Applications. Qimondas current
portfolio of DRAMs for use in servers, networking and storage
equipment includes FB-DIMMs, which Qimonda believes will serve
as the next generation of memory device used in high-end
servers, and very-low-profile-DIMMs, intended for the blade
server market. DRAM consumption in entry level servers is
expected to see a 60 percent compound annual growth rate
(CAGR) based on bits shipped from 2006 to 2011,
according to iSuppli. We believe that Qimonda is the only
FB-DIMM supplier that has in-house capabilities to design a key
component of this module, a logic chip called Advanced Memory
Buffer, or AMB. This allows Qimonda to customize the AMB design
specifically for its memory modules, providing better know-how
transfer from chip-level to system-level and vice versa. Qimonda
also provides customized modules to server manufacturers, in
each case specifically designed to meet the individual
customers unique platform requirements. Qimonda expects
the market for servers to grow substantially in the next few
years, and Qimonda is currently engaged in the development of
products it believes will address that growth. For example,
Qimonda is developing new generations of standard DRAM with 2
gigabits of capacity for use in future IT infrastructure
applications.
Graphics Applications. Qimonda offers a
broad portfolio of graphics DRAMs that support applications with
performance ranging from entry level to very advanced. Due to
their speed, low power consumption and limited heat generation,
Qimondas graphics DRAM components are used in game
consoles, graphics cards and PC and notebook computers. In some
cases, Qimonda makes customized products for use in
entertainment applications, including game consoles and imaging
devices. Qimonda believes that the trend toward the extensive
use of sophisticated graphics
64
applications will result in strong growth in high performance
graphics systems, which it believes will in turn drive the
demand for its graphics DRAM products.
Mobile and Consumer
Applications. Qimonda offers low-power
specialty DRAM products, such as Mobile-RAM and
CellularRAMtm
that are suited for use in a variety of mobile and consumer
applications, such as:
|
|
|
|
|
mobile phones;
|
|
|
|
mobile consumer products, such as digital still cameras and
digital audio players; and
|
|
|
|
stationary consumer products, such as digital televisions and
DVD recorders.
|
Qimondas Mobile-RAM is specifically designed for ultra-low
power consumption, which is increasingly demanded by
todays battery powered mobile communication devices,
especially in high end phones and handheld consumer products.
Qimonda intends to focus further on driving technological
innovation in this area and believes it was the first both to
produce chips with a temperature sensor integrated onto the chip
and to introduce a DDR interface for a Mobile-RAM to further
reduce power consumption or alternatively offer higher
performance. Qimonda also expects that new consumer products
that combine more features will require DRAMs that consume very
low power yet operate at adequate speeds. Qimonda believes that
the trench-architecture-based products it currently offers allow
for significantly longer battery life and reduced heat
dissipation, both important features for potential customers and
their end users.
Qimondas
CellularRAMtm
is designed to be the best choice of memory for entry and
midrange handset models. This market segment is characterized by
stringent low-power requirements but more moderate density and
bandwidth needs.
CellularRAMtm
balances low power efficiency with high data throughput. Qimonda
is also a founding member of the
CellularRAMtm
specification co-development team and, together with six other
industry members, creates common specifications for
high-performance pseudo-SRAM devices, enabling it to take an
active role in the development of DRAM memory products for one
of the fastest-growing technology sectors.
Both Qimondas Mobile-RAM and
CellularRAMtm
products are offered as components and as so-called
Known-Good-Dies, or KGDs, for use in Multi-Chip-Packages, or
MCPs. MCPs combine different memory chips, usually a
non-volatile flash chip, and a faster, volatile RAM chip, and
are increasingly used in mobile communication and consumer
devices due to their lower space consumption. Qimonda supplies
its Mobile-RAM and
CellularRAMtm
as KGDs on wafer level to MCP manufacturers.
Qimonda also offers a broad range of DRAM products for consumer
applications, some of which are of smaller memory densities or
older interface generations, such as SDRAM. These are often
referred to as legacy DRAM products. For example,
the manufacturers of hard disk drives, DVD players, home
gateways and some printers do not require large amounts of DRAM,
but do require a DRAM product that is guaranteed to be available
for the products entire life cycle, which may be many
years. In addition, Qimonda sells products with industrial-level
tolerance for cases where consumer applications require a
broader guaranteed temperature range. For high-end digital
televisions, Qimonda offers modules with up to DDR2 800. Demand
for these dedicated consumer DRAM products is often
less volatile, and their prices are relatively more steady
compared to other standard DRAM products.
Standard DRAMs
for PC, Notebook and Workstation Applications
In addition to DRAMs for infrastructure, graphics, mobile and
consumer applications, we believe Qimonda offers a complete
portfolio of standard DRAM products that provide a variety of
speeds, configurations and densities suited to particular end
uses. In the 2007 fiscal year, Qimonda sold the majority of its
standard DRAM products for use in PCs and workstations to
desktop and notebook computer manufacturers and to distributors
who sell DRAMs to smaller OEMs and contract manufacturers.
Qimondas standard modules, including Unbuffered DIMMs and
SO-DIMMs, are used primarily for PCs and notebooks, while its
more specialized modules such as High-Density
SO-DIMMs and
Micro-DIMMs are typically used in high-end notebook computers
and sub-notebooks. We believe Qimondas
65
engineering capabilities permit it to offer these specialized
modules and differentiate it from suppliers focused primarily on
standard DRAM products. Many of its customers that produce PCs
and workstations also produce servers, networking and storage
equipment or graphics, mobile and consumer products. We believe
these customers expect Qimonda to offer both standard DRAM
products and other types of DRAM products so that Qimonda can
supply their entire product ranges. Qimonda intends to invest in
technology development and anticipates playing an active role in
the development of future DRAM architectures, including
third-generation DDR, or DDR3.
Other
Products
In the beginning of the 2007 fiscal year, Qimonda ramped down
the production of its flash products and converted the capacity
to DRAM, as had been decided in the prior fiscal year following
the significant price decline for data flash memories. Qimonda
continues to be engaged in technology development for
non-volatile memories to address a potential future system flash
market with a competitive platform.
Qimonda conducts its non-volatile memory development activities
at facilities in Dresden and Munich, Germany and Padua, Italy.
Qimonda has stopped the development of NAND-compatible flash
memory products based on proprietary NROM technology that was
licensed from Saifun Semiconductors when it purchased its
remaining interest in its former joint venture with that
company. Qimonda continues to develop non-volatile memory
technologies based on alternative technology platforms,
including MRAMs, PCRAMs, CBRAMs and charge trapping technologies.
Qimonda also sells a small volume of embedded memories, which
are systems-on-a-chip designed for special applications.
Customers,
Sales and Marketing
Customers
We sell our products to customers located mainly in Europe, the
United States, the Asia/Pacific region and Japan.
We target our sales and marketing efforts on demand creation at
approximately 530 direct customers worldwide (including
distributor and Electronic Manufacturing Services
(EMS) accounts, as well as customers acquired
through our recent acquisition of the DSL CPE business of TI and
the mobility products business of LSI) of which approximately
120 are solely customers of Qimonda.
On a group wide basis, no customer accounted for more than
10 percent of our sales in the 2007 fiscal year, and our
top 20 customers accounted for approximately 56 percent of
our sales.
We focus our sales efforts on semiconductors customized to meet
our customers needs. We therefore seek to design our
products and solutions in cooperation with our customers so as
to become their preferred supplier. We also seek to create
relationships with our major customers that are leaders in their
market segments and have the most demanding technological
requirements in order to obtain the system expertise necessary
to compete in the semiconductor markets.
We have sales offices throughout the world. We believe that this
global presence enables us not only to respond promptly to our
customers needs, but also to be involved in our
customers product development processes and thereby be in
a better position to design customized ICs and solutions for
their new products. We believe that cooperation with customers
that are leaders in their respective fields provides us with a
special insight into these customers concerns and future
development of the market. Contacts to our customers
customers and market studies about the end consumer also
position us to be an effective partner.
We believe that a key element of our success is our ability to
offer a broad portfolio of technological capabilities and
competitive services to support our customers in providing
innovative and competitive
66
products to their customers and markets. This ability permits us
to balance variations in demand in different markets and, in our
view, is a significant factor in differentiating us from many of
our competitors.
Below we provide more detailed information on the customers of
each of our principal segments:
Automotive,
Industrial & Multimarket
Automotive
In the automotive business, which includes sales of
microcontrollers, power devices and sensors, our customer base
includes most of the worlds major automotive suppliers.
Our two largest customers in the 2007 fiscal year were Bosch and
the Siemens group. Bosch purchases products mainly for
automotive applications. The Siemens group purchases
semiconductors for automotive and industrial applications. Sales
of automotive products are made primarily in Europe and, to an
increasing extent, in the United States, China, Korea and Japan.
Industrial &
Multimarket
In the industrial & multimarket businesses, the
Siemens group is the largest OEM customer, but the bulk of our
sales of industrial products are made in small volumes to
customers that are either served directly or through third-party
distributors like Arrow, AVNET or Silicon Application
Corporation. Our sales of industrial products vary by type of
product, with devices for drive and power conversion
applications sold primarily in Europe and the United States, and
devices for power management and supply sold primarily in Asia
(other than Japan) and Europe. Our wide variety of discrete
commodity products is targeted at customers in all major fields
of applications, including consumer, computing and communication.
Security &
ASICs
Our chip card and security business derives a large portion of
its revenues from large-scale projects like ePassport projects.
Within the chip card business, three card
manufacturers Gemalto, Giesecke & Devrient
and Oberthur Card Systems accounted for a
significant portion of sales. We maintained our strong worldwide
position in the security business during the 2007 fiscal year.
With our broad and complementary IP portfolio, system
integration skills, and manufacturing expertise, we seek to
leverage our IP into ASIC-based system solutions. We concentrate
on customized designs for customers such as Hitachi Global
Storage and Microsoft Corporation.
Communication
Solutions
Wireless
Communications
In the field of wireless communications we sell a wide variety
of products addressing applications such as cellular phones,
cordless phones, transmission technologies for short, middle and
long distances, tuners, positioning systems and wireless
infrastructure to most of the worlds leading wireless
device and equipment suppliers. In cellular phone applications,
customers purchase products that range from ASSPs and customized
ASSPs that we produce to customer design and specifications to
complete system solutions including mobile software. With
complete system solutions, we target OEMs as well as design
houses and ODMs. Our largest cellular phone customer in the 2007
fiscal year was Nokia, which primarily sources RF semiconductors
from us. With the insolvency of BenQs German subsidiary in
the 2006 fiscal year, we lost a major customer for our baseband
ICs. Nevertheless, we successfully increased shipments of
complete mobile phone platform solutions to other leading
customers such as LG, Panasonic and ZTE. These mobile phone
platform solutions contain our baseband IC, RF IC and power
management IC or a single-chip IC integrating these components,
as well as the corresponding mobile software. During the 2007
fiscal year, Nokia, the largest cellular phone OEM with a
35 percent market share in 2006 according to Strategy
Analytics, announced that it will expand its use of commercially
available chipsets and has chosen our
E-GOLDvoice
single-chip for selected future entry level GSM cellular
phones. Our cordless telephone customers typically purchase
complete system IC kits including baseband ICs, RF ICs and
67
power amplifiers. To our wireless infrastructure customers, such
as Ericsson, we supply RF-power products.
Wireline
Communications
The wireline communications business sells IC products for
telecommunication and data communication applications to a
world-wide customer base, targeted at system providers of
broadband communication applications. Our product portfolio
includes ICs for voice and core access solutions (for example,
CODECs, SLICs, ISDN, T/E), broadband access system solutions for
xDSL and VoIP, as well as system solutions for broadband CPE and
home networking equipment.
In the 2007 fiscal year, Nokia Siemens Networks was the largest
OEM customer of the wireline communications business. Our
leading telecommunications and data communications customers
also include Ericsson, Huawei, Siemens and Sphairon. We deliver
our semiconductor solutions to our customers either directly,
via distributors such as Avnet, or via system manufacturers such
as Hon Hai Precision.
During the fourth quarter of the 2007 fiscal year, we acquired
the DSL CPE business of TI. This acquisition will enable us to
combine our innovative broadband CPE roadmap with TIs
large DSL CPE deployment base at major carriers worldwide.
Qimonda
Qimondas customers include the worlds largest
suppliers of computers and electronic devices. Qimondas
current principal customers include major computing OEMs, or
OEMs in the PC and server markets, including HP, Dell, IBM, Sun
Microsystems and Sony. To expand customer coverage and breadth,
Qimonda also sells a wide range of products to memory module
manufacturers that have diversified customer bases, such as
Kingston, and to a number of distributors. More recently and in
connection with the ongoing expansion of its product portfolio,
especially into graphics applications, Qimonda has added
customers with a strong focus on enabling these applications,
such as nVidia and AMD, and customers who are active in the game
console market, such as Microsoft, Sony and Nintendo. In
addition, Qimonda has added customers in the area of consumer
and mobile applications, such as LG, Spansion and SanDisk.
Qimonda believes that having a close relationship with these
customers can benefit it in the development of future memory
generations by making it easier to develop memory solutions for
future end applications and improve its product designs.
Sales and
Marketing
As of September 30, 2007, we had approximately 2,225 sales
and marketing employees (including approximately 390 Qimonda
employees) worldwide.
Infineon
Logic
We create and fulfill our product sales either directly or
through our network of distribution partners.
A team of Corporate Account Executives is assigned to develop
business relationships with our most important strategic
customers. Dedicated Account Managers foster our relationships
with all other important direct customers. Regional sales units
offer additional support for global accounts based in their
regions, as well as local accounts that are key players in
specific markets. In three smaller markets we still have
contractual arrangements with the Siemens and Epcos sales
organizations to provide defined sales support.
To serve the broader market and expand our indirect sales, a
dedicated organization develops, maintains and interacts with a
strong network of distribution partners.
68
This optimized network includes globally active distributors,
strong regional partners and committed niche specialists. In
addition, third-party sales representatives help to identify and
create business, particularly in the United States.
A number of our important direct customers increasingly
outsource activities ranging from product design and procurement
to manufacturing and logistics to global Electronics
Manufacturing Services (EMS). To meet the specific
requirements of the EMS industry, we have a dedicated EMS sales
team. Focusing on the EMS market leaders, these account managers
follow up on manufacturing transfers from OEM to EMS and
conclude strategic partnerships for design and technology to
increase our market share within the EMS channel.
Within each of our business units, we have product- and
applications-oriented marketing employees. These employees
investigate market trends and the needs of their respective
segments to grow our market share. They define, develop,
optimize and position new products and provide product support
from market introduction up to the end-of-life stage.
Finally, we utilize advertising campaigns mainly in the trade
press to establish and strengthen our identity as a major
semiconductor provider and actively participate in trade shows,
conferences and events to strengthen our brand recognition and
industry presence.
Qimonda
Qimonda makes memory-product sales primarily through direct
sales channels and makes use of distributors in order to ensure
the best possible customer coverage. It focuses its principal
sales and marketing efforts on the technology leaders in each of
the DRAM markets it serves. We believe Qimonda has strong
customer relationships and that its customers, many of which are
leaders in their respective fields, provide Qimonda with special
insights into the current state of their respective markets.
Qimondas engineering experts work directly with its
customers to tailor products to each of their specific needs as
well as to the needs of their quality and supply chain experts.
Qimondas regional sales teams are located in Europe, North
America, Asia/Pacific and Japan, and are supported by
headquarters staff in Germany. These regional sales centers
enable Qimonda to bring its business to its customer base and to
provide local contact and support to the teams in those regions.
Qimondas marketing teams work closely with its customers
and with its sales and R&D organizations. The product
marketing groups help plan Qimondas product roadmap, to
enable it to develop and manufacture products that meet
customers changing requirements.
Backlog
Standard
Products
Cyclical industry conditions in the memory products
market, in particular make it undesirable for many
customers to enter into long-term, fixed-price contracts to
purchase standard (i.e., non-customized) semiconductor products.
As a result, the market prices of our standard semiconductor
products, and our revenues from sales of these products,
fluctuate very significantly from period to period. Most of our
standard non-memory products are priced, and orders are
accepted, with an understanding that the price and other
contract terms may be adjusted to reflect market conditions at
the delivery date. It is a common industry practice to permit
major customers to change the date on which products are
delivered or to cancel existing orders. For these reasons, we
believe that the backlog at any time of standard products, such
as memory products, is not a reliable indicator of future sales.
Non-Standard
Products
Logic products are more customized than memory products.
Therefore, orders are generally made well in advance of
delivery. Quantities and prices of logic products may
nevertheless change between the times they are ordered and when
they are delivered, reflecting changes in customer needs and
industry
69
conditions. During periods of industry overcapacity and falling
sales prices, customer orders are generally not made as far in
advance of the scheduled shipment date as during periods of
capacity constraints, and more customers request logistics
agreements based on rolling forecasts. The resulting lower
levels of backlog reduce our managements ability to
forecast optimum production levels and future revenues. As a
result, we do not rely solely on backlog to manage our business
and do not use it to evaluate performance.
The markets for many of our products are intensely competitive,
and we face significant competition in each of our product
lines. We compete with other major international semiconductor
companies, some of which have substantially greater financial
and other resources with which to pursue research, development,
manufacturing, marketing and distribution of their products.
Smaller niche companies are also becoming increasingly important
players in the semiconductor market, and semiconductor foundry
companies have expanded significantly. Competitors include
manufacturers of standard semiconductors, application-specific
ICs and fully customized ICs, including both chip and
board-level products, as well as customers that develop their
own integrated circuit products and foundry operations. We also
cooperate in some areas with companies that are our competitors
in other areas.
The following table shows key competitors for each of our
segments in alphabetical order:
Key Competitors
by Segment
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|
|
Automotive, Industrial & Multimarket
|
|
Freescale, International Rectifier, Mitsubishi, NXP, Renesas,
Samsung, ST Microelectronics, Texas Instruments
|
Communication Solutions
|
|
Broadcom, Conexant, Freescale, NXP, Qualcomm, Texas Instruments
|
Qimonda
|
|
Elpida Memory, Hynix Semiconductor, Micron Technology, Nanya
Technology (with which we also have a joint venture), Samsung
Electronics
|
We compete in different product lines to various degrees on the
basis of product design, technical performance, price,
production capacity, product features, product system
compatibility, delivery times, quality and level of support.
Innovation and quality are competitive factors for all segments.
Production capacity as well as the ability to deliver products
reliably and within a very short period of time play
particularly important roles.
Our ability to compete successfully depends on elements both
within and outside of our control, including:
|
|
|
|
|
successful and timely development of new products, services and
manufacturing processes;
|
|
|
|
product performance and quality;
|
|
|
|
manufacturing costs, yields and product availability;
|
|
|
|
pricing;
|
|
|
|
our ability to meet changes in our customers demands by
altering production at our facilities;
|
|
|
|
our ability to provide solutions that meet our customers
specific needs;
|
|
|
|
the competence and agility of our sales, technical support and
marketing organizations; and
|
|
|
|
the resilience of our supply chain for services that we
outsource and the delivery of products, raw materials and
services by third party providers needed for our manufacturing
capabilities.
|
70
Our production of semiconductors is generally divided into two
steps, referred to as the front-end process and the back-end
process.
Front-end
In the first step, the front-end process, electronic circuits
are produced on raw silicon wafers through a series of
patterning, etching, deposition and implantation processes. At
the end of the front-end process, we test the chips for
functionality.
We believe that we are one of the leaders in the semiconductor
industry in terms of the structure size on our wafers. Structure
size refers to the minimum distances between electronic
structures on a chip. Smaller structure sizes increase
production efficiencies in the production of memory and logic
products. The structure size of our current logic products is as
small as 90-nanometers and we have qualified
65-nanometer
technology at multiple manufacturing sites. The structure size
of the memory products of Qimonda is as small as 75-nanometers
and Qimonda is currently developing production processes for
memory products with structure sizes as small as 58-nanometers.
We think that we achieve substantial differentiation at our
customers due to our power semiconductor process technology and
our world-wide network of manufacturing sites that combine the
highest quality standards and flexibility.
High-end mask technology is a prerequisite for achieving small
structure sizes. Since May 2002, the Advanced Mask Technology
Center (AMTC), our joint venture with Advanced Micro
Devices and Toppan Photomasks in Dresden, Germany, has developed
advanced masks. Since 2004, the joint ventures mask
foundry has produced high-end masks at AMTCs Dresden
production facility. Infineon and Qimonda expect to continue to
purchase most of their masks from AMTC and Toppan Photomasks
under cooperative arrangements.
Back-end
In the second step of semiconductor production, the back-end
process (also known as the packaging, assembly and test phase),
the processed wafers are ground and mounted on a synthetic foil,
which is fixed in a wafer frame. Mounted on this foil, the wafer
is diced into small silicon chips, each one containing a
complete integrated circuit. One or multiple individual chips
are removed from the foil and fixed onto a substrate or
lead-frame base, which will enable the physical connection of
the product to the electronic board. The next step is creating
electrical links between the chip and the base by soldering or
wiring. Subsequently, the chips and electrical links are molded
with plastic compounds for stabilization and protection.
Depending on the package type, the molded chips undergo a
separation and pin bending process. Finally, the semiconductor
is subject to functional tests.
Our back-end facilities are equipped with state-of-the-art
equipment and highly automated manufacturing technology,
enabling us to perform assembly and test on a cost-effective
basis. We have improved our cost position by moving significant
production volumes to lower-cost countries such as Malaysia and
China. Our back-end facilities also provide us with the
flexibility needed to customize products according to individual
customer specifications (giving us System in Package
capabilities). We continued the process of converting our
packages to comply with new international environmental
requirements for lead-and/or halogen-free green
packages in the 2007 fiscal year.
71
Manufacturing
Facilities
We operate manufacturing facilities around the world, including
through joint ventures in which we participate. The following
table shows selected key information with respect to our current
major manufacturing facilities:
Manufacturing
Facilities in 2007
|
|
|
|
|
|
|
|
|
Year of
|
|
|
|
|
|
commencement
|
|
|
|
|
|
of first
|
|
|
|
|
|
production line
|
|
|
Principal products or functions
|
|
Front-end facilities wafer fabrication
plants
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Infineon Logic:
|
|
|
|
|
|
|
Dresden, Germany
|
|
|
1996
|
|
|
DRAM, ASICs with embedded flash memory, logic ICs
|
Essonnes,
France(1)
|
|
|
1963
|
(2)
|
|
Logic ICs and ASICs with embedded flash memory
|
Horten, Norway
|
|
|
1985
|
|
|
MEMS
|
Kulim, Malaysia
|
|
|
2006
|
|
|
Power, smart power
|
Regensburg, Germany
|
|
|
1986
|
|
|
Power, smart power, sensors, mixed signal
|
Villach, Austria
|
|
|
1979
|
|
|
Power, smart power and discretes
|
Warstein, Germany
|
|
|
1965
|
(2)
|
|
High power
|
Qimonda:
|
|
|
|
|
|
|
Dresden 300mm, Germany
|
|
|
2001
|
|
|
DRAM
|
Richmond 200mm, Virginia
|
|
|
1998
|
|
|
DRAM
|
Richmond 300mm, Virginia
|
|
|
2005
|
|
|
DRAM
|
Taoyuan,
Taiwan(3)
|
|
|
2004
|
|
|
DRAM
|
|
|
|
|
|
|
|
Back-end facilities assembly and final
testing plants
|
|
|
|
|
|
|
Infineon Logic:
|
|
|
|
|
|
|
Batam, Indonesia
|
|
|
1996
|
|
|
Leaded power and non-power ICs
|
Cegléd, Hungary
|
|
|
1997
|
|
|
High power
|
Morgan Hill, California
|
|
|
2002
|
|
|
RF-power
|
Regensburg, Germany
|
|
|
2000
|
|
|
Chip card modules, sensors and pilot lines
|
Singapore
|
|
|
1970
|
|
|
Leadless and leaded non-power ICs, wafer test
|
Skoppum, Norway
|
|
|
1991
|
|
|
Sensors
|
Warstein, Germany
|
|
|
1965
|
(2)
|
|
High power
|
Wuxi, China
|
|
|
1996
|
|
|
Discretes, chip card modules
|
Malacca, Malaysia
|
|
|
1973
|
|
|
Discretes, power packages, sensors, logic ICs
|
Qimonda:
|
|
|
|
|
|
|
Dresden, Germany
|
|
|
1996
|
|
|
DRAM components and modules
|
Malacca, Malaysia
|
|
|
1973
|
|
|
DRAM components and modules
|
Porto, Portugal
|
|
|
1997
|
|
|
DRAM components and modules
|
Suzhou,
China(4)
|
|
|
2004
|
|
|
DRAM components and modules
|
|
|
(1)
|
ALTIS, our joint venture with IBM. We and IBM entered into an
agreement in August 2007 to sell ALTIS to AES.
|
|
(2)
|
The current main production line began operations in 1991.
|
|
(3)
|
Inotera Memories, Qimondas joint venture with Nanya.
|
|
(4)
|
Qimonda Technologies Suzhou Co. Ltd., Qimondas joint
venture with CSVC.
|
72
In addition to our own manufacturing capacity, we have entered
into a number of alliances and joint ventures, and have
relationships with several foundry partners, which give us
access to substantial additional manufacturing capacity,
allowing us to more flexibly meet variable demand for both
memory and logic products over market cycles. These arrangements
are described below under Manufacturing joint ventures and
partnerships and Strategic Alliances.
Logic
Manufacturing
Front-end
Our logic front-end facilities currently have a capacity of
approximately 280,000 200-millimeter equivalent wafer starts per
month. In implementing our fab-light strategy, we
have begun to shift the focus of our in-house manufacturing
toward power logic products and to shift manufacturing of
advanced logic products to foundries. In this context we pursued
the sale of our share in ALTIS. In August 2007, Infineon, IBM
and Advanced Electronic Systems AG (AES), entered
into an agreement, under which AES would acquire the equal
50 percent stakes in ALTIS Semiconductor S.N.C. from
Infineon and IBM.
To reflect this change we initiated a reorganization of our
operations in the 2007 fiscal year. As a result of these
reorganization measures, we expect to achieve additional
synergies between Power and Advanced CMOS front-ends and
back-ends, respectively.
In 2007, in-house production of advanced logic wafers (with
structure sizes of 250-nanometers or less) was carried out at
our 200-millimeter manufacturing facility in Dresden and at our
ALTIS joint-venture with IBM in Essonnes, France, while in-house
production of power logic wafers (with structure sizes of more
than
250-nanometers)
was largely carried out at our front-end manufacturing
facilities in Kulim, Regensburg, and Villach.
Generally, we use foundries to provide flexibility in meeting
demand, as well as managing investment expenditures. In recent
years, we have enhanced our manufacturing cooperation with
United Microelectronics Corporation (UMC),
particularly with respect to leading-edge CMOS products for
wireless communications down to 90-nanometer.
We have entered into a joint development agreement with IBM,
Chartered Semiconductor and Samsung, to accelerate the move to
65-nanometer and 45-nanometer process technologies. The
65-nanometer
technology has been qualified at several manufacturing sites and
the 45-nanometer technology is undergoing transfer to one of our
manufacturing partners. In May 2007, we extended the joint
development agreements with IBM and its development and
manufacturing partners to include the
32-nanometer
generation. Starting with 65-nanometer technology, our advanced
logic front-end manufacturing will be solely sourced from
manufacturing partners, optimizing capital investment and
business flexibility.
We continued the ramp up of our new power-logic plant in the
Kulim Hi-Tech Park in the north of Malaysia in the 2007 fiscal
year and plan to further increase our production capacity at
that site. This will allow us to further expand our presence in
the growing Asian market, as well as to strengthen our cost and
competitive positions. We expect to
ramp-up
capacity at Kulim according to market demand. We expect that
maximum capacity could reach approximately 100,000 wafer starts
per month.
Back-end
We have a number of logic back-end facilities, located primarily
in Europe and Asia. We also use assembly and test subcontractors
to provide us with flexibility in meeting demand, as well as
managing investment expenditures. For assembly services, we have
further intensified our partnership with AMKOR Technology on
leadless and flip-chip technologies.
73
Qimonda
Manufacturing
Front-end
In the 2007 fiscal year, Qimonda continued to increase the share
of its DRAM manufacturing on
300-millimeter
diameter wafers. The
ramp-up of
the second manufacturing module at Inotera, Qimondas
300-millimeter manufacturing joint venture with Nanya, was
completed and the total capacity in both manufacturing modules
at Inotera reached 120,000 wafer starts per month in September
2007. Qimonda and Nanya are each entitled to 50 percent of
Inoteras capacity. In addition, Qimondas
300-millimeter facility at Richmond ramped up production to a
capacity of approximately 30,000 wafer starts per month by
September 2007. The maximum capacity of this facility is
expected to amount to 50,000 wafer starts per month and is
planned to be ramped up depending on market developments.
Qimondas foundry and development partner Winbond has
continued the ramping up of its 300-millimeter production since
its opening in April 2006. The increasing share of
300-millimeter production and the conversion to
80-nanometer
and 75-nanometer technologies should substantially reduce
Qimondas overall
per-unit
cost for memory chips.
In April 2006, Qimonda entered into an agreement with
Infineon for the production of wafers in the Dresden
200-millimeter fab. Pursuant to the agreements, as amended in
January 2007, Infineon has agreed to manufacture specified
semiconductor memory products at the Dresden 200-millimeter fab,
using Qimondas manufacturing technologies and masks, and
to sell them to Qimonda at prices based on the cost of
manufacture. Qimonda is required under this agreement to pay for
idle costs resulting from its purchasing fewer wafers from
Infineon than agreed upon, if Infineon cannot otherwise utilize
the capacity. Qimonda is also obliged to indemnify Infineon
against any third party claims based on or related to any
products manufactured for Qimonda under this agreement and
against any intellectual property infringement claims related to
the products covered by the agreement. In addition, Qimonda
agreed in principle to share equally with Infineon potential
restructuring costs that might be incurred in connection with
the potential ramp down of production in one module of the
Dresden 200-millimeter fab.
On November 30, 2007, as part of its measures aimed at
further focusing its production on 300-millimeter capacities,
Qimonda announced that it will discontinue the purchase of
200-millimeter wafers from Infineon Dresden. The last wafers for
Qimonda are planned to enter production at the end of
February 2008.
Back-end
Qimonda has its own back-end operations at its lead fab in
Dresden as well as in Porto, Portugal and Malacca, Malaysia. In
addition, Qimonda sources back-end capacities from its joint
venture Qimonda Suzhou, China and uses third party
subcontractors for part of the back-end volumes to balance the
load in its own fabs. Package development is mainly done at
Dresden, whereas the back-end sites in Porto, Malacca and Suzhou
focus on volume manufacturing of components as well as DRAM
modules. In the 2007 fiscal year, Qimonda and EEMS Italia S.p.A.
entered into a partnership dedicated to the assembly and testing
of memories. EEMS will manufacture components in a dedicated
manufacturing facility in Suzhou, China, that is currently under
construction and scheduled to start operations early in the 2008
calendar year. In addition, Qimonda announced plans to construct
a new facility for module manufacturing in Johor, Malaysia in
which it expects to invest 150 million over the next
five years.
Qimonda
Fab Cluster System
Qimonda has structured and organized its memory fabrication
facilities worldwide in its so-called fab cluster.
Through this organizational approach, Qimonda seeks to use best
processes to maximize quality and consistency across facilities.
This allows it to ship many products from multiple sites, and
therefore supply products to anywhere in the world from multiple
facilities. In addition, by locating facilities in different
areas, Qimonda can also recruit talent globally. The fab cluster
includes Qimondas front-end facilities in Dresden and
Richmond and corresponding back-end sites in Dresden, Malacca
and Porto, as well as its front-end manufacturing joint venture
Inotera, back-end manufacturing joint venture Qimonda Suzhou and
its front-end foundry partners Winbond and SMIC, and the
dedicated back-end facility in Suzhou, China, of
74
EEMS Italia S.p.A. that is currently under construction and
scheduled to start operations early in the 2008 calendar year.
Manufacturing
joint ventures and partnerships
We have established the following manufacturing ventures and
arrangements with partners:
Infineon Joint
Ventures and Partnerships
ALTIS. In 1991 we entered into an
arrangement with IBM, under which IBM manufactured DRAM products
in its facility in Essonnes, France and we received a share of
the production. Later we agreed with IBM to convert the Essonnes
facility to the production of logic devices and to convert the
existing production cooperation arrangement into a joint venture
called ALTIS. In 2007, we owned 50 percent of the joint
ventures shares plus one share and IBM owned the rest.
Following an amendment in December 2005 we began to fully
consolidate ALTIS whereby IBMs 50 percent ownership
interest has been reflected as a minority interest. During the
2006 fiscal year, restructuring plans were announced to downsize
the workforce at ALTIS in order to maintain competitiveness and
reduce costs. Our allocated percentage of the output of ALTIS
was 89 percent in the 2007 fiscal year.
In August 2007, Infineon, IBM and Advanced Electronic Systems AG
(AES) entered into an agreement, under which AES
would acquire the equal 50 percent stakes in ALTIS from
Infineon and IBM. Pursuant to the agreement, Infineon will enter
into a two-year supply contract with ALTIS and we and IBM will
license key manufacturing process technologies to AES for use in
ALTIS. The transaction is expected to close during the first
quarter of the 2008 fiscal year, subject to governmental and
regulatory approval and works council consultation.
Qimonda Joint
Ventures and Partnerships
CSVC. Qimonda Technologies (Suzhou)
Co., Ltd. is Qimondas consolidated joint venture with
China-Singapore Suzhou Industrial Park Venture Co., Ltd.
(CSVC) in Suzhou, China, which has constructed a
back-end facility for the assembly and testing of Qimondas
products. The joint venture agreement was entered into in July
2003 and has an initial term of 50 years. It can generally
be terminated upon material breach by the other party, a
partys bankruptcy or insolvency and various other events
relating to a partys financial condition. The facility
officially opened in September 2004 and is scheduled to have
capacity of up to one billion chips per year. The facility will
be ramped in a number of stages as dictated by growth and trends
in the global semiconductor memory market. Qimonda is required
to purchase the entire output of the facility. We and Qimonda
have invested $155 million in the venture and Qimonda
expects to invest a further $86.5 million in the venture by
the end of its 2008 fiscal year pursuant to the current
contractual obligations. Qimonda currently holds 63 percent
of the outstanding capital stock of Qimonda Suzhou and plans to
increase its investment in this venture such that it will hold
approximately 72.5 percent of its share capital by the end
of 2008, with CSVC owning the remaining 27.5 percent.
Qimonda has the option to acquire the remaining CSVC stake at
the nominal investment value plus accrued and unpaid return. The
joint venture intends to arrange external financing for any
further investment required to purchase additional equipment.
There can be no assurance that this external financing can be
obtained at favorable terms or at all.
SMIC. In December 2002, we entered into
a Product Purchase and Capacity Reservation Agreement, as most
recently amended in October 2007, with Semiconductor
Manufacturing International Corporation (SMIC), a
Chinese foundry. As amended, this agreement provides Qimonda
access to additional DRAM manufacturing capacity. Under the
terms of this agreement, SMIC agreed to manufacture, and Qimonda
has agreed to purchase, up to 20,000 wafers per month at
SMICs 200-millimeter manufacturing facility in Shanghai at
least until 2007 and up to 15,000 wafers per month at
SMICs 300-millimeter manufacturing facility in Beijing at
least until 2009. The agreement remains in effect until
December 31, 2010 and may be extended. Qimonda has the
unilateral right to terminate this agreement in the event that
one of its competitors acquires 50 percent of SMICs
voting shares. In addition, either party may terminate the
75
agreement upon material breach by the other party of any
obligation under this or the ancillary know-how transfer
agreement or upon bankruptcy or insolvency of the other party.
Winbond. In May 2002, we entered into a
Product Purchase and Capacity Reservation Agreement with
Winbond, a Taiwanese foundry. This agreement provides Qimonda
access to additional DRAM production capacity. Under the terms
of this agreement, Winbond agreed to manufacture, and Qimonda
has agreed to purchase, up to 19,000 wafer starts per month from
Winbonds 200-millimeter production facility in Hsinchu,
Taiwan until 2007.
In August 2004, we entered into an extended Product Purchase and
Capacity Reservation Agreement, as most recently amended in
August 2006, with Winbond. This agreement gives Qimonda access
to additional DRAM production capacity of up to 15,000 wafers
per month in Winbonds 300-millimeter manufacturing
facility in Taiwan until 2009. Qimonda has exceeded this level
from time to time. Under the terms of this agreement Qimonda
agreed to provide its 80-nanometer DRAM trench technology to
Winbonds 300-millimeter manufacturing facility and Winbond
agreed to manufacture DRAMs for computing applications using
this technology exclusively for Qimonda.
In June 2007, Qimonda signed agreements with Winbond to expand
its existing cooperation with Winbond and its reservation of
capacity at Winbonds facility for up to 24,000
300-millimeter wafer starts per month. Under the terms of the
agreement, Qimonda will provide its 75-nanometer and
58-nanometer DRAM trench technology to Winbonds
300-millimeter manufacturing facility. In return, Winbond will
manufacture DRAMs for computing applications using these
technologies exclusively for Qimonda.
Each agreement remains in effect until the last shipment of, and
payment for, products manufactured under the agreement unless it
is earlier terminated for breach.
Inotera. We entered into agreements
with Nanya relating to a strategic cooperation in the
development of DRAM products and assigned these agreements to
Qimonda. We have also established a joint venture, Inotera
Memories, with Nanya. Inotera has constructed and operates a
300-millimeter manufacturing facility in Taiwan. Pursuant to the
agreements, we and Nanya developed advanced 90-nanometer and
75-nanometer technology and have begun development of
58-nanometer technology. Research is conducted in Dresden and
Munich, and manufacturing is conducted in Taoyuan, Taiwan.
Inoteras 300-millimeter manufacturing facilities in Taiwan
employ the production technology developed under our joint
development agreement with Nanya. Ramp-up of manufacturing at
the first facility was completed during the 2006 fiscal year. In
May 2005, the groundbreaking for the second manufacturing module
took place. Construction of this manufacturing module was
completed in the 2006 fiscal year and the
ramp-up of
capacities in this module was completed in September 2007 with a
capacity of 120,000 300-millimeter wafer starts per month in
total for both modules. Qimonda is entitled to half of the
production capacity of Inotera. Inotera has been listed on the
Taiwanese Stock Exchange since March 2006 and has conducted a
capital increase based on global depository receipts in May
2006. We completed the transfer of our shares in Inotera to
Qimonda on March 13, 2007, excluding less than
one percent of the total Inotera shares which we hold in
trust for Qimonda due to Taiwanese legal restrictions. Qimonda
currently owns 35.6 percent of Inotera.
76
Research and development (R&D) is critical to
our continuing success, and we are committed to maintaining high
levels of R&D over the long term. The table below sets
forth information with respect to our research and development
expenditures for the periods shown:
Research and
Development Expenditures
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
For the years ended September 30,
|
|
|
2005
|
|
2006
|
|
2007
|
|
|
( in millions, except percentages)
|
|
Expenditures (net of subsidies received)
|
|
|
1,293
|
|
|
|
1,249
|
|
|
|
1,169
|
|
As a percentage of net sales
|
|
|
19
|
%
|
|
|
16
|
%
|
|
|
15
|
%
|
Our R&D activities are concentrated in the areas of
semiconductor based product and system development, as well as
process technology. Major R&D activities range from the
development of leading edge RF, analog and power circuits,
complex digital
system-on-chip
solutions, high and low power discretes, sensors, reusable
IP-blocks,
software blocks, CAD flow and libraries, and packaging
technology to complex mobile phone system integration.
Infineon
Logic Research and Development
Our logic ICs generally utilize complex
system-on-chip
designs and require a wide variety of intellectual property and
sophisticated design methodologies, to combine high performance
with low power consumption. We believe that our range of
intellectual property and methodologies for logic ICs, in
particular our capability to integrate various ICs and complex
software products, will enable us to continue to strengthen our
position in the logic IC market. We view expertise in
analog/mixed-signal devices and RF design as a particular
competitive strength.
Our power ICs and discrete power transistors utilize a
sophisticated co-design of circuits and technology procedures to
optimize parameters like on-resistance, switching speed and
reliability. We believe our expertise in all fields of power
applications up to the highest voltage and current levels will
enable us to retain a leading development position and help us
to remain a leading supplier for power semiconductors.
In 2007 we entered a strategic cooperation with Hyundai Motor
Company for the development of automotive electronics. The two
companies opened a joint Hyundai Infineon Innovation Center
(HIIC) which will work on the functional and cost
optimization of car electronics systems, as well as develop
automotive electronic system architecture. The innovation center
is located at the Yangjae-dong headquarters of the Hyundai-Kia
Automotive Group in Seoul and is co-managed by both companies.
Also in 2007, we announced the expansion of our R&D
activities in Singapore. This expansion will enable us to better
serve the growing demand for products in the energy efficiency,
connectivity and security areas. We will invest approximately
200 million and add approximately 150 new positions
in R&D over a three-year period.
Process technologies are another important focus of our R&D
activities. We continuously develop our power technologies in
order to support our number one position in the power market.
Requirements for automotive and industrial applications, such as
high-temperature, high switching power and reliability allow for
differentiation through in-house R&D. For advanced logic
technologies we are following a strategy of alliances with
several partners and consortia to maintain a competitive
technology roadmap at an affordable cost level. This includes a
joint development agreement with IBM, Chartered Semiconductor
and Samsung, to accelerate the move to 65-nanometer and
45-nanometer process technology. The 65-nanometer technology has
been qualified at several manufacturing sites and the
45-nanometer technology is undergoing transfer to our
manufacturing partner. In May 2007, we extended our joint
development agreements with IBM and its development and
manufacturing partners to the 32-nanometer generation.
77
Our process technologies benefit from many modular
characteristics, including special low-power variants, analog
options and high-voltage capabilities.
Qimonda
Research and Development
Qimondas R&D activities are broadly divided into two
major steps. First, Qimonda develops a manufacturing process
technology and a design platform in conjunction with a
lead product. Subsequently, the rest of the product
portfolio is developed as follower products that
utilize the design platform established in the first step. The
goal of Qimondas technology development efforts is to
support its product designers to meet the customer requirements
for memory products regarding high performance, low power
consumption and small form factors (i.e., structure sizes) at a
competitive cost level.
In the area of memory process technology, Qimonda started
commercial production of DRAM products based on 75-nanometer
technology during the 2006 fiscal year. In addition, Qimonda
developed an 80-nanometer technology dedicated to its standard
DRAM product portfolio that was released for production in
October 2006. Both technologies have been in
ramp-up
during the 2007 fiscal year. A strategic development alliance
with Nanya for DRAM technologies allows Qimonda to share
development costs and resources. After having successfully
finalized the development of 75-nanometer process technology for
DRAM products in the 2006 fiscal year, the development alliance
is currently developing 58-nanometer process technologies for
DRAM products. Qimonda is at the same time working on designs
beyond this technology node with an open platform approach and a
range of architectures and technologies under review. Qimonda is
also engaged in the research and development of various emerging
memory technologies. All of Qimondas memory technology
development takes place at its memory technology development
center in Dresden, Germany.
Qimondas product development activities focus on those
specialized and advanced memory products that it believes
provide more stable and higher selling prices than standard
DRAMs. To enable this, Qimonda has increased the number of
product development engineers from around 560 at the end of the
2003 fiscal year to more than 1,100 worldwide at the end of the
2007 fiscal year. Qimonda believes these enhanced resources have
resulted in recent successes in developing new products. For
example, Qimonda expanded its graphic DRAM product portfolio
from a single product in 2003 to a range of seven products that
are currently offered in different densities, interfaces and
speeds for the full range of graphics applications from entry
level to high-end. Qimonda defines its products in close
cooperation with lead customers and industry partners and is
actively driving new standards and participating in
standardization committees such as the Joint Electron Device
Engineering Council (JEDEC). Qimondas
worldwide operating Application Engineering team helps its
customers to design in Qimonda products into their systems.
78
Locations
Our research and development activities are conducted at
locations throughout the world. The following table shows our
major research and development locations and their respective
areas of competence:
Principal
Research and Development Locations
|
|
|
Location
|
|
Areas of Competence
|
|
Infineon Logic:
|
|
|
Bangalore, India
|
|
IC, software and system development for wireless, wireline,
automotive and industrial products, CAD flow and library
development
|
Bucharest, Romania
|
|
Power mixed signal semiconductors, chip card ICs, RF IC
development for wireless products
|
Dresden, Germany
|
|
Advanced technology development
|
Duisburg, Germany
|
|
IC and system development for wireless products, RF IC
development, customer support for wireline products
|
Graz, Austria
|
|
Contactless systems, automotive power systems, sensor products
|
Linz, Austria
|
|
RF IC and software development for wireless and sensor products
|
Morgan Hill, California, USA
|
|
RF IC development for high power applications
|
Munich, Germany
|
|
Main product development site; Technology integration, CAD flow,
library development, IC, software and system development for
wireline products, microcontrollers, ASICs with embedded DRAM,
chip card ICs, automotive power and industrial products, process
technology development
|
Nuremberg, Germany
|
|
Software and system development for wireless products
|
Regensburg, Germany
|
|
Package development, process technology development
|
Shanghai, China
|
|
System development for wireless products
|
Singapore
|
|
IC, software and system development for wireline, wireless and
industrial products, package development
|
Sophia Antipolis, France
|
|
IC development for wireless products, library development, CAD
flow
|
Villach, Austria
|
|
IC development for power semiconductor products, mixed signal IC
development for automotive and communication products
|
Xian, China
|
|
IC development for automotive and communication products
|
|
|
|
Qimonda:
|
|
|
Burlington, Vermont, USA
|
|
Low power and mobile and consumer DRAMs
|
Dresden, Germany
|
|
DRAM technology, Flash technology and package technology
development
|
Munich, Germany
|
|
Computing and graphic DRAMs, emerging memory research, Flash
product development
|
Padua, Italy
|
|
Flash product development
|
Raleigh, North Carolina, USA
|
|
Product development for standard and specialty DRAM
|
Xian, China
|
|
Computing and legacy DRAMs
|
As of September 30, 2007, our research and development
staff consisted of approximately 8,340 employees working in
our R&D units throughout the world (including approximately
2,505 Qimonda employees), a net increase of approximately 595
from September 30, 2006 (including a net increase of
approximately 750 Qimonda employees). We have given
particular emphasis in recent years to the expansion of our
R&D resources in cost-attractive locations with good access
to lead markets and lead
79
customers. We believe that appropriate utilization of skilled
R&D personnel in lower-cost locations will improve our
ability to maintain our technical position while controlling
expenses.
Our intellectual property rights include patents, copyrights,
trade secrets, trademarks, utility models, designs and maskwork
rights. The subjects of our patents primarily relate to IC
designs and process technologies. We believe that our
intellectual property is a valuable asset not only to protect
our investment in technology but also a vital prerequisite for
cross licensing agreements with third parties.
At September 30, 2007, on a group-wide basis we owned more
than 43,000 patent applications and granted patents (both
referred to as patents below) in over 40 countries
throughout the world, of which approximately 20,000 were held by
Qimonda. These patents belong to approximately 14,000
patent families (each patent family containing all
patents originating from the same invention), of which more than
6,000 were patent families held by Qimonda. At
September 30, 2007, approximately 86 percent of our
patent families included patents in Europe, approximately
72 percent included patents in the United States and
approximately 34 percent included patents in Asia. We filed
first patent applications for approximately 1,150 inventions
during the 2007 fiscal year, of which approximately 430 related
to the Qimonda business. National and regional patent offices
examine whether our patent applications meet the necessary
requirements. Owing to the complex nature of our patent
applications this examination process typically takes several
years until grant of a patent.
It is common industry practice for semiconductor companies to
enter into patent cross licensing agreements with each other.
These agreements enable each company to utilize the patents of
the other on specified conditions. In some cases, these
agreements provide for payments to be made by one party to the
other. We are a party to a number of patent cross licensing
agreements, including agreements with other major semiconductor
companies. We believe that our own substantial patent portfolio
enables us to enter into patent cross licensing agreements on
favorable terms and conditions. We are currently in patent cross
licensing negotiations with several major industry participants.
Depending on new developments, new products or other business
necessities, we may initiate additional patent cross licensing
agreements in the future.
Our success depends in part on our ability to obtain patents,
licenses and other intellectual property rights covering our
products and their design and manufacturing processes. To that
end, we have obtained many patents and patent licenses and
intend to continue to seek patents on our developments. The
process of seeking patent protection can be lengthy and
expensive, and there can be no assurance that patents will be
issued from currently pending or future applications or that, if
patents are issued, they will be of sufficient scope or strength
to provide us with meaningful protection or a commercial
advantage. In addition, effective copyright and trade secret
protection may be limited in some countries or even unavailable.
Our competitors also seek to protect their technology by
obtaining patents and asserting other forms of intellectual
property rights. Third-party technology that is protected by
patents and other intellectual property rights may be
unavailable to us or available only on unfavorable terms and
conditions. Third parties may also claim that our technology
infringes their patents or other intellectual property rights,
and they may bring suit against us to protect their intellectual
property rights. From time to time, it may also be necessary for
us to initiate legal action to enforce our own intellectual
property rights. Litigation can be very expensive and can divert
financial resources and management attention from other
important uses. It is difficult or impossible to predict the
outcome of most litigation matters, and an adverse outcome can
result in significant financial costs that can have a material
adverse effect on the losing party. For a description of ongoing
disputes, see Legal Matters.
80
Infineon Logic
Strategic Alliances
As a part of our long term strategy, we have entered into a
number of strategic alliances with other leaders in the
semiconductor industry, primarily in the areas of research and
development for manufacturing process technologies and joint
manufacturing facilities as well as cooperative product design
and development.
R&D in advanced process technology nodes for wafer
manufacturing is a particular focus for multi-party alliances.
During the 2007 fiscal year, we expanded our technology
agreements with our alliance partners IBM, Chartered and Samsung
(the ICIS alliance) in this area and Freescale
joined the ICIS alliance. Pooling of human and technological
resources supports a high level of innovation coupled with
mutual learning and fast feedback, which in turn increases
efficiencies, improves economies of scale and reduces time to
market for new products.
The current alliance agreement covers 32-nanometer bulk
complementary metal oxide semiconductor (CMOS)
process technology and joint development of process design kits
(PDKs) to support product designs in those advanced
technologies. Collaboration on design, development and
manufacturing in advanced technologies has been committed
through 2010.
The 90-nanometer, 65-nanometer and 45-nanometer technologies
developed to date through this alliance will be used for a broad
range of systems including, for example, next generation
hand-held products. Future technologies are intended to solve
real life problems in fields such as medicine, communications,
transportation and security. Advanced technology nodes are
intended to support energy efficient, high performance and cost
conscious solutions.
Since advanced products include digital, analog, RF and embedded
memory circuitry, it is important for Infineon to stay involved
in leading edge technology development in order to be able to
bridge the requirements for wafer manufacturing and optimum
design. This need is independent of our manufacturing strategy,
whether in house or outsourced.
Our principal advanced CMOS process technology development
alliance is backed by appropriate contracts on CMOS
manufacturing with Chartered, UMC, and IBM, amongst others.
In March 2007, we announced a strategic cooperation with Hyundai
for the development of automotive electronics. We and Hyundai
also opened a joint innovation center with the goal of
developing automotive electronic system solutions for Hyundai
and Kia vehicles. The cooperation includes the development of
automotive electronics system architecture and related
semiconductors, along with enhancements of Hyundais
current automotive electronic systems, based on the synergy of
Hyundais automotive electronics technology and our
semiconductor know-how.
Qimonda
Strategic Alliances
In order to achieve and maintain technological leadership in the
DRAM market and to share
start-up
costs inherent in developing successive generations of memory
products, we have entered into a number of strategic alliances
over the years with selected partners for research and
development and manufacturing activities in relation to memory
products.
In November 2002, we entered into agreements with Nanya to
establish a strategic cooperation in the development of DRAM
products and to form Inotera, a joint venture to construct
and operate a 300-millimeter manufacturing facility with two
manufacturing modules in Taiwan. Under the terms of the initial
development agreement, we have developed 90- and 75-nanometer
DRAM technologies. In September 2005, we entered into another
agreement with Nanya for the joint development of advanced
58-nanometer production technologies for 300-millimeter wafers.
The development is being conducted at Qimondas R&D
centers in Dresden and Munich.
81
Qimonda also has a number of long-term strategic arrangements
with leading industry participants to manufacture products. See
Business Manufacturing
Qimonda Joint Ventures and Partnerships.
Acquisitions
and Dispositions
Reflecting our commitment to achieve profitability, we continued
to dispose of non-core assets in the 2007 fiscal year. In
addition, we also started to strengthen our businesses through
selective acquisitions. The principal transactions completed in
the 2007 fiscal year were as follows:
Sale of
Sci-Worx GmbH (Sci-Worx)
In January 2007, we sold Sci-Worx, a multimedia consumer
electronics and mobile telecommunications company in which we
had acquired an initial majority stake in the 2000 fiscal year.
On January 3, 2007, we sold all our shares in Sci-Worx to
Silicon Image Inc. (Silicon Image). As a part of the
transaction, we received approximately 11.9 million.
The sale was a consequence of our efforts to streamline our
R&D capabilities.
Sale of
Polymer Optical Fiber (POF) Business
In March 2007, we and Avago Technologies Ltd.
(Avago) entered into an agreement under which Avago
acquired our POF business, based in Regensburg, Germany. The POF
business is a provider of automotive multimedia infotainment
networks and transceivers for safety systems and also provides
transmitters and receivers for transportation switching and home
broadband services. The transaction included all POF employees
and was completed in June 2007. The sale was a consequence of
our withdrawal from fiber optic activities.
Acquisition of
Texas Instruments Inc.s CPE DSL business
We acquired Texas Instruments Inc.s (TI) CPE
DSL business during July 2007. With this acquisition, we expect
to become the leader in the ADSL market in terms of revenue
share. This acquisition will enable us to combine our innovative
broadband CPE roadmap with TIs large DSL CPE deployment
base at major carriers worldwide. We paid cash consideration of
45 million for the acquired business, which is
subject to an upward or downward contingent consideration
adjustment of up to $16 million, based on revenue targets
of the CPE business during the nine months following the
acquisition date.
Acquisition of
Mobility Product Group of LSI
In August 2007, we entered into an agreement to acquire the
mobility products business of LSI Corporation
(LSI) for $450 million plus a contingent
performance-based payment of up to $50 million. Through the
first six months of 2007, LSIs Mobility Products Group
reported sales of approximately 150 million.
LSIs Mobility Products Group consists mainly of mobile
radio baseband processors and platforms that complement our
existing portfolio. We took on approximately 630 LSI
employees as part of the transaction, which closed on
October 24, 2007. This acquisition will strengthen our
position with leading mobile phone customers, especially
Samsung, and our R&D activities for mobile phone platform
solutions.
Planned Sale
of our interest in ALTIS Semiconductor S.N.C.
In August 2007, we and International Business Machines
Corporation (IBM) signed an agreement in principle
to divest our respective shares in ALTIS Semiconductor S.N.C.,
Essonnes, France (ALTIS) via a sale to Advanced
Electronic Systems AG (AES). ALTIS, which has been
our joint venture with IBM since 1999, manufactures
semiconductor components for communication, automotive and
security applications in
250-nanometer
to 130-nanometer technologies at its manufacturing site in
Essonnes, France. Under the terms of the agreement in principle,
AES will purchase the equity, which includes the real estate and
technology assets of ALTIS from us and IBM, and AES agreed to
maintain the level of industrial activity in ALTIS. Pursuant to
the agreement, we will enter into a two-year supply contract
with ALTIS and IBM and we
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will license certain manufacturing process technologies to AES
for use in ALTIS. The agreement is subject to governmental and
regulatory approval and works council consultation.
Sale of
40 percent of High Power Bipolar business
In September 2007, we entered into a joint venture agreement
with Siemens AG (Siemens), whereby we would
contribute all assets and liabilities of our high power bipolar
business (including licenses, patents, and front-end and
back-end production assets) into a newly formed legal entity
called Infineon Technologies Bipolar GmbH & Co. KG
(Bipolar) and Siemens would acquire a
40 percent interest in Bipolar for 37 million.
We and Siemens already had an ongoing technology cooperation,
and this joint venture was a logical next step in that
partnership to secure our international competitiveness in this
area. The transaction closed in the first quarter of the 2008
fiscal year.
We employed a total of 43,079 employees as of
September 30, 2007 (including 13,481 Qimonda employees).
For a further description of our workforce by location and
function over the past three years, see Operating and
Financial Review Employees.
A significant percentage of our employees, especially in
Germany, are covered by collective bargaining agreements
determining remuneration, working hours and other conditions of
employment, and are represented by works councils. Works
councils are employee-elected bodies established at each
location in Germany and also at the parent company-wide level
(Infineon Technologies AG). Furthermore, works councils exist at
our subsidiaries in Austria and France (including ALTIS). In
Germany, works councils have extensive rights to notification
and of codetermination in personnel, social and economic
matters. Under the German Works Constitution Act
(Betriebsverfassungsgesetz), the works
councils must be notified in advance of any proposed employee
termination, they must confirm hirings and relocations and
similar matters, and they have a right to codetermine social
matters such as work schedules and rules of conduct. Management
considers its relations with the works councils to be good. The
members of the senior management of Infineon Technologies AG are
represented by a senior management committee
(Sprecherausschuss).
In October 2005, the relevant union organized a work stoppage in
connection with our plans to shut down our Munich-Perlach
facility. This work stoppage lasted one week and was ended
following an agreement to financially compensate those employees
whose contracts were not continued following the closing of this
manufacturing facility in March 2007.
Other than this incident, we have not experienced any labor
disputes resulting in major work stoppages in the last three
fiscal years.
Allocation of
Litigation Exposure between Infineon and Qimonda
We are the subject of a number of governmental investigations
and civil lawsuits that relate to the operations of our memory
products business prior to the carve-out of Qimonda. Under the
contribution agreement between us and Qimonda, Qimonda is
required to indemnify us, in whole or in part as specified
below, for any liability we incur in connection with the matters
described below (other than the disputes with
Dr. Schumacher and Wi-Lan).
All potential liabilities and risks in connection with legal
matters existing as of the carve-out date are generally to be
borne by the business unit which caused the risk or liability or
wherein the risk or liability arose. Except to the limited
extent described below for the securities class action
litigation, Qimonda has agreed to indemnify us for all
liabilities arising in connection with the legal matters
specifically described below (other than the disputes with
Dr. Schumacher and Wi-Lan), including court costs and legal
fees. We will not settle or otherwise agree to any of these
liabilities without Qimondas prior consent.
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Liabilities and risks relating to the securities class action
litigation, including court costs, will be equally shared by us
and Qimonda, but only with respect to the amount by which the
total amount payable exceeds the amount of the corresponding
accrual that we transferred to Qimonda. Any expenses incurred in
connection with the assertion of claims against the provider of
directors and officers (D&O)
insurance covering our two current or former officers named as
defendants in the suit will also be equally shared. The D&O
insurance provider has so far refused coverage.
Antitrust
Matters
U.S. Department of Justice
Investigation. In September 2004, we entered into
a plea agreement with the Antitrust Division of the
U.S. Department of Justice (DOJ) in connection
with its ongoing investigation into alleged antitrust violations
in the DRAM industry. Pursuant to this plea agreement, we agreed
to plead guilty to a single count of conspiring with other
unspecified DRAM manufacturers to fix the prices of DRAM
products between July 1, 1999 and June 15, 2002, and
to pay a fine of $160 million. The fine plus accrued
interest is being paid in equal annual installments through
2009. We have a continuing obligation to cooperate with the DOJ
in its ongoing investigation of other participants in the DRAM
industry. The price fixing charges related to DRAM sales to six
Original Equipment Manufacturer (OEM) customers that
manufacture computers and servers. We have entered into
settlement agreements with five of these OEM customers and are
considering the possibility of a settlement with the remaining
OEM customer, which purchased only a very small volume of DRAM
products from us. We have secured individual settlements with
eight direct customers in addition to those OEMs identified by
the DOJ.
U.S. Civil Litigation. Subsequent to the
commencement of the DOJ investigation, a number of putative
class action lawsuits were filed against us, Infineon
Technologies North America Corporation (IF North
America) and other DRAM suppliers.
Direct Purchaser Litigation. Sixteen
cases were filed between June and September 2002 in several
U.S. federal district courts, purporting to be on behalf of
a class of individuals and entities who purchased DRAM directly
from the various DRAM suppliers during a specified time period
(the Direct U.S. Purchaser Class), alleging
price-fixing in violation of the Sherman Act and seeking treble
damages in unspecified amounts, costs, attorneys fees, and
an injunction against the allegedly unlawful conduct.
In September 2002, the Judicial Panel on Multi-District
Litigation ordered that these federal cases be transferred to
the U.S. District Court for the Northern District of
California for coordinated or consolidated pre-trial proceedings
as part of a Multi District Litigation (MDL).
In September 2005, we and IF North America entered into a
definitive settlement agreement with counsel to the Direct
U.S. Purchaser Class (subject to approval by the
U.S. District Court and to an opportunity for individual
class members to opt out of the settlement). The settlement was
approved on November 1, 2006. The court entered final
judgment and dismissed the class action claims with prejudice in
November 2006. Under the terms of the settlement agreement we
agreed to pay approximately $21 million. In addition to
this settlement payment, we agreed to pay an additional amount
if it is proven that sales of DRAM products to the settlement
class (after opt-outs) during the settlement period exceeded
$208.1 million. The additional amount payable would be
calculated by multiplying by 10.53 percent the amount by
which those sales exceed $208.1 million. We do not
currently expect to pay any additional amount to the class.
In April 2006, Unisys Corporation (Unisys) filed a
complaint against us and IF North America, among other DRAM
suppliers, alleging state and federal claims for price fixing
and seeking recovery as both a direct and indirect purchaser of
DRAM. On May 5, 2006, Honeywell International, Inc.
(Honeywell) filed a complaint against us and IF
North America, among other DRAM suppliers, alleging a claim for
price fixing under federal law, and seeking recovery as a direct
purchaser of DRAM. Both Unisys and Honeywell opted out of the
Direct U.S. Purchaser Class and settlement, so their claims are
not barred by our settlement with the Direct U.S. Purchaser
Class. Both of these complaints were filed in the Northern
District of California and have been related to the MDL
described above. In April 2007 the court dismissed the initial
complaint with leave to amend. Unisys filed a First Amended
Complaint in May 2007. We, IF North America, and the
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other defendants again filed a motion to dismiss certain
portions of the Unisys First Amended Complaint in June 2007.
After Honeywell had filed a stipulation of dismissal without
prejudice of its lawsuit against Infineon, the court entered the
dismissal order in April 2007.
In February and March 2007 four more opt-out cases were filed by
All American Semiconductor, Inc., Edge Electronics, Inc., Jaco
Electronics, Inc., and DRAM Claims Liquidation Trust, by its
Trustee, Wells Fargo Bank, N.A. The All American Semiconductor
complaint alleges claims for price-fixing under the Sherman Act.
The Edge Electronics, Jaco Electronics and DRAM Claims
Liquidation Trust complaints allege state and federal claims for
price-fixing. All four cases were filed in the Northern District
of California and have been related to the MDL described above.
As with Unisys, the claims of these plaintiffs are not barred by
our settlement with the Direct U.S. Purchaser Class, since
they opted out of the Direct U.S. Purchaser Class and
settlement.
Based upon the courts order dismissing portions of the
initial Unisys complaint described above, the plaintiffs in all
four of these opt-out cases filed amended complaints in May
2007. In June 2007, Infineon and IF North America answered the
amended complaints filed by All American Semiconductor, Inc.,
Edge Electronics, Inc., and Jaco Electronics, Inc. and along
with its co-defendants filed a joint motion to dismiss certain
portions of the DRAM Claims Liquidation Trust amended complaint.
On October 15, 2007, the court entered an order denying the
motions to dismiss in the Unisys and the DRAM Claims Liquidation
Trust cases with prejudice. On October 29, 2007, we
answered the Unisys complaint, denying liability and asserting a
number of affirmative defenses. On November 1, 2007, we
answered the DRAM Claims Liquidation Trust complaint, denying
liability and asserting a number of affirmative defenses.
Indirect Purchaser
Litigation. Sixty-four additional cases were
filed between August and October 2005 in numerous federal and
state courts throughout the United States. Each of these state
and federal cases (except for one relating to foreign
purchasers, which was subsequently dismissed with prejudice and
as to which the plaintiffs have filed notice of appeal) purports
to be on behalf of a class of individuals and entities who
indirectly purchased DRAM in the United States during specified
time periods commencing in or after 1999. The complaints
variously allege violations of the Sherman Act,
Californias Cartwright Act, various other state laws,
unfair competition law and unjust enrichment and seek treble
damages in generally unspecified amounts, restitution, costs,
attorneys fees and injunctions against the allegedly
unlawful conduct.
Twenty-three of the state and federal court cases were
subsequently ordered transferred to the U.S. District Court
for the Northern District of California for coordinated and
consolidated pre-trial proceedings as part of the multi-district
litigation described above. Nineteen of the twenty-three
transferred cases are currently pending in the MDL litigation.
The pending California state cases were coordinated and
transferred to San Francisco County Superior Court for
proceedings. The plaintiffs in the indirect purchaser cases
outside California agreed to stay proceedings in those cases in
favor of proceedings on the indirect purchaser cases pending as
part of the MDL pre-trial proceedings. The defendants have filed
two motions for judgment on the pleadings directed at several of
the claims. Hearing on those motions took place in December 2006.
The court entered an order in June 2007 granting in part and
denying in part the defendants motions for judgment on the
pleadings. The order dismissed a large percentage of the
indirect purchaser plaintiffs claims, and granted leave to
amend with regard to claims under three specific state statutes.
The court ruled that the indirect purchaser plaintiffs must file
a motion for leave to amend the complaint with regard to any of
the other dismissed claims. In June 2007, the indirect purchaser
plaintiffs filed both a First Amended Complaint and a motion for
leave to file a Second Amended Complaint that attempts to
resurrect some of the claims that were dismissed. On
August 17, 2007, the court entered an order granting the
motion to file the Second Amended Complaint, which repleaded
part of the previously dismissed claims.
State Investigations. In July 2006, the
New York state attorney general filed an action in the
U.S. District Court for the Southern District of New York
against us, IF North America and several other
85
DRAM manufacturers on behalf of New York governmental entities
and New York consumers who purchased products containing DRAM
beginning in 1998. The plaintiffs allege violations of state and
federal antitrust laws arising out of the same allegations of
DRAM price-fixing and artificial price inflation practices
discussed above, and seek recovery of actual and treble damages
in unspecified amounts, penalties, costs (including
attorneys fees) and injunctive and other equitable relief.
In October 2006, the New York case was made part of the MDL
proceeding. In July 2006, the attorneys general of Alaska,
Arizona, Arkansas, California, Colorado, Delaware, Florida,
Hawaii, Idaho, Illinois, Iowa, Louisiana, Maryland,
Massachusetts, Michigan, Minnesota, Mississippi, Nebraska,
Nevada, New Mexico, North Dakota, Ohio, Oklahoma, Oregon,
Pennsylvania, South Carolina, Tennessee, Texas, Utah, Vermont,
Virginia, Washington, West Virginia and Wisconsin filed a
lawsuit in the U.S. District Court for the Northern
District of California against us, IF North America and several
other DRAM manufacturers on behalf of governmental entities,
consumers and businesses in each of those states who purchased
products containing DRAM beginning in 1998. In
September 2006, the complaint was amended to add claims by
the attorneys general of Kentucky, Maine, New Hampshire, North
Carolina, the Northern Mariana Islands and Rhode Island. This
action is based on state and federal law claims relating to the
same alleged anticompetitive practices in the sale of DRAM and
plaintiffs seek recovery of actual and treble damages in
unspecified amounts, penalties, costs (including attorneys
fees) and injunctive and other relief. In October 2006, we
joined the other defendants in filing motions to dismiss several
of the claims alleged in these two actions. On August 31,
2007, the court entered orders granting the motions in part and
denying the motions in part. The courts order dismissed
the claims on behalf of consumers, businesses and governmental
entities in a number of states, and dismissed certain other
claims with leave to amend, with any amended complaints to be
filed by October 1, 2007. Between June 25 and
August 15, 2007, the state attorneys general of four
states, Alaska, Ohio, New Hampshire and Texas, filed requests
for dismissal of their claims without prejudice.
European Commission Investigation. In April
2003, we received a request for information from the European
Commission (the Commission) to enable the Commission
to assess the compatibility with the Commissions rules on
competition of certain practices of which the Commission has
become aware in the European market for DRAM products. In light
of our plea agreement with the DOJ, we made an accrual during
the 2004 fiscal year for an amount representing the probable
minimum fine that may be imposed as a result of the
Commissions investigation. Any fine actually imposed by
the Commission may be significantly higher than the reserve
established, although we cannot more accurately estimate the
amount of the actual fine. We are fully cooperating with the
Commission in its investigation.
Canadian Competition Bureau Investigation. In
May 2004, the Canadian Competition Bureau advised IF North
America that it, its affiliates and present and past directors,
officers and employees are among the targets of a formal inquiry
into an alleged conspiracy to prevent or lessen competition
unduly in the production, manufacture, sale or supply of DRAM,
contrary to the Canadian Competition Act. No formal steps (such
as subpoenas) have been taken by the Competition Bureau to date.
We are fully cooperating with the Canadian Competition Bureau in
its inquiry.
Canadian Civil Litigation. Between December
2004 and February 2005 two putative class proceedings were filed
in the Canadian province of Quebec, and one was filed in each of
Ontario and British Columbia against us, IF North America and
other DRAM manufacturers on behalf of all direct and indirect
purchasers resident in Canada who purchased DRAM or products
containing DRAM between July 1999 and June 2002, seeking
damages, investigation and administration costs, as well as
interest and legal costs. Plaintiffs primarily allege conspiracy
to unduly restrain competition and to illegally fix the price of
DRAM.
U.S. Securities
Class Action. Between September and November
2004, seven securities class action complaints were filed
against us and current or former officers in U.S. federal
district courts, later consolidated in the Northern District of
California, on behalf of a putative class of purchasers of our
publicly-traded securities who purchased them during the period
from March 2000 to July 2004. The consolidated amended complaint
alleges violations of the U.S. securities laws and asserts
that the defendants made materially false and misleading public
statements about our historical and projected
86
financial results and competitive position because they did not
disclose our alleged participation in DRAM price-fixing
activities and that, by fixing the price of DRAM, defendants
manipulated the price of our securities, thereby injuring our
shareholders. The plaintiffs seek unspecified compensatory
damages, interest, costs and attorneys fees. In September
2006, the court dismissed the complaint with leave to amend. In
October 2006, the plaintiffs filed a second amended complaint.
In March 2007, pursuant to a stipulation agreed with the
defendants, the plaintiffs withdrew the second amended complaint
and were granted a motion for leave to file a third amended
complaint. Plaintiffs filed a third amended complaint in July
2007. A hearing is scheduled for November 19, 2007.
Our directors and officers insurance carriers have
denied coverage in the securities class action, and as a result
we filed suit against the carriers in December 2005 and August
2006. Our claims against one D&O insurance carrier were
finally dismissed in May 2007. The claim against the other
insurance carrier is still pending.
Other
matters
In April 2007, Lin Packaging Technologies, Ltd.
(Lin) filed a lawsuit against us, IF North America
and an additional DRAM manufacturer in the U.S. District
Court for the Eastern District of Texas, alleging that certain
DRAM products infringe two Lin patents.
On October 31, 2007,
Wi-LAN Inc.
filed suit in the U.S. district court for the Eastern District
of Texas against Westell Technologies, Inc. and 16 other
defendants, including our company and Infineon Technologies
North America Corp. The complaint alleges infringement of 3
U.S. patents by certain wireless products compliant with
the IEEE 802.11 standards and certain ADSL products compliant
with the ITU G.992 standards, in each case supplied by certain
of the defendants.
At the end of March 2004, Dr. Ulrich Schumacher
resigned his position as CEO and Chairman of our Management
Board. Following his resignation, a cancellation agreement was
signed in December 2004 that entitled Dr. Schumacher to a
severance payment in the gross amount of 5.3 million,
payable in two equal installments at the end of March and
October 2005. The first installment was paid to
Dr. Schumacher in accordance with the cancellation
agreement.
During 2005, German public prosecutors started an investigation
against the owner of a motor sport sponsoring agency with which
we had a business relationship, Dr. Andreas von Zitzewitz,
a former member of our Management Board, and others for bribery,
corruption and other criminal offenses. When we became aware
that the public prosecutors had also started an investigation
against Dr. Schumacher in connection with our former motor
sport sponsoring activities, we decided to withhold the second
installment of Dr. Schumachers severance payment.
Based on further facts that came to light during the course of
subsequent internal investigations, we decided to terminate the
cancellation agreement with Dr. Schumacher. In December
2005, Dr. Schumacher filed a lawsuit against us for the
payment of the second installment under the cancellation
agreement. In September 2006, a court ruled that
Dr. Schumacher was entitled to receive the second
installment. In October 2006, we filed an appeal and sought
other judicial remedies against the judgment. In February 2007,
the appellate court overruled and revoked the previous judgment
of the court from September 2006 and rejected the original claim
of Dr. Schumacher.
In addition, in March 2006, Dr. Schumacher filed a lawsuit
against us alleging that three statements made by the Chairman
of our Supervisory Board in the media were incorrect and
applying for a declaratory judgment that Dr. Schumacher was
entitled to damages. That lawsuit is still pending.
Accruals and
the Potential Effect of these Lawsuits on Our
Business
Liabilities related to legal proceedings are recorded when it is
probable that a liability has been incurred and the associated
amount can be reasonably estimated. Where the estimated amount
of loss is within a range of amounts and no amount within the
range is a better estimate than any other amount, the minimum
amount is accrued. As of September 30, 2007, we had accrued
liabilities in the amount of 95 million related to
the DOJ and European antitrust investigations and the direct and
indirect purchaser
87
litigation and settlements described above, as well as for legal
expenses for the DOJ and securities class action complaints.
As additional information becomes available, the potential
liability related to these matters will be reassessed and the
estimates revised, if necessary. These accrued liabilities would
be subject to change in the future based on new developments in
each matter, or changes in circumstances, which could have a
material adverse effect on our financial condition and results
of operations.
An adverse final resolution of the antitrust investigations or
related civil claims or the securities class action lawsuits
described above could result in significant financial liability
to, and other adverse effects on, us, which would have a
material adverse effect on our companys results of
operations, financial condition and cash flows. In each of these
matters we are continuously evaluating the merits of the
respective claims and defending ourselves vigorously or seeking
to arrive at alternative resolutions in our best interest, as we
deem appropriate. Irrespective of the validity or the successful
assertion of the claims described above, we could incur
significant costs with respect to defending against or settling
such claims, which could have a material adverse effect on our
results of operations, financial condition and cash flows.
Other
We are subject to various other lawsuits, legal actions, claims
and proceedings related to products, patents and other matters
incidental to our businesses. We have accrued a liability for
the estimated costs of adjudication or settlement of various
asserted and unasserted claims existing as of the balance sheet
date. Based upon information presently known to management, we
do not believe that the ultimate resolution of such other
pending matters will have a material adverse effect on our
financial position, although the final resolution of such
matters could have a material adverse effect on our results of
operations or cash flows in the period of settlement.
Environmental
Protection and Sustainable Management
In 2005, we instituted IMPRES the Infineon
Integrated Management Program for Environment, Safety and
Health. IMPRES is a dynamic framework integrating our safety,
health, and environmental protection processes, strategy, and
objectives, using high standards and at a global scale. IMPRES
fulfills the requirements of OHSAS 18001 and EN ISO 14001, while
enabling synergies throughout our company.
IMPRES is designed to minimize or eliminate the possible
negative impact of our manufacturing processes on the
environment, our employees and third parties. Most of our
production sites worldwide are already included in our
multi-site certification according to EN ISO 14001 and OHSAS
18001.
Hazardous substances or materials are to a certain extent
necessary in the production of semiconductors. However, most of
our processes are carried out in closed loops and systems that
eliminate the impact of hazardous substances or materials on our
employees health and the environment. We regularly test
and monitor employees whose work may expose them to hazardous
substances or materials, in order to detect any potential health
risks and to take appropriate remedial measures by an early
diagnosis. As part of IMPRES, we train our employees in the
proper handling of hazardous substances.
Where we are not able to eliminate adverse environmental impact
entirely, we aim to minimize the impact. For example, we need to
utilize PFCs (perfluorinated compounds) as etching agents in the
production of semiconductors. As early as 1992, we started to
install exhaust air filter systems to reduce PFC emissions. We
are signatories to the Memorandum of Agreement, a voluntary
commitment by the European Semiconductor Industry, and also to
the Memorandum of Understanding (in the United States of
America) both of which have the goal of reducing overall PFC
emissions by 2010 by approximately 10 percent from the
emission level of 1995, calculated in
CO2
equivalents. We have signed a similar commitment for Germany,
with a normalized target of 8 percent emission reduction on
basis of
CO2
equivalents.
We believe that we are in substantial compliance with
environmental as well as health and safety laws and regulations.
There is, nevertheless, a risk that we may become the subject of
environmental, health or
88
safety liabilities or litigation. Environmental, health, and
safety claims or the failure to comply with current or future
regulations could result in the assessment of damages or
imposition of fines against us, suspension of production or a
cessation of operations. Significant financial reserves or
additional compliance expenditures could be required in the
future due to changes in law or new information regarding
environmental conditions or other events, and those expenditures
could adversely affect our business or financial condition.
National legislation enacted pursuant to European Commission
Directive 2002/96/EC creates significant obligations regarding
the collection, recovery and disposal of waste electrical and
electronic equipment. This directive obligates manufacturers to
finance the collection, recovery and disposal of such products
at the end of their life cycle. The end-of-life obligations may
affect us as suppliers to electrical and electronic equipment
producers and as producers of electronic equipment. Because a
number of statutory definitions and interpretations remain
unclear and are still pending, the consequences for our company
cannot currently be determined in detail. As a result, we are
not able at this time to estimate the amount of additional costs
that we may incur in connection with this legislation.
Since July 1, 2006, another relevant European Commission
Directive, 2002/95/EC, has restricted the use of lead and other
hazardous substances in electrical and electronic equipment.
Because of this directive ongoing compliance expenditures could
be required in the future.
Directive 2005/32/EC on the eco-design of Energy-using Products
(EuP) establishes ecologically sound development for
electrical and electronic devices. It also provides for the
possibility that manufacturers of components and sub-assemblies
may be subject to specific information requirements regarding
environmentally relevant product characteristics. Because the
Directive defines conditions and criteria for setting such
requirements through subsequent implementing measures, but does
not introduce directly binding requirements for specific
products, the consequences for our company cannot currently be
determined in detail. As a result, we are not able at this time
to estimate the amount of additional costs that we may incur in
connection with this legislation.
A European Union regulatory framework for chemicals, called
REACH, dealing with the registration, evaluation, authorization
and restriction of chemicals, became effective on June 1,
2007. Subsequent obligations will become effective in stages
over the next few years. This regulation could have a
considerable impact not only on producers and importers of
chemical substances, but also on downstream users like the
semiconductor industry. The availability of chemical substances
could be significantly reduced in the European Union, which
could have a negative impact on our production as well as
research and development activities. We are in close contact
with our suppliers and consider ourselves prepared according to
the current status of REACH obligations. However, we cannot
exclude the possibility of significant future costs in
connection with this regulation.
The European Commission is considering restrictions on the use
of PFOS (Perfluoroctane sulphonate) in the EU. PFOS is an
important constituent of key chemicals used in the semiconductor
industry. Any restriction affecting its use may adversely impact
our production and cost position.
The Chinese government restricts the use of lead and other
hazardous substances in electronic products. Because not all
implementing measures nor the key product catalog are in place,
the consequences to us cannot currently be determined. As a
result, we are not able to estimate the impact, including the
additional costs, in connection with these regulations.
Similar regulations on substance bans are being established in
various countries of the world. We are not able at this time to
estimate the impact, including the amount of additional costs
that we may incur, in connection with these possible regulations.
Because the damage and loss caused by fire, natural hazards,
supply shortage, or other disturbance at a semiconductor
facility can be severe, we have constructed and operate our
facilities in ways that minimize the specific risks and that
enable a quick response if such an event should occur. We expect
to continue to invest in prevention and response measures at our
facilities.
89
Because some of our facilities, including some of those of our
joint ventures, are located close to or shared with those of
other companies, we may need to respond to certain claims and
certain liabilities relating to environmental issues, such as
contamination, not entirely originating from our own operations.
We own approximately 2.5 million square meters of land and
approximately 1.1 million square meters of building space,
including at our facilities at Cegléd (Hungary), Dresden
(Germany), Essonnes (France), Horten (Norway), Munich (Germany),
Regensburg (Germany), Villach (Austria), Warstein (Germany) and
Wuxi (China). This includes approximately 1.2 million
square meters of land and 370,000 square meters of building
space for Qimonda facilities at Dresden (Germany), Porto
(Portugal), Richmond (Virginia, USA) and Suzhou (China).
In addition, we have long-term rental and lease arrangements
covering approximately 1.2 million square meters of land at
our facilities at Batam (Indonesia), Kulim (Malaysia), Malacca
(Malaysia), Munich (Germany), Singapore (Singapore) and Suzhou
(China), and approximately 460,000 square meters of
building space in various locations in Asia/Pacific, Europe and
North America. This includes approximately 0.3 million
square meters of land and 86,000 square meters of building
space for Qimonda facilities. We believe that these properties
are rented or leased on ordinary market terms and conditions.
90
Supervisory Board
Members
The current members of our Supervisory Board, the Supervisory
Board position held by them, their occupation, their principal
external positions and their ages are as follows:
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Membership of other Supervisory
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Boards and comparable governing
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bodies of domestic and foreign
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Term
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companies during the fiscal year ended
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Name
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Age
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expires
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Occupation
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September 30, 2007
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Max Dietrich Kley
Chairman
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67
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2010
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Lawyer
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Chairman of the Supervisory Board of
SGL Carbon AG, Wiesbaden
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Member of the Supervisory Board of
BASF AG, Ludwigshafen
HeidelbergCement AG, Heidelberg
Schott AG, Mainz
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Member of the Board of Directors of
UniCredito Italiano S.p.A., Milan, Italy
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Gerd
Schmidt(1)
Deputy Chairman
(since February 15, 2007)
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53
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2009
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Chairman of the Infineon Central Works Council
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Chairman of the Infineon
Works Council, Regensburg
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Wigand
Cramer(1)
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54
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2009
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Labor union clerk IG Metall, Berlin
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Alfred
Eibl(1)
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58
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2009
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Chairman of the Infineon Works Council, Munich-Campeon (since
November 8, 2006)
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Prof. Johannes Feldmayer
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51
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2010
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Member of the Corporate Executive Committee of Siemens AG,
Munich (until September 30, 2007)
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Member of the Supervisory Board of Exxon Mobil Central Europe Holding GmbH, Hamburg
Until May 24, 2007:
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Chairman of the Board of Administration of
Siemens A.E., Athens, Greece
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Chairman of the Supervisory Board of
Siemens Rt., Budapest, Hungary
Siemens Sp. zo.o., Warsaw, Poland
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Chairman of shareholders representatives committee of
Siemens s.r.o., Prague, Czech Republic
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Deputy Chairman of the Board of Administration of
Siemens S.A., Madrid, Spain
Siemens S.p.A., Milan, Italy
Siemens Schweiz AG, Zurich, Switzerland
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Member of the Board of Administration of
Siemens France S.A., Saint-Denis, France
Siemens A.S., Istanbul, Turkey
Siemens A.S., Copenhagen, Denmark
Siemens A.S., Oslo, Norway (from October 1, 2006)
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Member of the Supervisory Board of
Siemens Holdings plc, Bracknell, Great Britain
Siemens AB, Stockholm, Sweden
Siemens AG, Vienna, Austria
Siemens Nederland N.V., Den Haag,
The Netherlands (from October 1, 2006)
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91
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Membership of other Supervisory
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Boards and comparable governing
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bodies of domestic and foreign
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Term
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companies during the fiscal year ended
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Name
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Age
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expires
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Occupation
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September 30, 2007
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Jakob
Hauser(1)
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55
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2009
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Chairman of the Works Council Qimonda AG, Munich
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Gerhard
Hobbach(1)
(since February 15, 2007)
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45
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2009
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Deputy Chairman of the Infineon Works Council,
Munich-Campeon
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Prof. Dr. Renate Köcher
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55
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2010
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Managing Director of Institut für
Demoskopie Allensbach GmbH, Allensbach
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Member of the Supervisory Board of
Allianz SE, Munich
BASF AG, Ludwigshafen
MAN AG, Munich
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Dr. Siegfried Luther
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63
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2010
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Managing Director of Reinhard Mohn
Verwaltungs GmbH, Gütersloh
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Member of the Supervisory Board of
Druck- und Verlagshaus Gruner &
Jahr AG, Hamburg (until August 28, 2007)
WestLB AG, Duesseldorf/Muenster
Wintershall Holding AG, Kassel
(since November 21, 2006)
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Chairman of the Board of Administration of
RTL Group S.A., Luxembourg
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Member of the Board of Administration of
Compagnie Nationale à Portefeuille S.A.,
Loverval, Belgium (since April 19, 2007)
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Michael
Ruth(1)
Representative of Senior Management
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47
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2009
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Corporate Vice President
Reporting, Planning and Controlling, Infineon Technologies AG
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Prof. Dr. rer. nat. Doris
Schmitt-Landsiedel
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54
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2010
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Professor at the Munich Technical University, Munich
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Kerstin
Schulzendorf(1)
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45
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2009
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Member of the Works Council Infineon Dresden
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Dr. Eckart Sünner
(since August 2, 2007)
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63
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2010
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President Legal, Taxes & Insurance BASF AG,
Ludwigshafen
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Chairman of the Supervisory Board of
Lucura Rückversicherungs AG, Ludwigshafen
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Member of the Supervisory Board of
K+S AG, Kassel
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Member of the Board of Directors of
BASF Corporation, Florham Park, New Jersey, USA
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Alexander
Trüby(1)
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37
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2009
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Member of the Works Council Infineon Dresden
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92
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Membership of other Supervisory
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Boards and comparable governing
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bodies of domestic and foreign
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Term
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companies during the fiscal year ended
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Name
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Age
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expires
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Occupation
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September 30, 2007
|
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Prof. Dr. rer. nat. Martin Winterkorn
|
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60
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2010
|
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|
Chairman of the Management Board of Audi AG, Ingolstadt
(until December 31,
2006)
Volkswagen AG,
Wolfsburg (since
January 1, 2007)
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Chairman of the Supervisory Board of
Audi AG, Ingolstadt (since January 1, 2007)
Member of the Supervisory Board of
Salzgitter AG, Salzgitter
FC Bayern München AG, Munich
TÜV Süddeutschland Holding AG, Munich
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Chairman of the Board of Administration of
SEAT S.A., Barcelona, Spain (until June 14, 2007)
Automobili Lamborghini Holding S.p.A.,
SantAgata Bolognese, Bologna, Italy
(until February 12, 2007)
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Member of the Board of Administration of
SEAT S.A., Barcelona, Spain (since June 14, 2007)
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Prof. Dr.-Ing. Dr.-Ing. E.h. Klaus Wucherer
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63
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2010
|
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Member of the Corporate Executive Committee of Siemens AG, Munich
|
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Member of the Supervisory Board of
Deutsche Messe AG, Hanover
BSH Bosch und Siemens Hausgeräte GmbH, Munich
Leoni AG, Nuremberg (since May 3, 2007)
SAP AG, Walldorf (since May 10, 2007)
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Chairman of the Board of Administration of
Siemens Ltd., Beijing, Peoples Republic of China
Siemens K.K., Tokyo, Japan (until
February 26, 2007)
Siemens S.A., Lisbon, Portugal
Siemens Ltd., Mumbai, India
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Klaus
Luschtinetz(1)
Deputy Chairman (resigned February 15, 2007)
|
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64
|
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|
|
2007
|
|
|
Employee of Infineon Technologies AG
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Dr. Stefan Jentzsch
(resigned August 2, 2007)
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46
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|
2007
|
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|
Member of the Management Board of
Dresdner Bank AG,
Frankfurt
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Member of the Supervisory Board of
Premiere AG, Munich
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|
(1) |
Employee representative.
|
93
The Supervisory Board maintains the following Principal
Committees:
|
|
|
Committee
|
|
Members
|
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Executive Committee
|
|
Max Dietrich Kley
Klaus Luschtinetz (resigned February 15, 2007)
Gerd Schmidt (since February 15, 2007)
Prof. Dr. rer. nat. Martin Winterkorn
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Investment, Finance and Audit Committee
|
|
Max Dietrich Kley
Dr. Siegfried Luther
Klaus Luschtinetz (resigned February 15, 2007)
Gerd Schmidt (since February 15, 2007)
|
Mediation Committee
|
|
Max Dietrich Kley
Klaus Luschtinetz (resigned February 15, 2007)
Gerd Schmidt (since February 15, 2007)
Alexander Trüby
Prof. Dr. rer. nat. Martin Winterkorn
|
Nomination Committee
|
|
Max Dietrich Kley
Prof. Johannes Feldmayer
Prof. Dr. Renate Köcher
Dr. Siegfried Luther
Prof. Dr. rer. nat. Doris Schmitt-Landsiedel
Dr. Eckart Sünner
Prof. Dr. rer. nat. Martin Winterkorn
Prof. Dr.-Ing. Dr.-Ing. E.h. Klaus Wucherer
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Strategy and Technology Committee
|
|
Alfred Eibl
Jakob Hauser
Alexander Trüby
Prof. Dr. rer. nat. Doris Schmitt-Landsiedel
Prof. Dr. rer. nat. Martin Winterkorn
Prof. Dr.-Ing. Dr.-Ing. E.h. Klaus Wucherer
|
94
Management Board
Members
The current members of our Management Board, their positions and
their ages are as follows:
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|
|
Memberships of Supervisory
|
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|
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|
|
Boards and comparable governing
|
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|
|
|
|
|
|
bodies of domestic and foreign
|
|
|
|
|
Term
|
|
|
|
companies during the fiscal year
|
Name
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Age
|
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expires
|
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Position
|
|
ended September 30, 2007
|
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Dr. Wolfgang Ziebart
|
|
57
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|
August 31, 2009
|
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Chairman of the
Management
Board, President
and Chief
Executive
Officer
|
|
Member of the Board of Directors of
Infineon Technologies China Co., Ltd., Shanghai,
Peoples Republic of China
Infineon Technologies Asia Pacific Pte., Ltd.,
Singapore
Infineon Technologies Japan K.K., Tokyo, Japan
Infineon Technologies North America Corp.,
Wilmington, Delaware, USA
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Peter Bauer
|
|
47
|
|
September 30, 2008
|
|
Member of the
Management
Board and
Executive Vice
President
|
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Member of the Supervisory Board of
Infineon Technologies Austria AG, Villach, Austria
(from April 30, 2007 until June 1, 2007,
Chairman)
|
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|
|
Prof. Dr. Hermann Eul
|
|
48
|
|
August 31, 2012
|
|
Member of the
Management
Board and
Executive Vice
President
|
|
Member of the Supervisory Board of
7Layers AG, Ratingen
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Peter J. Fischl
(resigned April 30, 2007; reappointed as of
August 7, 2007)
|
|
61
|
|
March 31, 2008
|
|
Member of the
Management
Board,
Executive Vice
President and
Chief Financial
Officer
|
|
Chairman of the Supervisory Board of
Qimonda AG, Munich
Infineon Technologies Austria AG, Villach, Austria
(until April 30, 2007)
Member of the Board of Directors of
Infineon Technologies Asia Pacific Pte., Ltd.,
Singapore (until May 1, 2007;
reappointed
September 10, 2007)
Infineon Technologies China Co., Ltd., Shanghai,
Peoples Republic of China
(until May 1, 2007;
reappointed August 22, 2007)
Infineon Technologies North America Corp.,
Wilmington, Delaware, USA
(until May 1, 2007; reappointed August 6, 2007)
Infineon Technologies Japan K.K., Tokyo, Japan
(until May 1, 2007)
|
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|
Dr. Reinhard Ploss (since June 1, 2007)
|
|
51
|
|
May 31, 2012
|
|
Member of the
Management
Board and
Executive Vice
President
|
|
Chairman of the Supervisory Board of
Infineon Technologies Austria AG, Villach, Austria
(since June 1, 2007)
Member of the Board of Directors of
Infineon Technologies (Kulim) Sdn. Bhd., Kulim,
Malaysia
|
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|
Chairman of the Executive Board of
Infineon Technologies Austria AG, Villach,
Austria (until May 31, 2007)
|
95
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Memberships of Supervisory
|
|
|
|
|
|
|
|
|
Boards and comparable governing
|
|
|
|
|
|
|
|
|
bodies of domestic and foreign
|
|
|
|
|
Term
|
|
|
|
companies during the fiscal year
|
Name
|
|
Age
|
|
expires
|
|
Position
|
|
ended September 30, 2007
|
|
Resigned Members of the Management Board
|
|
|
|
|
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|
|
|
|
|
Rüdiger Andreas Günther
(from April 1, 2007 until August 6, 2007)
|
|
49
|
|
|
|
Member of the
Management Board,
Executive
Vice President
(from May 1, 2007
until August 6,
2007, Chief
Financial Officer)
|
|
Member of the Supervisory Board of
Infineon Technologies Austria AG, Villach, Austria
(from May 16, 2007 until August 22, 2007)
Member of the Board of Directors of
Infineon Technologies Asia Pacific Pte., Ltd.,
Singapore (from May 22, 2007 until
August 23, 2007)
Infineon Technologies China Co., Ltd., Shanghai,
Peoples Republic of China (from May 18, 2007
until August 22, 2007)
Infineon Technologies North America Corp.,
Wilmington, Delaware, USA (from May 1, 2007
until August 6, 2007)
Infineon Technologies Japan K.K., Tokyo, Japan
(from May 15, 2007 until August 27, 2007)
|
Dr. Wolfgang Ziebart has been our Chairman,
President and Chief Executive Officer since September 2004.
Before that, he was deputy chairman of the Management Board of
Continental AG, an automotive supplier, and head of its
Automotive Systems Division, focusing on automotive electronics
and electronic brake systems. Previously, until 1999, he was a
member of the Management Board of automobile manufacturer BMW,
where he started his professional career in 1977 and held a
number of different positions, including responsibility for the
development of electronics. Dr. Ziebart holds a degree in
engineering and received his Ph.D. in engineering from the
Munich Technical University.
Peter Bauer has been our Executive Vice President and
Chief Sales and Marketing Officer since the inception of our
company in April 1999. Since January 2005 he has served as the
Head of the Automotive, Industrial & Multimarket
Segment and of Central Sales Functions. He was President and
Chief Executive Officer of Siemens Microelectronics, Inc. from
1998 to April 1999. From 1997 to 1999, Mr. Bauer was also
President, Sales and Solution Centers for Siemens Semiconductor
Group. Mr. Bauer began his career with Siemens
Semiconductor Group in 1986 as a development engineer.
Mr. Bauer holds a degree in electrical engineering from the
Munich Technical University.
Prof. Dr. Hermann Eul was appointed Deputy Executive
Vice President of our Management Board on as of August 2005 and
subsequently Executive Vice President and full member of our
Management Board as of December 1, 2006. Until 1999 he was
General Manager of the Digital TeleCom and Data Com ICs
operations at Siemens. When Infineon was formed, he took over
the Wireless Baseband and Systems Business Group as Vice
President and General Manager. From 2001 to 2002 he was
responsible for Security & Chip Card ICs operations as
Chief Executive Officer. In 2003 he was appointed as full
Professor and Faculty Chair for RF-Technology and Radio-Systems
at Hanover University. In 2004 he returned to Infineon where he
first co-managed the Wireline Communications segment as Senior
Vice President and then, following a reorganization, became
Executive Vice President and General Manager of the
Communication Solutions segment. Professor Eul studied
electrical engineering and has a doctorate in engineering.
Peter J. Fischl was our Executive Vice President and
Chief Financial Officer from the inception of our company in
April 1999 to April 2007. Mr. Fischl re-assumed office on
August 7, 2007 for an interim period ending March 31,
2008. Since May 2006, he has also served as the Chairman of the
Supervisory Board of our majority-owned subsidiary Qimonda AG,
which has been listed on the New York Stock Exchange since
August 2006. From October 1996 to March 1999, Mr. Fischl
served as Executive Vice President and Chief Financial Officer
of Siemens Semiconductor Group. From 1995 to 1996,
Mr. Fischl was General Manager and Vice President of
Siemens Mobile Network Division. Prior to that, he was Vice
President, Finance and
96
Business Administration at other Siemens divisions. He started
working at Siemens Telecommunications Group in 1971 as a project
manager.
Dr. Reinhard Ploss was appointed Executive Vice
President and Head of Operations effective June 1, 2007.
Dr. Ploss joined Siemens in 1986 as a process engineer. In
1996 he took over the Power Semiconductor business unit,
focusing on development and manufacturing. In 1999, he was
appointed President of eupec GmbH Co. KG. In 2000,
Dr. Ploss became head of the Automotive & Industrial
segment, which at the time consisted of power semiconductors,
electric drives, automotive applications and the microcontroller
business unit. In 2005, he assumed responsibility for
manufacturing, development and operational management in the
Automotive, Industrial & Multimarket segment.
The members of our Management Board, individually or in the
aggregate, do not own, directly or indirectly, more than
1 percent of our companys outstanding share capital.
The business address of each of the members of our Management
Board is Infineon Technologies AG, Am Campeon 1-12, D-85579
Neubiberg, Germany.
Overview of
Corporate Governance Structure
In accordance with the German Stock Corporation Act
(Aktiengesetz), our company has a Supervisory Board and a
Management Board. The two boards are separate and no individual
may simultaneously exercise functions or serve as a member of
both boards. The Management Board is responsible for managing
our business in accordance with applicable laws, our Articles of
Association and the rules of procedure of the Management Board.
It represents us in our dealings with third parties. The
Supervisory Board appoints and removes the members of the
Management Board and oversees the management of our company but
is not permitted to make management decisions.
In carrying out their duties, members of both the Management
Board and Supervisory Board must exercise the standard of care
of a prudent and diligent businessman, and they are liable to us
for damages if they fail to do so. Both boards are required to
take into account a broad range of considerations in their
decisions, including the interests of our company and its
shareholders, employees and creditors. The Management Board is
required to respect the shareholders rights to equal
treatment and equal information.
The Supervisory Board has comprehensive monitoring functions. To
ensure that these functions are carried out properly, the
Management Board must, among other things, regularly report to
the Supervisory Board with regard to current business operations
and future business planning. The Supervisory Board is also
entitled to request special reports at any time. The Management
Board is required to ensure appropriate risk management within
our company and must establish an internal monitoring system.
As a general rule under German law, a shareholder has no direct
recourse against the members of the Management Board or the
Supervisory Board in the event that they are believed to have
breached a duty to our company. Apart from insolvency or other
special circumstances, only our company has the right to claim
damages from members of either board. We may waive these damages
or settle these claims only if at least three years have passed
and if the shareholders approve the waiver or settlement at the
shareholders general meeting with a simple majority,
provided that opposing shareholders do not hold, in the
aggregate, one-tenth or more of the share capital of our company
and do not have their opposition formally noted in the minutes
maintained by a German notary.
Supervisory
Board
Our Supervisory Board consists of 16 members. The shareholders,
by a majority of the votes cast in a general meeting, elect
eight members and the employees elect the remaining eight
members. Among the eight employee representatives on the
Supervisory Board is one member from the ranks of the executive
employees (Leitende Angestellte), five members are from
the ranks of the employees (excluding executive employees) and
two representatives are of the trade unions represented in the
Infineon group in Germany. Seven shareholder representatives on
the Supervisory Board were elected at the general
shareholders
97
meeting held on January 25, 2005, one was elected at the
general shareholders meeting held on February 16,
2006. The term of all shareholder representatives ends with the
annual general meeting to be held in 2010. Seven of the employee
representatives on the Supervisory Board took office on
January 20, 2004, one trade union representative was
appointed by the lower district court of Munich on
April 20, 2006. The term of all employee representatives
ends with the annual general meeting to be held in 2009.
The shareholders, by a majority of the votes cast at a general
meeting, may remove any member of the Supervisory Board they
have elected at a general meeting. The employee representatives
may be removed by those employees that elected them by a vote of
three-quarters of the votes cast. The Supervisory Board elects a
chairman and a deputy chairman from among its members. If no
candidate is elected by a vote of two-thirds of the members of
the Supervisory Board, the shareholder representatives elect the
chairman and the employee representatives elect a deputy
chairman. The Supervisory Board normally acts by simple majority
vote, with the chairman having a deciding vote in the event of a
deadlock in a second vote on the same matter.
The Supervisory Board meets at least once a quarter. Its main
functions are:
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to monitor our management;
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|
to appoint our Management Board;
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|
|
to approve decisions of our Management Board in relation to the
following:
|
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|
|
|
financial and investment planning, including both budgets and
the establishment of limits for financial indebtedness;
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|
|
|
any investment or disposition that exceeds 10 percent of
our total investment budget; and
|
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|
|
the taking of any financial risk vis-à-vis third parties in
an amount exceeding 5 percent of our share capital plus
capital reserves.
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to approve matters in areas that the Supervisory Board has made
generally subject to its approval; and
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|
to approve matters that the Supervisory Board decides on a
case-by-case
basis to make subject to its approval.
|
Our Supervisory Board has established an Investment, Finance and
Audit Committee, comprising the chairman of the Supervisory
Board and two other members of the Supervisory Board, one of
whom is elected from the shareholder representatives and the
other from the employee representatives on the Supervisory
Board. The Investment, Finance and Audit Committee carries out
the functions normally carried out by the audit committee of a
U.S. company including, among other duties:
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|
preparing the decisions of the Supervisory Board regarding
approval of our companys annual financial statements,
including review of the financial statements, our annual
reports, the proposed application of earnings and the reports of
our auditors;
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|
reviewing the interim financial statements of our company that
are made public or otherwise filed with any securities
regulatory authority;
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|
issuing to our auditors terms of reference for their audit of
our annual financial statements; and
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approving decisions of our Management Board or a committee
thereof regarding increases of our companys capital
through the issuance of new shares out of authorized or
conditional capital, to the extent they are not issued to
employees as part of a share option plan.
|
The Investment, Finance and Audit Committee also supports the
Supervisory Board in its duty of supervising our business and
may exercise the oversight powers conferred upon the Supervisory
Board by German law for this purpose. Decisions of the
Investment, Finance and Audit Committee require a simple
majority.
98
According to German law, the shareholders may determine the term
of each shareholder-elected member of the Supervisory Board. The
maximum term of office of shareholder-elected Supervisory Board
members expires at the end of shareholders general meeting
in which the shareholders discharge the Supervisory Board
members for the fourth fiscal year after the start of their term
as a Supervisory Board member.
Neither we nor any of our subsidiaries have entered into special
service contracts with the members of the Supervisory Board that
provide for benefits during or upon termination of their board
membership other than as described under
Compensation.
The members of our Supervisory Board, individually or in the
aggregate, do not own, directly or indirectly, more than
1 percent of our companys outstanding share capital.
The business address of each of the members of our Supervisory
Board is Infineon Technologies AG, Am Campeon 1-12, D-85579
Neubiberg, Germany.
Management
Board
Our Management Board currently consists of five members. Under
our Articles of Association, our Supervisory Board determines
the Management Boards size, although it must have at least
two members.
Under our Articles of Association and German law, the Management
Board adopts rules of procedure for the conduct of its affairs,
and may amend them at any time. The adoption and amendment of
these rules require the unanimous vote of the Management Board
and the consent of the Supervisory Board. The Supervisory Board
may, however, decide to adopt rules of procedure for the
Management Board instead.
Our Management Board has adopted rules of procedure. Our
Supervisory Board approved these rules and resolved that the
following decisions of the Management Board require the consent
of the Supervisory Board:
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|
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|
|
Decisions relating to financial and investment planning,
including both budgets and the establishment of limits for
financial indebtedness;
|
|
|
|
Decisions relating to any investment or disposition that exceeds
10 percent of our total investment budget; and
|
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|
Decisions relating to the taking of any financial risk
vis-à-vis third parties in an amount exceeding
5 percent of our share capital plus capital reserves.
|
In addition, the rules of procedure provide that the chairman of
the Management Board must notify the chairman of the Supervisory
Board of any pending matter that is significant. The chairman of
the Supervisory Board must, at the next meeting of the
Supervisory Board, notify the other members of the Supervisory
Board of such matter, and the Supervisory Board may, on a
case-by-case
basis, designate such matter as one requiring Supervisory Board
approval.
The Management Board members are jointly responsible for all
management matters and pursuant to the current rules of
procedure must jointly decide on a number of issues, including:
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the annual financial statements;
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|
|
the calling of the shareholders general meeting;
|
|
|
|
matters for which the consent of the shareholders general
meeting or of the Supervisory Board must be obtained; and
|
|
|
|
matters involving basic organizational, business policy and
investment and financial planning questions for our company.
|
The rules of procedure provide that the Management Board take
action by unanimous vote.
99
The chairman of the Management Board must propose a plan that
allocates responsibilities among the Management Board members
and must obtain the consent of the Supervisory Board without
delay once the Management Board has adopted the plan. This
consent has been obtained.
The Supervisory Board appoints the members of the Management
Board for a maximum term of five years. Members of the
Management Board may be reappointed or have their term extended
for one or more terms of up to five years each. The Supervisory
Board may remove a member of the Management Board prior to
expiration of such members term for good cause, for
example, in the case of a serious breach of duty or a bona fide
vote of no confidence by the shareholders general meeting.
A member of the Management Board may not deal with, or vote on,
matters that relate to proposals, arrangements or contracts
between such member and our company.
Significant
Differences between our Corporate Governance Practices and those
of U.S. Companies Listed on the New York Stock
Exchange
A brief, general summary of the significant differences between
our corporate governance practices under German law and the
practices applicable to U.S. companies listed on the New
York Stock Exchange is available in the corporate governance
section of our website, www.infineon.com.
In compliance with legal requirements and the recommendations of
the German Corporate Governance Code as amended on June 14,
2007, this report provides information on the principles for
determining the compensation of the Management Board and
Supervisory Board of Infineon Technologies AG and the amount of
compensation paid to the individual members of the Management
Board and Supervisory Board.
Compensation
of the Management Board
Compensation
structure
The Executive Committee of the Supervisory Board, which includes
the chairman of the Supervisory Board Max Dietrich Kley, the
deputy chairman of the board Gerd Schmidt, and board member
Prof. Dr. Martin Winterkorn, is responsible for
determining the compensation of the Management Board. The
compensation of the members of the Management Board is intended
to reflect the companys size and global presence, its
economic condition and performance, and the level and structure
of the compensation paid to management boards of comparable
companies within Germany and abroad. Additional factors taken
into account are the duties and responsibilities as well as the
contributions of each member of the Management Board. Their
compensation complies with the stipulations of Section 87
of the German Stock Corporation Act and is calculated to be
competitive both nationally and internationally and thus to
provide an incentive for dedicated and successful work within a
dynamic environment. The level of compensation is reevaluated
every two years, taking into account an analysis of the income
paid to executives of comparable companies.
The compensation of the Management Board comprises the following
elements:
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|
|
Fixed annual base salary. The
non-performance-related annual base salary is contractually
fixed. It is partly paid in 12 equal monthly installments, and
partly paid as a lump sum at the end of each fiscal year (in the
following referred to as Annual Lump Sum).
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|
Performance-related compensation. The
annual bonus is dependent on the return on assets, which we
define as earnings before interest and taxes (EBIT) adjusted for
exceptional effects, in proportion to capital employed. This
ensures that a bonus is earned only if the business develops
positively. The annual bonus is determined by the Executive
Committee in a two-phase process. In a first step, a target
bonus amount is determined on the basis on the return on assets.
The Executive Committee subsequently evaluates the personal
performance of each individual board member over the past fiscal
year, and then determines the actual bonus amount. In addition
to the
|
100
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|
|
|
bonus dependent on the return on assets, Management Board
contracts provide for a possible special bonus awarded in
recognition of special business achievements.
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Infineon Technologies AG stock
options. Management Board members are
eligible to receive stock options under the 2006 Stock Option
Plan approved by the Infineon Technologies AG Shareholders
Annual General Meeting on February 16, 2006, as a variable
compensation element with a long-term incentive effect and a
risk character. Each stock option guarantees the right to
acquire one share at a fixed exercise price. The options are
valid for six years and may be exercised only after an initial
waiting period of three years and not during specified black-out
periods. The exercise price at which a share may be acquired
upon exercise of an option is equal to 120 percent of the
average Infineon opening prices on the Frankfurt Stock Exchange
in the XETRA trading system over the five trading days preceding
the date that the option is granted. The exercise of the options
is dependent on the attainment of absolute and relative
performance targets. The precondition for the exercise of the
option rights is that the Infineon share price on the Frankfurt
Stock Exchange in the XETRA trading system equals or exceeds the
exercise price on at least one trading day during the option
life. Furthermore, the options can only be exercised if the
Infineon share price exceeds the performance of the comparative
index Philadelphia Semiconductor Index for three consecutive
days on at least one occasion during the life of the option.
These absolute and relative performance targets serve to ensure
that the options are only exercised if the value of the company
significantly increases. The Supervisory Board is responsible
for all decisions on granting options to members of the
Management Board. The fair value of the options granted during
the 2007 fiscal year was 2.03 per option, determined
according to the Monte Carlo simulation model. The main
provisions of our 2006 stock option plan are described in
note 28 to our consolidated financial statements for the
year ended September 30, 2007, and are available in full
text on the Internet at www.infineon.com.
|
Compensation
of the Management Board in the 2007 fiscal year
In the 2007 fiscal year, the active members of the Management
Board received a total cash compensation of 5,349,206
(previous
year(1):
4,391,438). No performance-related bonuses were paid for
the 2007 fiscal year. The total compensation amounts to
6,465,706 (previous
year(2):
5,667,438). This includes stock options with a fair value
of 1,116,500 (previous year: 1,276,000), which were
granted to the Management Board members pursuant to the 2006
stock option plan.
The individual members of the Management Board who were active
in the 2007 fiscal year received the following compensation
(gross without statutory
deductions)(3):
101
Overview of
the total compensation
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|
|
Cash
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|
Stock-based
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|
Total
|
|
|
|
|
compensation
|
|
compensation
|
|
compensation
|
Management Board
|
|
Fiscal year
|
|
in
|
|
in
|
|
in
(4)
|
|
Dr. Wolfgang Ziebart (Chairman)
|
|
|
2007
|
|
|
|
1,636,828
|
|
|
|
406,000
|
|
|
|
2,042,828
|
|
|
|
|
2006
|
|
|
|
1,735,563
|
|
|
|
510,400
|
|
|
|
2,245,963
|
|
Peter Bauer
|
|
|
2007
|
|
|
|
920,146
|
|
|
|
203,000
|
|
|
|
1,123,146
|
|
|
|
|
2006
|
|
|
|
916,438
|
|
|
|
255,200
|
|
|
|
1,171,638
|
|
Prof. Dr. Hermann Eul
|
|
|
2007
|
|
|
|
729,815
|
|
|
|
203,000
|
|
|
|
932,815
|
|
|
|
|
2006
|
|
|
|
709,058
|
|
|
|
255,200
|
|
|
|
964,258
|
|
Peter J. Fischl
|
|
|
2007
|
|
|
|
1,027,130
|
|
|
|
304,500
|
|
|
|
1,331,630
|
|
|
|
|
2006
|
|
|
|
1,030,379
|
|
|
|
255,200
|
|
|
|
1,285,579
|
|
Rüdiger A. Günther
|
|
|
2007
|
|
|
|
799,628
|
|
|
|
|
|
|
|
799,628
|
|
|
|
|
2006
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Dr. Reinhard Ploss
|
|
|
2007
|
|
|
|
235,659
|
|
|
|
|
|
|
|
235,659
|
|
|
|
|
2006
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Total
|
|
|
2007
|
|
|
|
5,349,206
|
|
|
|
1,116,500
|
|
|
|
6,465,706
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
2006
|
|
|
|
4,391,438
|
|
|
|
1,276,000
|
|
|
|
5,667,438
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
(1)
|
This amount includes the Annual Lump Sum for the 2006 fiscal
year paid in October 2006.
|
|
(2)
|
This amount includes the Annual Lump Sum for the 2006 fiscal
year paid in October 2006 and the fair value of the stock
options granted in the 2006 fiscal year.
|
|
(3)
|
Each in accordance with the duration of the respective
Management Board service contract during the 2007 fiscal year.
|
|
(4)
|
This amount includes the fair value of the stock options granted
in the respective fiscal year.
|
Cash
compensation
The cash compensation listed in the overview above comprises the
following elements (in ):
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Performance-
|
|
|
|
|
|
|
|
|
|
|
|
|
related
|
|
|
|
|
|
|
|
|
|
Non-performance-related compensation
|
|
|
compensation
|
|
|
|
|
|
|
|
|
|
Annual Base Salary
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Amount paid in
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
12 monthly
|
|
|
Annual lump
|
|
|
|
|
|
|
|
|
Total cash
|
|
Management Board
|
|
Fiscal year
|
|
|
installments
|
|
|
sum(2)
|
|
|
Other(1)
|
|
|
Bonus
|
|
|
compensation
|
|
|
Dr. Wolfgang Ziebart
|
|
|
2007
|
|
|
|
800,000
|
|
|
|
800,000
|
|
|
|
36,828
|
|
|
|
|
|
|
|
1,636,828
|
|
(Chairman)
|
|
|
2006
|
|
|
|
800,000
|
|
|
|
800,000
|
|
|
|
35,563
|
|
|
|
100,000
|
|
|
|
1,735,563
|
|
Peter Bauer
|
|
|
2007
|
|
|
|
367,500
|
|
|
|
532,500
|
|
|
|
20,146
|
|
|
|
|
|
|
|
920,146
|
|
|
|
|
2006
|
|
|
|
360,000
|
|
|
|
540,000
|
|
|
|
16,438
|
|
|
|
|
|
|
|
916,438
|
|
Prof. Dr. Hermann Eul
|
|
|
2007
|
|
|
|
358,333
|
|
|
|
358,333
|
|
|
|
13,149
|
|
|
|
|
|
|
|
729,815
|
|
|
|
|
2006
|
|
|
|
350,000
|
|
|
|
350,000
|
|
|
|
9,058
|
|
|
|
|
|
|
|
709,058
|
|
Peter J. Fischl
|
|
|
2007
|
|
|
|
400,000
|
|
|
|
600,000
|
|
|
|
27,130
|
|
|
|
|
|
|
|
1,027,130
|
|
|
|
|
2006
|
|
|
|
400,000
|
|
|
|
600,000
|
|
|
|
30,379
|
|
|
|
|
|
|
|
1,030,379
|
|
Rüdiger A. Günther
|
|
|
2007
|
|
|
|
325,000
|
|
|
|
425,000
|
(3)
|
|
|
49,628
|
|
|
|
|
|
|
|
799,628
|
|
|
|
|
2006
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Dr. Reinhard Ploss
|
|
|
2007
|
|
|
|
116,667
|
|
|
|
116,667
|
|
|
|
2,325
|
|
|
|
|
|
|
|
235,659
|
|
|
|
|
2006
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Total
|
|
|
2007
|
|
|
|
2,367,500
|
|
|
|
2,832,500
|
|
|
|
149,206
|
|
|
|
|
|
|
|
5,349,206
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
2006
|
|
|
|
1,910,000
|
|
|
|
2,290,000
|
|
|
|
91,438
|
|
|
|
100,000
|
|
|
|
4,391,438
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
(1)
|
The compensation included under Other comprises
primarily the monetary value of the provision of a company car
and insurance contributions, and, in the case of
Mr. Günther, the repayment of relocation expenses.
|
|
(2)
|
This amount includes the Annual Lump Sum for the 2006 and 2007
fiscal years to be paid in the subsequent fiscal year before the
preparation of the prior year consolidated financial statements.
|
|
(3)
|
This amount comprises the Annual Lump Sum (pro rata) as well as
a guaranteed bonus in the amount of 100,000.
|
102
Stock-based
compensation
The stock-based compensation listed in the overview above
reflects the following stock options granted in the 2007 fiscal
year to members of the Management Board pursuant to the 2006
Stock Option Plan:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Stock options
|
|
|
|
|
|
|
granted in the 2007
|
|
Fair value at grant
|
Management Board
|
|
Fiscal Year
|
|
fiscal
year(1)
|
|
date in
|
|
Dr. Wolfgang Ziebart (Chairman)
|
|
|
2007
|
|
|
|
200,000
|
|
|
|
406,000
|
|
|
|
|
2006
|
|
|
|
160,000
|
|
|
|
510,400
|
|
Peter Bauer
|
|
|
2007
|
|
|
|
100,000
|
|
|
|
203,000
|
|
|
|
|
2006
|
|
|
|
80,000
|
|
|
|
255,200
|
|
Prof. Dr. Hermann Eul
|
|
|
2007
|
|
|
|
100,000
|
|
|
|
203,000
|
|
|
|
|
2006
|
|
|
|
80,000
|
|
|
|
255,200
|
|
Peter J. Fischl
|
|
|
2007
|
|
|
|
150,000
|
|
|
|
304,500
|
|
|
|
|
2006
|
|
|
|
80,000
|
|
|
|
255,200
|
|
Rüdiger A. Günther
|
|
|
2007
|
|
|
|
|
|
|
|
|
|
|
|
|
2006
|
|
|
|
|
|
|
|
|
|
Dr. Reinhard Ploss
|
|
|
2007
|
|
|
|
|
|
|
|
|
|
|
|
|
2006
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Total
|
|
|
2007
|
|
|
|
550,000
|
|
|
|
1,116,500
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
2006
|
|
|
|
400,000
|
|
|
|
1,276,000
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
(1) |
For the 2007 grants, the exercise price equals 13.30 per
share, while the fair value determined in accordance with the
Monte Carlo simulation model as of the grant date amounts to
2.03. The fair value underlying the amounts of the
previous year determined in accordance with the Black-Scholes
option pricing model was 3.19 per share.
|
Commitments to
the Management Board upon termination of
employment
Allowances and pension entitlements in the 2007 fiscal
year
The pension agreement with the chairman of the Management Board
sets the monthly pension payment at 70 percent of the last
monthly base salary. The other members of the Management Board
are contractually entitled to a fixed pension payment, which
increases by 5,000 annually (with the exception of
Mr. Fischl) until a maximum amount is attained. In
accordance with U.S. GAAP, a total of 3,146,830 was
added to pension reserves in the 2007 fiscal year (previous
year: 2,908,481). Upon termination of membership in the
Management Board, pension entitlements normally begin from
age 60 at the earliest. Exceptions are provided for in
cases such as departures from the board for health reasons and
surviving dependents pensions. Dr. Ziebart and
Mr. Bauer deviate from this model and are entitled to a
pension before age 60 if their contracts are not renewed,
provided that there is no good cause for a revocation of the
appointment in accordance with section 84, paragraph 3 of
the German Stock Corporation Act. In such a case, however, their
incomes from other employment and self-employed activities would
be set off against up to one half of their pension entitlements.
103
The following overview represents the annual pension
entitlements, as of the beginning of retirement, for Management
Board members active through the end of the 2007 fiscal year, on
the basis of the entitlements through September 30, 2007:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Pension
|
|
|
|
|
|
|
|
|
|
entitlements
|
|
|
|
|
|
Transfer to pension
|
|
|
|
(annual) as of
|
|
|
|
|
|
reserves in the
|
|
|
|
beginning of
|
|
|
Maximum
|
|
|
fiscal year (U.S.
|
|
Management Board
|
|
pension period in
|
|
|
amount in
|
|
|
GAAP) in
|
|
|
Dr. Wolfgang Ziebart (Chairman)
|
|
|
560,000
|
|
|
|
|
|
|
|
2,234,745
|
|
Peter Bauer
|
|
|
210,000
|
|
|
|
270,000
|
|
|
|
240,854
|
|
Prof. Dr. Hermann Eul
|
|
|
195,000
|
|
|
|
270,000
|
|
|
|
186,662
|
|
Peter J. Fischl
|
|
|
300,000
|
|
|
|
300,000
|
|
|
|
484,569
|
|
Dr. Reinhard Ploss
|
|
|
170,000
|
|
|
|
210,000
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Total
|
|
|
1,435,000
|
|
|
|
|
|
|
|
3,146,830
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
The contracts of Dr. Ziebart and Mr. Bauer,
furthermore, allow for a one-off transitional allowance upon
termination of employment. This transitional allowance is
equivalent to one years income, composed of the last 12
basic monthly installments, and a sum amounting to the average
of the bonus sums received over the last three fiscal years
prior to termination. There is no right to the payment of a
transitional allowance in the event of termination by a member
of the Management Board not prompted by the company, and if the
company has good cause for the termination. Subsequent to his
temporary departure, Mr. Fischl received a transitional
allowance of 1,133,333 in the 2007 fiscal year; he is not
entitled to any further transitional allowance.
Early termination of employment
In the 2007 fiscal year, Management Board contracts were
modified to include change-of-control clauses: A
change-of-control within the meaning of this clause occurs when
a third party, individually or in cooperation with another
party, holds 30 percent of voting rights in Infineon
Technologies AG as stipulated by section 30 of the German
Securities Acquisition and Takeover Act (Wertpapiererwerbs-
und Übernahmegesetz). In case of such a
change-of-control, the Management Board members have the right
to resign and terminate their contracts if the exercise of their
office and the fulfillment of their service contract become
unacceptable, due, for example, to considerable restrictions in
their areas of responsibility. In such an event, board members
are entitled to a continuation of their annual target income for
the full remaining duration of their contracts and a minimum of
two years. This amount is based on the annual target income for
the year of termination and the variable components assuming a
return on assets of 6 percent. In the event of a
termination of the contract by Infineon Technologies AG within
12 months after the announcement of a change of control,
the members of the Management Board are entitled to a
continuation of their annual target income for the full
remaining duration of their contracts and a minimum of three
years. Mr. Fischl, as an exception to this rule, is
entitled to a severance payment equivalent to two years of
annual target income in the event of his resignation/termination
of contract, and is entitled to a severance payment equivalent
to four years of annual target income in the event of the
termination of his contract by the company. The Management Board
members pension entitlements remain unaffected. These
rights in the event of a change of control, however, only exist
if there is no serious breach of duty.
Management Board contracts, furthermore, do not foresee
severance payments in the event of an early termination of
contract. Severance payments may, however, be stipulated in
individual termination agreements.
Fringe benefits and other awards in the 2007 fiscal
year
|
|
|
|
|
The members of the Management Board received no fringe benefits
besides the elements listed under Other in the
compensation table.
|
|
|
|
The members of the Management Board do not receive any loans
from the company.
|
104
|
|
|
|
|
The members of the Management Board received no compensation or
promise of compensation with regard to their activities on the
board from third parties in the 2007 fiscal year.
|
|
|
|
The company maintains a directors and officers group
liability insurance (D&O insurance). The insurance covers
the personal liability risk in the event of claims raised
against members of the Management Board for indemnification of
losses incurred in the exercise of their duties, if the claimed
loss exceeds 25 percent of the
non-performance-related
annual salary of the board member involved (which constitutes a
deductible as defined by the German Corporate Governance Code,
clause 3.8, para. 2).
|
Payments to
former members of the Management Board in the 2007 fiscal
year
Former members of the Management Board received total payments
of 1.3 million (severance and pension payments) in
the 2007 fiscal year. This includes a severance payment of
1.2 million to Mr. Günther.
According to U.S. GAAP, a total of 1,442,276 was
added to pension reserves for current pensions and entitlements
to pensions by former Management Board members; as of
September 30, 2007, these pension reserves amount to
13,587,269.
Compensation
of the Supervisory Board
Compensation structure
The compensation of the Supervisory Board is determined in the
companys Articles of Incorporation. It is intended to
reflect the companys size, the duties and responsibilities
of the members of the Supervisory Board, and the companys
economic condition and performance. The compensation of the
Supervisory Board is governed by Section 11 of the Articles
of Incorporation and comprises two elements:
|
|
|
|
|
fixed compensation of 25,000 per year and
|
|
|
|
a variable element in the form of 1,500 share
appreciation rights per annum, which are granted and may be
exercised on the same terms as provided for by the Infineon
Stock Option Plan 2006 approved by the Shareholders Annual
General Meeting, which is valid in the fiscal year in which
these rights are granted. These share appreciation rights,
however, do not entitle the holder to purchase shares but only
to a settlement in cash. The share appreciation rights expire
six years from the date of grant, and can be exercised only
following a waiting period of three years. The exercise price
per share appreciation right amounts to 120 percent of the
average Infineon opening price on the Frankfurt Stock Exchange
in the XETRA trading system over the five trading days preceding
the date the respective share appreciation right is granted. The
exercise of share appreciation rights is dependent on the
attainment of absolute and relative performance targets as
stipulated in the 2006 Stock Option Plan. Basic principles of
our 2006 Stock Option Plan are described in note 28 to the
consolidated financial statements for the year ended
September 30, 2007 and are available in full text on the
Internet at www.infineon.com. The fair value of the share
appreciation rights granted in the 2007 fiscal year amounts to
2.03 per share appreciation right, as determined in
accordance with the Monte Carlo simulation model.
|
Additional compensation is paid for certain functions within the
Supervisory Board. The Chairman of the Supervisory Board
receives an additional 100 percent of the fixed
compensation. Furthermore, each Vice-Chairman and each other
member of a Supervisory Board committee, with the exception of
the committees stipulated by law, receives an additional
50 percent of their fixed compensation.
Members of the Supervisory Board, moreover, receive compensation
for all expenses incurred in connection with their duties, as
well as the value-added tax apportioned to their compensation,
to the extent that they can charge for it separately and do so.
105
Compensation of the Supervisory Board in the 2007 fiscal
year
The share appreciation rights granted to the members of the
Supervisory Board in the 2007 fiscal year follow the terms of
the companys 2006 Stock Option Plan. The Supervisory Board
compensation otherwise remained unchanged from the previous
year. The individual members of the Supervisory Board received
the following cash compensation, including
19 percent VAT, in the 2007 fiscal year:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Additional
|
|
|
|
|
|
|
|
|
|
compensation for
|
|
|
|
|
|
|
Base compensation
|
|
|
special functions
|
|
|
Total payment
|
|
Supervisory Board member
|
|
in
|
|
|
in
|
|
|
in
|
|
|
Max Dietrich Kley
|
|
|
29,750
|
|
|
|
29,750
|
|
|
|
59,500
|
|
Wigand Cramer
|
|
|
29,750
|
|
|
|
|
|
|
|
29,750
|
|
Alfred Eibl
|
|
|
29,750
|
|
|
|
14,875
|
|
|
|
44,625
|
|
Prof. Johannes Feldmayer
|
|
|
29,750
|
|
|
|
|
|
|
|
29,750
|
|
Jakob Hauser
|
|
|
29,750
|
|
|
|
14,875
|
|
|
|
44,625
|
|
Gerhard
Hobbach(1)
|
|
|
19,833
|
|
|
|
|
|
|
|
19,833
|
|
Dr. Stefan
Jentzsch(2)
|
|
|
24,792
|
|
|
|
|
|
|
|
24,792
|
|
Prof. Dr. Renate Köcher
|
|
|
29,750
|
|
|
|
|
|
|
|
29,750
|
|
Klaus
Luschtinetz(3)
|
|
|
12,396
|
|
|
|
6,198
|
|
|
|
18,594
|
|
Dr. Siegfried Luther
|
|
|
29,750
|
|
|
|
14,875
|
|
|
|
44,625
|
|
Michael Ruth
|
|
|
29,750
|
|
|
|
|
|
|
|
29,750
|
|
Gerd Schmidt
|
|
|
29,750
|
|
|
|
9,917
|
|
|
|
39,667
|
|
Prof. Dr. Doris
Schmitt-Landsiedel
|
|
|
29,750
|
|
|
|
14,875
|
|
|
|
44,625
|
|
Kerstin Schulzendorf
|
|
|
29,750
|
|
|
|
|
|
|
|
29,750
|
|
Dr. Eckart
Sünner(4)
|
|
|
4,958
|
|
|
|
|
|
|
|
4,958
|
|
Alexander Trüby
|
|
|
29,750
|
|
|
|
14,875
|
|
|
|
44,625
|
|
Prof. Dr. Martin Winterkorn
|
|
|
29,750
|
|
|
|
14,875
|
|
|
|
44,625
|
|
Prof. Dr.-Ing. Klaus Wucherer
|
|
|
29,750
|
|
|
|
14,875
|
|
|
|
44,625
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Total
|
|
|
478,479
|
|
|
|
149,990
|
|
|
|
628,469
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
(1)
|
Pro rata from appointment (February 15, 2007).
|
|
(2)
|
Pro rata to retirement from office (August 2, 2007).
|
|
(3)
|
Pro rata to retirement from office (February 15, 2007).
|
|
(4)
|
Pro rata from appointment (August 2, 2007).
|
Other
The members of the Supervisory Board do not receive any loans
from the company.
The company maintains a directors and officers group
liability insurance (D&O insurance). The insurance covers
the personal liability risk in the event of claims raised
against members of the Supervisory Board for indemnification of
losses incurred in the exercise of their duties, if the claimed
loss exceeds 100 percent of the annual base salary of the
board member involved (which constitutes a deductible as defined
by the German Corporate Governance Code, section 3.8,
paragraph 2).
Long-Term
Incentive Plans
2006 Stock Option Plan. In February
2006, we adopted and our shareholders approved the Infineon
Technologies AG 2006 Stock Option Plan, which we refer to as the
2006 plan. Under the 2006 plan, we have the authority over a
three-year period to grant non-transferable share options to
members of our Management Board, members of senior management of
our subsidiaries, and other key managers and employees at
Infineon Technologies AG and our domestic and foreign
subsidiaries. We may grant options covering up to
1.625 million shares to members of our Management Board,
1.3 million shares to senior management of our domestic and
foreign subsidiaries, and 10.075 million shares to other
key managers
106
and employees at levels below the Management Board of Infineon
Technologies AG and senior management of our domestic and
foreign subsidiaries. No more than 40 percent of the
options available for grant to one of those three groups may be
issued during one fiscal year, and we may not grant options
under the 2006 plan covering more than 13 million shares in
the aggregate. As of September 30, 2007, options to
purchase an aggregate of 2.25 million shares were
outstanding under the 2006 plan, of which options to purchase
550,000 shares were granted to members of our Management
Board during their membership on the Management Board.
Under the 2006 plan, the Supervisory Board decides annually
within a period of 45 days after publication of the results
for the fiscal year then ended or of the first or second quarter
of a fiscal year, but no later than two weeks before the end of
the quarter, how many options to grant to the Management Board.
During that same period the Management Board may grant options
to other eligible persons.
The exercise price of the options granted under the 2006 plan is
120 percent of the average opening share price of our
shares on the Frankfurt Stock Exchange over the five trading
days preceding the date of grant. Options granted under the 2006
plan have a term of six years after the date of grant and may be
exercised after the third anniversary of the date of grant, at
the earliest. In addition, options may be exercised only if both
(a) the share price of our company has reached the exercise
price at least once during a trading day, and (b) the share
price of our company has exceeded for at least three consecutive
days, on at least one occasion since the date of grant, the
trend of the Philadelphia Semiconductor Stock Index, a
comparative index of the share price of companies in a similar
sector to Infineon Technologies AG. If the Philadelphia
Semiconductor Index is discontinued or is fundamentally altered
so as not to provide an appropriate means for comparison, then
the Management Board will either select another index to serve
as a comparative index or use a new index including as many as
possible of the individual prices previously tracked by the
Philadelphia Semiconductor Stock Index. In addition, holders may
not exercise an option within a fixed time period prior to or
following publication of our quarterly or annual results.
2001 International Long-Term Incentive
Plan. In April 2001, we adopted the Infineon
Technologies AG 2001 International Long-Term Incentive Plan,
which we refer to as the 2001 plan.
Under the 2001 plan, we granted non-transferable share options
to members of our Management Board, to the members of the top
management of our subsidiaries, and to other senior level
executives and employees with exceptional performance. As of
September 30, 2007, options to purchase an aggregate of
33.6 million shares were outstanding under the 2001 plan,
of which options to purchase 1.5 million shares were held
by members of our Management Board. No further options will be
granted under the 2001 plan.
The exercise price of the options granted under the 2001 plan is
105 percent of the average closing share price of our
companys shares on the Frankfurt Stock Exchange over the
five trading days preceding the date of grant. Options granted
under the 2001 plan have a term of seven years from the date of
grant and may be exercised at the earliest after the second
anniversary of the date of grant, but only if the share price of
our company has reached the exercise price at least once during
a trading day. In addition, holders may not exercise an option
within fixed time periods prior to or following publication of
our quarterly or annual results.
1999 Stock Option Plan. Under our
1999 Stock Option Plan we granted non-transferable share
options to members of our Management Board, directors of
subsidiaries and affiliates, managers and key employees.
As of September 30, 2007, options to purchase an aggregate
of 3.5 million shares were outstanding under the 1999 plan,
of which options to purchase 133,000 shares were held by
members of our Management Board. The 1999 plan was discontinued
and, accordingly, we no longer grant options under that plan.
107
The exercise price of the options granted under the 1999 plan is
120 percent of the average closing price of our
companys shares on the Frankfurt Stock Exchange over the
five trading days preceding the date of grant. Holders of
options may exercise them during the seven-year period following
the date of grant but only if the share price of our company has
reached the exercise price at least once during a trading day in
XETRA or its successor during the duration of the option and
only after the second anniversary of the date of grant. In
addition, holders may not exercise an option within fixed time
periods prior to or following publication of our quarterly or
annual results. When options are exercised, we may either issue
new shares from its conditional capital or deliver previously
issued shares.
108
The following table shows the beneficial ownership, as of
September 30, 2007, of our companys share capital by
(1) the principal shareholders (each person or entity that
has reported to us, as required by applicable German law, that
it beneficially owns 5 percent or more of our shares) and
(2) the members of our Management Board and Supervisory
Board, each as a group. We are not directly or indirectly owned
or controlled by any foreign government.
|
|
|
|
|
|
|
|
|
|
|
Shares owned
|
|
|
|
Number
|
|
|
%
|
|
|
Brandes Investment Partners,
L.P.(1)
|
|
|
38,371,696
|
|
|
|
5.1
|
|
Dodge & Cox Investment
Managers(2)
|
|
|
37,927,800
|
|
|
|
5.1
|
|
Templeton Global Advisors
Limited(3)
|
|
|
38,674,360
|
|
|
|
5.2
|
|
Members of the Management Board as a
group(4)
|
|
|
*
|
|
|
|
*
|
|
Members of the Supervisory Board as a
group(4)
|
|
|
*
|
|
|
|
*
|
|
|
|
(1)
|
The business address of Brandes Investment Partners, L.P. is
11988 El Camino Real, Suite 500, San Diego, California
92130, USA. Based solely on a notification to Infineon by the
shareholder on March 9, 2006 pursuant to the requirements
of the German Securities Trading Act.
|
|
(2)
|
The business address of Dodge & Cox Investment
Managers is 555 California Street, 40th Floor,
San Francisco, California 94104, USA. Based solely on a
notification to Infineon by the shareholder on February 8,
2007 pursuant to the requirements of the German Securities
Trading Act.
|
|
(3)
|
The business address of Templeton Global Advisors Limited is
Templeton Building, Lyford Cay, PO Box N7759, Nassau,
Bahamas. Based solely on a notification to Infineon by the
shareholder on April 24, 2006 pursuant to the requirements
of the German Securities Trading Act.
|
|
(4)
|
Represents less than 1 percent of our outstanding share
capital.
|
The German Securities Trading Act (Wertpapierhandelsgesetz)
requires each person whose shareholding of a listed German
company reaches, exceeds or, after exceeding, falls below 3
percent, 5 percent, 10 percent, 15 percent,
20 percent, 25 percent, 30 percent, 50 percent
or 75 percent voting rights thresholds to notify the
corporation and the German Federal Supervisory Authority for
Financial Services in writing without undue delay, at the latest
within four trading days after they have reached, exceeded or
fallen below such a threshold. In their notification, they must
also state the number of shares they hold.
Other than as disclosed above, we have not been notified by any
party holding 5% or more of our shares as of September 30,
2007.
Major shareholders do not have differing voting rights.
Significant changes in the percentage ownership held of record
by major shareholders in the last three fiscal years were as
follows: Wachovia Trust Company NA held 18.2 percent of our
shares in trust for Siemens AG as of September 30, 2004,
which were transferred to Siemens AG and held by Siemens AG as
of September 30, 2005. On April 3, 2006, Siemens
AG sold the remaining shares in our company held by it and it is
no longer one of our shareholders.
To our knowledge, as of September 30, 2007, there were
116,457,784 of our American Depositary Shares outstanding
(representing an equivalent number of our ordinary shares),
which represented approximately 15.5 percent of our issued
and outstanding share capital, and there were approximately 149
holders of record of our American Depositary Shares.
109
RELATED
PARTY TRANSACTIONS AND RELATIONSHIPS
Qimonda
In connection with the formation of Qimonda as a separate legal
entity, Infineon and Qimonda entered into a number of agreements
governing the carve-out of the memory products business, the
licensing of intellectual property, the use of Infineons
200-millimeter fabrication facility in Dresden, and ongoing
support services in the areas of general support, IT services
and research and development services. These agreements are
described in detail in the annual report of Qimonda on
Form 20-F
(Commission File
No. 001-32972),
filed with the Securities and Exchange Commission on
November 16, 2007, under the heading Related Party
Transactions and Relationships With Infineon,
which section is hereby incorporated herein by reference.
110
This section summarizes the material rights of holders of the
shares of our company under German law and the material
provisions of the Articles of Association of our company. This
description is only a summary and does not describe everything
that the Articles of Association contain. Copies of the Articles
of Association are publicly available at our website,
www.infineon.com, and from the Commercial Register in Munich,
Germany. An English translation has been filed with the
Securities and Exchange Commission in the United States.
Equity
The issued share capital of our company consists of
1,499,457,270 divided into 749,728,635 individual shares
in registered form with a notional value of 2.00 each.
Since our formation, changes in our share capital have been as
follows:
|
|
|
|
|
At our formation, our share capital consisted of
400,000,000, represented by 200,000,000 shares.
|
|
|
|
On January 26, 2000, we increased our share capital from
400,000,000 to 800,000,000 by issuing
200,000,000 shares for a 400,000,000 transfer of
corporate funds to capital. The new shares were issued to
Siemens and Siemens Nederland N.V. in proportion to their
respective ownership interests in our company at that time.
|
|
|
|
On February 14, 2000, we increased our share capital from
800,000,000 to 1,200,000,000 by issuing
200,000,000 shares for a 400,000,000 transfer of
corporate funds to capital. The new shares were issued to
Siemens and Siemens Nederland N.V. in proportion to their
respective ownership interests in our company at that time.
|
|
|
|
On March 8, 2000, we increased our share capital by
33,400,000 to 1,233,400,000 for cash contributions
by issuing 16,700,000 shares with full dividend entitlement
for the 2000 fiscal year. The shares were sold in our initial
public offering.
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|
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|
On April 28, 2000, we increased our share capital by
15,184,860 by issuing to Intel Corporation
7,592,430 shares with full dividend entitlement for the
2000 fiscal year. After the execution of the capital increase,
our share capital consisted of 1,248,584,860.
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|
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|
On June 28, 2000, we increased our share capital by
2,418,154 against a contribution in kind by issuing
1,209,077 shares with full dividend entitlement for the
2000 fiscal year to Savan Communications Ltd. After execution of
the capital increase our share capital consisted of
1,251,003,014.
|
|
|
|
On March 16, 2001, we increased our share capital by
886,976 against a contribution in kind by issuing
443,488 shares with full dividend entitlement for the 2001
fiscal year in connection with our investment in Ramtron
International Corporation. After execution of the capital
increase our share capital consisted of 1,251,889,990.
|
|
|
|
On April 11, 2001, we increased our share capital by
1,413,428 against a contribution in kind by issuing
706,714 shares with full dividend entitlement for the 2001
fiscal year in connection with our acquisition of Ardent
Technologies Incorporated. After the execution of the capital
increase our share capital consisted of 1,253,303,418.
|
|
|
|
In July 2001, we increased our share capital by
120,000,000 by issuing 60,000,000 shares (with full
dividend entitlement for the 2001 fiscal year) in our secondary
public offering. After the execution of the capital increase our
share capital consisted of 1,373,303,418.
|
|
|
|
On July 25, 2001, we increased our share capital by
12,746,870 against a contribution in kind by issuing
6,373,435 shares with full dividend entitlement for the
2001 fiscal year in connection with our acquisition of Catamaran
Communications Incorporated. After the execution of the capital
increase, our share capital consisted of 1,386,050,288.
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111
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|
|
|
|
On November 29, 2001, we increased our share capital by
24,000 by issuing 12,000 shares with full dividend
entitlement for the 2002 fiscal year to group employees in
connection with our 2001 employee share purchase program.
After the execution of the capital increase, our share capital
consisted of 1,386,074,288.
|
|
|
|
On July 24, 2002, we increased our share capital by
686,920 by issuing 343,460 shares with full dividend
entitlement for the 2002 fiscal year to group employees in
connection with our 2002 employee share purchase program.
After the execution of the capital increase, our share capital
consisted of 1,386,761,208.
|
|
|
|
On August 30, 2002, we increased our share capital by
55,000,000 against a contribution in kind by issuing
27,500,000 shares with full dividend entitlement for the
2002 fiscal year in connection with our acquisition of Ericsson
Microelectronics AB, Stockholm, Sweden. After the execution of
the capital increase, our share capital consisted of
1,441,761,208.
|
|
|
|
On March 23, 2004, we increased our share capital by
53,358,510 against a contribution in kind by issuing
26,679,255 shares with full dividend entitlement for the
2004 fiscal year in connection with the acquisition of the
remaining interest in Infineon Technologies SC300
GmbH & Co. KG, Dresden. After the execution of the
capital increase our share capital consisted of
1,495,119,718.
|
|
|
|
During the 2005 fiscal year, our share capital increased by
19,000 as a result of the exercise of 9,500 employee
stock options. After these exercises our share capital consisted
of 1,495,138,718.
|
|
|
|
During the 2006 fiscal year, our share capital increased by
79,870 as a result of the exercise of 39,935 employee
stock options. After these exercises our share capital consisted
of 1,495,218,588.
|
|
|
|
During the 2007 fiscal year, our share capital increased by
4,238,682 as a result of the exercise of
2,119,341 employee stock options. After these exercises our
share capital consisted of 1,499,457,270.
|
Registrar Services GmbH, the transfer agent and registrar of our
company in Germany, registers record holders of shares in the
share register on our behalf pursuant to a transfer agent
agreement. The transfer agent also maintains the register of our
shareholders.
Authorized
Capital
Under the German Stock Corporation Act, a stock
corporations shareholders can authorize the Management
Board to issue shares in a specified aggregate nominal amount of
up to 50 percent of the issued share capital at the time
the resolution is passed. The shareholders authorization
may extend for a period of no more than five years.
The Articles of Association of our company authorize the
Management Board to increase the share capital with the
Supervisory Boards consent. The Management Board may use
these authorizations to issue new shares in one or more tranches:
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in an aggregate nominal amount of up to 30 million to
issue shares to employees of the Infineon group companies (in
which case preemptive rights of the existing shareholders are
excluded) until January 19, 2009 (Authorized Capital
II/2004); and
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|
|
|
in an aggregate nominal amount of up to 224 million
to issue shares for cash (in which case preemptive rights of
existing shareholders may be excluded under certain
circumstances by the Management Board with the consent of the
Supervisory Board) or in exchange for contributions in kind (in
which case preemptive rights of the existing shareholders may be
excluded by the Management Board with the consent of the
Supervisory Board) until February 14, 2012 (Authorized
Capital 2007).
|
112
Conditional
Capital
Under the German Stock Corporation Act, a stock
corporations shareholders can authorize conditional
capital of up to 50 percent of the issued share capital at
the time of the resolution. Our Articles of Association provide
for the following conditional capital as approved by our
shareholders:
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|
|
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Conditional Capital I in an aggregate nominal amount of
91.7 million that may be used to issue up to
45.8 million new registered shares in connection with our
1999 and our 2001 long-term incentive plans;
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|
|
|
Conditional Capital III in an aggregate nominal amount of
29 million that may be used to issue up to
14.5 million new registered shares in connection with our
2001 and 2006 long-term incentive plan;
|
|
|
|
Conditional Capital IV/2006 in an aggregate nominal amount of
24.5 million that may be used to issue up to
12.25 million new registered shares in connection with our
2006 long-term incentive plan;
|
|
|
|
Conditional Capital 2002 in an aggregate nominal amount of
152 million that may be used to issue up to
76 million new registered shares upon conversion of debt
securities issued in June 2003; and
|
|
|
|
Conditional Capital 2007 in an aggregate nominal amount of
248 million that may be used to issue up to
124 million new registered shares upon conversion of debt
securities, which we may issue at any time prior to
February 14, 2012.
|
All of these shares will have dividend rights from the beginning
of the fiscal year in which they are issued.
Preemptive
Rights
Under the German Stock Corporation Act, an existing shareholder
in a stock corporation has a preferential right to subscribe for
issuances of new shares by that corporation in proportion to the
number of shares he holds in the corporations existing
share capital. These rights do not apply to shares issued out of
conditional capital. Preemptive rights also apply to securities
that may be converted into shares, securities with warrants,
profit sharing certificates and securities with dividend rights.
The German Stock Corporation Act allows the exclusion of this
preferential right only in limited circumstances. At least three
fourths of the share capital represented at the relevant
shareholders meeting must vote for exclusion. In addition
to approval by the shareholders, the exclusion of preemptive
rights requires a justification. The justification must be based
on the principle that the interest of the company in excluding
preemptive rights outweighs the shareholders interest in
their preemptive rights.
Preemptive rights resulting from a capital increase may
generally be transferred and may be traded on any of the German
stock exchanges upon which our shares are traded for a limited
number of days prior to the final date on which the preemptive
rights may be exercised.
Shareholders
Meetings and Voting Rights
A general meeting of the shareholders of Infineon may be called
by the Management Board or the Supervisory Board. Shareholders
holding in the aggregate at least 5 percent of our issued
share capital may also require the Management Board to call a
meeting. The annual general meeting must take place within the
first eight months of the fiscal year. The Management Board
calls this meeting upon the receipt of the Supervisory
Boards report on the annual financial statements.
Under German law and the Articles of Association of our company,
our company must publish notices of shareholder meetings in the
electronic edition of the German Federal Gazette
(elektronischer Bundesanzeiger) at least one month before
the last day on which the shareholders must notify our company
that they intend to attend the meeting.
A shareholder or group of shareholders holding a minimum of
either 5 percent of the share capital of our company or
shares representing at least 500,000 of its registered
capital may require that additional or modified proposals be
made at our shareholders general meeting.
113
Shareholders who are registered in the share register may
participate in and vote at the shareholders general
meeting. A notice by a shareholder of his or her intention to
attend a shareholders general meeting must be given to our
company at least six days (or a shorter period, if so determined
by the Management Board) before the meeting, not counting the
day of notice and the day of the meeting. Following receipt of a
notice of this type, our company will not enter a transfer of
the related shares in the share register until after the
conclusion of the shareholders general meeting. In certain
cases, a shareholder can be prevented from exercising his or her
voting rights. This would be the case, for instance, for
resolutions on the waiver or assertion of a claim by our company
against the shareholder.
Each share carries one vote at general meetings of the
shareholders. Resolutions are generally passed with a simple
majority of the votes cast. Resolutions that require a capital
majority are passed with a simple majority of the issued
capital, unless statutory law or the Articles of Association of
our company require otherwise. Under the German Stock
Corporation Act, a number of significant resolutions must be
passed by a majority of the votes cast and at least
75 percent of the share capital represented in connection
with the vote taken on that resolution. The majority required
for some of these resolutions may be lowered by the Articles of
Association. The shareholders of our company have lowered the
majority requirements to the extent permitted by law.
Although our company must notify shareholders of an ordinary or
extraordinary shareholders meeting as described above,
neither the German Stock Corporation Act nor our Articles of
Association fixes a minimum quorum requirement. This means that
holders of a minority of our shares could control the outcome of
resolutions not requiring a specified majority of our
outstanding share capital.
According to our Articles of Association, a resolution that
amends the Articles of Association must be passed by a majority
of the votes cast and at least a majority of the nominal capital
represented at the meeting of shareholders at which the
resolution is considered. However, resolutions to amend the
business purpose stated in our Articles of Association also
require a majority of at least three quarters of the share
capital represented at the meeting. The 75 percent majority
requirement also applies to the following matters:
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the exclusion of preemptive rights in a capital increase;
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capital decreases;
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|
a creation of authorized capital or conditional capital;
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|
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a dissolution;
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|
a merger or a consolidation with another stock corporation or
another corporate transformation;
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|
a transfer of all or virtually all of the assets of our
company; and
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|
the conclusion of any direct control, profit and loss pooling or
similar inter-company agreements.
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Dividend
Rights
Shareholders participate in profit distributions in proportion
to the number of shares they hold.
Under German law, we may declare and pay dividends only from
balance sheet profits as they are shown in our unconsolidated
annual financial statements prepared in accordance with
applicable German law. In determining the distributable balance
sheet profits, the Management Board and the Supervisory Board
may allocate to profit reserves up to one half of the annual
surplus remaining after allocations to statutory reserves and
losses carried forward.
The shareholders, in determining the distribution of profits,
may allocate additional amounts to profit reserves and may carry
forward profits in part or in full.
Dividends approved at a shareholders general meeting are
payable on the first stock exchange trading day after that
meeting, unless otherwise decided at the shareholders
general meeting. Where shareholders hold physical certificates,
we will pay dividends to those shareholders who present us or
the paying agent or agents that we may appoint from time to
time, with the appropriate dividend coupon. If a shareholder
holds shares that are entitled to dividends in a clearing
system, the dividends will be paid
114
according to that clearing systems rules. We will publish
notice of dividends paid and the paying agent or agents that we
have appointed in the German Federal Gazette.
Liquidation
Rights
In accordance with the German Stock Corporation Act, if we are
liquidated, any liquidation proceeds remaining after all of our
liabilities have been paid off would be distributed among our
shareholders in proportion to their holdings.
Shareholders
Other Rights and Obligations
Our shareholders have other rights and obligations, for example
the right to participate in the general discussion at the annual
meeting of shareholders and ask questions of our management. If
shareholders believe that our company has been harmed by members
of the Management Board or Supervisory Board they can initiate
proceedings against those persons under certain conditions. If a
German court determines that members of the Management Board or
Supervisory Board have violated their obligations towards our
company, then they are liable for damages to our company, but
generally not to the shareholders directly. Such direct claims
would be successful under very rare circumstances, for example
upon a finding that the member of the Management Board or the
Supervisory Board has engaged in willful misconduct with the
intention of harming shareholders.
Disclosure
Requirement
The German Securities Trading Act requires each person whose
shareholding of a listed company reaches, exceeds or, after
exceeding, falls below 3 percent, 5 percent,
10 percent, 15 percent, 20 percent,
25 percent, 30 percent, 50 percent or
75 percent voting rights thresholds to notify the
corporation and the German Federal Supervisory Authority for
Financial Services in writing without undue delay, at the latest
within four trading days after they have reached, exceeded or
fallen below such a threshold. In their notification, they must
also state the number of shares they hold. Such holders cannot
exercise any rights associated with those shares until they have
satisfied this disclosure requirement. In addition, the German
Securities Trading Act contains various rules designed to ensure
the attribution of shares to the person who has effective
control over the exercise of the voting rights attached to those
shares.
Repurchase of
Our Own Shares
We may repurchase our own shares pursuant to the authorization
granted by the shareholders general meeting on
February 15, 2007 or in other very limited circumstances
set out in the German Stock Corporation Act. The authorization
granted by our shareholders general meeting expires on
August 14, 2008. Shareholders may grant a new authorization
at our 2008 shareholders general meeting.
Shareholders may not grant a share repurchase authorization
lasting for more than 18 months. The rules in the German
Stock Corporation Act generally limit repurchases to
10 percent of our share capital and resales must be made
either on the stock exchange, in a manner that treats all
shareholders equally or in accordance with the rules that apply
to preemptive rights relating to a capital increase.
Corporate
Purpose of Our Company
The corporate purpose of our company, described in
section 2 of the Articles of Association, is direct or
indirect activity in the field of research, development,
manufacture and marketing of electronic components, electronic
systems and software, as well as the performance of related
services.
Registration
of our company with the Commercial Register
Our company was entered into the commercial register of Munich,
Germany, as a stock corporation on July 14, 1999 under the
number HRB 126492.
115
Infineon Technologies AG is the parent company of the Infineon
group, including Qimonda, with subsidiaries incorporated in
jurisdictions throughout Europe and Asia, as well as in the
United States. Our most significant subsidiaries are set out
below. Unless otherwise indicated, all of the subsidiaries in
the Infineon group (including Qimonda) were directly or
indirectly 100 percent owned by Infineon Technologies AG,
and all of the subsidiaries in the Qimonda group were directly
or indirectly 100 percent owned by Qimonda AG, as of
September 30, 2007.
Principal
Subsidiaries as of September 30, 2007
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Corporate name
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Registered office
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Principal activity
|
|
Infineon Group:
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ALTIS Semiconductor
S.N.C(1)
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Essonnes, France
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Production
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Infineon Technologies Asia Pacific Pte. Ltd.
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Singapore
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Production, distribution
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Infineon Technologies Austria AG
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Villach, Austria
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Production
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Infineon Technologies Bipolar GmbH & Co. KG
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Warstein, Germany
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Production and development
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Infineon Technologies China Co. Ltd.
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Shanghai, China
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Holding
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Infineon Technologies Dresden GmbH & Co. OHG
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Dresden, Germany
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Production
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Infineon Technologies Finance GmbH
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Neubiberg, Germany
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Financial services
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Infineon Technologies France S.A.S.
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Saint Denis, France
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Distribution
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Infineon Technologies Holding B.V.
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Rotterdam, The Netherlands
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Holding
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Infineon Technologies Investment B.V.
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Rotterdam, The Netherlands
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Holding
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Infineon Technologies Japan K.K.
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Tokyo, Japan
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Distribution
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Infineon Technologies North America Corp.
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Delaware, USA
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Research, development and distribution
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Infineon Technologies SensoNor AS
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Horten, Norway
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Production
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Infineon Technologies (Advanced Logic) Sdn. Bhd.
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Malacca, Malaysia
|
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Production
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Infineon Technologies (Kulim) Sdn. Bhd.
|
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Kulim, Malaysia
|
|
Production
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Infineon Technologies (Malaysia) Sdn. Bhd.
|
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Malacca, Malaysia
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Production
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Qimonda Group:
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Inotera Memories
Inc.(2)
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Taoyuan, Taiwan
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Production
|
Qimonda
AG(3)
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Munich, Germany
|
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Research, development, production and distribution of
semiconductor memory products and related services
|
Qimonda Asia Pacific Pte. Ltd.
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Singapore
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|
Distribution
|
Qimonda Dresden GmbH & Co. OHG
|
|
Dresden, Germany
|
|
Production
|
Qimonda Europe GmbH
|
|
Munich, Germany
|
|
Distribution, sales and marketing
|
Qimonda Holding B.V.
|
|
Rotterdam, The Netherlands
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|
Holding
|
Qimonda Japan K.K.
|
|
Tokyo, Japan
|
|
Sales and marketing
|
Qimonda Investment B.V.
|
|
Rotterdam, The Netherlands
|
|
Holding
|
Qimonda Malaysia Sdn. Bhd.
|
|
Malacca, Malaysia
|
|
Production
|
Qimonda Module (Suzhou) Co. Ltd.
|
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Suzhou, China
|
|
Production
|
Qimonda North America Corp.
|
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Delaware, USA
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|
Distribution, sales and marketing, research and development
|
Qimonda Portugal S.A.
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Vila do Conde, Portugal
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|
Production
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Qimonda Richmond, LLC
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Delaware, USA
|
|
Production
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Qimonda Technologies (Suzhou) Co.
Ltd.(4)
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Suzhou, China
|
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Production
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|
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(1)
|
50 percent interest plus one share held by Infineon. In
August 2007, Infineon, IBM and Advanced Electronic Systems AG
(AES) entered into an agreement, under which AES is
to acquire the interests in ALTIS from Infineon and IBM.
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(2)
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35.4 percent ownership interest held by Qimonda.
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(3)
|
77.5 percent beneficially owned by Infineon.
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(4)
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62.8 percent interest held by Qimonda.
|
116
Under the German Stock Corporation Act (Aktiengesetz),
the amount of dividends available for distribution to
shareholders is based on the level of earnings
(Bilanzgewinn) of the ultimate parent, Infineon
Technologies AG, as determined in accordance with HGB, the
German Commercial Code. All dividends must be approved by the
shareholders. The ordinary shareholders meeting held in February
2007 did not authorize a dividend. No earnings are available for
distribution as a dividend for the 2007 fiscal year, since
Infineon Technologies AG on a stand-alone basis as the ultimate
parent incurred a cumulative loss (Bilanzverlust) as of
September 30, 2007. Subject to market conditions, we intend
to retain future earnings for investment in the development and
expansion of our business. In connection with our strategy to
reduce our stake in Qimonda AG we intend to amend our Articles
of Association at our 2008 general meeting of shareholders to
enable a payment of dividends in kind to our shareholders. A
distribution of Qimonda shares as dividend in kind would then be
possible after our 2009 general meeting of shareholders,
provided that we have distributable profits.
Except as discussed elsewhere in this annual report on
Form 20-F, no significant change has occurred since the
date of the annual financial statements included in this annual
report on Form 20-F.
General
The principal trading market for our shares is the Frankfurt
Stock Exchange under the trading symbol IFX. Options on the
shares trade on the German options exchange (Eurex Deutschland)
and other exchanges. All of our shares are in registered form.
ADSs, each representing one share, are listed on the New York
Stock Exchange and trade under the symbol IFX. The depositary
for the ADSs is Deutsche Bank.
Trading on the
Frankfurt Stock Exchange
Our shares have traded on the Frankfurt Stock Exchange since
March 13, 2000. The table below sets forth, for the periods
indicated, the high and low closing sales prices for our
companys shares on the Frankfurt Stock Exchange, as
reported by the Frankfurt Stock Exchange Xetra trading system:
|
|
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|
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|
|
|
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Price per share in Euro
|
|
|
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High
|
|
|
Low
|
|
|
Fiscal year ended September 30, 2003
|
|
|
13.79
|
|
|
|
5.34
|
|
Fiscal year ended September 30, 2004
|
|
|
13.65
|
|
|
|
7.80
|
|
Fiscal year ended September 30, 2005
|
|
|
9.00
|
|
|
|
6.43
|
|
Fiscal year ended September 30, 2006
|
|
|
9.95
|
|
|
|
7.60
|
|
Fiscal year ended September 30, 2007
|
|
|
13.44
|
|
|
|
9.25
|
|
October 2005 through December 2005
|
|
|
8.51
|
|
|
|
7.60
|
|
January 2006 through March 2006
|
|
|
8.93
|
|
|
|
7.62
|
|
April 2006 through June 2006
|
|
|
9.95
|
|
|
|
8.22
|
|
July 2006 through September 30, 2006
|
|
|
9.76
|
|
|
|
8.21
|
|
October 2006 through December 2006
|
|
|
10.68
|
|
|
|
9.25
|
|
January 2007 through March 2007
|
|
|
12.27
|
|
|
|
10.66
|
|
April 2007 through June 2007
|
|
|
12.81
|
|
|
|
10.88
|
|
July 2007 through September 30, 2007
|
|
|
13.44
|
|
|
|
10.70
|
|
June 2007
|
|
|
12.81
|
|
|
|
11.34
|
|
July 2007
|
|
|
13.44
|
|
|
|
12.15
|
|
August 2007
|
|
|
11.87
|
|
|
|
10.70
|
|
September 2007
|
|
|
12.12
|
|
|
|
11.54
|
|
October 2007
|
|
|
11.95
|
|
|
|
10.13
|
|
November 2007
|
|
|
9.82
|
|
|
|
7.62
|
|
December
2007(1)
|
|
|
8.75
|
|
|
|
8.07
|
|
|
|
(1) |
Up to and including December 6,
2007.
|
117
On December 6,
2007, the closing sales price per share on the Frankfurt Stock
Exchange, as reported by the Xetra trading system, was
8.67,
equivalent to
$12.69
per share (translated at the noon buying rate on December 6,
2007).
Trading on the
New York Stock Exchange
ADSs representing our shares have traded on the New York Stock
Exchange since March 13, 2000. The table below sets forth,
for the periods indicated, the high and low closing sales prices
for the ADSs on the New York Stock Exchange:
|
|
|
|
|
|
|
|
|
|
|
Price per ADS in
|
|
|
|
U.S. dollars
|
|
|
|
High
|
|
|
Low
|
|
|
Fiscal year ended September 30, 2003
|
|
|
15.35
|
|
|
|
5.25
|
|
Fiscal year ended September 30, 2004
|
|
|
15.87
|
|
|
|
9.39
|
|
Fiscal year ended September 30, 2005
|
|
|
11.74
|
|
|
|
8.40
|
|
Fiscal year ended September 30, 2006
|
|
|
12.68
|
|
|
|
8.95
|
|
Fiscal year ended September 30, 2007
|
|
|
18.68
|
|
|
|
11.77
|
|
October 2005 through December 2005
|
|
|
10.03
|
|
|
|
8.95
|
|
January 2006 through March 2006
|
|
|
10.28
|
|
|
|
9.18
|
|
April 2006 through June 2006
|
|
|
12.68
|
|
|
|
10.24
|
|
July 2006 through September 30, 2006
|
|
|
12.49
|
|
|
|
10.37
|
|
October 2006 through December 2006
|
|
|
14.03
|
|
|
|
11.77
|
|
January 2007 through March 2007
|
|
|
16.26
|
|
|
|
13.94
|
|
April 2007 through June 2007
|
|
|
17.28
|
|
|
|
14.75
|
|
July 2007 through September 30, 2007
|
|
|
18.68
|
|
|
|
14.36
|
|
June 2007
|
|
|
17.28
|
|
|
|
15.14
|
|
July 2007
|
|
|
18.68
|
|
|
|
16.37
|
|
August 2007
|
|
|
16.37
|
|
|
|
14.36
|
|
September 2007
|
|
|
17.18
|
|
|
|
15.81
|
|
October 2007
|
|
|
17.13
|
|
|
|
14.52
|
|
November 2007
|
|
|
14.27
|
|
|
|
11.29
|
|
December
2007(1)
|
|
|
12.77
|
|
|
|
11.86
|
|
|
|
(1)
|
Up to and including
December 6,
2007.
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On December 6,
2007, the closing sales price per ADS on the New York Stock
Exchange was
$12.76.
118
Fluctuations in the exchange rate between the Euro and the
U.S. dollar will affect the U.S. dollar amounts
received by owners of shares or ADSs on conversion of dividends,
if any, paid in Euro on the shares and will affect the
U.S. dollar price of the ADSs on the New York Stock
Exchange. In addition, to enable you to ascertain how the trends
in our financial results might have appeared had they been
expressed in U.S. dollars, the table below states the
average exchange rates of U.S. dollars per Euro for the
periods shown. The annual average exchange rate is computed by
using the Federal Reserve noon buying rate for the Euro on the
last business day of each month during the period indicated.
Annual average
exchange rates of the U.S. dollar per Euro
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|
Fiscal year ended September 30,
|
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Average
|
|
|
2003
|
|
|
1.0919
|
|
2004
|
|
|
1.2199
|
|
2005
|
|
|
1.2727
|
|
2006
|
|
|
1.2364
|
|
2007
|
|
|
1.3415
|
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The table below shows the high and low Federal Reserve noon
buying rates for Euro in U.S. dollars per Euro for each
month from April 2007 through September 2007:
Recent high and
low exchange rates of the U.S. dollar per Euro
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High
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Low
|
|
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April 2007
|
|
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1.3660
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|
|
|
1.3363
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|
May 2007
|
|
|
1.3616
|
|
|
|
1.3419
|
|
June 2007
|
|
|
1.3526
|
|
|
|
1.3295
|
|
July 2007
|
|
|
1.3831
|
|
|
|
1.3592
|
|
August 2007
|
|
|
1.3808
|
|
|
|
1.3402
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|
September 2007
|
|
|
1.4219
|
|
|
|
1.3606
|
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The noon buying rate on September 28, 2007 was 1.00 =
$1.4219, and on
December 6,
2007 was 1.00 =
$1.4638.
German
Taxation
The following is a summary discussion of the material German tax
consequences for shareholders who are not resident in Germany
for income tax purposes and who do not hold shares or ADSs as
business assets of a permanent establishment or fixed base in
Germany (Non-German Shareholders). The discussion
does not purport to be a comprehensive description of all the
tax considerations that may be relevant to a decision to invest
in or hold our shares or ADSs. The discussion is based on the
tax laws of Germany as in effect on the date of this annual
report, which may be subject to change at short notice and,
within certain limits, possibly also with retroactive effect.
You are advised to consult your tax advisors in relation to the
tax consequences of the acquisition, holding and disposition or
transfer of shares and ADSs and in relation to the procedure
which needs to be observed in the event of a possible reduction
or refund of German withholding taxes. Only these advisors are
in a position to duly consider your specific tax situation.
Taxation of
the Company
In Germany the Corporate Tax Reform Act of 2008 introduced
several changes to the taxation of German business activities,
including a reduction of the combined corporate and trade tax
rate for the Company from approximately 37 percent to
approximately 28 percent.
119
In principle, German corporations are subject to corporate
income tax at a rate of 25 percent (15 percent after
2007). This tax rate applies irrespective of whether profits are
distributed or retained. In addition, a solidarity surcharge of
5.5 percent is levied on the assessed corporate income tax
liability, so that the combined effective tax burden of
corporate income tax and solidarity surcharge is
26.375 percent (15.825 percent after 2007). Certain
foreign source income is exempt from corporate income tax.
Generally, dividends received by us and capital gains realized
by us on the sale of shares in other corporations will also be
exempt from corporate income tax. However, 5 percent of
such dividends and capital gains are considered non deductible
business expenses.
In addition, German corporations are subject to a profit-based
trade tax, the exact amount of which depends on the municipality
in which the corporation conducts its business. With effect for
fiscal years ending after December 31, 2007, the basic
factor for the calculation of trade tax applicable to
corporations will be reduced from 0.05 to 0.035. As a
compensation, trade tax is no longer a deductible item in
calculating the corporations tax base for corporate income
and trade tax purposes.
Tax losses carried forward in respect of German corporate and
trade tax have an indefinite life. According to a minimum
taxation regime applicable as of 2004, not more than
1 million plus 60 percent of the amount
exceeding 1 million of the income of one fiscal year
may be offset against tax losses carried forward.
The Corporate Tax Reform Act of 2008 provides certain new rules
regarding the computation of profits which shall broaden the tax
base for corporate income tax and trade tax. Inter alia,
the deductibility of interest expenses of the company (payable
to shareholders or to third parties) may be limited to
30 percent of the companys taxable income before
interest payable and capital allowances, provided that the net
interest expense of the company (interest payable less interest
receivable) exceeds 1 million.
Taxation of
Dividends
Tax must be withheld at a rate of 20 percent plus
solidarity surcharge of 5.5 percent (in total
21.1 percent) on dividends paid (if any). In 2009, the rate
will increase to 25 percent plus solidarity surcharge (in
total 26.375 percent).
Pursuant to most German tax treaties, including the income tax
treaty between Germany and the United States (the
Treaty), the German withholding tax may not exceed
15 percent of the dividends received by Non-German
Shareholders who are eligible for treaty benefits. The
difference between the withholding tax including solidarity
surcharge that was levied and the maximum rate of withholding
tax permitted by an applicable tax treaty is refunded to the
shareholder by the German Federal Tax Office
(Bundeszentralamt für Steuern, An der Küppe 1,
D-53225 Bonn, Germany) upon application. Forms for a refund
application are available from the German Federal Tax Office and
German embassies and consulates. A further reduction applies
pursuant to most tax treaties if the shareholder is a
corporation which holds a stake of 25 percent or more, and
in some cases (including under the Treaty) of 10 percent or
more, of the registered share capital (or according to some tax
treaties of the votes) of a company.
Withholding
Tax Refund for U.S. Shareholders
U.S. shareholders who are eligible for treaty benefits
under the Treaty (as discussed below in United States
Taxation) are entitled to claim a refund of the portion of
the otherwise applicable 20 percent German withholding
tax and 5.5 percent solidarity surcharge on dividends that
exceeds the applicable Treaty rate (generally 15 percent).
For shares or ADSs kept in custody with the Depository
Trust Company in New York or one of its participating
banks, the German tax authorities have introduced a collective
procedure for the refund of German dividend withholding tax and
solidarity surcharge thereon. Under this procedure, the
Depository Trust Company may submit claims for refunds
payable to U.S. shareholders under the Treaty collectively
to the German tax authorities on behalf of these
U.S. shareholders. The German Federal Tax Office will pay
the refund amounts on a preliminary basis to the Depository
Trust Company, which will redistribute these
120
amounts to the U.S. shareholders according to the
regulations governing the procedure. The Federal Tax Office may
review whether the refund was made in accordance with the law
within four years after making the payment to the Depository
Trust Company. Details of this collective procedure are
available from the Depository Trust Company. This procedure
is currently permitted by German tax authorities but that
permission may be revoked, or the procedure may be amended, at
any time in the future.
Individual claims for refunds may be made on a special German
form, which must be filed with the German Federal Tax Office
(Bundeszentralamt für Steuern, An der Küppe 1,
D-53225 Bonn, Germany) within four years from the end of the
calendar year in which the dividend is received. Copies of the
required forms may be obtained from the German tax authorities
at the same address or from the Embassy of the Federal Republic
of Germany, 4645 Reservoir Road, NW, Washington D.C.
20007-1998.
As part of the individual refund claim, a U.S. shareholder
must submit to the German tax authorities the original
withholding certificate (or a certified copy thereof) issued by
the paying agent documenting the tax withheld and an official
certification of United States tax residency on IRS
Form 6166. IRS Form 6166 generally may be obtained by
filing a properly completed IRS Form 8802 with the Internal
Revenue Service, Philadelphia Service Center,
U.S. Residency Certification Request,
P.O. Box 16347, Philadelphia, PA
19114-0447.
Requests for certification must include the
U.S. shareholders name, Social Security Number or
Employer Identification Number, the type of U.S. tax return
filed and the tax period for which the certification is
requested. The Internal Revenue Service will send the
certification on IRS Form 6166 to the U.S. shareholder
who then must submit the certification with the claim for refund.
Taxation of
Capital Gains
Generally, capital gains from the disposition of shares and ADSs
realized by a Non-German shareholder other than a corporation
are only subject to German tax if (i) such shareholder at
any time during the five years preceding the disposition held
directly or indirectly an interest of 1 percent or more in
a companys issued share capital; if the shareholder has
acquired the shares or ADSs without consideration, the previous
owners holding period and size of shareholding will also
be taken into account, or (ii) the shareholder has acquired
the shares no earlier than 12 months before the
disposition. After 2008, the disposition of shares acquired
after December 31, 2008 will be generally subject to German
tax.
If the shareholder is an individual, one half of the capital
gain will generally be taxable. After 2009, 100 percent of
the capital gain will be taxable, but generally at a uniform tax
rate of 25 percent plus solidarity surcharge of
5.5 percent (in total: 26.375 percent). If the
shareholder is a corporation, effectively 5 percent of the
capital gain will generally be taxable. However, most German tax
treaties, including the Treaty, provide that Non-German
shareholders who are beneficiaries under the respective treaty
are generally not subject to German tax even under the
circumstances described in the preceding paragraph. See the
discussion regarding shareholders that generally are eligible
for benefits under the Treaty in United States
Taxation, below.
Special rules may apply to certain companies of the finance or
insurance sector (including pension funds) that are not
protected from German tax under a tax treaty.
Inheritance
and Gift Tax
Under German domestic law, the transfer of shares or ADSs will
be subject to German inheritance or gift tax on a transfer by
reason of death or as a gift if:
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(a)
|
the donor or transferor or the heir, donee or other beneficiary
is resident in Germany at the time of the transfer, or, if a
German citizen, was not continuously outside of Germany and
without German residence for more than five years; or
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(b)
|
at the time of the transfer, the shares or ADSs are held by the
decedent or donor as assets of a business for which a permanent
establishment is maintained or a permanent representative is
appointed in Germany; or
|
121
|
|
|
|
(c)
|
the decedent or donor has held, alone or together with related
persons, directly or indirectly, 10 percent or more of a
companys registered share capital at the time of the
transfer.
|
The few presently existing German estate tax treaties (e.g. the
Estate Tax Treaty with the United States) usually provide that
German inheritance or gift tax may only be imposed in cases
(a) and (b) above.
Other
Taxes
There are no transfer, stamp or similar taxes which would apply
to the sale or transfer of the shares or ADSs in Germany. Net
worth tax is no longer levied in Germany.
United States
Taxation
The following discussion is a summary of the material United
States federal tax consequences of the purchase, ownership and
disposition of shares or ADSs. This summary addresses only
U.S. Holders (as defined below) that hold shares or ADSs as
capital assets for United States federal income tax purposes and
that use the U.S. dollar as their functional currency.
As used in this document, the term U.S. Holder
means a beneficial owner of shares or ADSs that is for United
States federal income tax purposes:
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|
|
|
|
an individual who is a citizen or resident of the United States;
|
|
|
|
a corporation, or other entity taxable as a corporation, formed
under the laws of the United States or any state thereof or the
District of Columbia; or
|
|
|
|
an estate or trust, the income of which is subject to United
States federal income taxation regardless of its source.
|
The tax consequences to a partner in a partnership holding
shares or ADSs will generally depend on the status of the
partner and the activities of the partnership. If you are a
partner in a partnership that holds shares or ADSs, you are
urged to consult your own tax advisor regarding the specific tax
consequences of the purchase, ownership and disposition by the
partnership of shares or ADSs.
The following summary is of a general nature and does not
address all of the tax consequences that may be relevant to you
if you are a member of a special class of holders, some of which
may be subject to special rules, such as banks or other
financial institutions, insurance companies, regulated
investment companies, securities brokers-dealers, traders in
securities that elect to use a mark-to-market method of
accounting for security holdings, persons who are owners of an
interest in a partnership or other pass-through entity that is a
holder of shares or ADSs, tax-exempt entities, holders owning
directly, indirectly or by attribution 10 percent or more
of our voting shares, persons holding shares or ADSs as part of
a hedging, straddle, conversion or constructive sale transaction
or other integrated investment, persons who receive shares or
ADSs as compensation, or persons who are resident in Germany for
German tax purposes, hold the shares or ADSs in connection with
the conduct of business through a permanent establishment in
Germany, or perform personal services through a fixed base in
Germany.
In addition, this summary does not discuss the tax consequences
of the exchange or other disposition of foreign currency in
connection with the purchase or disposition of shares or ADSs.
This summary is based on the Internal Revenue Code of 1986, as
amended, its legislative history, existing and proposed
regulations thereunder, published rulings and court decisions,
as well as on the Treaty, all as currently in effect and all
subject to change at any time, possibly with retroactive effect,
or to different interpretation. There can be no assurance that
the U.S. Internal Revenue Service (the IRS)
will not challenge one or more of the tax consequences described
in this summary, and we have not obtained, nor do we intend to
obtain, a ruling from the IRS with respect to the United States
federal income tax consequences of the purchase, ownership or
disposition of shares or ADSs. In addition, this discussion is
based in part upon the representations of the depositary and the
assumption that each obligation in the deposit agreement and any
related agreement will be performed in accordance with its terms.
122
In general, for U.S. federal income tax purposes and for
purposes of the Treaty, holders of ADSs will be treated as the
owners of our shares represented by those ADSs. Exchanges of
shares for ADS, and ADS for shares, generally will not be
subject to United States federal income tax.
Taxation of
Dividends
For United States federal income tax purposes, the gross amount
of cash distributions (including the amount of foreign taxes, if
any, withheld therefrom) paid out of our current or accumulated
earnings and profits (as determined for United States federal
income tax purposes) will be includible in your gross income as
dividend income on the date of receipt. Dividends paid by us
will be treated as foreign source income and will not be
eligible for the dividends received deduction generally allowed
to corporate shareholders under United States federal income tax
law. Distributions in excess of our earnings and profits will be
treated, for United States federal income tax purposes, first as
a nontaxable return of capital to the extent of your tax basis
in the shares or ADSs, and thereafter as capital gain. The
amount of any dividend paid in a
non-United
States currency will be equal to the United States dollar value
of the
non-United
States currency on the date of receipt, regardless of whether
you convert the payment into United States dollars. You will
have a tax basis in the
non-United
States currency distributed equal to such United States dollar
amount. Gain or loss, if any, recognized by you on the sale or
disposition of the
non-United
States currency generally will be United States source ordinary
income or loss.
Dividend income is generally taxed as ordinary income. However,
a maximum United States federal income tax rate of
15 percent will apply to qualified dividend
income received by individuals (as well as certain trusts
and estates) in taxable years beginning before January 1,
2011, provided that certain holding period requirements are met.
Qualified dividend income includes dividends paid on
shares of United States corporations as well as dividends paid
on shares of qualified foreign corporations if,
among other things: (i) the shares of the foreign
corporation are readily tradable on an established securities
market in the United States; or (ii) the foreign
corporation is eligible with respect to substantially all of its
income for the benefits of a comprehensive income tax treaty
with the United States which contains an exchange of information
program (a qualifying treaty). ADSs backed by our
shares are readily tradable on an established securities market
in the United States. In addition, the Treaty is a qualifying
treaty. Accordingly, we believe that dividends paid by us with
respect to our shares and ADSs should constitute qualified
dividend income for United States federal income tax
purposes, provided that the holding period requirements are
satisfied and none of the other special exceptions applies.
Any foreign tax withheld from a distribution will generally be
treated as a foreign income tax that you may elect to deduct in
computing your United States federal taxable income or, subject
to certain complex conditions and limitations which must be
determined on an individual basis by each U.S. Holder,
credit against your United States federal income tax liability.
The limitations include, among others, rules that may limit
foreign tax credits allowable with respect to specific classes
of income to the United States federal income taxes otherwise
payable with respect to each such class of income. Dividends
paid by us generally will be foreign source passive
income or financial services income for United
States foreign tax credit purposes. However, recently enacted
legislation will modify the foreign tax credit rules by reducing
the number of classes of foreign source income to two for
taxable years beginning after December 31, 2006. Under such
legislation, dividends distributed by us would generally
constitute passive category income, but could, in
the case of certain U.S. Holders, constitute general
category income.
Taxation of
Sales or Other Taxable Dispositions
Sales or other taxable dispositions by U.S. shareholders of
shares or ADSs generally will give rise to capital gain or loss
equal to the difference between the U.S. dollar value of
the amount realized on the disposition and the
U.S. shareholders U.S. dollar basis in the
shares or ADSs. Any such capital gain or loss will be a
long-term capital gain or loss, subject to taxation at reduced
rates for non-corporate taxpayers, if the shares or ADSs were
held for more than one year. The deductibility of capital losses
is subject to limitations.
123
Information
Reporting and Backup Withholding
Dividends paid in respect of shares or ADSs, and payments of the
proceeds of a sale, exchange, redemption or other disposition of
shares or ADSs, paid within the United States or through certain
U.S.-related
financial intermediaries are subject to information reporting
and may be subject to backup withholding unless the holder
(i) is a corporation or other exempt recipient or
(ii) provides a taxpayer identification number and
certifies that no loss of exemption from backup withholding has
occurred. Holders that are not U.S. persons generally are
not subject to information reporting or backup withholding.
However, such a holder may be required to provide a
certification to establish its
non-U.S. status
in connection with payments received within the United States or
through certain
U.S.-related
financial intermediaries (generally an IRS
Form W-8BEN).
Backup withholding is not an additional tax. Amounts withheld as
backup withholding may be credited against a holders
U.S. federal income tax liability. A holder may obtain a
refund of any excess amounts withheld under the backup
withholding rules by filing the appropriate claim for a refund
with the IRS and furnishing any required information.
United States
Gift and Estate Taxes
An individual U.S. Holder generally will be subject to
United States gift and estate taxes with respect to the shares
or ADSs in the same manner and to the same extent as with
respect to other types of personal property.
Exchange
Controls and Limitations Affecting Shareholders
Germany does not currently restrict the movement of capital
between Germany and other countries, except for prohibitions on
the provision of financial aid or capital to certain individuals
and in connection with banned weapons-related transactions to
Belarus, Burma/Myanmar, Iran, Ivory Coast, Democratic Republic
of the Congo, Lebanon, Liberia, Democratic Peoples
Republic of Korea, Somalia, Sudan, Uzbekistan and Zimbabwe.
Germany also imposes certain restrictions on the movement of
capital to Iraq, as well as the provision of financial aid or
capital to the Taliban and Al Qaeda. Similar provisions have
been imposed with regard to certain individuals in order to
support the mandate of the International Criminal Tribunal for
the Former Yugoslavia (ICTY). These restrictions
were established to coincide with resolutions adopted by the
United Nations and the European Union.
More information can be found in German at:
http://www.bundesbank.de/finanzsanktionen/finanzsanktionen allgemein.php.
For statistical purposes, with some exceptions, every
corporation or individual residing in Germany must report to the
German Central Bank any payment received from or made to a
non-resident corporation or individual if the payment exceeds
12,500 (or the equivalent in a foreign currency).
Additionally, corporations and individuals residing in Germany
must report to the German Central Bank any claims of a resident
corporation or individual against, or liabilities payable to, a
non-resident corporation or individual exceeding an aggregate of
5.0 million (or the equivalent in a foreign currency)
at the end of any calendar month.
Neither German law nor our Articles of Association restrict the
right of non-resident or foreign owners of shares to hold or
vote the shares.
Change of Control
Provisions
The credit facilities entered into by us in September 2004
and August 2007 each contain a so-called change of control
clause (for further information please see note 23 to our
consolidated financial statements for the fiscal year ended
September 30, 2007). In the event of a change of control of
our company, the lenders under those facilities are entitled to
terminate the facility and to demand repayment of any
outstanding sums. A change of control for this purpose occurs if
a third party or a group acting in concert obtains control over
Infineon Technologies AG.
124
The subordinated convertible notes issued by our company as
guarantor through its subsidiary Infineon Technologies Holding
B.V. in June 2003 with a nominal value of 700 million
due in 2010 and the subordinated convertible notes issued by our
company as guarantor through its subsidiary Infineon
Technologies Investment B.V. in September 2007 with a
nominal value of 215 million due in 2010 (for further
information see note 23 to our consolidated financial
statements), each contain a change of control clause, which
grants the note holders an early redemption option in the event
of a change of control (as defined). A corporate reorganization
resulting in a substitution of the guarantor will not constitute
as change of control for such purpose.
In addition, some of the
cross-license
agreements and development agreements of our company contain
change of control clauses pursuant to which the counterparty is
entitled to terminate the agreement which require the other
partys approval of the change of control.
Our company is subject to the reporting requirements of the
U.S. Securities Exchange Act of 1934, as amended. In
accordance with these requirements, we file reports and other
information with the U.S. Securities and Exchange
Commission. These materials, including this annual report and
the exhibits thereto, may be inspected and copied at the
SECs Public Reference Room at 100 F Street,
N.E., Washington, DC 20549, and at the SECs regional
offices in Chicago, Illinois and New York, NY. The public may
obtain information on the operation of the SECs Public
Reference Room by calling the SEC in the United States at
1-800-SEC-0330.
The SEC also maintains a web site at
http://www.sec.gov
that contains reports and other information regarding
registrants. Material filed by us with the SEC can also be
inspected at the offices of the New York Stock Exchange at
20 Broad Street, New York, New York 10005 and at the
offices of Deutsche Bank as depositary for our ordinary shares,
at 60 Wall Street, New York, NY 10005.
Disclosure
Controls and Procedures
Our management, with the participation of our chief executive
officer and chief financial officer, evaluated the effectiveness
of our companys disclosure controls and procedures (as
defined in
Rules 13a-15(e)
and
15d-15(e)
under the Exchange Act) as of September 30, 2007. Based on
this evaluation, our chief executive officer and chief financial
officer concluded that, as of September 30, 2007, our
companys disclosure controls and procedures were
(1) designed to ensure that material information relating
to Infineon, including its consolidated subsidiaries, is made
known to our chief executive officer and chief financial officer
by others within those entities, particularly during the period
in which this report was being prepared, and (2) effective,
in that they provide reasonable assurance that information
required to be disclosed by Infineon in the reports that it
files or submits under the Exchange Act is recorded, processed,
summarized and reported within the time periods specified in the
SECs rules and forms.
Managements
Annual Report on Internal Control over Financial
Reporting
Our management is also responsible for establishing and
maintaining adequate internal control over financial reporting.
Internal control over financial reporting is defined in
Rule 13a-15(f)
or 15d-15(f)
promulgated under the Exchange Act as a process designed by, or
under the supervision of, our chief executive and chief
financial officers and effected by our board, management and
other personnel, to provide reasonable assurance regarding the
reliability of financial reporting and the preparation of
financial statements for external purposes in accordance with
U.S. generally accepted accounting principles, and includes
those policies and procedures that:
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pertain to the maintenance of records that in reasonable detail
accurately and fairly reflect the transactions and dispositions
of the assets of our company;
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125
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provide reasonable assurance that transactions are recorded as
necessary to permit preparation of financial statements in
accordance with generally accepted accounting principles, and
that receipts and expenditures of our company are being made
only in accordance with authorizations of management and board
of our company; and
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provide reasonable assurance regarding prevention or timely
detection of unauthorized acquisition, use or disposition of our
companys assets that could have a material effect on our
financial statements.
|
Our management assessed the effectiveness of our internal
control over financial reporting as of September 30, 2007.
In making this assessment, our management used the criteria set
forth by the Committee of Sponsoring Organizations of the
Treadway Commission (COSO) in the Internal Control Integrated
Framework. Based on our assessment, management concluded that,
as of September 30, 2007, our internal control over
financial reporting is effective based on those criteria.
Our independent registered public accounting firm has issued an
attestation report on our managements assessment of our
companys internal control over financial reporting. This
report appears on page F-2 of this Annual Report on Form 20-F.
Changes in
Internal Controls Over Financial Reporting
No change in our internal control over financial reporting
occurred during the fiscal year ended September 30, 2007
that has materially affected, or is reasonably likely to
materially affect, our internal control over financial reporting.
Limitations
There are inherent limitations to the effectiveness of any
system of disclosure and internal controls, including the
possibilities of faulty judgments in decision-making, simple
error or mistake, fraud, the circumvention of controls by
individual acts or the collusion of two or more people, or
management override of controls. Accordingly, even an effective
disclosure and internal control system can provide only
reasonable assurance with respect to disclosures and financial
statement preparation. Furthermore, because of changes in
conditions, the effectiveness of a disclosure and internal
control system may vary over time.
Audit
Committee Financial Expert
Our Supervisory Board has determined that Mr. Kley is an
audit committee financial expert, as such term is
defined by the regulations of the Securities and Exchange
Commission issued pursuant to Section 407 of the
Sarbanes-Oxley Act of 2002, and is independent, as
such term is defined in
Rule 10A-3
under the Exchange Act.
We have adopted a code of ethics (as a part of our
Business Conduct Guidelines) that applies to all of
our employees worldwide, including our principal executive
officer, principal financial officer and principal accounting
officer within the meaning of Item 16B of
Form 20-F.
These guidelines provide rules and conduct guidelines aimed at
ensuring high ethical standards throughout our organization. You
may obtain a copy of our code of ethics, at no cost, by writing
to us at Infineon Technologies AG, Am Campeon 1-12, D-85579
Neubiberg, Germany, Attention: Legal Department.
Principal
Accountant Fees and Services
Audit Fees. KPMG, our independent auditors,
charged us an aggregate of 7.3 million in the 2006
fiscal year and 5.9 million in the 2007 fiscal year
in connection with professional services rendered for the
126
audit of our annual consolidated financial statements and of
internal control over financial reporting and services normally
provided by them in connection with statutory and regulatory
filings or other compliance engagements. These services
consisted of quarterly review engagements and the annual audit.
Audit-Related Fees. In addition to the amounts
described above, KPMG charged us an aggregate of
1.0 million in the 2006 fiscal year and
0.6 million in the 2007 fiscal year for assurance and
related services in connection with the performance of the audit
of our annual consolidated financial statements. These services
consisted of transaction and accounting advisory services, IT
system audits, professional services in connection with the
filing of Qimondas registration statement, and services
related to the transition to IFRS.
Tax Fees. In addition to the amounts described
above, KPMG charged us an aggregate of 0.1 million in
the 2006 fiscal year and less than 0.1 million in the
2007 fiscal year for professional services related primarily to
tax compliance.
All Other Fees. Fees of less than
0.1 million were charged by KPMG in 2006 fiscal year
and 0.1 million in 2007 fiscal year for other services.
The above services fall within the scope of audit and permitted
non-audit services within the meaning of section 201 of the
Sarbanes-Oxley Act of 2002. Our Investment, Finance and Audit
Committee has pre-approved KPMGs performance of these
audit and permitted non-audit services and set limits on the
types of services and the maximum cost of these services in any
fiscal year. KPMG reports to our Investment, Finance and Audit
Committee on a quarterly basis on the type and extent of
non-audit services provided during the period and compliance
with these criteria.
Exemptions
from the Listing Standards for Audit Committees
As permitted by the rules of the Securities and Exchange
Commission, our audit committee includes one member who is a
non-executive employee of our company and who is named to our
Supervisory Board pursuant to the German law on employee
co-determination.
This section provides a summary of material contracts not in the
ordinary course of business to which we are a party and that
have been entered into during the two immediately preceding
fiscal years. The agreements described below, or English
translations thereof, where applicable, have been filed as
exhibits to this Annual Report on
Form 20-F.
Our Annual Reports on
Form 20-F
for the 2000 to 2006 fiscal years contain summaries of
additional material contracts entered into prior to
October 1, 2006, some of which may still be in effect.
Commercial
Agreements
The descriptions of our joint venture and strategic alliance
agreements set out under the headings
Business Manufacturing Manufacturing
joint ventures and partnerships and
Business Strategic Alliances and at
note 17 to our consolidated financial statements for the
year ended September 30, 2007 are incorporated herein by
reference.
Related Party
Transactions
In addition, please see Related-Party Transactions and
Relationships for a summary of contracts with certain of our
related parties.
127
|
|
|
200-millimeter manufacturing,
300-millimeter
manufacturing |
|
The size refers to the diameter of the wafers being processed in
a front-end fab. |
|
75-nanometer technology,
80-nanometer
technology |
|
The size refers to the feature size of the manufacturing process
used in a front-end fab. |
|
A-GPS |
|
Assisted Global Positioning System. GPS uses a network of
satellites to triangulate a receivers position and provide
latitude and longitude coordinates. Assisted GPS, or A-GPS, is a
technology that uses an assistance server to cut down the time
needed to find the location. |
|
ADSL |
|
Asymmetric Digital Subscriber Line. A form of Digital Subscriber
Line (see xDSL) in which the bandwidth available for
downloading data is significantly larger than for uploading
data. This technology is well suited for web browsing and client
server applications as well as for emerging applications such as
video on demand. |
|
AMB |
|
Advanced Memory Buffer. This is a dedicated logic chip used on
FB-DIMMs (see FB-DIMM). The AMB operates as the
interface between the system bus and the memory chips. |
|
analog |
|
A continuous representation of phenomena in terms of points
along a scale, each point merging imperceptibly into the next.
Analog signals vary continuously over a range of values. Real
world phenomena, such as heat and pressure, are analog. See also
digital. |
|
ASIC |
|
Application Specific Integrated Circuit. A logic or mixed-signal
circuit designed for a specific use and for a specific customer. |
|
ASSP |
|
Application Specific Standard Product. A logic or mixed-signal
circuit designed for a specific application market, and sold to
more than one customer, and thus, standard. |
|
Back-end |
|
The packaging, assembly and testing stages of the semiconductor
manufacturing process, which take place after electronic
circuits are imprinted on silicon wafers in the front-end
process. |
|
Baseband IC |
|
The baseband IC is an essential part of a cell phone. It
includes a digital signal processor, a microcontroller, some
on-chip memory, interfaces to several external devices, and
mixed-signal functionality like coder/decoder for speaker and
microphone. |
|
Bit |
|
A unit of information; a computational quantity (binary pulse)
that can take one of two values, such as true and false or 0 and
1; also the smallest unit of storage sufficient to hold one bit. |
|
Broadband |
|
Any network technology that combines and sorts multiple,
independent network frequencies onto a single cable. Commonly
used to refer to high-bandwidth copper or fiber cables with a
bandwidth of 1 Mbit per second and above. |
|
Byte |
|
A unit of storage measurement equal to eight bits. |
|
Chip cards |
|
Cards that contain an IC. Frequently used for telephone cards,
debit cards, SIM cards, social cards, identification cards and
PayTV cards. |
128
|
|
|
CMOS |
|
Complementary Metal Oxide Substrate technology. A process
technology that uses complementary MOS transistors (NMOS and
PMOS) to make a chip that will consume relatively low power and
permit a high level of integration. |
|
CO |
|
Central Office. A common carrier switching office in which
users lines terminate. The nerve center of a telephone
system. |
|
Contactless chip card |
|
In contrast to contact-based chip cards, contactless chip cards
communicate with the card reader through induction technology.
Contactless cards require only close proximity to an antenna to
complete transaction. |
|
CODEC |
|
Coder/Decoder. Hardware used to code and decode digital signals. |
|
CPE |
|
Customer Premises Equipment. CPE is telephone or other service
provider equipment, that is located on the customers
premises (physical location) rather than on the providers
premises or in between. |
|
DDR SDRAM |
|
Double data rate Synchronous Dynamically RAM. It activates
output on both the rising and falling edge of the system clock
rather than on just the rising edge, potentially doubling
output. See also RAM and SDRAM. |
|
DDR2 800 |
|
A memory device with a DDR2 interface and clocked with a
400 MHz clock. |
|
DECT |
|
Digital Enhanced Cordless Telecommunications. A standard used
for pan-European digital cordless telephones. |
|
Digital |
|
The representation of data by a series of bits or discrete
values such as 0 and 1. See also analog. |
|
DIMM |
|
Dual In-line Memory Module. A memory module with contact rows on
both sides and more bandwidth than a SIMM (single in-line memory
module). |
|
Discrete semiconductors |
|
Semiconductor devices that involve only a single device like a
transistor or a diode. |
|
DLC |
|
Digital Loop Carriers. A technology that makes use of digital
techniques to bring a wide range of services to users via
twisted-pair copper phone lines. |
|
DRAM |
|
Dynamic Random Access Memory. The most common type of solid
state memory. Each bit of information is stored as an amount of
electrical charge in a storage cell consisting of a capacitor
and a transistor. The capacitor discharges gradually due to
leakage and the memory cell loses the information stored. To
preserve the information, the memory has to be refreshed
periodically and is therefore referred to as
dynamic. DRAM is a widespread memory technology
because of its high packing density and consequently low price. |
|
DSL |
|
See xDSL. |
|
DSLAM |
|
Digital Subscriber Line Access Multiplexers. A network device,
usually located in a telephone company central office, that
receives signals from multiple customers digital
subscriber line connections (see xDSL) and puts the
signals on a high-speed backbone line using multiplexing
technologies (see multiplexing). |
129
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|
|
DVB-C |
|
Digital Video Broadcasting Cable. |
|
DVB-H |
|
Digital Video Broadcasting Handheld. |
|
DVB-S |
|
Digital Video Broadcasting Satellite. |
|
DVB-T |
|
Digital Video Broadcasting Terrestrial. |
|
EDGE |
|
Enhanced Data rate for GSM Evolution. Also referred to as 2.75G,
where GSM is 2G, GPRS is 2.5G and UMTS is 3G. |
|
Embedded DRAM,
Embedded flash |
|
A process technology that combines DRAM or flash, respectively,
and logic functions on a single chip. |
|
Ethernet |
|
A protocol for high speed communications, principally used for
LAN networks. |
|
Fab |
|
A semiconductor fabrication facility, in which the front-end
manufacturing process takes place. (see also
Front-end.) |
|
FB-DIMM |
|
Fully Buffered Dual In-line Memory Module. A variant of standard
DDR2 memory designed for server applications where both large
amounts of memory and memory coordination and accuracy at high
speeds are essential. |
|
Flash memory |
|
A type of non-volatile memory that can be erased and
reprogrammed. See NAND. |
|
FlexRay |
|
FlexRay is a new automotive network communications protocol. It
is positioned above CAN (controller area network) and MOST
(media oriented systems transport) in terms of both performance
and price. |
|
Front-end |
|
The wafer processing stage of the semiconductor manufacturing
process, in which electronic circuits are imprinted onto raw
silicon wafers. This is followed by the packaging, assembly and
testing stages, which comprise the back-end process. |
|
Foundry |
|
A semiconductor manufacture that makes chips for third parties. |
|
GDDR3, GDDR5 |
|
Graphic Double Data Rate. Third or fifth generation,
respectively. See GraphicsRAM. |
|
Gigabit (Gbit) |
|
Approximately one billion bits; precisely 2 to the power of 30
bits. |
|
Gigabyte |
|
Approximately one billion bytes; precisely 2 to the power of 30
bytes. |
|
GPRS |
|
General Packet Radio Services. A packet based wireless
communication service that promises data rates from 56 up to
114 Kbps and continuous connection to the Internet for
mobile phone and computer users. GPRS is based on GSM
communication. |
|
GraphicsRAM |
|
High-performance
DRAM chip, especially designed for graphics applications like
3D graphics boards and game consoles. See GDDR3,
GDDR5. |
|
GSM |
|
Global System for Mobile communication. A digital mobile
telephone system that is the de facto wireless telephone
standard in Europe and widely used in other parts of the world.
GSM digitizes and compresses data, then sends it down a channel
with two other streams of user data, each in its own time slot.
It operates at either the 900 MHz or 1800 MHz
frequency band. |
130
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|
|
IC |
|
Integrated Circuit. A semiconductor device consisting of many
interconnected transistors and other components like resistors,
capacitors and diodes. |
|
ISDN |
|
Integrated Services Digital Network. A type of online connection
that speeds up data transmission by handling information in a
digital form. Traditional modem communications translate a
computers digital data into an analog wave form and send
the signal, which then must be converted back to an analog
signal. ISDN can be thought of as a direct digital connection. |
|
ISO |
|
International Standards Organization. The international
organization responsible for developing and maintaining
worldwide standards for manufacturing, environmental protection,
computers, data communications, and many other fields. |
|
ITU |
|
International Telecommunication Union. The ITU is an
international organization established to standardize and
regulate international radio and telecommunications. |
|
Mask |
|
A transparent glass or quartz plate covered with an array of
patterns used in the IC manufacturing process to create
circuitry patterns on a wafer. Each pattern consists of opaque
and transparent areas that define the size and shape of all
circuit and device elements. The mask is used to expose selected
areas, and defines the areas to be processed. Masks may use
emulsion, chrome, iron oxide, silicon or other material to
produce the opaque areas. |
|
Megabit (Mbit) |
|
Approximately one million bits; precisely 2 to the power of 20
bits. |
|
Megabyte (MB) |
|
Approximately one million bytes; precisely 2 to the power of
20 bytes. |
|
Memory |
|
Any device that can store data in machine-readable format. |
|
Microcontroller |
|
A microprocessor combined with memory and interfaces integrated
on a single circuit and intended to operate as an embedded
system. |
|
Micron ( μm) |
|
A metric unit of linear measure which equals one millionth of a
meter. A human hair is about 100 microns in diameter. There are
1000 microns in 1 millimeter. |
|
Micro DIMM |
|
Dual in-line memory module. A small-factor memory module
specifically used in notebooks. |
|
Mixed-signal IC |
|
An integrated circuit that includes both analog and digital
signal processing circuitry on a single semiconductor die.
Typically, mixed-signal chips perform some whole function of
sub-function in a larger assembly such as the radio subsystem of
a cell phone. They often contain an entire
system-on-a-chip. |
|
NAND |
|
NAND flash architecture is one of two flash technologies (the
other being NOR) used in memory cards. It is also used in USB
flash drives, MP3 players, and provides the image storage for
digital cameras. NAND is best suited to flash devices requiring
high capacity data storage. |
|
Nanometer (nm) |
|
A metric unit of linear measure which equals one billionth of a
meter. There are 1000 nanometers in 1 micron. |
131
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|
|
Non-volatile memory |
|
A memory storage device whose contents are preserved when its
power is off. See also volatile memory. |
|
ODM |
|
Original Device Manufacturer. A company which manufactures a
product which ultimately will be branded by another firm for
sale. |
|
OHSAS |
|
Occupational Health and Safety Assessment Series. The discipline
concerned with protecting the safety, health and welfare of
employees, organizations, and others affected by the work they
undertake (such as customers, suppliers, and members of the
public). |
|
PBX |
|
Private Branch eXchange. A telephone exchange that is owned by a
private business, as opposed to one owned by a common carrier or
by a telephone company. |
|
PDA |
|
Personal Digital Assistant. A term used to refer to any small
mobile hand-held device that provides computing and information
storage and retrieval capabilities for personal or business use,
often for keeping schedule calendars and address book
information handy. |
|
PFC |
|
Perfluorinated Compounds. Compounds derived from hydrocarbons by
replacement of hydrogen atoms by fluorine atoms. |
|
PHY |
|
Physical Layer. A part of the electrical or mechanical interface
to the physical medium. For example, the PHY determines how to
put a stream of bits from the upper (data link) layer on to the
pins for a parallel printer interface or network line card. |
|
POF |
|
Polymer Optical Fiber. |
|
RAM |
|
Random access memory. A type of data storage device for which
the order of access to different locations does not affect the
speed of access. This is in contrast to, for example, a magnetic
disk or magnetic tape where it is much quicker to access data
sequentially because accessing a non sequential location
requires physical movement of the storage medium rather than
electronic switching. |
|
REACH |
|
Registration, Evaluation and Authorization of Chemicals. A
framework for regulation of chemicals in the European Union. |
|
RF transceiver |
|
Radio-frequency transceiver. A high-frequency used in mobile
telecommunications. The term radio frequency refers to
electromagnetic waves having characteristics such that, if the
current is input to an antenna, an electromagnetic field is
generated suitable for wireless broadcasting and/or
communications. |
|
RFID |
|
Radio frequency identification. Systems that read or write data
to RF tags that are present in a radio frequency field projected
from RF reading/writing equipment. Data may be contained in one
or more bits for the purpose of providing identification and
other information relevant to the object to which the tag is
attached. It incorporates the use of electromagnetic, or
electrostatic coupling in the radio frequency portion of the
spectrum to communicate to or from a tag through a variety of
modulation schemes. |
|
SDRAM |
|
Synchronous DRAM. The most common type of DRAM memory today.
Data are transferred synchronously to a clock signal. See also
DRAM. |
132
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|
|
Semiconductor |
|
Generic name for devices, such as transistors and integrated
circuits, that control the flow of electrical signals. More
generally a material, typically crystalline, that can be altered
to allow electrical current to flow or not flow in a pattern.
The most common semiconductor material for use in integrated
circuits is silicon. |
|
Server |
|
A computer that provides some service for other computers
connected to it via a network. The most common example is a file
server which has a local disk and services requests from remote
clients to read and write files on that disk. |
|
Silicon |
|
A type of semiconducting material used to make a wafer. Silicon
is the most widely used semiconductor material in the
semiconductor industry (other than Germanium) as a base material. |
|
SIM card |
|
Subscriber identification module card. Used in mobile handsets
for subscriber authentication. |
|
SLIC |
|
Subscriber line interface circuit. A circuit in a telephone
company switch to which a customers telephone line is
connected. |
|
SMARTi 3GE |
|
Infineons product name for a CMOS RF transceiver with
worldwide compatibility. |
|
SO-DIMM |
|
Small-Outline Dual In-line Memory Module. |
|
SoC |
|
System-on-a-chip.
The packaging of all the necessary electronic circuit and parts
for a system (such as a cell phone or digital
camera) on a single IC. |
|
SRAM |
|
Static RAM. A type of memory that is more expensive and much
faster than DRAM but has much lower power consumption than DRAM.
SRAM are used in cell phones because of low power consumption
and in PCs as a fast first-level memory buffer. |
|
Structure size |
|
A measurement (generally in micron or nanometer) of the width of
the smallest patterned feature on a semiconductor chip. |
|
T/E |
|
T1/E1, T3/E3. A data transmission technology based on copper
wires. Various speed classes are available: T1: 1,544 Mbit/s;
E1: 2,048 Mbit/s; T3: 44,736 Mbit/s; E3: 34,368 Mbit/s. The T
standards are prevalent in NAFTA. The E standards are European
standards. |
|
T-DMB |
|
Terrestrial Digital Multimedia Broadcasting. A system for
broadcasting a variety of digital content to mobile devices,
such as cellular phones. |
|
Telematics |
|
The combination of telecommunications and data processing. |
|
UMTS |
|
Universal Mobile Telecommunications Service. A so-called
third-generation (3G), broadband, packet based
transmission of text, digitized voice, video, and multimedia at
data rates up to two megabits per second (Mbps), that is based
on the GSM communication standard. UMTS aims to offer a
consistent set of services to mobile computer and phone users no
matter where they are located in the world. |
|
VDSL |
|
Very high bit-rate Digital Subscriber Line. A form of digital
subscriber line similar to ADSL but providing higher speeds at
reduced distances. See also xDSL. |
133
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|
|
VoIP |
|
Voice Over Internet Protocol. The routing of voice conversations
over the Internet or any other
IP-based
network. |
|
Volatile memory |
|
A memory storage device whose contents are not preserved when
its power is off. Most common types are DRAM and SRAM. See also
non-volatile memory. |
|
Wafer |
|
A disk made of a semiconducting material such as silicon,
currently usually either
150-millimeters
or
200-millimeters
or
300-millimeters
in diameter, used to form the substrate of a chip. A finished
wafer may contain several thousand chips. |
|
WDCT |
|
Worldwide Digital Cordless Telecommunications. |
|
WLAN |
|
Wireless LAN. A wireless data communications network covering a
small area, usually within the confines of a building or floors
within a building. |
|
xDSL |
|
Digital Subscriber Line (where x represents the type
of technology, e.g. ADSL, VDSL, SHDSL). A family of digital
telecommunications protocols designed to allow high speed data
communication over existing copper telephone lines between
end-users and the telephone company. See also VDSL. |
|
Yield |
|
When used in connection with manufacturing, the ratio of the
number of usable products to the total number of produced
products. |
134
INFINEON
TECHNOLOGIES AG AND SUBSIDIARIES
INDEX TO CONSOLIDATED FINANCIAL STATEMENTS
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Page
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F-2
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F-4
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F-5
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F-6
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F-7
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F-8
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F-1
REPORT
OF INDEPENDENT REGISTERED PUBLIC
ACCOUNTING FIRM
The Supervisory Board
Infineon Technologies AG:
We have audited the accompanying consolidated balance sheets of
Infineon Technologies AG and subsidiaries (the
Company) as of September 30, 2006 and 2007, and
the related consolidated statements of operations,
shareholders equity, and cash flows for each of the years
in the three-year period ended September 30, 2007. We also
have audited managements assessment, included in the
accompanying Item 15: Controls and Procedures
Managements Annual Report on Internal Control over
Financial Reporting, that Infineon Technologies AG and
subsidiaries maintained effective internal control over
financial reporting as of September 30, 2007, based on
criteria established in Internal Control
Integrated Framework issued by the Committee of Sponsoring
Organizations of the Treadway Commission (COSO). The
Companys management is responsible for these consolidated
financial statements, for maintaining effective internal control
over financial reporting, and for its assessment of the
effectiveness of internal control over financial reporting. Our
responsibility is to express an opinion on these consolidated
financial statements, an opinion on managements
assessment, and an opinion on the effectiveness of the
Companys internal control over financial reporting based
on our audits.
We conducted our audits in accordance with the standards of the
Public Company Accounting Oversight Board (United States). Those
standards require that we plan and perform the audits to obtain
reasonable assurance about whether the financial statements are
free of material misstatement and whether effective internal
control over financial reporting was maintained in all material
respects. Our audits of the consolidated financial statements
included examining, on a test basis, evidence supporting the
amounts and disclosures in the consolidated financial
statements, assessing the accounting principles used and
significant estimates made by management, and evaluating the
overall financial statement presentation. Our audit of internal
control over financial reporting included obtaining an
understanding of internal control over financial reporting,
evaluating managements assessment, testing and evaluating
the design and operating effectiveness of internal control, and
performing such other procedures as we considered necessary in
the circumstances. We believe that our audits provide a
reasonable basis for our opinions.
A companys internal control over financial reporting is a
process designed to provide reasonable assurance regarding the
reliability of financial reporting and the preparation of
financial statements for external purposes in accordance with
U.S. generally accepted accounting principles. A
companys internal control over financial reporting
includes those policies and procedures that (1) pertain to
the maintenance of records that, in reasonable detail,
accurately and fairly reflect the transactions and dispositions
of the assets of the company; (2) provide reasonable
assurance that transactions are recorded as necessary to permit
preparation of financial statements in accordance with
U.S. generally accepted accounting principles, and that
receipts and expenditures of the company are being made only in
accordance with authorizations of management and directors of
the company; and (3) provide reasonable assurance regarding
prevention or timely detection of unauthorized acquisition, use,
or disposition of the companys assets that could have a
material effect on the financial statements. Because of its
inherent limitations, internal control over financial reporting
may not prevent or detect misstatements. Also, projections of
any evaluation of effectiveness to future periods are subject to
the risk that controls may become inadequate because of changes
in conditions, or that the degree of compliance with the
policies or procedures may deteriorate.
In our opinion, the consolidated financial statements referred
to above present fairly, in all material respects, the financial
position of Infineon Technologies AG and subsidiaries as of
September 30, 2006 and 2007, and the results of their
operations and their cash flows for each of the years in the
three-year period ended September 30, 2007, in conformity
with U.S. generally accepted accounting principles. Also,
in our opinion, managements assessment that Infineon
Technologies AG and subsidiaries maintained
F-2
effective internal control over financial reporting as of
September 30, 2007, is fairly stated, in all material
respects, based on criteria established in Internal
Control Integrated Framework issued by COSO.
Furthermore, in our opinion, Infineon Technologies AG and
subsidiaries maintained, in all material respects, effective
internal control over financial reporting as of
September 30, 2007, based on criteria established in
Internal Control Integrated Framework issued
by COSO.
As discussed in Note 2 to the consolidated financial
statements, the Company adopted the recognition provision of
Statement of Financial Accounting Standards No. 158,
Employers Accounting for Defined Benefit Pension
and Other Postretirement Plans an amendment of FASB
Statements No. 87, 88, 106, and 132(R), effective
September 30, 2007.
Munich, Germany
November 13, 2007, except as to note 37,
which is as of November 30, 2007
KPMG Deutsche
Treuhand-Gesellschaft
Aktiengesellschaft
Wirtschaftsprüfungsgesellschaft
F-3
Infineon
Technologies AG and Subsidiaries
Consolidated Statements of Operations
For the years ended September 30, 2005, 2006 and 2007
(in millions, except for share data)
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Notes
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2005
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2006
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2007
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2007
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|
|
|
|
|
|
|
|
( millions)
|
|
|
( millions)
|
|
|
( millions)
|
|
|
($ millions)
|
|
|
Net sales:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Third parties
|
|
|
|
|
|
|
5,843
|
|
|
|
7,546
|
|
|
|
7,625
|
|
|
|
10,842
|
|
Related parties
|
|
|
31
|
|
|
|
916
|
|
|
|
383
|
|
|
|
57
|
|
|
|
81
|
|
|
|
Total net sales
|
|
|
|
|
|
|
6,759
|
|
|
|
7,929
|
|
|
|
7,682
|
|
|
|
10,923
|
|
|
|
Cost of goods sold
|
|
|
8
|
|
|
|
4,909
|
|
|
|
5,854
|
|
|
|
6,092
|
|
|
|
8,662
|
|
|
|
Gross profit
|
|
|
|
|
|
|
1,850
|
|
|
|
2,075
|
|
|
|
1,590
|
|
|
|
2,261
|
|
|
|
Research and development expenses
|
|
|
|
|
|
|
1,293
|
|
|
|
1,249
|
|
|
|
1,169
|
|
|
|
1,662
|
|
Selling, general and administrative expenses
|
|
|
|
|
|
|
655
|
|
|
|
751
|
|
|
|
700
|
|
|
|
995
|
|
Restructuring charges
|
|
|
9
|
|
|
|
78
|
|
|
|
23
|
|
|
|
45
|
|
|
|
64
|
|
Other operating expense, net
|
|
|
8
|
|
|
|
92
|
|
|
|
108
|
|
|
|
46
|
|
|
|
66
|
|
|
|
Operating loss
|
|
|
|
|
|
|
(268
|
)
|
|
|
(56
|
)
|
|
|
(370
|
)
|
|
|
(526
|
)
|
|
|
Interest expense, net
|
|
|
|
|
|
|
(9
|
)
|
|
|
(92
|
)
|
|
|
(33
|
)
|
|
|
(46
|
)
|
Equity in earnings of associated companies, net
|
|
|
17
|
|
|
|
57
|
|
|
|
78
|
|
|
|
117
|
|
|
|
166
|
|
Gain on subsidiaries and associated company share issuance, net
|
|
|
17
|
|
|
|
|
|
|
|
19
|
|
|
|
|
|
|
|
|
|
Other non-operating income (expense), net
|
|
|
|
|
|
|
26
|
|
|
|
(33
|
)
|
|
|
13
|
|
|
|
18
|
|
Minority interests
|
|
|
26
|
|
|
|
2
|
|
|
|
(23
|
)
|
|
|
19
|
|
|
|
27
|
|
|
|
Loss before income taxes
|
|
|
|
|
|
|
(192
|
)
|
|
|
(107
|
)
|
|
|
(254
|
)
|
|
|
(361
|
)
|
|
|
Income tax expense
|
|
|
10
|
|
|
|
(120
|
)
|
|
|
(161
|
)
|
|
|
(79
|
)
|
|
|
(112
|
)
|
|
|
Loss before extraordinary loss
|
|
|
|
|
|
|
(312
|
)
|
|
|
(268
|
)
|
|
|
(333
|
)
|
|
|
(473
|
)
|
|
|
Extraordinary loss, net of tax
|
|
|
4
|
|
|
|
|
|
|
|
|
|
|
|
(35
|
)
|
|
|
(50
|
)
|
|
|
Net loss
|
|
|
|
|
|
|
(312
|
)
|
|
|
(268
|
)
|
|
|
(368
|
)
|
|
|
(523
|
)
|
|
|
Basic and diluted loss per share before extraordinary loss
|
|
|
|
|
|
|
(0.42
|
)
|
|
|
(0.36
|
)
|
|
|
(0.45
|
)
|
|
|
(0.64
|
)
|
|
|
Basic and diluted loss per share
|
|
|
11
|
|
|
|
(0.42
|
)
|
|
|
(0.36
|
)
|
|
|
(0.49
|
)
|
|
|
(0.70
|
)
|
|
|
See accompanying notes to the consolidated financial statements.
F-4
Infineon
Technologies AG and Subsidiaries
Consolidated Balance Sheets
September 30, 2006 and 2007
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Notes
|
|
|
2006
|
|
|
2007
|
|
|
2007
|
|
|
|
|
|
|
|
|
( millions)
|
|
|
( millions)
|
|
|
($ millions)
|
|
|
Assets:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Current assets:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Cash and cash equivalents
|
|
|
|
|
|
|
2,040
|
|
|
|
1,819
|
|
|
|
2,586
|
|
Marketable securities
|
|
|
12
|
|
|
|
615
|
|
|
|
475
|
|
|
|
675
|
|
Trade accounts receivable, net
|
|
|
13
|
|
|
|
1,245
|
|
|
|
894
|
|
|
|
1,271
|
|
Inventories
|
|
|
14
|
|
|
|
1,202
|
|
|
|
1,217
|
|
|
|
1,731
|
|
Deferred income taxes
|
|
|
10
|
|
|
|
97
|
|
|
|
66
|
|
|
|
94
|
|
Other current assets
|
|
|
15
|
|
|
|
482
|
|
|
|
807
|
|
|
|
1,148
|
|
|
|
Total current assets
|
|
|
|
|
|
|
5,681
|
|
|
|
5,278
|
|
|
|
7,505
|
|
|
|
Property, plant and equipment, net
|
|
|
16
|
|
|
|
3,764
|
|
|
|
3,647
|
|
|
|
5,186
|
|
Intangible assets, net
|
|
|
19
|
|
|
|
230
|
|
|
|
232
|
|
|
|
330
|
|
Long-term investments
|
|
|
17
|
|
|
|
659
|
|
|
|
652
|
|
|
|
927
|
|
Restricted cash
|
|
|
|
|
|
|
78
|
|
|
|
77
|
|
|
|
109
|
|
Deferred income taxes
|
|
|
10
|
|
|
|
627
|
|
|
|
593
|
|
|
|
843
|
|
Pension assets
|
|
|
32
|
|
|
|
|
|
|
|
60
|
|
|
|
85
|
|
Other assets
|
|
|
18
|
|
|
|
146
|
|
|
|
140
|
|
|
|
199
|
|
|
|
Total assets
|
|
|
|
|
|
|
11,185
|
|
|
|
10,679
|
|
|
|
15,184
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Liabilities and shareholders equity:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Current liabilities:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Short-term debt and current maturities
|
|
|
23
|
|
|
|
797
|
|
|
|
336
|
|
|
|
478
|
|
Trade accounts payable
|
|
|
20
|
|
|
|
1,245
|
|
|
|
1,285
|
|
|
|
1,827
|
|
Accrued liabilities
|
|
|
21
|
|
|
|
525
|
|
|
|
526
|
|
|
|
748
|
|
Deferred income taxes
|
|
|
10
|
|
|
|
26
|
|
|
|
15
|
|
|
|
21
|
|
Short-term pension liabilities
|
|
|
32
|
|
|
|
|
|
|
|
5
|
|
|
|
7
|
|
Other current liabilities
|
|
|
22
|
|
|
|
712
|
|
|
|
680
|
|
|
|
967
|
|
|
|
Total current liabilities
|
|
|
|
|
|
|
3,305
|
|
|
|
2,847
|
|
|
|
4,048
|
|
|
|
Long-term debt
|
|
|
23
|
|
|
|
1,208
|
|
|
|
1,376
|
|
|
|
1,957
|
|
Pension liabilities
|
|
|
32
|
|
|
|
134
|
|
|
|
111
|
|
|
|
158
|
|
Deferred income taxes
|
|
|
10
|
|
|
|
60
|
|
|
|
46
|
|
|
|
65
|
|
Long-term accrued liabilities
|
|
|
24
|
|
|
|
46
|
|
|
|
36
|
|
|
|
51
|
|
Other liabilities
|
|
|
25
|
|
|
|
277
|
|
|
|
316
|
|
|
|
449
|
|
|
|
Total liabilities
|
|
|
|
|
|
|
5,030
|
|
|
|
4,732
|
|
|
|
6,728
|
|
|
|
Minority interests
|
|
|
26
|
|
|
|
840
|
|
|
|
1,033
|
|
|
|
1,469
|
|
|
|
Shareholders equity:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Ordinary share capital
|
|
|
27
|
|
|
|
1,495
|
|
|
|
1,499
|
|
|
|
2,131
|
|
Additional paid-in capital
|
|
|
|
|
|
|
5,828
|
|
|
|
5,864
|
|
|
|
8,338
|
|
Accumulated deficit
|
|
|
|
|
|
|
(1,780
|
)
|
|
|
(2,148
|
)
|
|
|
(3,054
|
)
|
Accumulated other comprehensive loss
|
|
|
29
|
|
|
|
(228
|
)
|
|
|
(301
|
)
|
|
|
(428
|
)
|
|
|
Total shareholders equity
|
|
|
|
|
|
|
5,315
|
|
|
|
4,914
|
|
|
|
6,987
|
|
|
|
Total liabilities and shareholders equity
|
|
|
|
|
|
|
11,185
|
|
|
|
10,679
|
|
|
|
15,184
|
|
|
|
See accompanying notes to the consolidated financial statements.
F-5
Infineon
Technologies AG and Subsidiaries
Consolidated Statements of Shareholders Equity
For the years ended September 30, 2005, 2006 and 2007
(in millions of Euro, except for share data)
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Additional
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
minimum
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
pension
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Foreign
|
|
|
liability/
|
|
|
Unrealized
|
|
|
Unrealized
|
|
|
|
|
|
|
|
|
|
Issued
|
|
|
Additional
|
|
|
|
|
|
currency
|
|
|
Defined
|
|
|
gain (loss)
|
|
|
gain (loss) on
|
|
|
|
|
|
|
|
|
|
Ordinary shares
|
|
|
paid-in
|
|
|
Accumulated
|
|
|
translation
|
|
|
benefit
|
|
|
on
|
|
|
cash flow
|
|
|
|
|
|
|
Notes
|
|
|
Shares
|
|
|
Amount
|
|
|
capital
|
|
|
deficit
|
|
|
adjustment
|
|
|
plans
|
|
|
securities
|
|
|
hedge
|
|
|
Total
|
|
|
|
|
|
|
Balance as of October 1, 2004
|
|
|
|
|
|
|
747,559,859
|
|
|
|
1,495
|
|
|
|
5,800
|
|
|
|
(1,200
|
)
|
|
|
(122
|
)
|
|
|
|
|
|
|
4
|
|
|
|
1
|
|
|
|
5,978
|
|
|
|
Net loss
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
(312
|
)
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
(312
|
)
|
Other comprehensive income (loss)
|
|
|
29
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
64
|
|
|
|
(84
|
)
|
|
|
8
|
|
|
|
(25
|
)
|
|
|
(37
|
)
|
|
|
Total comprehensive loss
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
(349
|
)
|
|
|
Issuance of ordinary shares:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Exercise of stock options
|
|
|
27
|
|
|
|
9,500
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Balance as of September 30, 2005
|
|
|
|
|
|
|
747,569,359
|
|
|
|
1,495
|
|
|
|
5,800
|
|
|
|
(1,512
|
)
|
|
|
(58
|
)
|
|
|
(84
|
)
|
|
|
12
|
|
|
|
(24
|
)
|
|
|
5,629
|
|
|
|
Net loss
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
(268
|
)
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
(268
|
)
|
Other comprehensive income (loss)
|
|
|
29
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
(69
|
)
|
|
|
(3
|
)
|
|
|
(7
|
)
|
|
|
5
|
|
|
|
(74
|
)
|
|
|
Total comprehensive loss
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
(342
|
)
|
|
|
Issuance of ordinary shares:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Exercise of stock options
|
|
|
27
|
|
|
|
39,935
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Stock-based compensation
|
|
|
28
|
|
|
|
|
|
|
|
|
|
|
|
28
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
28
|
|
|
|
Balance as of September 30, 2006
|
|
|
|
|
|
|
747,609,294
|
|
|
|
1,495
|
|
|
|
5,828
|
|
|
|
(1,780
|
)
|
|
|
(127
|
)
|
|
|
(87
|
)
|
|
|
5
|
|
|
|
(19
|
)
|
|
|
5,315
|
|
|
|
Net loss
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
(368
|
)
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
(368
|
)
|
Other comprehensive (loss) income
|
|
|
29
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
(105
|
)
|
|
|
90
|
|
|
|
(12
|
)
|
|
|
2
|
|
|
|
(25
|
)
|
|
|
Total comprehensive loss
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
(393
|
)
|
|
|
Issuance of ordinary shares:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Exercise of stock options
|
|
|
27
|
|
|
|
2,119,341
|
|
|
|
4
|
|
|
|
15
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
19
|
|
Stock-based compensation
|
|
|
28
|
|
|
|
|
|
|
|
|
|
|
|
17
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
17
|
|
Deferred compensation, net
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
4
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
4
|
|
Adjustment to initially apply SFAS No. 158, net of tax
|
|
|
32
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
(48
|
)
|
|
|
|
|
|
|
|
|
|
|
(48
|
)
|
|
|
Balance as of September 30, 2007
|
|
|
|
|
|
|
749,728,635
|
|
|
|
1,499
|
|
|
|
5,864
|
|
|
|
(2,148
|
)
|
|
|
(232
|
)
|
|
|
(45
|
)
|
|
|
(7
|
)
|
|
|
(17
|
)
|
|
|
4,914
|
|
|
|
See accompanying notes to the consolidated financial statements.
F-6
Infineon
Technologies AG and Subsidiaries
Consolidated Statements of Cash Flows
For the years ended September 30, 2005, 2006 and
2007
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
2005
|
|
|
2006
|
|
|
2007
|
|
|
2007
|
|
|
|
|
|
( millions)
|
|
|
( millions)
|
|
|
( millions)
|
|
|
($ millions)
|
|
|
Net loss
|
|
|
(312
|
)
|
|
|
(268
|
)
|
|
|
(368
|
)
|
|
|
(523
|
)
|
Adjustments to reconcile net loss to cash provided by operating
activities:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Depreciation and amortization
|
|
|
1,316
|
|
|
|
1,405
|
|
|
|
1,276
|
|
|
|
1,814
|
|
Provision for (recovery of) doubtful accounts
|
|
|
3
|
|
|
|
23
|
|
|
|
(19
|
)
|
|
|
(27
|
)
|
Gains on sales of marketable securities
|
|
|
(8
|
)
|
|
|
(3
|
)
|
|
|
(8
|
)
|
|
|
(11
|
)
|
Losses (gains) on sales of businesses and interests in
subsidiaries
|
|
|
(39
|
)
|
|
|
10
|
|
|
|
63
|
|
|
|
90
|
|
Gains on disposals of property, plant, and equipment
|
|
|
(8
|
)
|
|
|
(9
|
)
|
|
|
(13
|
)
|
|
|
(18
|
)
|
Equity in earnings of associated companies, net
|
|
|
(57
|
)
|
|
|
(78
|
)
|
|
|
(117
|
)
|
|
|
(166
|
)
|
Dividends received from associated companies
|
|
|
51
|
|
|
|
29
|
|
|
|
61
|
|
|
|
87
|
|
Gain on subsidiaries and associated company share issuance, net
|
|
|
|
|
|
|
(19
|
)
|
|
|
|
|
|
|
|
|
Minority interests
|
|
|
(2
|
)
|
|
|
23
|
|
|
|
(19
|
)
|
|
|
(27
|
)
|
Impairment charges
|
|
|
134
|
|
|
|
57
|
|
|
|
40
|
|
|
|
57
|
|
Stock-based compensation
|
|
|
|
|
|
|
28
|
|
|
|
17
|
|
|
|
24
|
|
Deferred income taxes
|
|
|
88
|
|
|
|
(6
|
)
|
|
|
58
|
|
|
|
82
|
|
Changes in operating assets and liabilities:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Trade accounts receivable, net
|
|
|
119
|
|
|
|
(334
|
)
|
|
|
331
|
|
|
|
471
|
|
Inventories
|
|
|
(25
|
)
|
|
|
(145
|
)
|
|
|
(76
|
)
|
|
|
(108
|
)
|
Other current assets
|
|
|
(2
|
)
|
|
|
31
|
|
|
|
55
|
|
|
|
78
|
|
Trade accounts payable
|
|
|
(52
|
)
|
|
|
222
|
|
|
|
29
|
|
|
|
41
|
|
Accrued liabilities
|
|
|
(115
|
)
|
|
|
85
|
|
|
|
4
|
|
|
|
6
|
|
Other current liabilities
|
|
|
1
|
|
|
|
52
|
|
|
|
(109
|
)
|
|
|
(157
|
)
|
Other assets and liabilities
|
|
|
(2
|
)
|
|
|
(100
|
)
|
|
|
2
|
|
|
|
3
|
|
|
|
Net cash provided by operating activities
|
|
|
1,090
|
|
|
|
1,003
|
|
|
|
1,207
|
|
|
|
1,716
|
|
|
|
Cash flows from investing activities:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Purchases of marketable securities available for sale
|
|
|
(2,228
|
)
|
|
|
(492
|
)
|
|
|
(224
|
)
|
|
|
(319
|
)
|
Proceeds from sales of marketable securities available for sale
|
|
|
3,310
|
|
|
|
730
|
|
|
|
357
|
|
|
|
508
|
|
Proceeds from sales of businesses and interests in subsidiaries
|
|
|
101
|
|
|
|
72
|
|
|
|
273
|
|
|
|
388
|
|
Business acquisitions, net of cash acquired
|
|
|
|
|
|
|
|
|
|
|
(45
|
)
|
|
|
(64
|
)
|
Investment in associated and related companies
|
|
|
(135
|
)
|
|
|
(6
|
)
|
|
|
(2
|
)
|
|
|
(3
|
)
|
Cash increase from initial consolidation of ALTIS
|
|
|
|
|
|
|
119
|
|
|
|
|
|
|
|
|
|
Purchases of intangible assets
|
|
|
(27
|
)
|
|
|
(44
|
)
|
|
|
(39
|
)
|
|
|
(55
|
)
|
Purchases of property, plant and equipment
|
|
|
(1,368
|
)
|
|
|
(1,253
|
)
|
|
|
(1,375
|
)
|
|
|
(1,955
|
)
|
Proceeds from sales of property, plant and equipment
|
|
|
58
|
|
|
|
21
|
|
|
|
188
|
|
|
|
267
|
|
|
|
Net cash used in investing activities
|
|
|
(289
|
)
|
|
|
(853
|
)
|
|
|
(867
|
)
|
|
|
(1,233
|
)
|
|
|
Cash flows from financing activities:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Net change in short-term debt
|
|
|
(20
|
)
|
|
|
|
|
|
|
30
|
|
|
|
43
|
|
Net change in related party financial receivables and payables
|
|
|
18
|
|
|
|
7
|
|
|
|
(3
|
)
|
|
|
(4
|
)
|
Proceeds from issuance of long-term debt
|
|
|
192
|
|
|
|
400
|
|
|
|
245
|
|
|
|
348
|
|
Principal repayments of long-term debt
|
|
|
(500
|
)
|
|
|
(56
|
)
|
|
|
(744
|
)
|
|
|
(1,058
|
)
|
Change in restricted cash
|
|
|
21
|
|
|
|
10
|
|
|
|
1
|
|
|
|
1
|
|
Proceeds from issuance of ordinary shares
|
|
|
|
|
|
|
|
|
|
|
23
|
|
|
|
33
|
|
Proceeds from issuance of shares to minority interest
|
|
|
23
|
|
|
|
|
|
|
|
4
|
|
|
|
6
|
|
Proceeds from issuance of shares of Qimonda
|
|
|
|
|
|
|
406
|
|
|
|
|
|
|
|
|
|
Dividend payments to minority interests
|
|
|
|
|
|
|
(5
|
)
|
|
|
(77
|
)
|
|
|
(110
|
)
|
|
|
Net cash (used in) provided by financing activities
|
|
|
(266
|
)
|
|
|
762
|
|
|
|
(521
|
)
|
|
|
(741
|
)
|
|
|
Effect of foreign exchange rate changes on cash and cash
equivalents
|
|
|
5
|
|
|
|
(20
|
)
|
|
|
(40
|
)
|
|
|
(57
|
)
|
Net increase (decrease) in cash and cash equivalents
|
|
|
540
|
|
|
|
892
|
|
|
|
(221
|
)
|
|
|
(315
|
)
|
Cash and cash equivalents at beginning of year
|
|
|
608
|
|
|
|
1,148
|
|
|
|
2,040
|
|
|
|
2,901
|
|
|
|
Cash and cash equivalents at end of year
|
|
|
1,148
|
|
|
|
2,040
|
|
|
|
1,819
|
|
|
|
2,586
|
|
|
|
See accompanying notes to the consolidated financial statements.
F-7
Infineon
Technologies AG and Subsidiaries
Notes to the Consolidated Financial Statements
|
|
1.
|
Description of
Business and Basis of Presentation
|
Description of
Business
Infineon Technologies AG and its subsidiaries (collectively, the
Company) design, develop, manufacture and market a
broad range of semiconductors and complete systems solutions
used in a wide variety of microelectronic applications,
including computer systems, telecommunications systems, consumer
goods, automotive products, industrial automation and control
systems, and chip card applications. The Companys products
include standard commodity components, full-custom devices,
semi-custom devices and application-specific components for
memory, analog, digital and mixed-signal applications. The
Company has operations, investments and customers located mainly
in Europe, Asia and North America. The fiscal year-end for the
Company is September 30.
Basis of
Presentation
The accompanying consolidated financial statements have been
prepared in accordance with accounting principles generally
accepted in the United States of America
(U.S. GAAP). Infineon Technologies AG is
incorporated in Germany. The German Commercial Code
(Handelsgesetzbuch or HGB)
requires the Company to prepare consolidated financial
statements in accordance with the HGB accounting principles and
regulations (German GAAP). Pursuant to the German
Commercial Code Implementation Act
(Einführungsgesetz zum HGB-EGHGB),
Article 58, paragraph 5, the Company is exempt from
this requirement, if consolidated financial statements are
prepared and issued in accordance with a body of internationally
accepted accounting principles (such as U.S. GAAP).
Accordingly, the Company presents the U.S. GAAP
consolidated financial statements contained herein.
All amounts herein are shown in Euro (or )
except where otherwise stated. The accompanying consolidated
balance sheet as of September 30, 2007, and the
consolidated statements of operations and cash flows for the
year then ended are also presented in U.S. dollars
($), solely for the convenience of the reader, at
the rate of 1 = $1.4219, the Federal Reserve noon buying
rate on September 28, 2007. The U.S. dollar
convenience translation amounts have not been audited.
Certain amounts in prior year consolidated financial statements
and notes have been reclassified to conform to the current year
presentation. Dividends received from Associated Companies (as
defined below), previously reported as part of cash flows from
investing activities in the consolidated statements of cash
flows, have been reclassified to cash flows from operating
activities. The Companys consolidated results of
operations and overall cash flows have not been affected by
these reclassifications.
|
|
2.
|
Summary of
Significant Accounting Policies
|
The following is a summary of significant accounting policies
followed in the preparation of the accompanying consolidated
financial statements.
Basis of
Consolidation
The accompanying consolidated financial statements include the
accounts of the Company and its significant subsidiaries that
are directly or indirectly controlled on a consolidated basis.
Control is generally conveyed by ownership of the majority of
voting rights. Additionally, the Company evaluates its
relationships with entities to identify whether they are
variable interest entities (VIEs), and to
assess whether it is the primary beneficiary of such entities.
If the determination is made that the Company is the primary
beneficiary, then that entity is included in the consolidated
financial statements. VIEs are entities for which either
the equity investment at risk is not sufficient to permit the
entity to finance its activities without additional subordinated
financial support, the investors lack an essential
characteristic of a controlling financial interest, or the
investors economic interests are disproportionate to the
attached voting rights
F-8
Infineon
Technologies AG and Subsidiaries
Notes to the Consolidated Financial Statements
and substantially all of the entitys activities involve or
are conducted for an investor with disproportionately few voting
rights.
Investments in companies in which the Company has the ability to
exercise significant influence over operating and financial
policies, generally through an ownership interest of
20 percent or more and that are not controlled by the
Company (Associated Companies) are accounted for
using the equity method of accounting (see note 17). The
equity in earnings of Associated Companies with fiscal year ends
that differ by not more than three months from the
Companys fiscal year end are recorded on a three month
lag. Other equity investments (Related Companies),
generally in which the Company has an ownership interest of less
than 20 percent, are recorded at cost. The effects of all
significant intercompany transactions are eliminated.
The Company group consists of the following numbers of entities:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Consolidated
|
|
|
Associated
|
|
|
|
|
|
|
subsidiaries
|
|
|
companies
|
|
|
Total
|
|
|
September 30, 2006
|
|
|
66
|
|
|
|
7
|
|
|
|
73
|
|
Additions
|
|
|
8
|
|
|
|
|
|
|
|
8
|
|
Disposals
|
|
|
(5
|
)
|
|
|
(2
|
)
|
|
|
(7
|
)
|
|
|
|
|
|
|
|
|
|
|
|
|
|
September 30, 2007
|
|
|
69
|
|
|
|
5
|
|
|
|
74
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Reporting and
Foreign Currency
The Companys reporting currency is the euro, and therefore
the accompanying consolidated financial statements are presented
in euro.
The assets and liabilities of foreign subsidiaries with
functional currencies other than the euro are translated using
period-end exchange rates, while the revenues and expenses of
such subsidiaries are translated using average exchange rates
during the period. Differences arising from the translation of
assets and liabilities in comparison with the translations
reported in the previous periods are included in other
comprehensive income (loss) and reported as a separate component
of shareholders equity.
The exchange rates of the primary currencies used in the
preparation of the accompanying consolidated financial
statements are as follows in Euro:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Exchange Rate
|
|
Annual average
|
|
|
|
|
|
September 29,
|
|
September 28,
|
|
exchange rate
|
|
Currency:
|
|
|
|
2006
|
|
2007
|
|
2006
|
|
2007
|
|
|
U.S. dollar
|
|
1$ =
|
|
|
0.7899
|
|
|
0.7052
|
|
|
0.8117
|
|
|
0.7497
|
|
Japanese yen
|
|
100 JPY =
|
|
|
0.6696
|
|
|
0.6124
|
|
|
0.6978
|
|
|
0.6297
|
|
Great Britain pound
|
|
1 GBP =
|
|
|
1.4756
|
|
|
1.4300
|
|
|
1.4595
|
|
|
1.4806
|
|
Singapore dollar
|
|
1 SGD =
|
|
|
0.4981
|
|
|
0.4728
|
|
|
0.5016
|
|
|
0.4904
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Revenue
Recognition
Sales
Revenue from products sold to customers is recognized, pursuant
to U.S. Securities and Exchange Commission
(SEC) Staff Accounting Bulletin (SAB)
104, Revenue Recognition, when persuasive
evidence of an arrangement exists, the price is fixed or
determinable, shipment is made and collectibility is reasonably
assured. The Company records reductions to revenue for estimated
product returns and allowances for discounts, volume rebates and
price protection, based on actual historical experience, at the
time the related revenue is recognized. In general, returns are
permitted only for quality-related
F-9
Infineon
Technologies AG and Subsidiaries
Notes to the Consolidated Financial Statements
reasons within the applicable warranty period. Distributors can,
in certain cases, apply for stock rotation or scrap allowances
and price protection. Allowances for stock rotation returns are
accrued based on expected stock rotation as per the contractual
agreement. Distributor scrap allowances are accrued based on the
contractual agreement and, upon authorization of the claim,
reimbursed up to a certain maximum of the average inventory
value. Price protection programs allow distributors to apply for
a price protection credit on unsold inventory in the event the
Company reduces the standard list price of the products included
in such inventory. In some cases, rebate programs are offered to
specific customers or distributors whereby the customer or
distributor may apply for a rebate upon achievement of a defined
sales volume. Distributors are also partially compensated for
commonly defined cooperative advertising on a
case-by-case
basis.
License
Income
License income is recognized when earned and realizable (see
note 6). Lump sum payments are generally non-refundable and
are deferred where applicable and recognized over the period in
which the Company is obliged to provide additional service.
Pursuant to Emerging Issues Task Force (EITF) Issue
No. 00-21,
Revenue Arrangements with Multiple
Deliverables, revenues from contracts with multiple
elements are recognized as each element is earned based on the
relative fair value of each element and when there are no
undelivered elements that are essential to the functionality of
the delivered elements and when the amount is not contingent
upon delivery of the undelivered elements. Royalties are
recognized as earned.
Grants
Grants for capital expenditures include both tax-free government
grants (Investitionszulage) and taxable grants for
investments in property, plant and equipment
(Investitionszuschüsse). Grants receivable are
established when a legal right for the grant exists and the
criteria for receiving the grant have been met. Tax-free
government grants are deferred and recognized over the remaining
useful life of the related asset. Taxable grants are deducted
from the acquisition costs of the related asset and thereby
reduce depreciation expense in future periods. Other taxable
grants reduce the related expense
(see notes 7, 22 and 25).
Product-related
Expenses
Shipping and handling costs associated with product sales are
included in cost of sales. Expenditures for advertising, sales
promotion and other sales-related activities are expensed as
incurred. Provisions for estimated costs related to product
warranties are generally made at the time the related sale is
recorded, based on estimated failure rates and claim history.
Research and development costs are expensed as incurred.
Income
Taxes
Income taxes are accounted for under the asset and liability
method pursuant to FASB Statement of Financial Accounting
Standards (SFAS) No. 109, Accounting
for Income Taxes. Deferred tax assets and liabilities
are recognized for the future tax consequences attributable to
differences between the financial statement carrying amounts of
existing assets and liabilities and their respective tax bases.
Valuation allowances are recorded to reduce deferred tax assets
to an amount that is more-likely-than-not to be realized in the
future. Deferred tax assets and liabilities are measured using
enacted tax rates expected to apply to taxable income in the
years in which those temporary differences are expected to be
recovered or settled. The effect on deferred tax assets and
liabilities of a change in tax rates is recognized in income in
the period that includes the enactment date. Investment tax
credits are accounted for under the flow-through method.
F-10
Infineon
Technologies AG and Subsidiaries
Notes to the Consolidated Financial Statements
Stock-based
Compensation
Prior to the adoption of SFAS No. 123 (revised
2004) Share-Based Payment, the Company
accounted for stock-based compensation using the intrinsic value
method pursuant to Accounting Principles Board (APB)
Opinion 25, Accounting for Stock Issued to
Employees, recognized compensation cost over the pro
rata vesting period, and adopted the disclosure-only provisions
of SFAS No. 123, Accounting for Stock-Based
Compensation as amended by SFAS No. 148
Accounting for Stock-Based Compensation
Transition and Disclosure, an Amendment of FASB Statement
No. 123.
Effective October 1, 2005, the Company adopted
SFAS No. 123 (revised 2004) under the modified
prospective application method. Under this application, the
Company records stock-based compensation expense for all awards
granted on or after the date of adoption and for the portion of
previously granted awards that remained unvested at the date of
adoption. Stock-based compensation cost is measured at the grant
date, based on the fair value of the award, and is recognized as
expense over the period during which the employee is required to
provide service in exchange for the award.
SFAS No. 123 (revised 2004) eliminates the
alternative method of accounting for employee share-based
payments previously available under APB No. 25. Periods
prior to October 1, 2005 have not been restated and do not
reflect the recognition of stock-based compensation (see
note 28).
Issuance of
shares by Subsidiaries or Associated Companies
Gains or losses arising from the issuances of shares by
subsidiaries or Associated Companies, due to changes in the
Companys proportionate share of the value of the
issuers equity, are recognized in earnings pursuant to
SAB Topic 5:H, Accounting for Sales of Stock by a
Subsidiary (see notes 3 and 17).
Cash and Cash
Equivalents
Cash and cash equivalents represent cash, deposits and liquid
short-term investments with original maturities of three months
or less. Cash equivalents as of September 30, 2006 and 2007
were 1,926 million and 1,653 million,
respectively, and consisted mainly of bank term deposits and
fixed income securities with original maturities of three months
or less.
Restricted
Cash
Restricted cash includes collateral deposits used as security
under arrangements for deferred compensation, business
acquisitions, construction projects, leases and financing (see
note 35).
Marketable
Securities and Investments
The Companys marketable securities are classified as
available-for-sale and are stated at fair value as determined by
the most recently traded price of each security at the balance
sheet date. Unrealized gains and losses are included in
accumulated other comprehensive income, net of applicable income
taxes. Realized gains or losses and declines in value, if any,
judged to be other-than-temporary on available-for-sale
securities are reported in other non-operating income or
expense. For the purpose of determining realized gains and
losses, the cost of securities sold is based on specific
identification.
The Company assesses declines in the value of marketable
securities and investments to determine whether such decline is
other-than-temporary, thereby rendering the marketable security
or investment impaired. This assessment is made by considering
available evidence including changes in general market
conditions, specific industry and investee data, the length of
time and the extent to which the fair value has been less than
cost, and the Companys intent and ability to hold the
marketable security or investment for a period of time
sufficient to allow for any anticipated recovery in fair value.
F-11
Infineon
Technologies AG and Subsidiaries
Notes to the Consolidated Financial Statements
Inventories
Inventories are valued at the lower of cost or market, cost
being generally determined on the basis of an average method.
Cost consists of purchased component costs and manufacturing
costs, which comprise direct material and labor costs and
applicable indirect costs.
Property,
Plant and Equipment
Property, plant and equipment are stated at cost less
accumulated depreciation. Spare parts, maintenance and repairs
are expensed as incurred. Depreciation expense is recognized
using the straight-line method. Construction in progress
includes advance payments for construction of fixed assets. Land
and construction in progress are not depreciated. The cost of
construction of certain long-term assets includes capitalized
interest, which is amortized over the estimated useful life of
the related asset. During the years ended September 30,
2006 and 2007 capitalized interest was less than
1 million. The estimated useful lives of assets are
as follows:
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Years
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Buildings
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10-25
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Technical equipment and machinery
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3-10
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Other plant and office equipment
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1-10
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Leases
The Company is a lessee of property, plant and equipment. All
leases where the Company is lessee that meet certain specified
criteria intended to represent situations where the substantive
risks and rewards of ownership have been transferred to the
lessee are accounted for as capital leases pursuant to
SFAS No. 13, Accounting for Leases,
and related interpretations. All other leases are accounted for
as operating leases.
Goodwill and
Other Intangible Assets
The Company accounts for business combinations using the
purchase method of accounting pursuant to
SFAS No. 141, Business
Combinations. Intangible assets acquired in a purchase
method business combination are recognized and reported apart
from goodwill, pursuant to the criteria specified by
SFAS No. 141.
Intangible assets consist primarily of purchased intangible
assets, such as licenses and purchased technology, which are
recorded at acquisition cost, and goodwill resulting from
business acquisitions, representing the excess of purchase price
over fair value of net assets acquired. Intangible assets other
than goodwill are amortized on a straight-line basis over the
estimated useful lives of the assets ranging from 3 to
10 years. Pursuant to SFAS No. 142,
Goodwill and Other Intangible Assets,
goodwill is not amortized, but instead tested for impairment at
least annually in accordance with the provisions of
SFAS No. 142. The Company tests goodwill annually for
impairment in the fourth quarter of the fiscal year, whereby if
the carrying amount of a reporting unit with goodwill exceeds
its fair value, the amount of impairment is determined as the
excess of recorded goodwill over the fair value of goodwill. The
determination of fair value of the reporting units and related
goodwill requires considerable judgment by management.
Impairment of
Long-lived Assets
The Company reviews long-lived assets, including property, plant
and equipment and intangible assets subject to amortization, for
impairment whenever events or changes in circumstances indicate
that the carrying amount of an asset may not be recoverable.
Recoverability of assets to be held and used is
F-12
Infineon
Technologies AG and Subsidiaries
Notes to the Consolidated Financial Statements
measured by a comparison of the carrying amount of an asset to
future net cash flows expected to be generated by the asset. If
such assets are considered to be impaired, the impairment to be
recognized is measured by the amount by which the carrying
amount of the assets exceeds the fair value of the assets.
Estimated fair value is generally based on either market value,
appraised value or discounted estimated future cash flows.
Considerable management judgment is necessary to estimate
discounted future cash flows.
Financial
Instruments
The Company operates internationally, giving rise to exposure to
changes in foreign currency exchange rates. The Company uses
financial instruments, including derivatives such as foreign
currency forward and option contracts as well as interest rate
swap agreements, to reduce this exposure based on the net
exposure to the respective currency. The Company applies
SFAS No. 133, Accounting for Derivative
Instruments and Hedging Activities, as amended, which
provides guidance on accounting for derivative instruments,
including certain derivative instruments embedded in other
contracts, and for hedging activities. Derivative financial
instruments are recorded at their fair value and included in
other current assets or other current liabilities. Generally the
Company does not designate its derivative instruments as hedge
transactions. Changes in fair value of undesignated derivatives
that relate to operations are recorded as part of cost of sales,
while undesignated derivatives relating to financing activities
are recorded in other non-operating expense, net. Changes in
fair value of derivatives designated as fair value hedges and
the related changes in the hedged item are reflected in
earnings. Changes in the fair value of derivatives designated as
cash flow hedges are, to the extent effective, deferred in
accumulated other comprehensive income and subsequently
reclassified to earnings when the hedging transaction is
reflected in earnings and, to the extent ineffective, included
in earnings immediately. The fair value of derivative and other
financial instruments is discussed in note 33.
Pension
Plans
The measurement of pension-benefit liabilities is based on
actuarial computations using the
projected-unit-credit
method in accordance with SFAS No. 87,
Employers Accounting for Pensions. The
assumptions used to calculate pension liabilities and costs are
shown in note 32. Prior to the adoption of the recognition
provision of SFAS No. 158, Employers
Accounting for Defined Benefit Pension and Other Postretirement
Plans an amendment of FASB Statements No. 87,
88, 106, and 132(R), changes in the amount of the
projected benefit obligation or plan assets resulting from
experience different from that assumed and from changes in
assumptions could result in gains or losses not yet recognized
in the Companys consolidated financial statements.
Amortization of an unrecognized net gain or loss is included as
a component of the Companys net periodic benefit plan cost
for a year if, as of the beginning of the year, that
unrecognized net gain or loss exceeds 10 percent of the
greater of the projected benefit obligation or the fair value of
that plans assets. In that case, the amount of
amortization recognized by the Company is the resulting excess
divided by the average remaining service period of the active
employees expected to receive benefits under the plan.
Effective September 30, 2007, the Company adopted the
recognition provision of SFAS No. 158, whereby the
Company recognizes the overfunded or underfunded status of its
defined benefit postretirement plans as an asset or liability in
its statement of financial position. Changes in funded status
will be recognized in the year in which the changes occur
through other comprehensive income. The incremental effects of
the adoption of the recognition provision on the individual line
items of the September 30, 2007 consolidated balance sheet
are shown in note 32. See also Recent Accounting
Pronouncements below.
The Company also records a liability for amounts payable under
the provisions of its various defined contribution plans.
F-13
Infineon
Technologies AG and Subsidiaries
Notes to the Consolidated Financial Statements
Use of
Estimates
The preparation of the accompanying consolidated financial
statements requires management to make estimates and assumptions
that affect the reported amounts of assets and liabilities and
disclosure of contingent amounts and liabilities at the date of
the financial statements and reported amounts of revenues and
expenses during the reporting period. Actual amounts could
differ materially from such estimates made by management.
Recent
Accounting Pronouncements
In May 2005, the FASB issued SFAS No. 154,
Accounting Changes and Error Corrections.
SFAS No. 154 replaces APB Opinion No. 20,
Accounting Changes, and SFAS No. 3,
Reporting Accounting Changes in Interim Financial
Statements, and changes the requirements for the
accounting and reporting of a change in accounting principle.
The Company adopted SFAS No. 154 on October 1,
2006. The adoption of SFAS No. 154 did not have a
significant impact on the Companys consolidated financial
position or results of operations.
In June 2006, the FASB issued Interpretation No. 48,
Accounting for Uncertainty in Income Taxes
an Interpretation of FASB Statement 109
(FIN 48), which defines the threshold for
recognizing the benefits of tax return positions in the
financial statements as more-likely-than-not
to be sustained by the taxing authority. The recently issued
literature also provides guidance on the derecognition,
measurement and classification of income tax uncertainties,
along with any related interest and penalties. FIN 48 also
includes guidance concerning accounting for income tax
uncertainties in interim periods and increases the level of
disclosures associated with any recorded income tax uncertainty.
FIN 48 is effective for fiscal years beginning after
December 15, 2006. The difference between the amounts
recognized in the statements of financial position prior to the
adoption of FIN 48 and the amounts reported after adoption
will be accounted for as a cumulative-effect adjustment recorded
to the beginning balance of retained earnings. The provisions of
FIN 48 are effective for the Company as of October 1,
2007. The Company is in the process of determining the impact,
if any, that the adoption of FIN 48 will have on its
consolidated financial position and results of operations.
In September 2006, the FASB released SFAS No. 157,
Fair Value Measurements, which provides
guidance for using fair value to measure assets and liabilities.
SFAS No. 157 defines fair value, establishes a
framework for measuring fair value in generally accepted
accounting principles, and expands disclosures about fair value
measurements. The standard also responds to investors
requests for more information about the extent to which
companies measure assets and liabilities at fair value, the
information used to measure fair value, and the effect that fair
value measurements have on earnings. SFAS No. 157 will
apply whenever another standard requires (or permits) assets or
liabilities to be measured at fair value. The standard does not
expand the use of fair value to any new circumstances.
SFAS No. 157 is effective for the Company in the
fiscal year beginning on October 1, 2008, and interim
periods within that fiscal year. The Company will adopt
SFAS No. 157 on October 1, 2008 on a prospective
basis.
In September 2006, the FASB issued SFAS No. 158,
Employers Accounting for Defined Benefit Pension
and Other Postretirement Plans an amendment of FASB
Statements No. 87, 88, 106, and 132(R), which
requires an employer to recognize the overfunded or underfunded
status of a defined benefit postretirement plan (other than a
multiemployer plan) as an asset or liability in its statement of
financial position and to recognize changes in that funded
status in the year in which the changes occur through
comprehensive income of a business entity or changes in
unrestricted net assets of a not-for-profit organization
(Recognition Provision). The Company adopted the
Recognition Provision of SFAS No. 158 as of the end of
the fiscal year ended September 30, 2007. The incremental
effects of the implementation of the Recognition Provision on
the individual line items in the September 30, 2007
consolidated balance
F-14
Infineon
Technologies AG and Subsidiaries
Notes to the Consolidated Financial Statements
sheet are shown in note 32. SFAS No. 158 also
requires an employer to measure the funded status of a plan as
of the date of its year-end statement of financial position,
with limited exceptions (Measurement Date
Provision). The Company currently measures the funded
status of its plans annually on June 30. The Measurement
Date Provision is effective for the Company as of the end of the
fiscal year ending September 30, 2009. The Company does not
expect the change in the annual measurement date to September 30
to have a significant impact on its consolidated financial
position and results of operations.
In September 2006, the SEC issued SAB No. 108,
Considering the Effects of Prior Year Misstatements
when Quantifying Misstatements in Current Year Financial
Statements. SAB No. 108 provides
interpretive guidance on how the effects of prior-year
uncorrected misstatements should be considered when quantifying
misstatements in the current year financial statements.
SAB No. 108 requires registrants to quantify
misstatements using both an income statement
(rollover) and balance sheet (iron
curtain) approach and evaluate whether either approach
results in a misstatement that, when all relevant quantitative
and qualitative factors are considered, is material. If prior
year errors that had been previously considered immaterial are
now considered material based on either approach, no restatement
is required so long as management properly applied its previous
approach and all relevant facts and circumstances were
considered. If prior years are not restated, the cumulative
effect adjustment is recorded in opening accumulated earnings
(deficit) as of the beginning of the year of adoption.
SAB No. 108 is effective for fiscal years ending on or
after November 15, 2006. The Company adopted
SAB No. 108 during the fourth quarter of the fiscal
year ended September 30, 2007. The adoption of
SAB No. 108 did not have an impact on the
Companys consolidated financial position or results of
operations.
In February 2007, the FASB issued SFAS No. 159,
The Fair Value Option for Financial Assets and
Financial Liabilities including an amendment of FASB
Statement No. 115. SFAS No. 159 permits
entities to choose to measure certain financial assets and
liabilities and other eligible items at fair value, which are
not otherwise currently required to be measured at fair value.
Under SFAS No. 159, the decision to measure items at
fair value is made at specified election dates on an irrevocable
instrument-by-instrument
basis. Entities electing the fair value option would be required
to recognize changes in fair value in earnings and to expense
upfront costs and fees associated with the item for which the
fair value option is elected. Entities electing the fair value
option are required to distinguish on the face of the statement
of financial position the fair value of assets and liabilities
for which the fair value option has been elected and similar
assets and liabilities measured using another measurement
attribute. If elected, SFAS No. 159 is effective as of
the beginning of the first fiscal year that begins after
November 15, 2007, with earlier adoption permitted as of
the beginning of a fiscal year provided that the entity also
early adopts all of the requirements of SFAS No. 157.
The Company is currently evaluating whether to elect the option
provided for in this standard.
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3.
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Separation of
Memory Products Business
|
Effective May 1, 2006, substantially all of the memory
products-related assets and liabilities, operations and
activities of Infineon were contributed to Qimonda AG
(Qimonda), a stand-alone legal company (the
Formation). In conjunction with the Formation, the
Company entered into contribution agreements and various other
service agreements with Qimonda. In cases where physical
contribution (ownership transfer) of assets and liabilities was
not feasible or cost effective, the monetary value was
transferred in the form of cash or debt. At the Formation,
Qimondas operations in Japan and Korea were initially held
in trust for Qimondas benefit by Infineon until the legal
transfer to Qimonda could take place. Qimondas Korea
operations were legally transferred to Qimonda in October 2006.
Infineon legally transferred the Japanese operations to Qimonda
during the year ended September 30, 2007. Qimondas
investment in Inotera Memories Inc. (Inotera),
previously held in trust by Infineon, was transferred to Qimonda
in March 2007 (see note 17). The Companys investment
in Advanced Mask Technology Center
F-15
Infineon
Technologies AG and Subsidiaries
Notes to the Consolidated Financial Statements
GmbH & Co. KG (AMTC) is intended to be
transferred to Qimonda after approval by the other shareholders
in the venture (see note 17).
The contribution agreements include provisions pursuant to which
Qimonda agreed to indemnify Infineon against any claim
(including any related expenses) arising in connection with the
liabilities, contracts, offers, incomplete transactions,
continuing obligations, risks, encumbrances, guarantees and
other matters relating to the memory products business that were
transferred to it as part of the Formation. In addition, the
contribution agreements provide for indemnification of Infineon
with respect to certain existing and future legal claims and
potential restructuring costs incurred in connection with the
potential rampdown of production in one module of Infineon
Technologies Dresden GmbH & Co. OHG. Although no
restructuring has been established for the respective module of
Infineon Technologies Dresden GmbH & Co. OHG, these
costs could be material and could adversely impact the financial
condition and results of operations of Qimonda and of the
Company. With the exception of the securities and certain patent
infringement and antitrust claims identified in note 35,
Qimonda is obligated to indemnify Infineon against any liability
arising in connection with claims relating to the memory
products business described in that section. Liabilities and
risks relating to the securities class action litigation,
including court costs, will be equally shared by Infineon and
Qimonda, but only with respect to the amount by which the total
amount payable exceeds the amount of the corresponding accrual
that Infineon transferred to Qimonda at Formation. Qimonda has
agreed to indemnify Infineon for 60 percent of any license
fee payments to which Infineon may agree in connection with
ongoing negotiations relating to licensing and cross-licensing
arrangements with a third party. These payments could be
substantial and could remain in effect for lengthy periods.
Qimonda fully repaid its short-term loan from Infineon of
344 million during the 2007 fiscal year.
On August 9, 2006 Qimonda completed its IPO on the New York
Stock Exchange through the issuance of 42 million ordinary
shares which are traded as American Depositary Shares
(ADSs) under the symbol QI, for an
offering price of $13.00 per ADS. As a result, the
Companys ownership interest in Qimonda was diluted to
87.7 percent and its proportional share of Qimondas
equity decreased by 53 million, which loss the
Company reflected as part of non-operating expenses under gain
on subsidiaries and associated company share issuance, net
during the year ended September 30, 2006. The net offering
proceeds amounted to 406 million (before tax benefits
available to Qimonda of 9 million) and were
classified as proceeds from issuance of shares of Qimonda within
cash flows from financing activities in the accompanying
consolidated statement of cash flows for the year ended
September 30, 2006. In addition, Infineon sold
6.3 million Qimonda ADSs upon exercise of the
underwriters over-allotment option. As a result, the
Companys ownership interest in Qimonda decreased to
85.9 percent and the Company recognized a loss of
12 million, which was reflected as part of other
operating expenses, net during the year ended September 30,
2006. The net over-allotment proceeds amounted to
58 million and were classified as proceeds from sale
of businesses and interests in subsidiaries within cash flows
from investing activities in the accompanying consolidated
statement of cash flows for the year ended September 30,
2006. Qimonda used the offering proceeds to finance investments
in its manufacturing facilities and for research and development.
On September 25, 2007, Infineon sold an additional
28.75 million Qimonda ADSs (including the
underwriters over-allotment option) for an offering price
of $10.92 per ADS. As a result, the Companys ownership
interest in Qimonda decreased to 77.5 percent and the
Company recognized a loss on sale of 84 million,
which is reflected in other operating expenses, net during the
year ended September 30, 2007. The net proceeds from this
transaction amounted to 216 million and are
classified as proceeds from sale of businesses and interests in
subsidiaries within cash flows from investing activities in the
accompanying consolidated statement of cash flows for the year
ended September 30, 2007.
F-16
Infineon
Technologies AG and Subsidiaries
Notes to the Consolidated Financial Statements
In addition, on September 26, 2007, Infineon Technologies
Investment B.V., a wholly owned subsidiary of Infineon
Technologies AG, issued notes exchangeable into ADSs of Qimonda
in the amount of 215 million (including the
underwriters over-allotment option). The coupon of the
three-year exchangeable note is 1.375 percent per year. The
exchange price is 10.48 for each Qimonda ADS,
corresponding to an exchange premium of 35 percent. If all
noteholders exercise their exchange rights, Infineon will
deliver 20.5 million Qimonda ADSs, equivalent to
approximately 6.0 percent of Qimondas share capital
(see notes 23 and 26).
On January 26, 2007 Infineon and Qimonda extended their
agreement for the production of wafers in Infineon Technologies
Dresden GmbH & Co. OHG production facility through
September 30, 2009 (see note 37).
On April 25, 2007, Qimonda and SanDisk Corporation
(SanDisk) entered into an agreement to jointly
develop and manufacture multichip packages (MCPs)
utilizing SanDisks NAND flash and controllers and
Qimondas low power mobile DRAM. The jointly owned company,
SanQi Solutions Lda., based in Portugal, targets the need for
high capacity, integrated memory solutions for data-intensive
mobile applications.
On April 25, 2007, Qimonda announced plans to construct a
fully-owned 300-millimeter front-end manufacturing facility in
Singapore. Depending on the growth and development of the world
semiconductor market, Qimonda plans to invest approximately
2 billion in the site over the next 5 years.
Qimonda expects to finance the initial capital expenditures for
the construction with a combination of its own cash flows and
project-based financing.
During December 2004, Saifun Semiconductors Ltd.
(Saifun) and the Company modified their existing
flash memory cooperation agreement. As a consequence, the
Company consummated the acquisition of Saifuns remaining
30 percent share in the Infineon Technologies Flash joint
venture in January 2005 and was granted a license for the use of
Saifuns
NROM®
technologies, in exchange for $95 million (subsequently
reduced to $46 million) to be paid in quarterly
installments over 10 years and additional purchase
consideration primarily in the form of net liabilities assumed
aggregating 7 million (see note 6). The assets
acquired and liabilities assumed were recorded in the
accompanying consolidated balance sheet based upon their
estimated fair values as of the date of the acquisition. The
excess of the purchase price over the estimated fair values of
the underlying assets acquired and liabilities assumed amounted
to 7 million and was allocated to goodwill. Qimonda
has sole ownership and responsibility for the business and
started to account for its entire financial results in the three
months ended March 31, 2005. In light of the weak market
conditions for commodity NAND flash memories in the three months
ended September 30, 2006, Qimonda decided to ramp down its
flash production and stop the development of NAND compatible
flash memory products based on Saifuns technology. Qimonda
and Saifun amended the above license agreement to terminate the
payment of quarterly installments as of December 31, 2006.
As a result, Qimonda reduced payables, goodwill and other
intangible assets, and recognized an impairment charge of
9 million related to license and fixed assets that
were not considered to be recoverable as of September 30,
2006.
On July 31, 2007, the Company acquired Texas Instruments
Inc.s (TI) DSL Customer Premises Equipment
(CPE) business for cash consideration of
45 million. The purchase price is subject to an
upward or downward contingent consideration adjustment of up to
$16 million, based on revenue targets of the CPE business
during the nine months following the acquisition date. The
Company plans to continue supporting the acquired product
portfolio and existing customer designs while leveraging the
acquired experience in future product generations. The results
of operations of the CPE business have been included in the
consolidated financial statements starting August 1, 2007.
F-17
Infineon
Technologies AG and Subsidiaries
Notes to the Consolidated Financial Statements
On August 20, 2007, the Company announced that it plans to
acquire the mobility products business of LSI Corporation
(LSI) for a price of $450 million plus a
contingent performance-based payment of up to $50 million
in order to further strengthen its activities in the field of
communications. The mobility products business designs
semiconductors and software for cellular telephone handsets. The
assets and liabilities to be acquired consist primarily of
customer relationships, goodwill, fixed assets and current
assets and liabilities. The Company is in the process of
obtaining an appraisal of the estimated fair value of the assets
and liabilities of the business to be acquired, the exact amount
of which is not currently determinable. Pending the approval of
the corresponding authorities, the transaction is expected to
close in the first quarter of the 2008 fiscal year (see
note 37).
During the quarter ended March 31, 2007, the Company
entered into agreements with Molstanda Vermietungsgesellschaft
mbH (Molstanda) and a financial institution.
Molstanda is the owner of a parcel of land located in the
vicinity of the Companys headquarters south of Munich.
Pursuant to FASB Interpretation No. 46 (revised December
2003), Consolidation of Variable Interest
Entities an interpretation of ARB
No. 51 (FIN 46R), the Company
determined that Molstanda is a variable interest entity since it
does not have sufficient equity to demonstrate that it could
finance its activities without additional financial support, and
as a result of the agreements the Company became its primary
beneficiary. Accordingly, the Company consolidated the assets
and liabilities of Molstanda beginning in the second quarter of
the 2007 fiscal year. Since Molstanda is not considered a
business pursuant to FIN 46R, the 35 million
excess in fair value of liabilities assumed and consolidated of
76 million, over the fair value of the newly
consolidated identifiable assets of 41 million, was
recorded as an extraordinary loss during the second quarter of
the 2007 fiscal year (see note 30). Due to the
Companys cumulative loss situation described in
note 10 no tax benefit was provided on this loss. The
Company subsequently acquired the majority of the outstanding
capital of Molstanda during the fourth quarter of the 2007
fiscal year. In August 2007, the Company entered into an
agreement to sell part of the acquired parcel of land to a
third-party developer-lessor in connection with the construction
and lease of Qimondas new headquarters office in the south
of Munich (see note 37).
F-18
Infineon
Technologies AG and Subsidiaries
Notes to the Consolidated Financial Statements
The following table summarizes the Companys business
acquisitions during the years ended September 30, 2005 and
2007 (there were no significant business acquisitions during the
2006 fiscal year):
|
|
|
|
|
|
|
|
|
|
|
2005
|
|
|
2007
|
|
|
|
Flash
|
|
|
CPE
|
|
Acquisition Date
|
|
January 2005
|
|
|
July 2007
|
|
|
|
|
|
|
Communication
|
|
Segment
|
|
Qimonda
|
|
|
Solutions
|
|
|
|
( in millions)
|
|
|
Cash
|
|
|
1
|
|
|
|
|
|
Other current assets
|
|
|
16
|
|
|
|
6
|
|
Property, plant and equipment
|
|
|
4
|
|
|
|
1
|
|
Intangible assets
|
|
|
|
|
|
|
|
|
Core technology
|
|
|
58
|
|
|
|
|
|
Other
|
|
|
|
|
|
|
7
|
|
Goodwill
|
|
|
7
|
|
|
|
31
|
|
Other non-current assets
|
|
|
3
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Total assets acquired
|
|
|
89
|
|
|
|
45
|
|
Current liabilities
|
|
|
(45)
|
|
|
|
|
|
Non-current liabilities
|
|
|
(2)
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Total liabilities assumed
|
|
|
(47)
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Net assets acquired
|
|
|
42
|
|
|
|
45
|
|
|
|
|
|
|
|
|
|
|
Cash paid (Purchase Consideration)
|
|
|
|
|
|
|
45
|
|
The above acquisitions have been accounted for by the purchase
method of accounting and, accordingly, the consolidated
statements of operations include the results of the acquired
companies from their respective acquisition dates. For each
significant acquisition the Company engaged an independent third
party to assist in the valuation of net assets acquired.
Pro forma financial information relating to these acquisitions
is not material either individually or in the aggregate to the
results of operations and financial position of the Company and
has been omitted.
On December 23, 2004, the Company agreed to sell its
venture capital activities, reflected in the Other Operating
Segments, to Cipio Partners, a venture capital company. Under
the terms of the agreement, the Company sold its interest in
Infineon Ventures GmbH including the majority of the venture
investments held therein. The transaction closed on
February 23, 2005. As a result of the sale, the Company
realized a gain before tax of 13 million which was
recorded in other non-operating expense, net in the 2005 fiscal
year.
On January 25, 2005, Finisar Corporation
(Finisar) and the Company entered into an agreement
under which Finisar acquired certain assets of the
Companys fiber optics business. Under the terms of the
agreement, the Company received 34 million shares of
Finisars common stock valued at 40 million as
consideration for the sale of inventory, fixed assets and
intellectual property associated with the design and manufacture
of fiber optic transceivers. The Company also committed to
provide Finisar with contract manufacturing services under
separate supply agreements for up to one year following the
closing. The transaction did not require shareholder or
regulatory approval and closed on January 31, 2005. As a
result of the transaction, the Company realized a gain before
tax of 21 million which was recorded in other
operating expense, net in the 2005 fiscal year.
On April 8, 2005, the Company sold to VantagePoint Venture
Partners its entire share interest in Finisars common
stock. As a result of the sale, the Company recorded an
other-than-temporary
F-19
Infineon
Technologies AG and Subsidiaries
Notes to the Consolidated Financial Statements
impairment of 8 million in other non-operating
expense during the second quarter of the 2005 fiscal year, to
reduce the investments carrying value to the net sale
proceeds.
The Company retained ownership of its remaining fiber optics
businesses consisting of Bi-Directional Fiber Transmission
(BIDI) components for Fiber-To-The-Home
(FTTH) applications, Parallel Optical Components
(PAROLI) and Polymer Optical Fiber (POF)
components that are used in automotive applications, which were
reclassified from held for sale to held and used during the
second quarter of the 2005 fiscal year, and were restructured.
The reclassification of the retained fiber optic businesses into
the held and used category was measured at the lower of their
carrying amount before they were classified as held for sale,
adjusted for depreciation expense that would have been
recognized had the retained fiber optic businesses been
continuously classified as held and used, or the fair value of
the assets on January 25, 2005. Accordingly, the Company
recognized an impairment charge of 34 million in
other operating expenses during the second quarter of the 2005
fiscal year.
On August 2, 2005, the Company sold the long-term assets
utilized in the design and manufacture of BIDI components to
EZConn Corporation (EZConn) for cash consideration
of 3 million. The Company also committed to provide
EZConn with contract manufacturing services through March 2006.
As a result of the transaction, the Company realized a gain
before tax of 2 million, which was recorded in other
operating income in the 2005 fiscal year, and deferred
1 million which was realized over the term of the
contract manufacturing agreement until June 2006.
On April 7, 2005, the Company and Exar Corporation
(Exar) entered into an agreement whereby the Company
sold to Exar a significant portion of its optical networking
business unit for $11 million cash. The sale included
assets relating to multi-rate TDM framer products, Fiber Channel
over SONET/SDH, Resilient Packet Ring (RPR), as well
as certain intellectual property for Data Over SONET products.
As a result of the sale, the Company reclassified related
non-current assets into assets held for sale during the second
quarter of the 2005 fiscal year and recorded an impairment of
3 million to reduce their carrying value to the net
sale proceeds. The sale of the assets was consummated during the
2005 fiscal year.
On June 29, 2007, the Company sold its POF business, based
in Regensburg, Germany, to Avago Technologies Ltd. The POF
business operates in the market for automotive multimedia
infotainment networks and transceivers for safety systems. As a
result of the sale, the Company realized a gain before tax of
17 million which was recorded in other operating
expense, net during the 2007 fiscal year.
On August 8, 2007 the Company and International Business
Machines Corporation (IBM) signed an agreement in
principle to divest their respective shares in ALTIS
Semiconductor S.N.C., Essonnes, France (ALTIS) via a
sale to Advanced Electronic Systems AG (AES). Under
the terms of the agreement in principle, AES will purchase the
equity, which includes the real estate and technology assets of
ALTIS, from the Company and IBM, and AES agreed to maintain the
level of industrial activity in ALTIS. Pursuant to the
agreement, the Company will enter into a two-year supply
contract with ALTIS and IBM and Infineon will license certain
manufacturing process technologies to AES for use in ALTIS. The
agreement is subject to governmental and regulatory approval and
works council consultation. As a result of the agreement, the
Company reclassified related non-current assets and liabilities
into assets and liabilities held for sale during the fourth
quarter of the 2007 fiscal year.
At September 30, 2007, other current assets included assets
held for sale relating to ALTIS (see note 15). These assets
include land, buildings and equipment, and current assets
associated with the production facility located in Essonnes,
France. Related liabilities are included in other current
liabilities (see note 22). Pursuant to SFAS 144,
Accounting for Impairment or Disposal of Long-lived
Assets, the recognition of depreciation expense ceased
as of August 1, 2007. The Company performed an impairment
assessment and concluded that no impairment was necessary.
F-20
Infineon
Technologies AG and Subsidiaries
Notes to the Consolidated Financial Statements
Summarized balance sheet information for ALTIS is set forth
below:
|
|
|
|
|
|
September 30,
|
|
|
2007
|
|
|
( in millions)
|
|
Current assets
|
|
|
103
|
Non-current assets
|
|
|
169
|
|
|
|
|
Total assets held for sale (note 15)
|
|
|
272
|
|
|
|
|
Current liabilities
|
|
|
110
|
Non-current liabilities
|
|
|
7
|
|
|
|
|
Total liabilities related to assets held for sale (note 22)
|
|
|
117
|
|
|
|
|
Summary financial information for the divested businesses
(through the date of divestiture) for the years ended
September 30, 2005, 2006 and 2007, are as follows:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
2005
|
|
|
2006
|
|
|
2007
|
|
|
|
( in millions)
|
|
|
Sales:
|
|
|
|
|
|
|
|
|
|
|
|
|
Fiber Optics
|
|
|
23
|
|
|
|
|
|
|
|
|
|
BIDI
|
|
|
6
|
|
|
|
|
|
|
|
|
|
POF
|
|
|
28
|
|
|
|
26
|
|
|
|
14
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Total
|
|
|
57
|
|
|
|
26
|
|
|
|
14
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
EBIT:
|
|
|
|
|
|
|
|
|
|
|
|
|
Infineon Ventures GmbH
|
|
|
(3
|
)
|
|
|
|
|
|
|
|
|
Fiber Optics
|
|
|
(27
|
)
|
|
|
|
|
|
|
|
|
BIDI
|
|
|
(20
|
)
|
|
|
|
|
|
|
|
|
POF
|
|
|
(7
|
)
|
|
|
(1
|
)
|
|
|
(6
|
)
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Total
|
|
|
(57
|
)
|
|
|
(1
|
)
|
|
|
(6
|
)
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Gain (loss) on sale before tax:
|
|
|
|
|
|
|
|
|
|
|
|
|
Infineon Ventures GmbH
|
|
|
13
|
|
|
|
|
|
|
|
|
|
Fiber Optics
|
|
|
21
|
|
|
|
|
|
|
|
|
|
BIDI
|
|
|
2
|
|
|
|
|
|
|
|
|
|
POF
|
|
|
|
|
|
|
|
|
|
|
17
|
|
Other
|
|
|
3
|
|
|
|
|
|
|
|
3
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Total
|
|
|
39
|
|
|
|
|
|
|
|
20
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
On September 28, 2007, the Company entered into a joint
venture agreement with Siemens AG (Siemens), whereby
the Company would contribute all assets and liabilities of its
high power bipolar business (including licenses, patents, and
front-end and back-end production assets) into a newly formed
legal entity called Infineon Technologies Bipolar
GmbH & Co. KG (Bipolar) and Siemens would
acquire a 40 percent interest in Bipolar for
37 million. The Company contributed all assets and
liabilities of its high power bipolar business into Bipolar
effective September 30, 2007. The joint venture agreement
will grant Siemens certain contractual participating rights
which will inhibit the Company from exercising control over the
newly formed entity. Accordingly, the Company will account for
its 60 percent interest in Bipolar under the equity method
of accounting and will recognize the excess of the consideration
received over the carrying value of the interests sold as other
operating income. Pending the approval of the applicable
authorities, the transaction is expected to close in the first
quarter of the 2008 fiscal year (see note 37).
F-21
Infineon
Technologies AG and Subsidiaries
Notes to the Consolidated Financial Statements
During the years ended September 30, 2005, 2006 and 2007,
the Company recognized revenues related to license and
technology transfer fees of 175 million,
29 million and 28 million, respectively,
which are included in net sales in the accompanying statements
of operations. Included in these amounts are previously deferred
license fees of 33 million, 12 million and
8 million, which were recognized as revenue pursuant
to SAB 104 in the years ended September 30, 2005, 2006
and 2007, respectively, since the Company had fulfilled all of
its obligations and the amounts were realized.
On November 10, 2004, the Company and ProMOS Technology
Inc. (ProMOS) reached an agreement regarding
ProMOS license of the Companys previously
transferred technologies, pursuant to which ProMOS may continue
to produce and sell products using those technologies and to
develop its own processes and products. The Company has no
continuing involvement with the licensing of these products to
ProMOS. As full consideration, ProMOS agreed to pay the Company
$156 million in four installments through April 30,
2006, against which the Companys accrued liability for
DRAM products from ProMOS of $36 million was offset. The
parties agreed to withdraw their respective claims, including
arbitration. The present value of the settlement amounted to
118 million and was recognized as license income
during the 2005 fiscal year.
In connection with its joint technology development with Nanya
Technology Corporation (Nanya), in 2003 the Company
granted Nanya a license to use its 110-nanometer technology and
to do joint development on the 90-nanometer and 70-nanometer
technologies. On September 29, 2005, the Company and Nanya
signed an agreement to expand their development cooperation with
respect to the joint development of advanced 58-nanometer
production technologies for 300-millimeter wafers (see
note 17). On September 24, 2007, Qimonda and Nanya
entered into an agreement for further know-how transfer from
Qimonda to Nanya. License income related to the technology is
recognized over the estimated life of the technology.
In connection with a capacity reservation agreement with Winbond
Electronics Corp. (Winbond) in August 2004, the
Company granted Winbond a license to use its 110-nanometer
technology and for the production and sale of Winbonds
proprietary Specialty DRAM products to third parties. In August
2006, Qimonda entered into an agreement with Winbond whereby
Qimonda transferred its 80-nanometer DRAM technology to Winbond
to manufacture DRAM using this technology exclusively for
Qimonda. On June 27, 2007, Qimonda signed agreements with
Winbond to expand their existing cooperation and capacity
reservation. Under the terms of the agreements, Qimonda agreed
to transfer its 75-nanometer and 58-nanometer DRAM trench
technologies to Winbond. In return, Winbond will manufacture
DRAM using these technologies exclusively for Qimonda. Winbond
will also use the 58-nanometer technology to develop and sell
proprietary Specialty DRAM products to third parties, for which
Qimonda would receive license fees and royalties.
On March 18, 2005 the Company and Rambus Inc.
(Rambus) reached an agreement settling all claims
between them and licensing the Rambus patent portfolio for use
in current and future Company products. Rambus granted to the
Company a worldwide license to existing and future Rambus
patents and patent applications for use in the Companys
memory products. In exchange for this worldwide license, the
Company agreed to pay $50 million in quarterly installments
of $6 million between November 15, 2005 and
November 15, 2007. As of March 31, 2005, the Company
recorded a license and corresponding liability in the amount of
37 million, representing the estimated present value of
the minimum future license payments. After November 15,
2007, and only if Rambus enters into additional specified
licensing agreements with certain other DRAM manufacturers,
Qimonda would make additional quarterly payments which may
accumulate up to a maximum of an additional $100 million.
Because Rambus ability to conclude the agreements is not
within the Companys control, the Company is not able to
estimate whether additional payment obligations may arise. The
agreement also provides the Company an option for
F-22
Infineon
Technologies AG and Subsidiaries
Notes to the Consolidated Financial Statements
acquiring certain other licenses. All licenses provide for the
Company to be treated as a most-favored customer of
Rambus. The Company simultaneously granted to Rambus a
fully-paid perpetual license for memory interfaces. In addition
to the licenses, the two companies agreed to the immediate
dismissal of all pending litigation and released each other from
all existing legal claims. The license of 37 million
is being amortized over the expected useful life of the related
technologies of ten years (see note 19).
In January 2005, the Company was granted a license for the use
of Saifuns
NROM®
technologies. The estimated fair value of the license and
minimum future license payments of 58 million were
recorded as an asset and liability, respectively. The Company
retained the option to terminate the entire license, or parts
thereof, at any time without penalty. During the three months
ended June 30, 2005, the Company exercised its termination
option and cancelled the portion of the license encompassing
NROM®
Code Flash products. As a result of the partial termination, the
license asset and related liability were reduced to
28 million and 29 million, respectively.
Effective September 30, 2006, the Company and Saifun
amended the license agreement (see note 4). As a result of
the amendment, the related liability was reduced to
3 million as of September 30, 2006.
On June 14, 2006, Infineon and Qimonda reached agreements
with MOSAID Technologies Inc. (MOSAID) settling all
claims between them and licensing the MOSAID patent portfolio
for use in current and future Company products. MOSAID granted
to Infineon and Qimonda a six-year license to use any MOSAID
patents in the manufacturing and sale of semiconductor products,
as well as a lives of the patents license to certain
MOSAID patent families. In exchange for these licenses, the
Company and Qimonda agreed to make license payments commencing
on July 1, 2006 over a six-year term (see note 19).
On August 1, 2006, Infineon and Qimonda entered into
settlement agreements with Tessera Inc. (Tessera) in
respect of all of Tesseras patent infringement and
antitrust claims and all counterclaims and other claims Infineon
and Qimonda had raised against Tessera. As part of the
settlement, Infineon and Qimonda entered into license agreements
with Tessera, effective July 1, 2006, that provide the
companies world-wide, nonexclusive, non-transferable and
non-sublicensable licenses to use a portfolio of Tessera patents
relating to packaging for integrated circuits in Infineons
and Qimondas production. The license agreements have a
six-year term and can be extended. Under the license agreements,
Infineon and Qimonda agreed to pay Tessera an initial upfront
fee and additional royalty payments over a six year period based
on the volume of components they sell that are subject to the
license. The Company recognized the litigation settlement
portion of 37 million as other operating expense
during the year ended September 30, 2006. The remaining
license portion is being amortized over the term of the
agreement and the royalty payments are recognized as the related
sales are made.
F-23
Infineon
Technologies AG and Subsidiaries
Notes to the Consolidated Financial Statements
The Company has received economic development funding from
various governmental entities, including grants for the
construction of manufacturing facilities, as well as grants to
subsidize research and development activities and employee
training. Grants and subsidies included in the accompanying
consolidated financial statements during the fiscal years ended
September 30, 2005, 2006 and 2007, are as follows:
|
|
|
|
|
|
|
|
|
|
|
|
2005
|
|
2006
|
|
2007
|
|
|
( in millions)
|
|
Included in the consolidated statements of operations:
|
|
|
|
|
|
|
|
|
|
Research and development
|
|
|
50
|
|
|
67
|
|
|
115
|
Cost of sales
|
|
|
121
|
|
|
86
|
|
|
133
|
|
|
|
|
|
|
|
|
|
|
|
|
|
171
|
|
|
153
|
|
|
248
|
|
|
|
|
|
|
|
|
|
|
Construction grants deducted from the cost of fixed assets
(note 30)
|
|
|
|
|
|
49
|
|
|
1
|
Deferred government grants amounted to 212 million
and 182 million as of September 30, 2006 and
2007, respectively. The amounts of grants receivable as of
September 30, 2006 and 2007 were 138 million and
104 million, respectively.
|
|
8.
|
Supplemental
Operating Cost Information
|
The costs of services and materials are as follows for the years
ended September 30:
|
|
|
|
|
|
|
|
|
|
|
|
2005
|
|
2006
|
|
2007
|
|
|
( in millions)
|
|
Raw materials, supplies and purchased goods
|
|
|
1,867
|
|
|
2,244
|
|
|
2,382
|
Purchased services
|
|
|
1,166
|
|
|
1,330
|
|
|
1,352
|
|
|
|
|
|
|
|
|
|
|
Total
|
|
|
3,033
|
|
|
3,574
|
|
|
3,734
|
|
|
|
|
|
|
|
|
|
|
Personnel expenses are as follows for the years ended September
30:
|
|
|
|
|
|
|
|
|
|
|
|
2005
|
|
2006
|
|
2007
|
|
|
( in millions)
|
|
Wages and salaries
|
|
|
1,664
|
|
|
1,827
|
|
|
1,880
|
Social levies
|
|
|
285
|
|
|
319
|
|
|
341
|
Pension expense (note 32)
|
|
|
28
|
|
|
37
|
|
|
41
|
|
|
|
|
|
|
|
|
|
|
Total
|
|
|
1,977
|
|
|
2,183
|
|
|
2,262
|
|
|
|
|
|
|
|
|
|
|
F-24
Infineon
Technologies AG and Subsidiaries
Notes to the Consolidated Financial Statements
Other operating expense, net is as follows for the years ended
September 30:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
2005
|
|
|
2006
|
|
|
2007
|
|
|
|
( in millions)
|
|
|
Gains (losses) from sales of businesses and interests in
subsidiaries
|
|
|
39
|
|
|
|
(10
|
)
|
|
|
(63
|
)
|
Goodwill and intangible assets impairment charges (note 19)
|
|
|
(57
|
)
|
|
|
(38
|
)
|
|
|
(2
|
)
|
Long-lived asset impairment charges
|
|
|
(39
|
)
|
|
|
(6
|
)
|
|
|
(4
|
)
|
Litigation settlement charges, net of recoveries (note 35)
|
|
|
(20
|
)
|
|
|
(60
|
)
|
|
|
9
|
|
Other
|
|
|
(15
|
)
|
|
|
6
|
|
|
|
14
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Other operating expense, net
|
|
|
(92
|
)
|
|
|
(108
|
)
|
|
|
(46
|
)
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Litigation settlement charges refer to the settlement of an
antitrust investigation by the U.S. Department of Justice
and related settlements with customers (see note 21), as
well as, during the year ended September 30, 2006, the
settlement of the Tessera litigation (see note 6).
Total rental expenses under operating leases amounted to
125 million, 151 million and
134 million for the years ended September 30,
2005, 2006 and 2007, respectively.
The average number of employees by geographic region is as
follows for the years ended September 30:
|
|
|
|
|
|
|
|
|
|
|
|
2005
|
|
2006
|
|
2007
|
|
Germany
|
|
|
16,334
|
|
|
15,822
|
|
|
15,449
|
Other Europe
|
|
|
5,606
|
|
|
7,455
|
|
|
7,479
|
North America
|
|
|
3,108
|
|
|
3,283
|
|
|
3,433
|
Asia/Pacific
|
|
|
10,919
|
|
|
14,285
|
|
|
15,964
|
Japan
|
|
|
147
|
|
|
180
|
|
|
202
|
Other
|
|
|
44
|
|
|
41
|
|
|
22
|
|
|
|
|
|
|
|
|
|
|
Total
|
|
|
36,158
|
|
|
41,066
|
|
|
42,549
|
|
|
|
|
|
|
|
|
|
|
Of the total average number of employees listed above, 10,332,
11,003 and 12,775 for the years ended September 30, 2005,
2006 and 2007, respectively, were employees of Qimonda.
During the 2005 fiscal year, the Company announced restructuring
measures aimed at reducing costs, downsizing certain portions of
its workforce, and consolidating certain functions and
operations. As part of the restructuring measures, the Company
agreed upon plans to terminate approximately 350 employees.
The terminations were primarily the result of the close down of
fiber optics operations in Germany and the United States, and
were completed in the 2006 fiscal year. In addition, the Company
took measures to restructure its chip manufacturing within the
manufacturing cluster Munich-Perlach, Regensburg and Villach.
Production from Munich-Perlach was transferred primarily to
Regensburg and to a lesser extent to Villach. Manufacturing at
Munich-Perlach was phased out in March 2007. As part of the
restructuring, the Company reduced its workforce by
approximately 600 employees.
During the 2006 fiscal year, restructuring plans were announced
to downsize the workforce at ALTIS and the Companys chip
card back-end activities in order to maintain competitiveness
and reduce cost. As part of these restructuring measures, the
Company agreed upon plans to terminate approximately
390 employees and recorded restructuring charges in the
2007 fiscal year.
During the 2007 fiscal year, further restructuring measures were
taken by the Company, mainly as a result of the insolvency of
one of its largest mobile phone customers, BenQ Mobile
GmbH & Co. OHG, and
F-25
Infineon
Technologies AG and Subsidiaries
Notes to the Consolidated Financial Statements
in order to further streamline certain research and development
locations. Approximately 280 jobs are affected worldwide,
thereof approximately 120 in the German locations Munich,
Salzgitter and Nuremberg. A large portion of these restructuring
measures have been completed during the 2007 fiscal year.
During the years ended September 30, 2005, 2006 and 2007,
charges of 78 million, 23 million and
45 million, respectively, were recognized as a result
of the above-mentioned restructuring initiatives.
The development of the restructuring liability during the year
ended September 30, 2007 is as follows:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
September 30,
|
|
|
|
|
|
|
September 30,
|
|
|
2006
|
|
Restructuring
|
|
|
|
|
2007
|
|
|
Liabilities
|
|
Charges
|
|
Payments
|
|
|
Liabilities
|
|
|
( in millions)
|
|
Employee terminations
|
|
|
57
|
|
|
39
|
|
|
(58
|
)
|
|
|
38
|
Other exit costs
|
|
|
6
|
|
|
6
|
|
|
(6
|
)
|
|
|
6
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Total
|
|
|
63
|
|
|
45
|
|
|
(64
|
)
|
|
|
44
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Income (loss) before income taxes and minority interest is
attributable to the following geographic locations for the years
ended September 30, 2005, 2006 and 2007:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
2005
|
|
|
2006
|
|
|
2007
|
|
|
|
( in millions)
|
|
|
Germany
|
|
|
(298
|
)
|
|
|
(378
|
)
|
|
|
(453
|
)
|
Foreign
|
|
|
104
|
|
|
|
294
|
|
|
|
180
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Total
|
|
|
(194
|
)
|
|
|
(84
|
)
|
|
|
(273
|
)
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Income tax expense (benefit) for the years ended
September 30, 2005, 2006 and 2007 are as follows:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
2005
|
|
2006
|
|
|
2007
|
|
|
|
( in millions)
|
|
|
Current taxes:
|
|
|
|
|
|
|
|
|
|
|
|
Germany
|
|
|
31
|
|
|
126
|
|
|
|
14
|
|
Foreign
|
|
|
1
|
|
|
41
|
|
|
|
7
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
32
|
|
|
167
|
|
|
|
21
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Deferred taxes:
|
|
|
|
|
|
|
|
|
|
|
|
Germany
|
|
|
66
|
|
|
(21
|
)
|
|
|
88
|
|
Foreign
|
|
|
22
|
|
|
15
|
|
|
|
(30
|
)
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
88
|
|
|
(6
|
)
|
|
|
58
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Income tax expense
|
|
|
120
|
|
|
161
|
|
|
|
79
|
|
|
|
|
|
|
|
|
|
|
|
|
|
F-26
Infineon
Technologies AG and Subsidiaries
Notes to the Consolidated Financial Statements
Total income taxes for the years ended September 30, 2005,
2006 and 2007 were allocated as follows:
|
|
|
|
|
|
|
|
|
|
|
|
|
2005
|
|
|
2006
|
|
2007
|
|
|
( in millions)
|
|
Income tax expense
|
|
|
120
|
|
|
|
161
|
|
|
79
|
Goodwill and intangible assets, for initial recognition of
acquired tax benefits that were previously included in the
valuation allowance
|
|
|
(30
|
)
|
|
|
|
|
|
|
Shareholders equity, for other comprehensive income (loss)
|
|
|
|
|
|
|
|
|
|
5
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
90
|
|
|
|
161
|
|
|
84
|
|
|
|
|
|
|
|
|
|
|
|
The Companys corporate statutory tax rate in Germany is
25 percent in the 2005, 2006 and 2007 fiscal years.
Additionally, a solidarity surcharge of 5.5 percent is
levied. The trade tax decreased in respect of Infineon
Technologies AG from 13 percent in 2005 to 11 percent
in 2006 due to the move of the Companys headquarters in
2006. Therefore, the combined statutory tax rate is
39 percent in 2005, and 37 percent in 2006 and 2007,
respectively.
On August 17, 2007 the Business Tax Reform Act 2008 was
enacted in Germany including several changes to the taxation of
German business activities, including a reduction of the
Companys combined statutory corporate and trade tax rate
in Germany from 37 percent to 28 percent. Most of the
changes will come into effect for the Company in its 2008 fiscal
year. Pursuant to SFAS No. 109, the Company recorded a
deferred tax charge of 53 million as of
September 30, 2007, reflecting the reduction in value of
the Companys deferred tax assets in Germany upon enactment.
A reconciliation of income taxes for the fiscal years ended
September 30, 2005, 2006 and 2007, determined using the
German corporate tax rate plus trade taxes, net of federal
benefit, for a combined statutory rate of 39 percent for
2005 and 37 percent for 2006 and 2007 is as follows:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
2005
|
|
|
2006
|
|
|
2007
|
|
|
|
( in millions)
|
|
|
Expected expense (benefit) for income taxes
|
|
|
(76
|
)
|
|
|
(31
|
)
|
|
|
(101
|
)
|
Increase in available tax credits
|
|
|
(5
|
)
|
|
|
(36
|
)
|
|
|
(35
|
)
|
Non-taxable investment (income) loss
|
|
|
(26
|
)
|
|
|
(31
|
)
|
|
|
4
|
|
Tax rate differential
|
|
|
(18
|
)
|
|
|
(50
|
)
|
|
|
(107
|
)
|
Non deductible expenses
|
|
|
29
|
|
|
|
13
|
|
|
|
28
|
|
Change in German tax rate
|
|
|
|
|
|
|
3
|
|
|
|
53
|
|
Increase in valuation allowance
|
|
|
192
|
|
|
|
292
|
|
|
|
226
|
|
Other
|
|
|
24
|
|
|
|
1
|
|
|
|
11
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Actual provision for income taxes
|
|
|
120
|
|
|
|
161
|
|
|
|
79
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
The Company has operations in a jurisdiction which grants a tax
holiday from the 2005 fiscal year onwards, which has a remaining
term of two years. Compared to ordinary taxation in this
jurisdiction, this resulted in tax savings of 0,
16 million and 6 million for the years
ended September 30, 2005, 2006 and 2007, respectively,
which are reflected in the tax rate differential.
In the 2006 fiscal year, the Company reached an agreement with
German tax authorities on certain tax matters relating to prior
years. As a result, the timing of the deductibility of certain
temporary differences was revised, which led to an increase in
the valuation allowance for the 2006 fiscal year in the amount
of 50 million.
F-27
Infineon
Technologies AG and Subsidiaries
Notes to the Consolidated Financial Statements
Deferred income tax assets and liabilities as of
September 30, 2006 and 2007 relate to the following:
|
|
|
|
|
|
|
|
|
|
|
2006
|
|
|
2007
|
|
|
|
( in millions)
|
|
|
Deferred tax assets:
|
|
|
|
|
|
|
|
|
Intangible assets
|
|
|
95
|
|
|
|
62
|
|
Property, plant and equipment
|
|
|
264
|
|
|
|
197
|
|
Deferred income
|
|
|
94
|
|
|
|
57
|
|
Net operating loss and tax credit carry-forwards
|
|
|
1,350
|
|
|
|
1,319
|
|
Other items
|
|
|
179
|
|
|
|
272
|
|
|
|
|
|
|
|
|
|
|
Gross deferred tax assets
|
|
|
1,982
|
|
|
|
1,907
|
|
Valuation allowance
|
|
|
(1,091
|
)
|
|
|
(1,050
|
)
|
|
|
|
|
|
|
|
|
|
Deferred tax assets
|
|
|
891
|
|
|
|
857
|
|
|
|
|
|
|
|
|
|
|
Deferred tax liabilities:
|
|
|
|
|
|
|
|
|
Intangible assets
|
|
|
4
|
|
|
|
|
|
Property, plant and equipment
|
|
|
103
|
|
|
|
75
|
|
Accounts receivable
|
|
|
17
|
|
|
|
43
|
|
Accrued liabilities and pensions
|
|
|
118
|
|
|
|
113
|
|
Other items
|
|
|
11
|
|
|
|
28
|
|
|
|
|
|
|
|
|
|
|
Deferred tax liabilities
|
|
|
253
|
|
|
|
259
|
|
|
|
|
|
|
|
|
|
|
Deferred tax assets, net
|
|
|
638
|
|
|
|
598
|
|
|
|
|
|
|
|
|
|
|
Net deferred income tax assets and liabilities presented in the
accompanying consolidated balance sheets as of
September 30, 2006 and 2007, are as follows:
|
|
|
|
|
|
|
|
|
|
|
2006
|
|
|
2007
|
|
|
|
( in millions)
|
|
|
Deferred tax assets:
|
|
|
|
|
|
|
|
|
Current
|
|
|
97
|
|
|
|
66
|
|
Non-current
|
|
|
627
|
|
|
|
593
|
|
Deferred tax liabilities:
|
|
|
|
|
|
|
|
|
Current
|
|
|
(26
|
)
|
|
|
(15
|
)
|
Non-current
|
|
|
(60
|
)
|
|
|
(46
|
)
|
|
|
|
|
|
|
|
|
|
Deferred tax assets, net
|
|
|
638
|
|
|
|
598
|
|
|
|
|
|
|
|
|
|
|
At September 30, 2007, the Company had in Germany tax loss
carry-forwards of 3,295 million (relating to both
trade and corporate tax, plus an additional loss carry-forward
applicable only to trade tax of 1,375 million); in
other jurisdictions the Company had tax loss carry-forwards of
220 million and tax effected credit carry-forwards of
149 million. Such tax loss carry-forwards and tax
effected credit carry-forwards are generally limited to use by
the particular entity that generated the loss or credit and do
not expire under current law. The benefit for tax credits is
accounted for on the flow-through method when the individual
legal entity is entitled to the claim. In connection with the
formation of Qimonda, the net operating losses related to the
memory products segment have been retained by Infineon
Technologies AG.
Pursuant to SFAS No. 109, the Company has assessed its
deferred tax asset and the need for a valuation allowance. Such
an assessment considers whether it is more likely than not that
some portion or all of the deferred tax assets may not be
realized. The assessment requires considerable judgment on the
part of management, with respect to, among other factors,
benefits that could be realized from available tax strategies
and future taxable income, as well as other positive and
negative factors. The ultimate realization of deferred tax
assets is dependent upon the Companys ability to generate
the appropriate
F-28
Infineon
Technologies AG and Subsidiaries
Notes to the Consolidated Financial Statements
character of future taxable income sufficient to utilize loss
carry-forwards or tax credits before their expiration. Since the
Company had incurred a cumulative loss in certain tax
jurisdictions over a three-year period as of September 30,
2007, which is significant evidence that the more likely than
not criterion is not met pursuant to the provisions of
SFAS No. 109, the impact of forecasted future taxable
income is excluded from such an assessment. For these tax
jurisdictions, the assessment was therefore only based on the
benefits that could be realized from available tax strategies
and the reversal of temporary differences in future periods. As
a result of this assessment, the Company increased the deferred
tax asset valuation allowance as of September 30, 2005,
2006 and 2007 by 192 million, 292 million,
and 226 million, respectively, to reduce the deferred
tax asset to an amount that is more likely than not expected to
be realized in future.
The changes in valuation allowance for deferred tax assets
during the years ended September 30, 2005, 2006 and 2007
were as follows:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
2005
|
|
|
2006
|
|
2007
|
|
|
|
( in millions)
|
|
|
Balance, beginning of the year
|
|
|
567
|
|
|
|
740
|
|
|
1,091
|
|
Applicable to continuing operations
|
|
|
192
|
|
|
|
292
|
|
|
226
|
|
Purchase accounting adjustments
|
|
|
(30
|
)
|
|
|
|
|
|
|
|
Change in tax rate
|
|
|
|
|
|
|
|
|
|
(298
|
)
|
Adjustment in corresponding net operating loss carry-forward
|
|
|
11
|
|
|
|
59
|
|
|
31
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Balance, end of the year
|
|
|
740
|
|
|
|
1,091
|
|
|
1,050
|
|
|
|
|
|
|
|
|
|
|
|
|
|
In the 2006 and 2007 fiscal years, the Company recorded
adjustments to certain net operating loss carry-forwards mainly
as a result of final tax assessment reconciliations. As the
adjustments were made in jurisdictions in which the Company is
in cumulative loss positions, such adjustments were recorded
directly to the valuation allowance and approximated
11 million, 59 million and
31 million in the 2005, 2006 and 2007 fiscal years,
respectively.
The Company did not provide for income taxes or foreign
withholding taxes on cumulative earnings of foreign subsidiaries
as of September 30, 2006 and 2007, as these earnings are
intended to be indefinitely reinvested in those operations. It
is not practicable to estimate the amount of unrecognized
deferred tax liabilities for these undistributed foreign
earnings.
The Company reorganized certain businesses in different tax
jurisdictions which resulted in deferred intercompany
transactions. As of September 30, 2006 and 2007, deferred
tax charges related to these transactions amounted to
63 million and 56 million, respectively,
of which 56 million and 50 million,
respectively are non-current (see note 18).
|
|
11.
|
Earnings (Loss)
Per Share
|
Basic earnings (loss) per share (EPS) is calculated
by dividing net loss by the weighted average number of ordinary
shares outstanding during the year. Diluted EPS is calculated by
dividing net income by the sum of the weighted average number of
ordinary shares outstanding plus all additional ordinary shares
that would have been outstanding if potentially dilutive
instruments or ordinary share equivalents had been issued.
F-29
Infineon
Technologies AG and Subsidiaries
Notes to the Consolidated Financial Statements
The computation of basic and diluted EPS for the years ended
September 30, 2005, 2006 and 2007, is as follows:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
2005
|
|
|
2006
|
|
|
2007
|
|
|
Numerator ( in millions):
|
|
|
|
|
|
|
|
|
|
|
|
|
Net loss before extraordinary loss
|
|
|
(312
|
)
|
|
|
(268
|
)
|
|
|
(333
|
)
|
Extraordinary loss, net of tax
|
|
|
|
|
|
|
|
|
|
|
(35
|
)
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Net loss
|
|
|
(312
|
)
|
|
|
(268
|
)
|
|
|
(368
|
)
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Denominator (shares in millions):
|
|
|
|
|
|
|
|
|
|
|
|
|
Weighted-average shares outstanding basic
|
|
|
747.6
|
|
|
|
747.6
|
|
|
|
748.6
|
|
Effect of dilutive instruments
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Weighted-average shares outstanding diluted
|
|
|
747.6
|
|
|
|
747.6
|
|
|
|
748.6
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Basic and diluted loss per share (in ):
|
|
|
|
|
|
|
|
|
|
|
|
|
Net loss before extraordinary loss
|
|
|
(0.42
|
)
|
|
|
(0.36
|
)
|
|
|
(0.45
|
)
|
Extraordinary loss, net of tax
|
|
|
|
|
|
|
|
|
|
|
(0.04
|
)
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Net loss
|
|
|
(0.42
|
)
|
|
|
(0.36
|
)
|
|
|
(0.49
|
)
|
|
|
|
|
|
|
|
|
|
|
|
|
|
The weighted average of potentially dilutive instruments that
were excluded from the diluted loss per share computations,
because the exercise price was greater than the average market
price of the ordinary shares during the period or were otherwise
not dilutive, includes 39.4 million, 46.7 million and
41.2 million shares underlying employee stock options for
the years ended September 30, 2005, 2006 and 2007,
respectively. Additionally, 86.5 million, 86.5 million
and 74.7 million ordinary shares issuable upon the
conversion of the convertible subordinated notes for the years
ended September 30, 2005, 2006 and 2007, respectively, were
not included in the computation of diluted earnings (loss) per
share as their impact would have been antidilutive.
F-30
Infineon
Technologies AG and Subsidiaries
Notes to the Consolidated Financial Statements
|
|
12.
|
Marketable
Securities
|
Marketable securities at September 30, 2006 and 2007
consist of the following:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
2006
|
|
2007
|
|
|
|
|
Fair
|
|
Unrealized
|
|
Unrealized
|
|
|
|
Fair
|
|
Unrealized
|
|
Unrealized
|
|
|
Cost
|
|
Value
|
|
Gains
|
|
Losses
|
|
Cost
|
|
Value
|
|
Gains
|
|
Losses
|
|
|
( in millions)
|
|
Foreign government securities
|
|
|
9
|
|
|
11
|
|
|
2
|
|
|
|
|
|
9
|
|
|
11
|
|
|
2
|
|
|
|
Floating rate notes
|
|
|
156
|
|
|
162
|
|
|
6
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Fixed term securities
|
|
|
460
|
|
|
453
|
|
|
|
|
|
(7)
|
|
|
491
|
|
|
477
|
|
|
1
|
|
|
(15)
|
Other debt securities
|
|
|
14
|
|
|
18
|
|
|
4
|
|
|
|
|
|
18
|
|
|
22
|
|
|
4
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Total debt securities
|
|
|
639
|
|
|
644
|
|
|
12
|
|
|
(7)
|
|
|
518
|
|
|
510
|
|
|
7
|
|
|
(15)
|
Equity securities
|
|
|
4
|
|
|
5
|
|
|
1
|
|
|
|
|
|
5
|
|
|
6
|
|
|
1
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Total marketable securities
|
|
|
643
|
|
|
649
|
|
|
13
|
|
|
(7)
|
|
|
523
|
|
|
516
|
|
|
8
|
|
|
(15)
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Reflected as follows:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Current assets
|
|
|
616
|
|
|
615
|
|
|
6
|
|
|
(7)
|
|
|
490
|
|
|
475
|
|
|
|
|
|
(15)
|
Non-current assets (note 18)
|
|
|
27
|
|
|
34
|
|
|
7
|
|
|
|
|
|
33
|
|
|
41
|
|
|
8
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Total marketable securities
|
|
|
643
|
|
|
649
|
|
|
13
|
|
|
(7)
|
|
|
523
|
|
|
516
|
|
|
8
|
|
|
(15)
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Unrealized losses relating to securities held for more than
12 months as of September 30, 2006 and 2007, were
7 million and 8 million, respectively.
Realized (losses) gains, net are reflected as other
non-operating income (expense), net and were as follows for the
years ended September 30:
|
|
|
|
|
|
|
|
|
|
|
|
2005
|
|
2006
|
|
2007
|
|
|
( in millions)
|
|
Realized gains
|
|
|
8
|
|
|
3
|
|
|
7
|
Realized losses
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Realized gains, net
|
|
|
8
|
|
|
3
|
|
|
7
|
|
|
|
|
|
|
|
|
|
|
As of September 30, 2007, there were no significant fixed
term deposits with contractual maturities between three and
twelve months.
Debt securities as of September 30, 2007 had the following
remaining contractual maturities:
|
|
|
|
|
|
|
|
|
Cost
|
|
Fair Value
|
|
|
( in millions)
|
|
Less than 1 year
|
|
|
160
|
|
|
152
|
Between 1 and 5 years
|
|
|
133
|
|
|
130
|
More than 5 years
|
|
|
225
|
|
|
228
|
|
|
|
|
|
|
|
Total debt securities
|
|
|
518
|
|
|
510
|
|
|
|
|
|
|
|
Actual maturities may differ due to call or prepayment rights.
F-31
Infineon
Technologies AG and Subsidiaries
Notes to the Consolidated Financial Statements
|
|
13.
|
Trade Accounts
Receivable, net
|
Trade accounts receivable at September 30, 2006 and 2007
consist of the following:
|
|
|
|
|
|
|
|
|
|
|
2006
|
|
|
2007
|
|
|
|
( in millions)
|
|
|
Third party trade
|
|
|
1,304
|
|
|
|
916
|
|
Associated and Related Companies trade (note 31)
|
|
|
8
|
|
|
|
16
|
|
|
|
|
|
|
|
|
|
|
Trade accounts receivable, gross
|
|
|
1,312
|
|
|
|
932
|
|
Allowance for doubtful accounts
|
|
|
(67
|
)
|
|
|
(38
|
)
|
|
|
|
|
|
|
|
|
|
Trade accounts receivable, net
|
|
|
1,245
|
|
|
|
894
|
|
|
|
|
|
|
|
|
|
|
Activity in the allowance for doubtful accounts for the years
ended September 30, 2006 and 2007 is as follows:
|
|
|
|
|
|
|
|
|
|
2006
|
|
2007
|
|
|
|
( in millions)
|
|
|
Allowance for doubtful accounts at beginning of year
|
|
|
44
|
|
|
67
|
|
Provision for (recovery of) bad debt, net
|
|
|
23
|
|
|
(29
|
)
|
|
|
|
|
|
|
|
|
Allowance for doubtful accounts at end of year
|
|
|
67
|
|
|
38
|
|
|
|
|
|
|
|
|
|
Inventories at September 30, 2006 and 2007 consist of the
following:
|
|
|
|
|
|
|
|
|
2006
|
|
2007
|
|
|
( in millions)
|
|
Raw materials and supplies
|
|
|
125
|
|
|
123
|
Work-in-process
|
|
|
777
|
|
|
665
|
Finished goods
|
|
|
300
|
|
|
429
|
|
|
|
|
|
|
|
Total Inventories
|
|
|
1,202
|
|
|
1,217
|
|
|
|
|
|
|
|
F-32
Infineon
Technologies AG and Subsidiaries
Notes to the Consolidated Financial Statements
Other current assets at September 30, 2006 and 2007 consist
of the following:
|
|
|
|
|
|
|
|
|
2006
|
|
2007
|
|
|
( in millions)
|
|
Assets held for sale (note 5)
|
|
|
|
|
|
272
|
VAT and other tax receivables
|
|
|
189
|
|
|
174
|
Grants receivable (note 7)
|
|
|
125
|
|
|
104
|
Associated and Related Companies financial and other
receivables (note 31)
|
|
|
1
|
|
|
59
|
Third party financial and other receivables
|
|
|
61
|
|
|
57
|
Financial instruments (note 33)
|
|
|
22
|
|
|
49
|
Prepaid expenses
|
|
|
36
|
|
|
42
|
License fees receivable
|
|
|
14
|
|
|
13
|
Employee receivables (note 31)
|
|
|
7
|
|
|
8
|
Intangible pension asset (note 32)
|
|
|
13
|
|
|
|
Other
|
|
|
14
|
|
|
29
|
|
|
|
|
|
|
|
Total other current assets
|
|
|
482
|
|
|
807
|
|
|
|
|
|
|
|
|
|
16.
|
Property, Plant
and Equipment, net
|
A summary of activity for property, plant and equipment for the
years ended September 30, 2006 and 2007 is as follows:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Technical
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
equipment
|
|
|
Other plant
|
|
|
|
|
|
|
|
|
|
Land and
|
|
|
and
|
|
|
and office
|
|
|
Construction
|
|
|
|
|
|
|
buildings
|
|
|
machinery
|
|
|
equipment
|
|
|
in progress
|
|
|
Total
|
|
|
|
( in millions)
|
|
|
Cost
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
September 30, 2006
|
|
|
1,554
|
|
|
|
9,173
|
|
|
|
2,309
|
|
|
|
218
|
|
|
|
13,254
|
|
Additions
|
|
|
61
|
|
|
|
618
|
|
|
|
105
|
|
|
|
646
|
|
|
|
1,430
|
|
Impairments
|
|
|
|
|
|
|
(3
|
)
|
|
|
|
|
|
|
|
|
|
|
(3
|
)
|
Disposals
|
|
|
(15
|
)
|
|
|
(162
|
)
|
|
|
(180
|
)
|
|
|
(4
|
)
|
|
|
(361
|
)
|
Reclassifications
|
|
|
13
|
|
|
|
424
|
|
|
|
25
|
|
|
|
(462
|
)
|
|
|
|
|
Transfers
|
|
|
(101
|
)
|
|
|
(971
|
)
|
|
|
(24
|
)
|
|
|
(7
|
)
|
|
|
(1,103
|
)
|
Foreign currency effects
|
|
|
(56
|
)
|
|
|
(224
|
)
|
|
|
(20
|
)
|
|
|
(9
|
)
|
|
|
(309
|
)
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
September 30, 2007
|
|
|
1,456
|
|
|
|
8,855
|
|
|
|
2,215
|
|
|
|
382
|
|
|
|
12,908
|
|
Accumulated depreciation
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
September 30, 2006
|
|
|
(732
|
)
|
|
|
(6,749
|
)
|
|
|
(2,009
|
)
|
|
|
|
|
|
|
(9,490
|
)
|
Depreciation
|
|
|
(103
|
)
|
|
|
(933
|
)
|
|
|
(187
|
)
|
|
|
|
|
|
|
(1,223
|
)
|
Disposals
|
|
|
9
|
|
|
|
155
|
|
|
|
175
|
|
|
|
|
|
|
|
339
|
|
Reclassifications
|
|
|
|
|
|
|
(5
|
)
|
|
|
5
|
|
|
|
|
|
|
|
|
|
Transfers
|
|
|
41
|
|
|
|
880
|
|
|
|
18
|
|
|
|
|
|
|
|
939
|
|
Foreign currency effects
|
|
|
18
|
|
|
|
139
|
|
|
|
17
|
|
|
|
|
|
|
|
174
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
September 30, 2007
|
|
|
(767
|
)
|
|
|
(6,513
|
)
|
|
|
(1,981
|
)
|
|
|
|
|
|
|
(9,261
|
)
|
Book value September 30, 2006
|
|
|
822
|
|
|
|
2,424
|
|
|
|
300
|
|
|
|
218
|
|
|
|
3,764
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Book value September 30, 2007
|
|
|
689
|
|
|
|
2,342
|
|
|
|
234
|
|
|
|
382
|
|
|
|
3,647
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
F-33
Infineon
Technologies AG and Subsidiaries
Notes to the Consolidated Financial Statements
On December 8, 2004, the Company announced plans to build a
new front-end production plant in Kulim High Tech Park,
Malaysia. The facility mainly produces power and logic chips
used in automotive and industrial power applications. The
construction started in early 2005 and production started in
September 2006. At full capacity, the facility is expected to
employ more than 1,500 people. Maximum capacity will be
about 100,000 wafer starts per month using 200-millimeter
wafers. As of September 30, 2007, the Company had invested
a total of 379 million in this production plant.
|
|
17.
|
Long-term
Investments
|
A summary of activity for long-term investments for the years
ended September 30, 2006 and 2007, is as follows:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Investment in
|
|
|
|
|
|
|
|
|
|
Associated
|
|
|
Investment in
|
|
|
|
|
|
|
Companies
|
|
|
Related Companies
|
|
|
Total
|
|
|
|
( in millions)
|
|
|
Balance at September 30, 2005
|
|
|
758
|
|
|
|
21
|
|
|
|
779
|
|
Additions
|
|
|
5
|
|
|
|
1
|
|
|
|
6
|
|
Disposals
|
|
|
|
|
|
|
(3
|
)
|
|
|
(3
|
)
|
Dividend payments
|
|
|
(29
|
)
|
|
|
|
|
|
|
(29
|
)
|
Capitalized interest
|
|
|
(1
|
)
|
|
|
|
|
|
|
(1
|
)
|
Impairments
|
|
|
(13
|
)
|
|
|
|
|
|
|
(13
|
)
|
Equity in earnings
|
|
|
78
|
|
|
|
|
|
|
|
78
|
|
Consolidation of ALTIS
|
|
|
(202
|
)
|
|
|
4
|
|
|
|
(198
|
)
|
Gain on share issuance
|
|
|
72
|
|
|
|
|
|
|
|
72
|
|
Reclassifications
|
|
|
10
|
|
|
|
1
|
|
|
|
11
|
|
Foreign currency effects
|
|
|
(43
|
)
|
|
|
|
|
|
|
(43
|
)
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Balance at September 30, 2006
|
|
|
635
|
|
|
|
24
|
|
|
|
659
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Additions
|
|
|
|
|
|
|
2
|
|
|
|
2
|
|
Disposals
|
|
|
(25
|
)
|
|
|
(3
|
)
|
|
|
(28
|
)
|
Dividend payments
|
|
|
(61
|
)
|
|
|
|
|
|
|
(61
|
)
|
Capitalized interest
|
|
|
(1
|
)
|
|
|
|
|
|
|
(1
|
)
|
Impairments
|
|
|
|
|
|
|
(2
|
)
|
|
|
(2
|
)
|
Equity in earnings
|
|
|
117
|
|
|
|
|
|
|
|
117
|
|
Reclassifications
|
|
|
(12
|
)
|
|
|
4
|
|
|
|
(8
|
)
|
Foreign currency effects
|
|
|
(26
|
)
|
|
|
|
|
|
|
(26
|
)
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Balance at September 30, 2007
|
|
|
627
|
|
|
|
25
|
|
|
|
652
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Investments in Related Companies principally relate to
investment activities aimed at strengthening the Companys
future intellectual property potential.
The following Associated Companies as of September 30, 2007
are accounted for using the equity method of accounting:
|
|
|
|
|
|
Direct and
|
|
|
indirect
|
Name of the Associated Company
|
|
ownership(1)
|
|
Advanced Mask Technology Center GmbH & Co. KG,
Dresden, Germany (AMTC)
|
|
|
25.8%
|
Inotera Memories Inc., Taoyuan, Taiwan (Inotera)
|
|
|
27.6%
|
|
|
(1) |
Direct and indirect ownership percentages are net of
Qimondas minority interest.
|
F-34
Infineon
Technologies AG and Subsidiaries
Notes to the Consolidated Financial Statements
The Company has accounted for these investments under the equity
method of accounting due to the lack of unilateral control (see
note 2). The above companies are principally engaged in the
research and development, design and manufacture of
semiconductors and related products.
On May 16, 2002, the Company entered into the AMTC joint
venture with its partners Advanced Micro Devices Inc., USA
(AMD), and DuPont Photomasks Inc., USA
(DuPont), with the purpose of developing and
manufacturing advanced photo masks. In addition, the Company
agreed to sell specified photomask equipment to DuPont, and
entered into a long-term purchase agreement through 2011.
Accordingly, as of September 30, 2007,
12 million was deferred which is being recognized
over the term of the purchase agreement. Toppan Printing Co.,
Ltd. acquired DuPont in April 2005 which led to a name change;
former DuPont is now named Toppan Photomasks Inc., Ltd.
On November 13, 2002, the Company entered into agreements
with Nanya relating to a strategic cooperation in the
development of DRAM products and the foundation of a joint
venture (Inotera) to construct and operate a 300-millimeter
manufacturing facility in Taiwan. Pursuant to several
agreements, the Company and Nanya developed advanced
90-nanometer and have been developing 75-and 58-nanometer
technology. The 300-millimeter fabrication facility, which
employs the technology developed under the aforementioned
agreements to manufacture DRAM products, was completed in the
2006 fiscal year and was funded by Inotera. The ramp-up of the
second manufacturing module at Inotera was completed and the
total capacity in both manufacturing modules reached 120,000
wafer starts per month in September 2007. The second module was
also fully funded by Inotera. The joint venture partners are
obliged to each purchase one-half of the facilitys
production based, in part, on market prices.
On March 17, 2006, Inotera successfully completed an IPO on
the Taiwanese stock exchange of 200 million ordinary
shares, representing 7.97 percent of its outstanding share
capital before IPO, for an issuance price of NT$33 per share. As
a result, the Companys ownership interest was diluted to
41.4 percent while its proportional share of Inoteras
equity increased by approximately 30 million, which
gain the Company recognized as part of non-operating income
during the third quarter of the 2006 fiscal year.
On May 10, 2006, Inotera successfully completed a public
offering on the Luxembourg Stock Exchange of 40 million
global depositary shares (representing 400,000,000 ordinary
shares) which are traded on the Euro MTF market and represent
14.8 percent of its outstanding share capital before the
offering, for an issuance price of NT$33 per ordinary share. As
a result, the Companys ownership interest was diluted to
36.0 percent (30.9 percent net of Qimondas
minority interest) while its proportional share of
Inoteras equity increased by 42 million, which gain
the Company reflected as part of non-operating income during the
fourth quarter of the 2006 fiscal year.
The agreement governing the joint venture with Nanya allowed
Infineon to transfer its shares in Inotera to Qimonda. However,
under Taiwanese law, Infineons shares in Inotera are
subject to a compulsory restriction on transfer
(lock-up) as
a result of Inoteras IPO. Infineon may only transfer these
shares to Qimonda gradually over the four years following
Inoteras IPO. The Company sought an exemption from this
restriction that would permit the immediate transfer of all of
these shares to Qimonda. In connection with the Formation,
Infineon and Qimonda entered into a trust agreement under which
Infineon held its Inotera shares in trust for Qimonda until the
shares could be transferred. This trust agreement provided for
Infineon to transfer the shares to Qimonda as and when the
transfer restrictions expire or Qimonda received the exemption
from the
lock-up. In
March 2007, the Inotera shares (except for the portion
representing less than 1 percent of the total shares) were
transferred to Qimonda. The Inotera shares remain subject to
Taiwanese
lock-up
provisions related to the Inotera IPO through January 2008,
after which the remaining shares are to be transferred to
Qimonda.
ALTIS is a joint venture between the Company and IBM, with each
having equal voting representation. During the year ended
September 30, 2003, the Company and IBM amended the
original shareholders
F-35
Infineon
Technologies AG and Subsidiaries
Notes to the Consolidated Financial Statements
agreement. Pursuant to the amendment, the Company agreed to
ratably increase its capacity reservation in the production
output of ALTIS from 50 percent to 100 percent during
fiscal years 2004 through 2007.
In December 2005, the Company further amended its agreements
with IBM in respect of ALTIS, and extended its product purchase
agreement with ALTIS through 2009. Pursuant to the December 2005
amendment, the Company granted to IBM an option to require the
Company to acquire four-fifths of IBMs 50 percent
interest in the joint venture (or a total of 40 percent of
the outstanding shares of ALTIS) at any time after April 1,
2006 and prior to January 1, 2009. In connection with the
exercise of such option, IBM would be required to make a payment
to the Company to settle the respective interests of the
parties. In addition, the Company granted to IBM a second option
to require the Company to acquire up to four-fifths of
IBMs 50 percent interest in the joint venture (or a
total of 40 percent of the outstanding shares of ALTIS) in
increments of 10 percent after April 1, 2006 and prior
to January 1, 2009. The amendment also permits IBM to sell
its interest in ALTIS to a third party meeting certain specified
criteria.
Under the December 2005 amendment, the Company and IBM also
agreed a number of administrative matters regarding the
governance and management of ALTIS, as well as related
cost-allocation and accounting matters. The Company evaluated
the amendment in accordance with FIN 46R and concluded that
it held an interest in a variable interest entity in which the
Company is determined to be the primary beneficiary.
Accordingly, the Company began to fully consolidate ALTIS
following the December 19, 2005 amendment whereby
IBMs 50 percent ownership interest has been reflected
as a minority interest.
The following table summarizes the elimination of the investment
in ALTIS as previously accounted for under the equity method of
accounting, and the Companys initial consolidation of
ALTIS during first quarter of the 2006 fiscal year (see
note 5):
|
|
|
|
|
|
|
ALTIS
|
|
Consolidation Date
|
|
December 2005
|
|
|
|
Communication
|
|
Segment
|
|
Solutions
|
|
|
|
( in millions)
|
|
|
Cash
|
|
|
119
|
|
Inventories
|
|
|
45
|
|
Other current assets
|
|
|
10
|
|
Property, plant and equipment
|
|
|
212
|
|
Long-term investment
|
|
|
(202
|
)
|
Other non-current assets
|
|
|
(47
|
)
|
|
|
|
|
|
Total assets consolidated
|
|
|
137
|
|
Current liabilities
|
|
|
(79
|
)
|
Non-current liabilities (including debt)
|
|
|
6
|
|
Deferred tax liabilities
|
|
|
3
|
|
Minority Interests
|
|
|
207
|
|
|
|
|
|
|
Total liabilities consolidated
|
|
|
137
|
|
|
|
|
|
|
Net assets consolidated
|
|
|
|
|
|
|
|
|
|
Cash paid
|
|
|
|
|
In November 2003, the Company, together with United Epitaxy
Company, Ltd. (UEC), Hsinchu, Taiwan, founded a
joint venture company ParoLink. The Company initially invested
6 million, held a 56 percent ownership interest
in ParoLink and accounted for its investment in ParoLink using
the equity
F-36
Infineon
Technologies AG and Subsidiaries
Notes to the Consolidated Financial Statements
method, since substantive participating minority rights
prevented the exercise of unilateral control. In connection with
the Companys disposal of its fiber optics business (see
note 5), the Company acquired the minority interest in
ParoLink, terminated the joint venture with UEC and recorded an
impairment to reduce the investment to its estimated fair value
of 3 million. During January 2006, the joint venture
partners decided to dissolve and liquidate ParoLink. The
liquidation was completed in the 2007 fiscal year.
On October 1, 2002, the Company, Agere Systems Inc. and
Motorola Inc. incorporated StarCore, LLC (StarCore),
based in Austin, Texas. StarCore focused on developing,
standardizing and promoting Digital Signal Processor
(DSP) core technology. In the 2006 fiscal year the
shareholders decided by consensus to pursue their objectives in
DSP core technology individually and to liquidate StarCore. As a
consequence the Company recorded an impairment of
13 million during the 2006 fiscal year.
On November 13, 2006 Qimonda sold its investment in Ramtron
International Corp., Colorado, USA (Ramtron) through
a private placement. As a result of the sale, Qimonda recorded a
gain of 2 million as part of other non-operating
income during the 2006 fiscal year.
The Company recognized impairment charges related to certain
investments for which the carrying value exceeded the fair value
on an other-than-temporary basis of 29 million,
13 million and 2 million during the years
ended September 30, 2005, 2006 and 2007, respectively.
There was no goodwill included in the amount of long-term
investments at September 30, 2006 and 2007, respectively.
For the Associated Companies as of September 30, 2007, the
aggregate summarized financial information for the fiscal years
2005, 2006 and 2007, is as follows:
|
|
|
|
|
|
|
|
|
|
|
|
2005
|
|
2006
|
|
2007
|
|
|
( in millions)
|
|
Sales
|
|
|
439
|
|
|
894
|
|
|
1,122
|
Gross profit
|
|
|
137
|
|
|
312
|
|
|
381
|
Net income (loss)
|
|
|
72
|
|
|
208
|
|
|
277
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
2005
|
|
|
2006
|
|
|
2007
|
|
|
|
( in millions)
|
|
|
Current assets
|
|
|
520
|
|
|
|
1,084
|
|
|
|
714
|
|
Non-current assets
|
|
|
1,883
|
|
|
|
1,811
|
|
|
|
2,810
|
|
Current liabilities
|
|
|
(334
|
)
|
|
|
(524
|
)
|
|
|
(661
|
)
|
Non-current liabilities
|
|
|
(891
|
)
|
|
|
(637
|
)
|
|
|
(1,133
|
)
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Shareholders equity
|
|
|
1,178
|
|
|
|
1,734
|
|
|
|
1,730
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
F-37
Infineon
Technologies AG and Subsidiaries
Notes to the Consolidated Financial Statements
Other non-current assets at September 30, 2006 and 2007
consist of the following:
|
|
|
|
|
|
|
|
|
2006
|
|
2007
|
|
|
( in millions)
|
|
Deferred tax charges (note 10)
|
|
|
56
|
|
|
50
|
Marketable securities (note 12)
|
|
|
34
|
|
|
41
|
Long-term receivables
|
|
|
20
|
|
|
27
|
Employee receivables (note 31)
|
|
|
2
|
|
|
1
|
Grants receivable (note 7)
|
|
|
13
|
|
|
|
Other
|
|
|
21
|
|
|
21
|
|
|
|
|
|
|
|
Total
|
|
|
146
|
|
|
140
|
|
|
|
|
|
|
|
A summary of activity for intangible assets for the years ended
September 30, 2006 and 2007 is as follows:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Other
|
|
|
|
|
|
|
Goodwill
|
|
|
Intangibles
|
|
|
Total
|
|
|
|
( in millions)
|
|
|
Cost
|
|
|
|
|
|
|
|
|
|
|
|
|
September 30, 2005
|
|
|
125
|
|
|
|
448
|
|
|
|
573
|
|
Additions
|
|
|
|
|
|
|
56
|
|
|
|
56
|
|
Impairment charges (note 8)
|
|
|
(7
|
)
|
|
|
(31
|
)
|
|
|
(38
|
)
|
Disposals
|
|
|
(11
|
)
|
|
|
(26
|
)
|
|
|
(37
|
)
|
Foreign currency effects
|
|
|
(6
|
)
|
|
|
(1
|
)
|
|
|
(7
|
)
|
|
|
|
|
|
|
|
|
|
|
|
|
|
September 30, 2006
|
|
|
101
|
|
|
|
446
|
|
|
|
547
|
|
Additions
|
|
|
31
|
|
|
|
45
|
|
|
|
76
|
|
Impairment charges (note 8)
|
|
|
|
|
|
|
(2
|
)
|
|
|
(2
|
)
|
Disposals
|
|
|
(6
|
)
|
|
|
(46
|
)
|
|
|
(52
|
)
|
Foreign currency effects
|
|
|
(9
|
)
|
|
|
(4
|
)
|
|
|
(13
|
)
|
|
|
|
|
|
|
|
|
|
|
|
|
|
September 30, 2007
|
|
|
117
|
|
|
|
439
|
|
|
|
556
|
|
Accumulated amortization
|
|
|
|
|
|
|
|
|
|
|
|
|
September 30, 2005
|
|
|
|
|
|
|
(258
|
)
|
|
|
(258
|
)
|
Amortization
|
|
|
|
|
|
|
(67
|
)
|
|
|
(67
|
)
|
Disposals
|
|
|
|
|
|
|
5
|
|
|
|
5
|
|
Foreign currency effects
|
|
|
|
|
|
|
3
|
|
|
|
3
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
September 30, 2006
|
|
|
|
|
|
|
(317
|
)
|
|
|
(317
|
)
|
Amortization
|
|
|
|
|
|
|
(52
|
)
|
|
|
(52
|
)
|
Disposals
|
|
|
|
|
|
|
42
|
|
|
|
42
|
|
Foreign currency effects
|
|
|
|
|
|
|
3
|
|
|
|
3
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
September 30, 2007
|
|
|
|
|
|
|
(324
|
)
|
|
|
(324
|
)
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Carrying value September 30, 2005
|
|
|
125
|
|
|
|
190
|
|
|
|
315
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Carrying value September 30, 2006
|
|
|
101
|
|
|
|
129
|
|
|
|
230
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Carrying value September 30, 2007
|
|
|
117
|
|
|
|
115
|
|
|
|
232
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
F-38
Infineon
Technologies AG and Subsidiaries
Notes to the Consolidated Financial Statements
The estimated aggregate amortization expense relating to other
intangible assets for each of the five succeeding fiscal years
is as follows: 2008 37 million; 2009
22 million; 2010 17 million; 2011
16 million; 2012 11 million.
In connection with the acquisition of Saifuns remaining
30 percent share in the Infineon Technologies Flash joint
venture, the Company was granted a license for the use of
Saifuns
NROM®
technologies (see note 4). During the three months ended
March 31, 2005 the Company recorded the license of
58 million and a corresponding liability in the
amount of 58 million, representing the estimated fair
value of the license and minimum future license payments,
respectively. The Company retained the option to terminate the
entire license, or parts thereof, at any time without penalty.
During the three months ended June 30, 2005, the Company
exercised its termination option and cancelled the portion of
the license encompassing
NROM®
Code Flash products. Effective September 30, 2006, the
Company and Saifun amended the license agreement (see
note 4). As a result of the amendment, the related
liability was reduced to 3 million as of
September 30, 2006.
In March 2005, the Company and Rambus reached an agreement
settling all claims between them and licensing the Rambus patent
portfolio. The license of 37 million is being
amortized over the expected useful life of the related
technologies of ten years (see note 6).
On June 14, 2006, Infineon and Qimonda reached agreements
with MOSAID settling all claims between them and licensing the
MOSAID patent portfolio for use in current and future Company
products. The license of 32 million is being
amortized over the expected useful life of the related
technologies of six years (see note 6).
During the years ended September 30, 2005, 2006 and 2007,
the Company recognized intangible assets impairment charges of
57 million, 38 million and
2 million, respectively.
During the year ended September 30, 2005, the Company
concluded that sufficient indicators existed to require an
assessment of whether the carrying values of goodwill and
certain other intangible assets in the Customer Premises
Equipment, Wireless Infrastructure, Short Range Wireless, RF
Engine and Optical Networking reporting units within the
Communication Solutions segment might not be recoverable.
Recoverability of these intangible assets was measured by a
comparison of the carrying amount of the assets to the future
net cash flows expected to be generated by the assets.
Impairments of 57 million were recognized in other
operating expenses, representing the amount by which the
carrying amount of the assets exceeded their fair value.
During the year ended September 30, 2006, partially as a
result of the insolvency of one of the Companys largest
mobile phone customers, BenQ Mobile GmbH & Co. OHG,
the Company concluded that sufficient indicators existed to
require an assessment of whether the carrying values of goodwill
and certain other intangible assets principally in reporting
units within the Communication Solutions segment might not be
recoverable. Recoverability of these intangible assets was
measured by a comparison of the carrying amount of the assets to
the future net cash flows expected to be generated by the
assets. Impairments of 38 million were recognized in
other operating expenses, representing the amount by which the
carrying amount of the assets exceeded their fair value.
During the year ended September 30, 2007, the Company did
not recognize any impairments of goodwill.
F-39
Infineon
Technologies AG and Subsidiaries
Notes to the Consolidated Financial Statements
|
|
20.
|
Trade Accounts
Payable
|
Trade accounts payable at September 30, 2006 and 2007
consist of the following:
|
|
|
|
|
|
|
|
|
2006
|
|
2007
|
|
|
( in millions)
|
|
Third party trade
|
|
|
1,165
|
|
|
1,128
|
Associated and Related Companies trade (note 31)
|
|
|
80
|
|
|
157
|
|
|
|
|
|
|
|
Total
|
|
|
1,245
|
|
|
1,285
|
|
|
|
|
|
|
|
Accrued liabilities at September 30, 2006 and 2007 consist
of the following:
|
|
|
|
|
|
|
|
|
2006
|
|
2007
|
|
|
( in millions)
|
|
Personnel costs
|
|
|
353
|
|
|
381
|
Warranties and licenses
|
|
|
54
|
|
|
44
|
Settlement for antitrust related matters (note 35)
|
|
|
53
|
|
|
38
|
Other
|
|
|
65
|
|
|
63
|
|
|
|
|
|
|
|
Total
|
|
|
525
|
|
|
526
|
|
|
|
|
|
|
|
On September 15, 2004 the Company entered into a plea
agreement with the United States Department of Justice in
connection with its antitrust investigation (see
note 35) and agreed to pay a fine aggregating
$160 million over a five-year period. The related amount
due within one year is included in accrued liabilities and other
current liabilities, and the long-term portion is reflected as
other non-current liabilities (see note 25). As a result of
this agreement and other antitrust related investigations and
customer settlements (see note 35), the Company recorded
other operating (expenses) income with an aggregate of
(20) million, (23) million and
9 million during the years ended September 30,
2005, 2006 and 2007, respectively (see note 8).
A tabular reconciliation of the changes in the aggregate product
warranty liability for the year ended September 30, 2007 is
as follows:
|
|
|
|
|
|
|
2007
|
|
|
|
( in millions)
|
|
|
Balance as of September 30, 2006
|
|
|
51
|
|
Accrued during the year, net
|
|
|
29
|
|
Settled during the year
|
|
|
(36
|
)
|
|
|
|
|
|
Balance as of September 30, 2007
|
|
|
44
|
|
|
|
|
|
|
F-40
Infineon
Technologies AG and Subsidiaries
Notes to the Consolidated Financial Statements
|
|
22.
|
Other Current
Liabilities
|
Other current liabilities at September 30, 2006 and 2007
consist of the following:
|
|
|
|
|
|
|
|
|
2006
|
|
2007
|
|
|
( in millions)
|
|
Deferred income
|
|
|
62
|
|
|
124
|
VAT and other taxes payable
|
|
|
212
|
|
|
109
|
Liabilities related to asset held for sale (note 5)
|
|
|
|
|
|
117
|
Payroll obligations to employees
|
|
|
128
|
|
|
88
|
Deferred government grants (note 7)
|
|
|
95
|
|
|
69
|
Restructuring (note 9)
|
|
|
63
|
|
|
44
|
Financial instruments (note 33)
|
|
|
11
|
|
|
38
|
Interest
|
|
|
37
|
|
|
20
|
Settlement for anti-trust related matters (note 35)
|
|
|
24
|
|
|
20
|
Associated and Related Companies financial and other
payables (note 31)
|
|
|
9
|
|
|
12
|
Other
|
|
|
71
|
|
|
39
|
|
|
|
|
|
|
|
Total
|
|
|
712
|
|
|
680
|
|
|
|
|
|
|
|
Other deferred income includes amounts relating to license
income (see note 6) and deferred revenue. The
non-current portion is included in other liabilities (see
note 25).
Debt at September 30, 2006 and 2007 consists of the
following:
|
|
|
|
|
|
|
|
|
2006
|
|
2007
|
|
|
( in millions)
|
|
Short-term debt:
|
|
|
|
|
|
|
Loans payable to banks, weighted average rate 4.55%
|
|
|
51
|
|
|
155
|
Convertible subordinated notes, 4.25%, due 2007
|
|
|
638
|
|
|
|
Current portion of long-term debt
|
|
|
108
|
|
|
153
|
Capital lease obligation
|
|
|
|
|
|
28
|
|
|
|
|
|
|
|
Total short-term debt and current maturities
|
|
|
797
|
|
|
336
|
|
|
|
|
|
|
|
Long-term debt:
|
|
|
|
|
|
|
Exchangeable subordinated notes, 1.375%, due 2010
|
|
|
|
|
|
215
|
Convertible subordinated notes, 5.0%, due 2010
|
|
|
692
|
|
|
695
|
Loans payable to banks:
|
|
|
|
|
|
|
Unsecured term loans, weighted average rate 4.82%,
due 2009 2013
|
|
|
458
|
|
|
318
|
Secured term loans, weighted average rate 1.99%, due 2013
|
|
|
7
|
|
|
4
|
Other loans payable, weighted average rate 4.35%, due 2011
|
|
|
3
|
|
|
|
Notes payable to governmental entity, rate 2.02%, due 2010
2027
|
|
|
48
|
|
|
44
|
Capital lease obligation
|
|
|
|
|
|
100
|
|
|
|
|
|
|
|
Total long-term debt
|
|
|
1,208
|
|
|
1,376
|
|
|
|
|
|
|
|
Short-term loans payable to banks consist primarily of
borrowings under the terms of short-term borrowing arrangements.
F-41
Infineon
Technologies AG and Subsidiaries
Notes to the Consolidated Financial Statements
On September 26, 2007, the Company (as guarantor), through
its subsidiary Infineon Technologies Investment B.V. (as
issuer), issued 215 million in exchangeable
subordinated notes due 2010 at par in an underwritten offering
to institutional investors in Europe. The notes accrue interest
at 1.375 percent per year. The notes are exchangeable into
a maximum of 20.5 million Qimonda ADSs, at an exchange
price of 10.48 per ADS any time during the exchange
period, as defined, through maturity, corresponding to an
exchange premium of 35 percent. The notes are unsecured and
rank pari passu with all present and future unsecured
subordinated obligations of the issuer. The noteholders have a
negative pledge relating to future capital market indebtedness,
as defined, and an early redemption option in the event of a
change of control, as defined. The Company may, at its option,
redeem the outstanding notes in whole, but not in part, at the
principal amount thereof together with accrued interest to the
date of redemption, if the issuer has determined that, as a
result of a publicly announced transaction, there is a
substantial likelihood that the aggregate ownership of the share
capital of Qimonda AG by the issuer, the guarantor and any of
their respective subsidiaries will be less than 50 percent
plus one share. In addition, the Company may, at its option,
redeem the outstanding notes in whole, but not in part, at their
principal amount together with interest accrued to the date of
redemption, if the share price of the ADSs on each of 15 trading
days during a period of 30 consecutive trading days commencing
on or after August 31, 2009, exceeds 130 percent of
the exchange price. The exchangeable notes are listed on the
Frankfurt Stock Exchange. At September 30, 2007,
unamortized debt issuance costs amount to 6 million.
Concurrently with this transaction, the Company loaned an
affiliate of J.P. Morgan Securities Inc. 3.6 million
Qimonda ADSs ancillary to the placement of the exchangeable
subordinated notes. The affiliate of J.P. Morgan Securities
Inc. sold these ADSs as part of the Qimonda ADSs sale on
September 25, 2007 (see note 3).
On June 5, 2003, the Company (as guarantor), through its
subsidiary Infineon Technologies Holding B.V. (as issuer),
issued 700 million in convertible subordinated notes
due 2010 at par in an underwritten offering to institutional
investors in Europe. The notes are convertible, at the option of
the holders of the notes, into a maximum of 68.4 million
ordinary shares of the Company, at a conversion price of
10.23 per share through maturity. The notes accrue
interest at 5.0 percent per year. The notes are unsecured
and rank pari passu with all present and future unsecured
subordinated obligations of the issuer. The noteholders have a
negative pledge relating to future capital market indebtedness,
as defined. The note holders have an early redemption option in
the event of a change of control, as defined. A corporate
reorganization resulting in a substitution of the guarantor
shall not be regarded as a change of control, as defined. The
Company may redeem the convertible notes after three years at
their principal amount plus interest accrued thereon, if the
Companys share price exceeds 125 percent of the
conversion price on 15 trading days during a period of 30
consecutive trading days. The convertible notes are listed on
the Luxembourg Stock Exchange. On September 29, 2006 the
Company (through the issuer) irrevocably waived its option to
pay a cash amount in lieu of the delivery of shares upon
conversion. At September 30, 2007, unamortized debt
issuance costs amount to 5 million.
On February 6, 2007, the Company (as guarantor), through
its subsidiary Infineon Technologies Holding B.V. (as issuer),
fully redeemed its convertible subordinated notes due 2007 at
the principal outstanding amount of 640 million.
In September 2004, the Company executed a
$400/400 million syndicated credit facility with a
five-year term, which was subsequently reduced to
$345/300 million in August 2006. The facility
consists of two tranches. Tranche A is a term loan intended
to finance the expansion of the Richmond, Virginia,
manufacturing facility. In January 2006, the Company drew
$345 million under Tranche A, on the basis of a
repayment schedule that foresees equal installments falling due
in March and September each year. At September 30, 2007,
$235 million was outstanding under Tranche A.
Tranche B, which is a 300 million multicurrency
revolving facility to be used for general corporate purposes,
remained available and undrawn at September 30, 2007. The
facility has customary financial covenants, and drawings bear
interest at market-related rates that are linked to financial
performance. The lenders of this credit facility
F-42
Infineon
Technologies AG and Subsidiaries
Notes to the Consolidated Financial Statements
have been granted a negative pledge relating to the future
financial indebtedness of the Company with certain permitted
encumbrances. In September 2007, the Company extended its credit
lines by 300 million in additional short-term
bilateral commitments from lenders of the facility described
above under the same terms and conditions applicable to
Tranche B.
In September 2007, Qimonda entered into a sale and leaseback
transaction of 200-millimeter equipment. The four-year lease is
accounted for as a capital lease, whereby the present value of
the lease payments is reflected as a capital lease obligation.
The Company has established independent financing arrangements
with several financial institutions, in the form of both short-
and long-term credit facilities, which are available for
anticipated funding purposes.
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Nature of financial
|
|
|
|
As of September 30, 2007
|
|
|
Institution
|
|
Purpose/intended
|
|
Aggregate
|
|
|
|
|
Term
|
|
Commitment
|
|
use
|
|
facility
|
|
Drawn
|
|
Available
|
|
|
|
|
|
|
( in millions)
|
|
Short-term
|
|
firm commitment
|
|
working capital,
guarantees
|
|
|
164
|
|
|
127
|
|
|
37
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Short-term
|
|
no firm commitment
|
|
working capital, cash management
|
|
|
336
|
|
|
28
|
|
|
308
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Long-term(1)
|
|
firm commitment
|
|
general corporate purposes
|
|
|
766
|
|
|
165
|
|
|
601
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Long-term(1)
|
|
firm commitment
|
|
project finance
|
|
|
354
|
|
|
354
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Total
|
|
|
1,620
|
|
|
674
|
|
|
946
|
|
|
|
|
|
|
|
|
|
|
|
|
(1) |
Including current maturities.
|
At September 30, 2007, the Company was in compliance with
its debt covenants under the relevant facilities.
Interest expense for the years ended September 30, 2005,
2006 and 2007 was 83 million, 109 million
and 89 million, respectively.
Aggregate amounts of debt maturing subsequent to
September 30, 2007 are as follows:
|
|
|
|
|
Fiscal year ending September 30,
|
|
Amount
|
|
|
|
( in millions)
|
|
|
2008
|
|
|
336
|
|
2009
|
|
|
207
|
|
2010
|
|
|
1,002
|
|
2011
|
|
|
95
|
|
2012
|
|
|
26
|
|
Thereafter
|
|
|
46
|
|
|
|
|
|
|
Total
|
|
|
1,712
|
|
|
|
|
|
|
F-43
Infineon
Technologies AG and Subsidiaries
Notes to the Consolidated Financial Statements
|
|
24.
|
Long-term Accrued
Liabilities
|
Long-term accrued liabilities at September 30, 2006 and
2007 consist of the following:
|
|
|
|
|
|
|
|
|
|
|
2006
|
|
|
2007
|
|
|
|
( in millions)
|
|
|
Asset retirement obligations
|
|
|
33
|
|
|
|
24
|
|
Post-retirement benefits
|
|
|
4
|
|
|
|
3
|
|
Personnel costs
|
|
|
6
|
|
|
|
6
|
|
Other
|
|
|
3
|
|
|
|
3
|
|
|
|
|
|
|
|
|
|
|
Total
|
|
|
46
|
|
|
|
36
|
|
|
|
|
|
|
|
|
|
|
Other non-current liabilities at September 30, 2006 and
2007 consist of the following:
|
|
|
|
|
|
|
|
|
|
|
2006
|
|
|
2007
|
|
|
|
( in millions)
|
|
|
Deferred income
|
|
|
40
|
|
|
|
114
|
|
Deferred government grants (note 7)
|
|
|
117
|
|
|
|
113
|
|
Settlement for antitrust related matters (note 35)
|
|
|
62
|
|
|
|
37
|
|
License fees payable
|
|
|
41
|
|
|
|
27
|
|
Deferred Compensation
|
|
|
|
|
|
|
13
|
|
Other
|
|
|
17
|
|
|
|
12
|
|
|
|
|
|
|
|
|
|
|
Total
|
|
|
277
|
|
|
|
316
|
|
|
|
|
|
|
|
|
|
|
On July 28, 2003, the Company entered into a joint venture
agreement with China-Singapore Suzhou Industrial Park Venture
Company (CSVC) for the construction of a back-end
manufacturing facility in the Peoples Republic of China.
Pursuant the joint venture agreement, the capital invested by
CSVC earns an annual return and has a liquidation preference,
while all accumulated earnings and dividend rights accrue to the
benefit of the Company. Accordingly, the Company has fully
consolidated the joint venture from inception, and the capital
invested and annual return of the minority investor is reflected
as minority interest.
ALTIS is a joint venture between the Company and IBM, with each
having equal voting representation. In December 2005, the
Company further amended its agreements with IBM in respect of
the ALTIS joint venture and began to fully consolidate ALTIS,
whereby IBMs 50 percent ownership interest is
reflected as minority interest (see note 5 and 17).
Effective May 1, 2006, the Company contributed
substantially all of the operations of its memory products
segment, including the assets and liabilities that were used
exclusively for these operations, to Qimonda, a stand-alone
legal company. On August 9, 2006, Qimonda completed an
initial public offering on the New York Stock Exchange through
the issuance of 42 million ADSs which are traded under the
symbol QI, for an offering price of $13 per ADS. In
addition, the Company sold 6.3 million Qimonda ADSs upon
exercise of the underwriters over-allotment option. As a
result of these transactions, the Company reduced its
shareholding in Qimonda to 85.9 percent. During the fourth
quarter of the 2007 fiscal year, Infineon sold an additional
28.75 million Qimonda ADSs (including underwriters
over-allotment option), further reducing its ownership interest
in Qimonda to 77.5 percent. The minority investors
ownership interest in Qimonda of 14.1 percent and
22.5 percent as of September 30, 2006 and 2007,
respectively, is reflected as minority interest (see
note 3).
F-44
Infineon
Technologies AG and Subsidiaries
Notes to the Consolidated Financial Statements
|
|
27.
|
Ordinary Share
Capital
|
As of September 30, 2007 the Company had 749,728,635
registered ordinary shares, notional value of 2.00 per
share, outstanding. During the years ended September 30,
2006 and 2007 the Company increased its share capital by
0.08 million and 4 million, respectively,
by issuing 39,935 and 2,119,341 ordinary shares, respectively,
in connection with the Companys Long-Term Incentive Plans.
Authorized and
Conditional Share Capital
In addition to the issued share capital, the Companys
Articles of Association authorize the Management Board to
increase the ordinary share capital with the Supervisory
Boards consent by issuing new shares. As of
September 30, 2007, the Management Board may use these
authorizations to issue new shares as follows:
|
|
|
|
|
Through January 19, 2009, Authorized Share Capital
II/2004 in an aggregate nominal amount of up to
30 million to issue shares to employees (in which
case the pre-emptive rights of existing shareholders are
excluded).
|
|
|
|
Through February 14, 2012, Authorized Share Capital
2007 in an aggregate nominal amount of up to
224 million to issue shares for cash, where the
pre-emptive rights of shareholders may be partially excluded, or
in connection with business combinations (contributions in
kind), where the pre-emptive rights of shareholders may be
excluded for all shares.
|
The Company has conditional capital of up to an aggregate
nominal amount of 92 million (Conditional Share
Capital I), of up to an aggregate nominal amount of
29 million (Conditional Share Capital III) and
up to an aggregate nominal amount of 24.5 million
(Conditional Share Capital IV/2006) that may be used to issue up
to 72.6 million new registered shares in connection with
the Companys long-term incentive plans (see note 28).
These shares will have dividend rights from the beginning of the
fiscal year in which they are issued.
The Company has conditional capital of up to an aggregate
nominal amount of 152 million (Conditional Share
Capital 2002) that may be used to issue up to
76 million new registered shares upon conversion of debt
securities, issued in June 2003 and which may be converted at
any time until May 22, 2010 (see note 23). These
shares will have dividend rights from the beginning of the
fiscal year in which they are issued.
The Company has further conditional capital of up to an
aggregate nominal amount of 248 million (Conditional
Share Capital 2007) that may be used to issue up to
124 million new registered shares upon conversion of debt
securities which may be issued before February 14, 2012.
These shares will have dividend rights from the beginning of the
fiscal year in which they are issued.
Dividends
Under the German Stock Corporation Act (Aktiengesetz),
the amount of dividends available for distribution to
shareholders is based on the level of earnings
(Bilanzgewinn) of the ultimate parent, as determined in
accordance with the HGB. All dividends must be approved by
shareholders.
The ordinary shareholders meeting held in February 2007 did not
authorize a dividend. No earnings are available for distribution
as a dividend for the 2007 fiscal year, since Infineon
Technologies AG on a stand-alone basis as the ultimate parent
incurred a cumulative loss (Bilanzverlust) as of
September 30, 2007.
F-45
Infineon
Technologies AG and Subsidiaries
Notes to the Consolidated Financial Statements
|
|
28.
|
Stock-based
Compensation
|
Effective October 1, 2005, the Company adopted
SFAS No. 123 (revised 2004) under the modified
prospective application method. Under this application, the
Company records stock-based compensation expense for all awards
granted on or after the date of adoption and for the portion of
previously granted awards that remained unvested at the date of
adoption. Stock-based compensation cost is measured at the grant
date, based on the fair value of the award, and is recognized as
expense over the period during which the employee is required to
provide service in exchange for the award. Amounts in periods
prior to the adoption of SFAS No. 123 (revised
2004) have not been restated and do not reflect the
recognition of stock-based compensation.
Infineon Stock
Option Plan
In 1999, the shareholders approved a long-term incentive plan
(LTI 1999 Plan), which provided for the granting of
non-transferable options to acquire ordinary shares over a
future period. Under the terms of the LTI 1999 Plan, the Company
could grant up to 48 million options over a five-year
period. The exercise price of each option equals
120 percent of the average closing price of the
Companys stock during the five trading days prior to the
grant date. Granted options vest at the latter of two years from
the grant date or the date on which the Companys stock
reaches the exercise price for at least one trading day. Options
expire seven years from the grant date.
In 2001, the Companys shareholders approved the
International Long-Term Incentive Plan (LTI 2001
Plan) which replaced the LTI 1999 Plan. Options previously
issued under the LTI 1999 Plan remain unaffected as to terms and
conditions; however, no additional options may be issued under
the LTI 1999 Plan. Under the terms of the LTI 2001 Plan, the
Company could grant up to 51.5 million options over a
five-year period. The exercise price of each option equals
105 percent of the average closing price of the
Companys stock during the five trading days prior to the
grant date. Granted options have a vesting period of between two
and four years, subject to the Companys stock reaching the
exercise price on at least one trading day, and expire seven
years from the grant date.
Under the LTI 2001 Plan, the Companys Supervisory Board
decided annually within 45 days after publication of the
financial results how many options to grant to the Management
Board. The Management Board, within the same period, decided how
many options to grant to eligible employees.
In 2006, the Companys shareholders approved the Stock
Option Plan 2006 (SOP 2006) which replaced the
LTI 2001 Plan. Under the terms of SOP 2006, the Company can
grant up to 13 million options over a three-year period.
The exercise price of each option equals 120 percent of the
average closing price of the Companys stock during the
five trading days prior to the grant date. Granted options are
only exercisable if the price of a share exceeds the trend of
the comparative index Philadelphia Semiconductor Index
(SOX) for at least three consecutive days on at
least one occasion during the life of the option. Granted
options have a vesting period of three years, subject to the
Companys stock reaching the exercise price on at least one
trading day, and expire six years from the grant date.
Under the SOP 2006, the Supervisory Board will decide
annually within a period of 45 days after publication of
the annual results or the results of the first or second
quarters of a fiscal year, but no later than two weeks before
the end of the quarter, how many options to grant to the
Management Board. During that same period the Management Board
may grant options to other eligible employees.
F-46
Infineon
Technologies AG and Subsidiaries
Notes to the Consolidated Financial Statements
A summary of the status of the LTI 1999 Plan, the LTI 2001 Plan,
and the SOP 2006 as of September 30, 2007, and changes
during the fiscal year then ended is presented below (options in
millions, exercise price in euro, intrinsic value in millions of
euro):
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Weighted-
|
|
|
Weighted-
|
|
|
|
|
|
|
|
|
|
average
|
|
|
average
|
|
|
Aggregated
|
|
|
|
Number of
|
|
|
exercise
|
|
|
remaining life
|
|
|
Intrinsic
|
|
|
|
options
|
|
|
price
|
|
|
(in years)
|
|
|
Value
|
|
|
Outstanding at September 30, 2006
|
|
|
44.8
|
|
|
|
18.12
|
|
|
|
3.54
|
|
|
|
14
|
|
Granted
|
|
|
2.3
|
|
|
|
13.30
|
|
|
|
|
|
|
|
|
|
Exercised
|
|
|
(2.1
|
)
|
|
|
8.91
|
|
|
|
|
|
|
|
|
|
Forfeited and expired
|
|
|
(5.6
|
)
|
|
|
33.58
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Outstanding at September 30, 2007
|
|
|
39.4
|
|
|
|
16.17
|
|
|
|
2.99
|
|
|
|
66
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Vested and expected to vest, net
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
of estimated forfeitures at
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
September 30, 2007
|
|
|
39.1
|
|
|
|
16.20
|
|
|
|
2.97
|
|
|
|
66
|
|
Exercisable at September 30, 2007
|
|
|
25.8
|
|
|
|
19.52
|
|
|
|
2.06
|
|
|
|
31
|
|
Options with an aggregate fair value of 42 million,
51 million and 32 million vested during
the fiscal years ended September 30, 2005, 2006 and 2007,
respectively. Options with a total intrinsic value of 0,
0 and 6 million were exercised during the
fiscal years ended September 30, 2005, 2006 and 2007,
respectively.
Changes in the Companys unvested options for the fiscal
year ended September 30, 2007 are summarized as follows
(options in million, fair values in euro, intrinsic value in
millions of euro):
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Weighted-
|
|
|
Weighted-
|
|
|
|
|
|
|
|
|
|
average
|
|
|
average
|
|
|
Aggregated
|
|
|
|
Number of
|
|
|
grant date
|
|
|
remaining life
|
|
|
Intrinsic
|
|
|
|
options
|
|
|
fair value
|
|
|
(in years)
|
|
|
Value
|
|
|
Unvested at September 30, 2006
|
|
|
19.2
|
|
|
|
4.11
|
|
|
|
5.11
|
|
|
|
11
|
|
Granted
|
|
|
2.3
|
|
|
|
2.03
|
|
|
|
|
|
|
|
|
|
Vested
|
|
|
(7.0
|
)
|
|
|
4.63
|
|
|
|
|
|
|
|
|
|
Forfeited
|
|
|
(0.9
|
)
|
|
|
3.91
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Unvested at September 30, 2007
|
|
|
13.6
|
|
|
|
3.50
|
|
|
|
4.77
|
|
|
|
35
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Unvested options expected to vest
|
|
|
13.2
|
|
|
|
3.53
|
|
|
|
4.81
|
|
|
|
34
|
|
The fair value of each option grant issued pursuant to the 1999
and 2001 Long-Term Incentive Plans was estimated on the grant
date using the Black-Scholes option-pricing model. Prior to the
adoption of SFAS No. 123 (revised 2004), Infineon
relied on historical volatility measures when estimating the
fair value of stock options granted to employees. Following the
implementation of SFAS No. 123 (revised 2004),
Infineon uses a combination of implied volatilities from traded
options on Infineons ordinary shares and historical
volatility when estimating the fair value of stock options
granted to employees, as it believes that this methodology
better reflects the expected future volatility of its stock. The
expected life of options granted was estimated based on
historical experience.
The fair value of each option grant issued pursuant to the Stock
Option Plan 2006 was estimated on the grant date using a Monte
Carlo simulation model. This model takes into account vesting
conditions relating to the performance of the SOX and its impact
on stock option fair value. The Company uses a combination of
implied volatilities from traded options on Infineons
ordinary shares and historical volatility when estimating the
fair value of stock options granted to employees, as it believes
that this methodology
F-47
Infineon
Technologies AG and Subsidiaries
Notes to the Consolidated Financial Statements
better reflects the expected future volatility of its stock. The
expected life of options granted was estimated using the Monte
Carlo simulation model.
Beginning on the date of adoption of SFAS No. 123
(revised 2004), forfeitures are estimated based on historical
experience; prior to the date of adoption, forfeitures were
recorded as they occurred. The risk-free rate is based on
treasury note yields at the time of grant for the estimated life
of the option. Infineon has not made any dividend payments
during the fiscal year ended September 30, 2007.
The following weighted-average assumptions were used in the fair
value calculation:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
2005
|
|
|
2006
|
|
|
2007
|
|
|
Weighted-average assumptions:
|
|
|
|
|
|
|
|
|
|
|
|
|
Risk-free interest rate
|
|
|
3.02%
|
|
|
|
3.08%
|
|
|
|
3.91%
|
|
Expected volatility, underlying shares
|
|
|
58%
|
|
|
|
43%
|
|
|
|
40%
|
|
Expected volatility, SOX index
|
|
|
|
|
|
|
|
|
|
|
36%
|
|
Forfeiture rate, per year
|
|
|
|
|
|
|
|
|
|
|
3.40%
|
|
Dividend yield
|
|
|
0%
|
|
|
|
0%
|
|
|
|
0%
|
|
Expected life in years
|
|
|
4.50
|
|
|
|
5.07
|
|
|
|
3.09
|
|
Weighted-average fair value per option at grant date in
|
|
|
4.03
|
|
|
|
3.19
|
|
|
|
2.03
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
As of September 30, 2007, there was a total of
12 million in unrecognized compensation expense
related to unvested stock options of Infineon, which is expected
to be recognized over a weighted-average period of 1 year.
Qimondas
Stock Option Plan
Qimonda shareholders approved a stock option plan (Qimonda
2006 SOP) during the 2006 fiscal year. Under the terms of
the Qimonda 2006 SOP, Qimonda can grant up to 6 million
non-transferable option rights over a three-year period which
grant the holder the right to receive ordinary shares issued by
Qimonda. The exercise price of each option equals
100 percent of the average closing price of Qimondas
ADSs on the New York Stock Exchange during the five trading days
prior to the grant date. Granted options are only exercisable if
the price of Qimonda ADSs as quoted on the New York Stock
Exchange exceeds the trend of the comparative index SOX for at
least three consecutive days on at least one occasion during the
life of the option. Granted options have a vesting period of
three years, subject to Qimondas ADSs reaching the
exercise price on at least one trading day, and expire six years
from the grant date. On November 24, 2006, Qimonda granted
1.9 million stock options to its employees under the
Qimonda 2006 SOP.
F-48
Infineon
Technologies AG and Subsidiaries
Notes to the Consolidated Financial Statements
A summary of the status of the Qimonda 2006 SOP as of
September 30, 2007, and changes during the fiscal year then
ended, is presented below (options in millions, exercise prices
in U.S. dollar, fair value in euro):
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Weighted-
|
|
|
Weighted-
|
|
|
|
|
|
|
|
|
average
|
|
|
average
|
|
|
Aggregated
|
|
|
|
Number of
|
|
exercise
|
|
|
remaining life
|
|
|
Intrinsic
|
|
|
|
options
|
|
price
|
|
|
(in years)
|
|
|
Value
|
|
|
Outstanding at September 30, 2006
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Granted
|
|
|
1.9
|
|
|
15.97
|
|
|
|
6.00
|
|
|
|
|
|
Exercised
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Forfeited and expired
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Outstanding at September 30, 2007
|
|
|
1.9
|
|
|
15.97
|
|
|
|
5.16
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Expected to vest, net of estimated forfeitures, at
September 30, 2007
|
|
|
1.7
|
|
|
15.97
|
|
|
|
5.16
|
|
|
|
|
|
Exercisable at September 30, 2007
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Changes of the Qimonda 2006 SOP unvested options for the fiscal
year ended September 30, 2007 are summarized as follows
(options in million, fair values in euro, intrinsic value in
millions of euro):
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Weighted-
|
|
|
Weighted-
|
|
|
|
|
|
|
|
|
average
|
|
|
average
|
|
|
Aggregated
|
|
|
|
Number of
|
|
grant date
|
|
|
remaining life
|
|
|
Intrinsic
|
|
|
|
options
|
|
fair value
|
|
|
(in years)
|
|
|
Value
|
|
|
Unvested at September 30, 2006
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Granted
|
|
|
1.9
|
|
|
3.23
|
|
|
|
6.00
|
|
|
|
|
|
Vested
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Forfeited
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Unvested at September 30, 2007
|
|
|
1.9
|
|
|
3.23
|
|
|
|
5.16
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Unvested options expected to vest
|
|
|
1.7
|
|
|
3.23
|
|
|
|
5.16
|
|
|
|
|
|
The fair value of each option grant issued pursuant to the
Qimonda 2006 SOP was estimated on the grant date using a Monte
Carlo simulation model. This model takes into account vesting
conditions relating to the performance of the SOX and its impact
on stock option fair value. Following the implementation of
SFAS No. 123 (revised 2004), Qimonda uses a
combination of implied and historical volatilities from traded
options on Qimondas peer group when estimating the fair
value of stock options granted to employees, as it believes that
this methodology better reflects the expected future volatility
of its stock. The peer group is a group of publicly listed
companies deemed to reflect the fundamentals of Qimondas
stock. Forfeitures are estimated based on historical experience.
The expected life of options granted was estimated using the
Monte Carlo simulation model. The risk-free rate is based on
treasury note yields at the time of grant for the estimated life
of the option. Qimonda has not made any dividend payments during
the fiscal year ended September 30, 2007.
F-49
Infineon
Technologies AG and Subsidiaries
Notes to the Consolidated Financial Statements
The following weighted average assumptions were used in the fair
value calculation:
|
|
|
|
|
|
2007
|
|
Weighted-average assumptions:
|
|
|
|
Risk-free interest rate
|
|
|
4.62%
|
Expected volatility, underlying ADS
|
|
|
45%
|
Expected volatility, SOX
|
|
|
29%
|
Forfeiture rate, per year
|
|
|
3.40%
|
Dividend yield
|
|
|
0%
|
Expected life in years
|
|
|
4.62
|
Weighted-average fair value per option at grant date in
|
|
|
3.23
|
|
|
|
|
As of September 30, 2007, there was a total of
4 million in unrecognized compensation expense
related to unvested stock options of Qimonda 2006 SOP, which is
expected to be recognized over a weighted average period of
2.27 years.
Stock-Based
Compensation Expense
Stock-based compensation expense was allocated as follows for
the fiscal years ended September 30, 2006 and 2007:
|
|
|
|
|
|
|
|
|
|
|
2006
|
|
|
2007
|
|
|
|
( in millions)
|
|
|
Compensation expense recognized:
|
|
|
|
|
|
|
|
|
Cost of goods sold
|
|
|
7
|
|
|
|
4
|
|
Selling, general and administrative expenses
|
|
|
12
|
|
|
|
7
|
|
Research and development expenses
|
|
|
9
|
|
|
|
6
|
|
|
|
|
|
|
|
|
|
|
Total stock-based compensation expense
|
|
|
28
|
|
|
|
17
|
|
|
|
|
|
|
|
|
|
|
Stock-based compensation effect on basic and diluted loss per
share in
|
|
|
(0.04
|
)
|
|
|
(0.02
|
)
|
|
|
|
|
|
|
|
|
|
Cash received from stock option exercises was 0 and
19 million during the fiscal years ended
September 30, 2006 and 2007, respectively. The amount of
stock-based compensation expense which was capitalized and
remained in inventories for the fiscal years ended
September 30, 2005, 2006 and 2007 was immaterial.
Stock-based compensation expense does not reflect any income tax
benefits, since stock options are granted in tax jurisdictions
where the expense is not deductible for tax purposes.
Prior to the 2006 fiscal year, the Company applied the
provisions of APB No. 25, as permitted under
SFAS No. 148.
If the Company had accounted for stock option grants and
employee stock purchases under its plans according to the fair
value method of SFAS No. 123, and thereby recognized
compensation expense based on the above fair values over the
respective option vesting periods, net loss and loss per share
F-50
Infineon
Technologies AG and Subsidiaries
Notes to the Consolidated Financial Statements
would have been increased to the pro forma amounts
indicated below, pursuant to the provisions of
SFAS No. 148:
|
|
|
|
|
|
2005
|
|
|
( in millions)
|
|
Net loss:
|
|
|
|
As reported
|
|
|
(312)
|
Deduct: Stock-based employee compensation expense included in
reported net loss, net of related tax effects
|
|
|
|
Add: Total stock-based employee compensation expense determined
under fair value based method for all awards, net of related tax
effects
|
|
|
(39)
|
|
|
|
|
Pro forma
|
|
|
(351)
|
|
|
|
|
Basic and diluted loss per share in :
|
|
|
|
As reported
|
|
|
(0.42)
|
Pro forma
|
|
|
(0.47)
|
|
|
29.
|
Other
Comprehensive Loss
|
The changes in the components of other comprehensive loss for
the years ended September 30, 2005, 2006 and 2007 are as
follows:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
2005
|
|
|
2006
|
|
|
2007
|
|
|
|
|
|
|
Tax
|
|
|
|
|
|
|
|
|
Tax
|
|
|
|
|
|
|
|
|
Tax
|
|
|
|
|
|
|
Pretax
|
|
|
effect
|
|
|
Net
|
|
|
Pretax
|
|
|
effect
|
|
|
Net
|
|
|
Pretax
|
|
|
effect
|
|
|
Net
|
|
|
|
( in millions)
|
|
|
Unrealized (losses) gains on securities:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Unrealized holding (losses) gains
|
|
|
13
|
|
|
|
(1
|
)
|
|
|
12
|
|
|
|
6
|
|
|
|
(1
|
)
|
|
|
5
|
|
|
|
(7
|
)
|
|
|
|
|
|
|
(7
|
)
|
Reclassification adjustment for losses (gains) included in net
income or loss
|
|
|
(4
|
)
|
|
|
|
|
|
|
(4
|
)
|
|
|
(13
|
)
|
|
|
1
|
|
|
|
(12
|
)
|
|
|
(6
|
)
|
|
|
1
|
|
|
|
(5
|
)
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Net unrealized (losses) gains, net
|
|
|
9
|
|
|
|
(1
|
)
|
|
|
8
|
|
|
|
(7
|
)
|
|
|
|
|
|
|
(7
|
)
|
|
|
(13
|
)
|
|
|
1
|
|
|
|
(12
|
)
|
Unrealized gains (losses) on cash flow hedges
|
|
|
(25
|
)
|
|
|
|
|
|
|
(25
|
)
|
|
|
5
|
|
|
|
|
|
|
|
5
|
|
|
|
2
|
|
|
|
|
|
|
|
2
|
|
Additional minimum pension liability/Defined benefit plans
|
|
|
(85
|
)
|
|
|
1
|
|
|
|
(84
|
)
|
|
|
(3
|
)
|
|
|
|
|
|
|
(3
|
)
|
|
|
95
|
|
|
|
(5
|
)
|
|
|
90
|
|
Foreign currency translation adjustment
|
|
|
64
|
|
|
|
|
|
|
|
64
|
|
|
|
(69
|
)
|
|
|
|
|
|
|
(69
|
)
|
|
|
(105
|
)
|
|
|
|
|
|
|
(105
|
)
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Other comprehensive loss
|
|
|
(37
|
)
|
|
|
|
|
|
|
(37
|
)
|
|
|
(74
|
)
|
|
|
|
|
|
|
(74
|
)
|
|
|
(21
|
)
|
|
|
(4
|
)
|
|
|
(25
|
)
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
F-51
Infineon
Technologies AG and Subsidiaries
Notes to the Consolidated Financial Statements
|
|
30.
|
Supplemental Cash
Flow Information
|
|
|
|
|
|
|
|
|
|
|
|
|
|
2005
|
|
2006
|
|
2007
|
|
|
|
( in millions)
|
|
|
Cash paid for:
|
|
|
|
|
|
|
|
|
|
|
Interest
|
|
|
91
|
|
|
116
|
|
|
100
|
|
Income taxes
|
|
|
79
|
|
|
117
|
|
|
134
|
|
Non-cash investing activities:
|
|
|
|
|
|
|
|
|
|
|
Construction grants deducted from cost of fixed assets
(note 7)
|
|
|
|
|
|
49
|
|
|
1
|
|
Molstanda (note 4)
|
|
|
|
|
|
|
|
|
(41
|
)
|
Non-cash financing activities:
|
|
|
|
|
|
|
|
|
|
|
Molstanda (note 4)
|
|
|
|
|
|
|
|
|
76
|
|
The Company has transactions in the normal course of business
with Associated and Related Companies (Related
Parties). The Company purchases certain of its raw
materials, especially chipsets, from, and sells certain of its
products to, Related Parties. Purchases and sales to Related
Parties are generally based on market prices or manufacturing
cost plus a
mark-up.
Transactions between the Company and ALTIS subsequent to the
consolidation of ALTIS during the first quarter of the 2006
fiscal year are no longer reflected as Related Party
transactions (see notes 5 and 17).
On April 3, 2006, Siemens disposed of its remaining
shareholding in the Company. Transactions between the Company
and Siemens subsequent to this date are no longer reflected as
Related Party transactions.
Related Party receivables at September 30, 2006 and 2007
consist of the following:
|
|
|
|
|
|
|
|
|
2006
|
|
2007
|
|
|
( in millions)
|
|
Current:
|
|
|
|
|
|
|
Associated and Related Companies trade (note 13)
|
|
|
8
|
|
|
16
|
Associated and Related Companies financial and other
receivables (note 15)
|
|
|
1
|
|
|
59
|
Employee receivables (note 15)
|
|
|
7
|
|
|
8
|
|
|
|
|
|
|
|
|
|
|
16
|
|
|
83
|
|
|
|
|
|
|
|
Non-current:
|
|
|
|
|
|
|
Employee receivables (note 18)
|
|
|
2
|
|
|
1
|
|
|
|
|
|
|
|
Total Related Party receivables
|
|
|
18
|
|
|
84
|
|
|
|
|
|
|
|
Related Party payables at September 30, 2006 and 2007
consist of the following:
|
|
|
|
|
|
|
|
|
2006
|
|
2007
|
|
|
( in millions)
|
|
Associated and Related Companies trade (note 20)
|
|
|
80
|
|
|
157
|
Associated and Related Companies financial and other
payables (note 22)
|
|
|
9
|
|
|
12
|
|
|
|
|
|
|
|
Total Related Party payables
|
|
|
89
|
|
|
169
|
|
|
|
|
|
|
|
F-52
Infineon
Technologies AG and Subsidiaries
Notes to the Consolidated Financial Statements
Related Party receivables and payables as of September 30,
2007, have been segregated first between amounts owed by or to
companies in which the Company has an ownership interest, and
second based on the underlying nature of the transactions. Trade
receivables and payables include amounts for the purchase and
sale of products and services. Financial and other receivables
and payables represent amounts owed relating to loans and
advances and accrue interest at interbank rates.
At September 30, 2007, current Associated and Related
Companies financial and other receivables included a
revolving term loan of 52 million due from ALTIS.
Transactions with Related Parties during the years ended
September 30, 2005, 2006 and 2007, include the following:
|
|
|
|
|
|
|
|
|
|
|
|
2005
|
|
2006
|
|
2007
|
|
|
( in millions)
|
|
Sales to Related Parties:
|
|
|
|
|
|
|
|
|
|
Siemens group companies
|
|
|
861
|
|
|
322
|
|
|
|
Associated and Related Companies
|
|
|
55
|
|
|
61
|
|
|
57
|
|
|
|
|
|
|
|
|
|
|
Total sales to Related Parties
|
|
|
916
|
|
|
383
|
|
|
57
|
|
|
|
|
|
|
|
|
|
|
Purchases from Related Parties:
|
|
|
|
|
|
|
|
|
|
Siemens group companies
|
|
|
226
|
|
|
73
|
|
|
|
Associated and Related
Companies(1)
|
|
|
615
|
|
|
575
|
|
|
593
|
|
|
|
|
|
|
|
|
|
|
Total purchases from Related Parties
|
|
|
841
|
|
|
648
|
|
|
593
|
|
|
|
|
|
|
|
|
|
|
|
|
(1) |
The decrease during the fiscal year ended September 30,
2006 is primarily related to the initial consolidation of ALTIS.
|
Purchases from Associated and Related Companies during the years
ended September 30, 2005, 2006 and 2007 are principally
related to products purchased from Inotera.
Sales to Siemens group companies include sales to the Siemens
group sales organizations for resale to third parties of
38 million and 21 million for the years
ended September 30, 2005 and 2006, respectively. Purchases
from Siemens group companies primarily include purchases of
fixed assets, inventory, IT services, and administrative
services.
Pension benefits provided by the Company are currently organized
primarily through defined benefit pension plans which cover a
significant portion of the Companys employees. Plan
benefits are principally based upon years of service. Certain
pension plans are based on salary earned in the last year or
last five years of employment, while others are fixed plans
depending on ranking (both salary level and position). The
measurement date for the Companys pension plans is
June 30.
In February 2007, the Company transferred the majority of its
existing domestic (German) pension plans into a new Infineon
pension plan with effect from October 1, 2006. Under the
new plan, employee benefits are predominantly based on
contributions made by the Company, although defined benefit
provisions are retained. The plan qualifies as a defined benefit
plan and, accordingly, the change from the previous defined
benefit plans is treated as a plan amendment pursuant to
SFAS No. 87. In comparison to the existing domestic
pension obligation, the additional impact on projected benefit
obligation consists of unrecognized prior service cost about
4 million and is reflected as a separate component of
accumulated other comprehensive income (see note 29), which
will be amortized as part of net periodic pension cost over the
expected years of future service.
As a result of the adoption of SFAS No. 158 as of the end
of the fiscal year ending September 30, 2007, the Company
must recognize the overfunded or underfunded status of a defined
benefit postretirement
F-53
Infineon
Technologies AG and Subsidiaries
Notes to the Consolidated Financial Statements
plan as an asset or liability in its consolidated balance sheet
and recognize the change in that funded status in the year in
which the changes occur through comprehensive income
(Recognition Provision). Actuarial gains and losses
and unrecognized prior service costs are to be recognized as a
component of other comprehensive income, net of tax.
The following table summarizes the incremental effect as of
September 30, 2007 resulting from the initial adoption of
SFAS No. 158.
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Adjustments to
|
|
|
|
|
|
|
Before adoption of
|
|
|
initially apply
|
|
|
After adoption of
|
|
|
|
SFAS No. 158
|
|
|
SFAS No. 158
|
|
|
SFAS No. 158
|
|
|
|
( in millions)
|
|
|
Prepaid pension costs
|
|
|
108
|
|
|
|
(108
|
)
|
|
|
|
|
Current deferred income taxes
|
|
|
2
|
|
|
|
(5
|
)
|
|
|
(3
|
)
|
Intangible asset
|
|
|
4
|
|
|
|
(4
|
)
|
|
|
|
|
Non-current pension asset
|
|
|
|
|
|
|
60
|
|
|
|
60
|
|
Short-term pension liability
|
|
|
|
|
|
|
(5
|
)
|
|
|
(5
|
)
|
Pension liabilities
|
|
|
(125
|
)
|
|
|
14
|
|
|
|
(111
|
)
|
Accumulated other comprehensive loss, net of tax
|
|
|
(3
|
)
|
|
|
48
|
|
|
|
45
|
|
F-54
Infineon
Technologies AG and Subsidiaries
Notes to the Consolidated Financial Statements
Information with respect to the Companys pension plans for
the years ended September 30, 2005, 2006 and 2007 is
presented for German (Domestic) plans and non-German
(Foreign) plans:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
2005
|
|
|
2006
|
|
|
2007
|
|
|
|
Domestic
|
|
|
Foreign
|
|
|
Domestic
|
|
|
Foreign
|
|
|
Domestic
|
|
|
Foreign
|
|
|
|
plans
|
|
|
plans
|
|
|
plans
|
|
|
plans
|
|
|
plans
|
|
|
plans
|
|
|
|
( in millions)
|
|
|
Accumulated benefit obligations end of year
|
|
|
(337
|
)
|
|
|
(64
|
)
|
|
|
(378
|
)
|
|
|
(61
|
)
|
|
|
(372
|
)
|
|
|
(60
|
)
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Change in projected benefit obligations:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Projected benefit obligations beginning of year
|
|
|
(271
|
)
|
|
|
(78
|
)
|
|
|
(392
|
)
|
|
|
(85
|
)
|
|
|
(443
|
)
|
|
|
(75
|
)
|
Service cost
|
|
|
(16
|
)
|
|
|
(7
|
)
|
|
|
(24
|
)
|
|
|
(5
|
)
|
|
|
(26
|
)
|
|
|
(3
|
)
|
Interest cost
|
|
|
(15
|
)
|
|
|
(4
|
)
|
|
|
(17
|
)
|
|
|
(4
|
)
|
|
|
(21
|
)
|
|
|
(4
|
)
|
Actuarial gains (losses)
|
|
|
(89
|
)
|
|
|
(2
|
)
|
|
|
(13
|
)
|
|
|
8
|
|
|
|
94
|
|
|
|
(1
|
)
|
Divestitures
|
|
|
1
|
|
|
|
4
|
|
|
|
|
|
|
|
|
|
|
|
2
|
|
|
|
|
|
Plan amendments
|
|
|
(8
|
)
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
(4
|
)
|
|
|
|
|
Benefits paid
|
|
|
2
|
|
|
|
2
|
|
|
|
3
|
|
|
|
2
|
|
|
|
5
|
|
|
|
3
|
|
Curtailment gain
|
|
|
4
|
|
|
|
1
|
|
|
|
|
|
|
|
7
|
|
|
|
|
|
|
|
1
|
|
Foreign currency effects
|
|
|
|
|
|
|
(1
|
)
|
|
|
|
|
|
|
2
|
|
|
|
|
|
|
|
3
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Projected benefit obligations end of year
|
|
|
(392
|
)
|
|
|
(85
|
)
|
|
|
(443
|
)
|
|
|
(75
|
)
|
|
|
(393
|
)
|
|
|
(76
|
)
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Change in fair value of plan assets:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Fair value at beginning of year
|
|
|
174
|
|
|
|
30
|
|
|
|
208
|
|
|
|
35
|
|
|
|
282
|
|
|
|
38
|
|
Contributions and transfers
|
|
|
17
|
|
|
|
4
|
|
|
|
63
|
|
|
|
4
|
|
|
|
65
|
|
|
|
5
|
|
Actual return on plan assets
|
|
|
19
|
|
|
|
2
|
|
|
|
14
|
|
|
|
2
|
|
|
|
27
|
|
|
|
4
|
|
Benefits paid
|
|
|
(2
|
)
|
|
|
(2
|
)
|
|
|
(3
|
)
|
|
|
(2
|
)
|
|
|
(5
|
)
|
|
|
(3
|
)
|
Foreign currency effects
|
|
|
|
|
|
|
1
|
|
|
|
|
|
|
|
(1
|
)
|
|
|
|
|
|
|
(1
|
)
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Fair value at end of year
|
|
|
208
|
|
|
|
35
|
|
|
|
282
|
|
|
|
38
|
|
|
|
369
|
|
|
|
43
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Funded status
|
|
|
(184
|
)
|
|
|
(50
|
)
|
|
|
(161
|
)
|
|
|
(37
|
)
|
|
|
(24
|
)
|
|
|
(33
|
)
|
Unrecognized actuarial (gains) losses
|
|
|
138
|
|
|
|
4
|
|
|
|
144
|
|
|
|
(8
|
)
|
|
|
33
|
|
|
|
(7
|
)
|
Unrecognized prior service cost (benefit)
|
|
|
14
|
|
|
|
(2
|
)
|
|
|
13
|
|
|
|
|
|
|
|
16
|
|
|
|
|
|
Post measurement date contributions
|
|
|
16
|
|
|
|
1
|
|
|
|
16
|
|
|
|
1
|
|
|
|
1
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Net asset (liability) recognized
|
|
|
(16
|
)
|
|
|
(47
|
)
|
|
|
12
|
|
|
|
(44
|
)
|
|
|
26
|
|
|
|
(40
|
)
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
The above amounts are recognized as follows in the accompanying
consolidated balance sheets as of September 30:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
2005
|
|
|
2006
|
|
|
2007
|
|
|
|
Domestic
|
|
|
Foreign
|
|
|
Domestic
|
|
|
Foreign
|
|
|
Domestic
|
|
|
Foreign
|
|
|
|
plans
|
|
|
plans
|
|
|
plans
|
|
|
plans
|
|
|
plans
|
|
|
plans
|
|
|
|
( in millions)
|
|
|
Prepaid pension cost
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
1
|
|
|
|
|
|
|
|
|
|
Intangible asset (note 15)
|
|
|
14
|
|
|
|
|
|
|
|
13
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Non-current pension asset
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
57
|
|
|
|
3
|
|
Current pension liability
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
(5
|
)
|
|
|
|
|
Pension liabilities
|
|
|
(115
|
)
|
|
|
(47
|
)
|
|
|
(89
|
)
|
|
|
(45
|
)
|
|
|
(75
|
)
|
|
|
(36
|
)
|
Accumulated other comprehensive income
|
|
|
85
|
|
|
|
|
|
|
|
88
|
|
|
|
|
|
|
|
49
|
|
|
|
(7
|
)
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Net asset (liability) recognized
|
|
|
(16
|
)
|
|
|
(47
|
)
|
|
|
12
|
|
|
|
(44
|
)
|
|
|
26
|
|
|
|
(40
|
)
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
F-55
Infineon
Technologies AG and Subsidiaries
Notes to the Consolidated Financial Statements
The amounts in accumulated other comprehensive income that are
expected to be recognized as components of the net periodic
benefit cost in the 2008 fiscal year are actuarial losses in an
amount of less than 1 million and prior service cost
in an amount of 1 million.
Information for pension plans with projected benefit obligations
and accumulated benefit obligations in excess of plan assets are
as follows:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
2005
|
|
2006
|
|
2007
|
|
|
Domestic
|
|
Foreign
|
|
Domestic
|
|
Foreign
|
|
Domestic
|
|
Foreign
|
|
|
plans
|
|
plans
|
|
plans
|
|
plans
|
|
plans
|
|
plans
|
|
|
( in millions)
|
|
Projected benefit obligation
|
|
|
392
|
|
|
85
|
|
|
443
|
|
|
64
|
|
|
108
|
|
|
63
|
Fair value of plan assets
|
|
|
208
|
|
|
35
|
|
|
282
|
|
|
26
|
|
|
27
|
|
|
26
|
Accumulated benefit obligations
|
|
|
337
|
|
|
57
|
|
|
378
|
|
|
54
|
|
|
99
|
|
|
47
|
Fair value of plan assets
|
|
|
208
|
|
|
26
|
|
|
282
|
|
|
26
|
|
|
27
|
|
|
19
|
The weighted-average assumptions used in calculating the
actuarial values for the pension plans are as follows:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
2005
|
|
2006
|
|
2007
|
|
|
Domestic
|
|
Foreign
|
|
Domestic
|
|
Foreign
|
|
Domestic
|
|
Foreign
|
|
|
plans
|
|
plans
|
|
plans
|
|
plans
|
|
plans
|
|
plans
|
|
Discount rate
|
|
|
4.5%
|
|
|
4.8%
|
|
|
4.8%
|
|
|
5.3%
|
|
|
5.5%
|
|
|
5.6%
|
Rate of compensation increase
|
|
|
2.5%
|
|
|
3.1%
|
|
|
2.5%
|
|
|
1.8%
|
|
|
2.5%
|
|
|
2.2%
|
Projected future pension increases
|
|
|
1.3%
|
|
|
2.2%
|
|
|
1.8%
|
|
|
2.2%
|
|
|
1.8%
|
|
|
2.7%
|
Expected return on plan assets
|
|
|
7.3%
|
|
|
6.9%
|
|
|
6.5%
|
|
|
6.9%
|
|
|
6.1%
|
|
|
6.9%
|
Discount rates are established based on prevailing market rates
for high-quality fixed-income instruments that, if the pension
benefit obligation were settled at the measurement date, would
provide the necessary future cash flows to pay the benefit
obligation when due. The Company believes short-term changes in
interest rates should not affect the measurement of the
Companys long-term obligation.
Investment
strategies
The investment approach of the Companys pension plans
involves employing a sufficient level of flexibility to capture
investment opportunities as they occur, while maintaining
reasonable parameters to ensure that prudence and care are
exercised in the execution of the investment program. The
Companys pension plans assets are invested with
several investment managers. The plans employ a mix of active
and passive investment management programs. Considering the
duration of the underlying liabilities, a portfolio of
investments of plan assets in equity securities, debt securities
and other assets is targeted to maximize the long-term return on
assets for a given level of risk. Investment risk is monitored
on an ongoing basis through periodic portfolio reviews, meetings
with investment managers and annual liability measurements.
Investment policies and strategies are periodically reviewed to
ensure the objectives of the plans are met considering any
changes in benefit plan design, market conditions or other
material items.
Expected
long-term rate of return on plan assets
Establishing the expected rate of return on pension assets
requires judgment. The Companys approach in determining
the long-term rate of return for plan assets is based upon
historical financial market relationships that have existed over
time, the types of investment classes in which pension plan
assets are invested, long-term investment strategies, as well as
the expected compounded return the Company can reasonably expect
the portfolio to earn over appropriate time periods.
F-56
Infineon
Technologies AG and Subsidiaries
Notes to the Consolidated Financial Statements
The Company reviews the expected long-term rate of return
annually and revises it as appropriate. Also, the Company
periodically commissions detailed asset/liability studies to be
performed by third-party professional investment advisors and
actuaries.
Plan asset
allocation
As of September 30, 2006 and 2007 the percentage of plan
assets invested and the targeted allocation in major asset
categories are as follows:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
2006
|
|
2007
|
|
Targeted Allocation
|
|
|
Domestic
|
|
Foreign
|
|
Domestic
|
|
Foreign
|
|
Domestic
|
|
Foreign
|
|
|
plans
|
|
plans
|
|
plans
|
|
plans
|
|
plans
|
|
plans
|
|
Equity securities
|
|
|
33%
|
|
|
59%
|
|
|
38%
|
|
|
58%
|
|
|
52%
|
|
|
57%
|
Debt securities
|
|
|
33%
|
|
|
26%
|
|
|
35%
|
|
|
24%
|
|
|
21%
|
|
|
22%
|
Other
|
|
|
34%
|
|
|
15%
|
|
|
27%
|
|
|
18%
|
|
|
27%
|
|
|
21%
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Total
|
|
|
100%
|
|
|
100%
|
|
|
100%
|
|
|
100%
|
|
|
100%
|
|
|
100%
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
The Companys asset allocation targets for its pension plan
assets are based on its assessment of business and financial
conditions, demographic and actuarial data, funding
characteristics, related risk factors, market sensitivity
analysis and other relevant factors. The overall allocation is
expected to help protect the plans funded status while
generating sufficiently stable real returns (i.e., net of
inflation) to meet current and future benefit payment needs. Due
to active portfolio management, the asset allocation may differ
from the target allocation up to certain limits for different
classes. As a matter of policy, the Companys pension plans
do not invest in shares of Infineon or Qimonda.
The components of net periodic pension cost for the years ended
September 30, 2005, 2006 and 2007 are as follows:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
2005
|
|
|
2006
|
|
|
2007
|
|
|
|
Domestic
|
|
|
Foreign
|
|
|
Domestic
|
|
|
Foreign
|
|
|
Domestic
|
|
|
Foreign
|
|
|
|
plans
|
|
|
plans
|
|
|
plans
|
|
|
plans
|
|
|
plans
|
|
|
plans
|
|
|
|
( in millions)
|
|
|
Service cost
|
|
|
(16
|
)
|
|
|
(7
|
)
|
|
|
(24
|
)
|
|
|
(5
|
)
|
|
|
(26
|
)
|
|
|
(3
|
)
|
Interest cost
|
|
|
(15
|
)
|
|
|
(4
|
)
|
|
|
(17
|
)
|
|
|
(4
|
)
|
|
|
(21
|
)
|
|
|
(4
|
)
|
Expected return on plan assets
|
|
|
13
|
|
|
|
2
|
|
|
|
13
|
|
|
|
3
|
|
|
|
17
|
|
|
|
3
|
|
Amortization of unrecognized prior service (cost) benefits
|
|
|
|
|
|
|
|
|
|
|
(1
|
)
|
|
|
2
|
|
|
|
(1
|
)
|
|
|
|
|
Amortization of unrecognized actuarial gains (losses)
|
|
|
(3
|
)
|
|
|
|
|
|
|
(7
|
)
|
|
|
|
|
|
|
(8
|
)
|
|
|
1
|
|
Curtailment gain recognized
|
|
|
1
|
|
|
|
1
|
|
|
|
|
|
|
|
3
|
|
|
|
|
|
|
|
1
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Net periodic pension cost (note 8)
|
|
|
(20
|
)
|
|
|
(8
|
)
|
|
|
(36
|
)
|
|
|
(1
|
)
|
|
|
(39
|
)
|
|
|
(2
|
)
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
The prior service costs relating to the pension plans are
amortized in equal amounts over the expected years of future
service of each active employee who is expected to receive
benefits from the pension plans.
Unrecognized gains or losses are included in the net pension
cost for the year, if as of the beginning of the year, the
unrecognized net gains or losses exceed 10 percent of the
greater of the projected benefit obligation or the market value
of the plan assets. The amortization is the excess divided by
the average remaining service period of active employees
expected to receive benefits under the plan.
Actuarial gains (losses) amounted to (91) million,
(5) million and 93 million for the fiscal
years ended September 30, 2005, 2006 and 2007,
respectively. The decrease in actuarial losses in the 2006
fiscal year was primarily the result of the increase in the
discount rate used to determine the benefit
F-57
Infineon
Technologies AG and Subsidiaries
Notes to the Consolidated Financial Statements
obligation. The increase in actuarial gains in the 2007 fiscal
year was primarily the result of the increase in the discount
rates used to determine the benefit obligation.
It is not planned nor anticipated that any plan assets will be
returned to any business entity during the next fiscal year.
In September 2006, Qimonda established a separate pension trust
for the purpose of funding future pension benefit payments for
its employees in Germany. A portion of the Companys
pension plan assets have been allocated to Qimonda for periods
prior to its formation based on the proportion of Qimondas
projected benefit obligation to the total Companys
projected benefit obligation. Accordingly, the Company
transferred 26 million in cash from its Pension Trust
into the Qimonda pension trust.
The effect of employee terminations, in connection with the
Companys restructuring plans (see note 9), on the
Companys pension obligation is reflected as a curtailment
in the years ended September 30, 2005, 2006 and 2007
pursuant to the provisions of SFAS No. 88
Employers Accounting for Settlements and Curtailments
of Defined Benefit Pension Plans and for Termination
Benefits.
The future benefit payments, which reflect future service, as
appropriate, that are expected to be paid from the
Companys pension plan for the next five fiscal years and
thereafter are as follows:
|
|
|
|
|
|
|
|
|
Domestic
|
|
Foreign
|
Years ending September 30,
|
|
plans
|
|
plans
|
|
|
( in millions)
|
|
2008
|
|
|
19
|
|
|
1
|
2009
|
|
|
17
|
|
|
2
|
2010
|
|
|
23
|
|
|
2
|
2011
|
|
|
26
|
|
|
2
|
2012
|
|
|
20
|
|
|
2
|
2013 - 2017
|
|
|
135
|
|
|
18
|
During the year ended September 30, 2002, the Company
established a deferred savings plan for its employees in
Germany, whereby a portion of the employees salary is
invested for a lump sum benefit payment including interest upon
retirement. The liability for such future payments of
17 million and 26 million as of
September 30, 2006 and 2007, respectively, is actuarially
determined and accounted for on the same basis as the
Companys other pension plans.
F-58
Infineon
Technologies AG and Subsidiaries
Notes to the Consolidated Financial Statements
|
|
33.
|
Financial
Instruments
|
The Company periodically enters into derivatives, including
foreign currency forward and option contracts as well as
interest rate swap agreements. The objective of these
transactions is to reduce the impact of interest rate and
exchange rate fluctuations on the Companys foreign
currency denominated net future cash flows. The Company does not
enter into derivatives for trading or speculative purposes.
Gains and losses on derivative financial instruments are
included in determining net loss, with those related to
operations included primarily in cost of goods sold, and those
related to financial activities included in other non-operating
income (expense).
The euro equivalent notional amounts in millions and fair values
of the Companys derivative instruments as of
September 30, 2006 and 2007 are as follows:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
2006
|
|
|
2007
|
|
|
|
Notional
|
|
Fair
|
|
|
Notional
|
|
Fair
|
|
|
|
amount
|
|
value
|
|
|
amount
|
|
value
|
|
|
|
( in millions)
|
|
|
Forward contracts sold:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
U.S. dollar
|
|
|
682
|
|
|
1
|
|
|
|
735
|
|
|
25
|
|
Japanese yen
|
|
|
30
|
|
|
|
|
|
|
17
|
|
|
|
|
Great Britain pound
|
|
|
1
|
|
|
|
|
|
|
|
|
|
|
|
Malaysian ringgit
|
|
|
6
|
|
|
|
|
|
|
3
|
|
|
|
|
Norwegian krone
|
|
|
|
|
|
|
|
|
|
2
|
|
|
|
|
Forward contracts purchased:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
U.S. dollar
|
|
|
209
|
|
|
(1
|
)
|
|
|
356
|
|
|
(20
|
)
|
Japanese yen
|
|
|
24
|
|
|
|
|
|
|
73
|
|
|
(2
|
)
|
Singapore dollar
|
|
|
27
|
|
|
|
|
|
|
24
|
|
|
|
|
Great Britain pound
|
|
|
7
|
|
|
|
|
|
|
6
|
|
|
|
|
Malaysian ringgit
|
|
|
35
|
|
|
|
|
|
|
83
|
|
|
(2
|
)
|
Norwegian krone
|
|
|
|
|
|
|
|
|
|
7
|
|
|
|
|
Other currencies
|
|
|
|
|
|
|
|
|
|
1
|
|
|
|
|
Currency Options sold:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
U.S. dollar
|
|
|
259
|
|
|
(5
|
)
|
|
|
|
|
|
|
|
Currency Options purchased:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
U.S. dollar
|
|
|
252
|
|
|
2
|
|
|
|
|
|
|
|
|
Interest rate swaps
|
|
|
1,200
|
|
|
5
|
|
|
|
700
|
|
|
(10
|
)
|
Other
|
|
|
218
|
|
|
9
|
|
|
|
231
|
|
|
20
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Fair value, net
|
|
|
|
|
|
11
|
|
|
|
|
|
|
11
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
The Company entered into interest rate swap agreements with
independent financial institutions during the year ended
September 30, 2004, which were designated as a cash flow
hedge of interest rate fluctuations on forecasted future lease
payments during the first 10 years of the Campeon lease
agreement (see note 35). The ineffective portion of the
cash flow hedge was 0 for the years ended
September 30, 2005, 2006, and 2007. The effective portion
of (22) million was deferred in other comprehensive
income until the commencement of the lease in the first quarter
of the 2006 fiscal year, and is being amortized ratably into
lease expense over the lease term of 15 years.
Fair values of financial instruments are determined using quoted
market prices or discounted cash flows. The fair value of the
Companys unsecured term loans and interest-bearing notes
payable approximate their carrying values as their interest
rates approximate those which could be obtained currently. At
September 30, 2007, the subordinated convertible and
exchangeable notes, both due 2010, were trading at a
22.1 percent and a 2.5 percent premium to par,
respectively, based on quoted market values. The fair values of
the Companys cash and cash equivalents, receivables and
payables, as well as
F-59
Infineon
Technologies AG and Subsidiaries
Notes to the Consolidated Financial Statements
related-party receivables and payables and other financial
instruments approximated their carrying values due to their
short-term nature. Marketable securities are recorded at fair
value (see note 12).
Financial instruments that expose the Company to credit risk
consist primarily of trade receivables, cash equivalents,
marketable securities and financial derivatives. Concentrations
of credit risks with respect to trade receivables are limited by
the large number of geographically diverse customers that make
up the Companys customer base. The Company controls credit
risk through credit approvals, credit limits and monitoring
procedures, as well as comprehensive credit evaluations for all
customers. Related Parties account for a considerable portion of
sales and trade receivables. The credit risk with respect to
cash equivalents, marketable securities and financial
derivatives is limited by transactions with a number of large
international financial institutions, with pre-established
limits. The Company does not believe that there is significant
risk of non-performance by these counterparties because the
Company monitors their credit risk and limits the financial
exposure and the amounts of agreements entered into with any one
financial institution.
In order to remain competitive, the Company must continue to
make substantial investments in process technology and research
and development. Portions of these investments might not be
recoverable if these research and development efforts fail to
gain market acceptance or if markets significantly deteriorate.
Due to the high-technology nature of the Companys
operations, intellectual property is an integral part of the
Companys business. The Company has intellectual property
which it has self-developed, purchased or licensed from third
parties. The Company is exposed to infringements by others of
such intellectual property rights. Conversely, the Company is
exposed to assertions by others of infringement by the Company
of their intellectual property rights.
The Company, through its use of third-party foundry and joint
venture arrangements, uses a significant portion of
manufacturing capacity that is outside of its direct control. As
a result, the Company is reliant upon such other parties for the
timely and uninterrupted supply of products and is exposed, to a
certain extent, to fluctuations in product procurement cost.
The Company has established policies and procedures which serve
as business conduct guidelines for its employees. Should these
guidelines not be adhered to, the Company could be exposed to
risks relating to wrongful actions by its employees.
Approximately 8,600 of the Companys employees are covered
by collective bargaining agreements. The collective bargaining
agreements pertain primarily to certain of the Companys
non-management employees in Germany (affecting approximately
4,900 employees), Austria (affecting approximately
2,500 employees) and France (affecting approximately
1,200 employees, including ALTIS). The agreement in Germany
is perpetual, but can be terminated by the trade union with a
notice of two months prior to October 31, 2008. The
agreement in Austria expires on May 1, 2008. The minimum
salaries stipulated in the agreement in France are subject to
yearly revision coming into effect on January 1 each year. The
provisions of these agreements generally remain in effect until
replaced by a subsequent agreement. Agreements for periods after
expiration are to be negotiated with the respective trade unions
through a process of collective negotiations.
|
|
35.
|
Commitments and
Contingencies
|
Litigation and
Investigations
In September 2004, the Company entered into a plea agreement
with the Antitrust Division of the U.S. Department of
Justice (DOJ) in connection with its investigation
into alleged antitrust violations in the
F-60
Infineon
Technologies AG and Subsidiaries
Notes to the Consolidated Financial Statements
DRAM industry. Pursuant to this plea agreement, the Company
agreed to plead guilty to a single count of conspiring with
other unspecified DRAM manufacturers to fix the prices of DRAM
products between July 1, 1999 and June 15, 2002, and
to pay a fine of $160 million. The fine plus accrued
interest is being paid in equal annual installments through
2009. The Company has a continuing obligation to cooperate with
the DOJ in its ongoing investigation of other participants in
the DRAM industry. The price fixing charges related to DRAM
sales to six Original Equipment Manufacturer (OEM)
customers that manufacture computers and servers. The Company
has entered into settlement agreements with five of these OEM
customers and is considering the possibility of a settlement
with the remaining OEM customer, which purchased only a very
small volume of DRAM products from the Company. The Company has
secured individual settlements with eight direct customers in
addition to those OEM customers.
Subsequent to the commencement of the DOJ investigation, a
number of putative class action lawsuits were filed against the
Company, its U.S. subsidiary Infineon Technologies North
America Corporation (IF North America) and other
DRAM suppliers.
Sixteen cases were filed between June and September 2002 in
several U.S. federal district courts, purporting to be on
behalf of a class of individuals and entities who purchased DRAM
directly from the various DRAM suppliers during a specified time
period (the Direct U.S. Purchaser Class), alleging
price-fixing in violation of the Sherman Act and seeking treble
damages in unspecified amounts, costs, attorneys fees, and
an injunction against the allegedly unlawful conduct. In
September 2002, the Judicial Panel on Multi-District Litigation
ordered that these federal cases be transferred to the
U.S. District Court for the Northern District of California
for coordinated or consolidated pre-trial proceedings as part of
a Multi District Litigation (MDL).
In September 2005, the Company and IF North America entered into
a definitive settlement agreement with counsel to the Direct
U.S. Purchaser Class (subject to approval by the
U.S. District Court and to an opportunity for individual
class members to opt out of the settlement). The settlement was
approved on November 1, 2006. The court entered final
judgment and dismissed the class action claims with prejudice in
November 2006. Under the terms of the settlement agreement the
Company agreed to pay approximately $21 million. In
addition to this settlement payment, the Company agreed to pay
an additional amount if it is proven that sales of DRAM products
to the settlement class (after opt-outs) during the settlement
period exceeded $208.1 million. The additional amount
payable would be calculated by multiplying by 10.53 percent
the amount by which those sales exceed $208.1 million. The
Company does not currently expect to pay any additional amount
to the class.
In April 2006, Unisys Corporation (Unisys) filed a
complaint against the Company and IF North America, among other
DRAM suppliers, alleging state and federal claims for price
fixing and seeking recovery as both a direct and indirect
purchaser of DRAM. On May 5, 2006, Honeywell International,
Inc. (Honeywell) filed a complaint against the
Company and IF North America, among other DRAM suppliers,
alleging a claim for price fixing under federal law, and seeking
recovery as a direct purchaser of DRAM. Both Unisys and
Honeywell opted out of the Direct U.S. Purchaser Class and
settlement, so their claims are not barred by the settlement
with the Direct U.S. Purchaser Class. Both of these
complaints were filed in the Northern District of California and
have been related to the MDL described above. In April 2007 the
court dismissed the initial complaint with leave to amend.
Unisys filed a First Amended Complaint in May 2007. The Company,
IF North America, and the other defendants again filed a motion
to dismiss certain portions of the Unisys First Amended
Complaint in June 2007. After Honeywell had filed a stipulation
of dismissal without prejudice of its lawsuit against Infineon,
the court entered the dismissal order in April 2007.
In February and March 2007 four more opt-out cases were filed by
All American Semiconductor, Inc., Edge Electronics, Inc., Jaco
Electronics, Inc., and DRAM Claims Liquidation Trust, by its
Trustee, Wells Fargo Bank, N.A. The All American Semiconductor
complaint alleges claims for price-fixing under the
F-61
Infineon
Technologies AG and Subsidiaries
Notes to the Consolidated Financial Statements
Sherman Act. The Edge Electronics, Jaco Electronics and DRAM
Claims Liquidation Trust complaints allege state and federal
claims for price-fixing. All four cases were filed in the
Northern District of California and have been related to the MDL
described above. As with Unisys, the claims of these plaintiffs
are not barred by the settlement with the Direct
U.S. Purchaser Class, since they opted out of the Direct
U.S. Purchaser Class and settlement.
Based upon the courts order dismissing portions of the
initial Unisys complaint described above, the plaintiffs in all
four of these opt-out cases filed amended complaints in May
2007. In June 2007, Infineon and IF North America answered the
amended complaints filed by All American Semiconductor, Inc.,
Edge Electronics, Inc., and Jaco Electronics, Inc. and along
with its co-defendants filed a joint motion to dismiss certain
portions of the DRAM Claims Liquidation Trust amended complaint
(see note 37).
Sixty-four additional cases were filed between August and
October 2005 in numerous federal and state courts throughout the
United States. Each of these state and federal cases (except for
one relating to foreign purchasers, which was subsequently
dismissed with prejudice and as to which the plaintiffs have
filed notice of appeal) purports to be on behalf of a class of
individuals and entities who indirectly purchased DRAM in the
United States during specified time periods commencing in or
after 1999 (the Indirect U.S. Purchaser Class). The
complaints variously allege violations of the Sherman Act,
Californias Cartwright Act, various other state laws,
unfair competition law and unjust enrichment and seek treble
damages in generally unspecified amounts, restitution, costs,
attorneys fees and injunctions against the allegedly
unlawful conduct.
Twenty-three of the state and federal court cases were
subsequently ordered transferred to the U.S. District Court
for the Northern District of California for coordinated and
consolidated pretrial proceedings as part of the multi-district
litigation described above. Nineteen of the twenty-three
transferred cases are currently pending in the MDL litigation.
The pending California state cases were coordinated and
transferred to San Francisco County Superior Court for
pre-trial proceedings. The plaintiffs in the indirect purchaser
cases outside California agreed to stay proceedings in those
cases in favor of proceedings on the indirect purchaser cases
pending as part of the MDL pre-trial proceedings. The defendants
have filed two motions for judgment on the pleadings directed at
several of the claims. Hearing on those motions took place in
December 2006.
The court entered an order in June 2007 granting in part and
denying in part the defendants motions for judgment on the
pleadings. The order dismissed a large percentage of the
indirect purchaser plaintiffs claims, and granted leave to
amend with regard to claims under three specific state statutes.
The court ruled that the indirect purchaser plaintiffs must file
a motion for leave to amend the complaint with regard to any of
the other dismissed claims. In June 2007, the indirect purchaser
plaintiffs filed both a First Amended Complaint and a motion for
leave to file a Second Amended Complaint that attempts to
resurrect some of the claims that were dismissed. On
August 17, 2007, the court entered an order granting the
motion to file the Second Amended Complaint, which re-pleaded
part of the previously dismissed claims.
In July 2006, the New York state attorney general filed an
action in the U.S. District Court for the Southern District
of New York against the Company, IF North America and several
other DRAM manufacturers on behalf of New York governmental
entities and New York consumers who purchased products
containing DRAM beginning in 1998. The plaintiffs allege
violations of state and federal antitrust laws arising out of
the same allegations of DRAM price-fixing and artificial price
inflation practices discussed above, and seek recovery of actual
and treble damages in unspecified amounts, penalties, costs
(including attorneys fees) and injunctive and other
equitable relief. In October 2006, this action was made part of
the MDL proceeding described above. In July 2006, the attorneys
general of Alaska, Arizona, Arkansas, California, Colorado,
Delaware, Florida, Hawaii, Idaho, Illinois, Iowa, Louisiana,
Maryland, Massachusetts, Michigan, Minnesota, Mississippi,
Nebraska, Nevada, New Mexico, North Dakota, Ohio, Oklahoma,
Oregon, Pennsylvania, South Carolina, Tennessee, Texas, Utah,
Vermont, Virginia, Washington,
F-62
Infineon
Technologies AG and Subsidiaries
Notes to the Consolidated Financial Statements
West Virginia and Wisconsin filed a lawsuit in the
U.S. District Court for the Northern District of California
against the Company, IF North America and several other DRAM
manufacturers on behalf of governmental entities, consumers and
businesses in each of those states who purchased products
containing DRAM beginning in 1998. In September 2006, the
complaint was amended to add claims by the attorneys general of
Kentucky, Maine, New Hampshire, North Carolina, the Northern
Mariana Islands and Rhode Island. This action is based on state
and federal law claims relating to the same alleged
anticompetitive practices in the sale of DRAM and plaintiffs
seek recovery of actual and treble damages in unspecified
amounts, penalties, costs (including attorneys fees) and
injunctive and other relief. In October 2006 Infineon joined the
other defendants in filing motions to dismiss several of the
claims alleged in these two actions. On August 31, 2007,
the court entered orders granting the motions in part and
denying the motions in part. The courts order dismissed
the claims on behalf of consumers, businesses and governmental
entities in a number of states, and dismissed certain other
claims with leave to amend, with any amended complaints to be
filed by October 1, 2007. Between June 25 and
August 15, 2007, the state attorneys general of four
states, Alaska, Ohio, New Hampshire and Texas, filed requests
for dismissal of their claims without prejudice.
In April 2003, the Company received a request for information
from the European Commission (the Commission) to
enable the Commission to assess the compatibility with the
Commissions rules on competition of certain practices of
which the Commission has become aware in the European market for
DRAM products. In light of its plea agreement with the DOJ, the
Company made an accrual during the 2004 fiscal year for an
amount representing the probable minimum fine that may be
imposed as a result of the Commissions investigation. Any
fine actually imposed by the Commission may be significantly
higher than the reserve established, although the Company cannot
more accurately estimate the amount of the actual fine. The
Company is fully cooperating with the Commission in its
investigation.
In May 2004, the Canadian Competition Bureau advised IF North
America that it, its affiliates and present and past directors,
officers and employees are among the targets of a formal inquiry
into an alleged conspiracy to prevent or lessen competition
unduly in the production, manufacture, sale or supply of DRAM,
contrary to the Canadian Competition Act. No formal steps (such
as subpoenas) have been taken by the Competition Bureau to date.
The Company is fully cooperating with the Competition Bureau in
its inquiry.
Between December 2004 and February 2005 two putative class
proceedings were filed in the Canadian province of Quebec, and
one was filed in each of Ontario and British Columbia against
the Company, IF North America and other DRAM manufacturers on
behalf of all direct and indirect purchasers resident in Canada
who purchased DRAM or products containing DRAM between July 1999
and June 2002, seeking damages, investigation and administration
costs, as well as interest and legal costs. Plaintiffs primarily
allege conspiracy to unduly restrain competition and to
illegally fix the price of DRAM.
Between September and November 2004 seven securities class
action complaints were filed against the Company and current or
former officers in U.S. federal district courts, later
consolidated in the Northern District of California, on behalf
of a putative class of purchasers of the Companys
publicly-traded securities who purchased them during the period
from March 2000 to July 2004 (the Securities
Class Actions). The consolidated amended complaint
alleges violations of the U.S. securities laws and asserts
that the defendants made materially false and misleading public
statements about the Companys historical and projected
financial results and competitive position because they did not
disclose the Companys alleged participation in DRAM
price-fixing activities and that, by fixing the price of DRAM,
defendants manipulated the price of the Companys
securities, thereby injuring its shareholders. The plaintiffs
seek unspecified compensatory damages, interest, costs and
attorneys fees. In September 2006, the court dismissed the
complaint with leave to amend. In October 2006 the plaintiffs
filed a second amended complaint. In March 2007, pursuant to a
stipulation agreed with the defendants, the plaintiffs withdrew
the second amended complaint and were granted a motion for leave
to file a third amended
F-63
Infineon
Technologies AG and Subsidiaries
Notes to the Consolidated Financial Statements
complaint. Plaintiffs filed a third amended complaint in July
2007. A hearing is scheduled for November 19, 2007.
The Companys directors and officers insurance
carriers have denied coverage in the Securities
Class Actions and the Company filed suit against the
carriers in December 2005 and August 2006. The Companys
claims against one D&O insurance carrier were finally
dismissed in May 2007. The claim against the other insurance
carrier is still pending.
In April 2007, Lin Packaging Technologies, Ltd.
(Lin) filed a lawsuit against the Company, IF North
America and an additional DRAM manufacturer in the
U.S. District Court for the Eastern District of Texas,
alleging that certain DRAM products infringe two Lin patents.
Accruals and
the Potential Effect of these Lawsuits
Liabilities related to legal proceedings are recorded when it is
probable that a liability has been incurred and the associated
amount can be reasonably estimated. Where the estimated amount
of loss is within a range of amounts and no amount within the
range is a better estimate than any other amount, the minimum
amount is accrued. As of September 30, 2007, the Company
had accrued liabilities in the amount of 95 million
related to the DOJ and European antitrust investigations and the
direct and indirect purchaser litigation and settlements
described above, as well as for legal expenses for the DOJ
related and securities class action complaints.
As additional information becomes available, the potential
liability related to these matters will be reassessed and the
estimates revised, if necessary. These accrued liabilities would
be subject to change in the future based on new developments in
each matter, or changes in circumstances, which could have a
material adverse effect on the Companys financial
condition and results of operations.
An adverse final resolution of the investigations or lawsuits
described above could result in significant financial liability
to, and other adverse effects on, the Company, which would have
a material adverse effect on its results of operations,
financial condition and cash flows. In each of these matters,
the Company is continuously evaluating the merits of its
respective claims and defending itself vigorously or seeking to
arrive at alternative resolutions in the best interest of the
Company, as it deems appropriate. Irrespective of the validity
or the successful assertion of the claims described above, the
Company could incur significant costs with respect to defending
against or settling such claims, which could have a material
adverse effect on its results of operations, financial condition
and cash flows.
The Company is subject to various other lawsuits, legal actions,
claims and proceedings related to products, patents,
environmental matters, and other matters incidental to its
businesses. The Company has accrued a liability for the
estimated costs of adjudication of various asserted and
unasserted claims existing as of the balance sheet date. Based
upon information presently known to management, the Company does
not believe that the ultimate resolution of such other pending
matters will have a material adverse effect on the
Companys financial position, although the final resolution
of such matters could have a material adverse effect on the
Companys results of operations or cash flows in the period
of settlement.
F-64
Infineon
Technologies AG and Subsidiaries
Notes to the Consolidated Financial Statements
Contractual
Commitments
The following table summarizes the Companys commitments
with respect to external parties as of September 30,
2007(1)(2):
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Payments Due by Period
|
|
|
|
|
Less
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
than
|
|
1-2
|
|
2-3
|
|
3-4
|
|
4-5
|
|
After
|
|
|
Total
|
|
1 year
|
|
years
|
|
years
|
|
years
|
|
years
|
|
5 years
|
|
|
( in millions)
|
|
Contractual commitments:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Operating lease payments
|
|
|
870
|
|
|
90
|
|
|
78
|
|
|
65
|
|
|
62
|
|
|
57
|
|
|
518
|
Unconditional purchase commitments
|
|
|
1,212
|
|
|
1,161
|
|
|
29
|
|
|
11
|
|
|
6
|
|
|
1
|
|
|
4
|
Other long-term commitments
|
|
|
77
|
|
|
71
|
|
|
2
|
|
|
2
|
|
|
1
|
|
|
1
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Total Commitments
|
|
|
2,159
|
|
|
1,322
|
|
|
109
|
|
|
78
|
|
|
69
|
|
|
59
|
|
|
522
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
(1)
|
Certain payments of obligations or expirations of commitments
that are based on the achievement of milestones or other events
that are not date-certain are included for purposes of this
table based on estimates of the reasonably likely timing of
payments or expirations in the particular case. Actual outcomes
could differ from those estimates.
|
|
(2)
|
Product purchase commitments associated with continuing capacity
reservation agreements are not included in this table, since the
purchase prices are based, in part, on future market prices, and
are accordingly not accurately quantifiable at
September 30, 2007. Purchases under such arrangements
aggregated 1,165 million for the year ended
September 30, 2007.
|
The Company has capacity reservation agreements with certain
Associated Companies and external foundry suppliers for the
manufacturing and testing of semiconductor products. These
agreements generally are greater than one year in duration and
are renewable. Under the terms of these agreements, the Company
has agreed to purchase a portion of their production output
based, in part, on market prices.
Purchases under these agreements are recorded as incurred in the
normal course of business. The Company assesses its anticipated
purchase requirements on a regular basis to meet customer demand
for its products. An assessment of losses under these agreements
is made on a regular basis in the event that either budgeted
purchase quantities fall below the specified quantities or
market prices for these products fall below the specified prices.
Other
Contingencies
The following table summarizes the Companys contingencies
with respect to external parties, other than those related to
litigation, as of September 30,
2007(1):
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Expirations by Period
|
|
|
|
|
Less
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
than
|
|
1-2
|
|
2-3
|
|
3-4
|
|
4-5
|
|
After
|
|
|
Total
|
|
1 year
|
|
years
|
|
years
|
|
years
|
|
years
|
|
5 years
|
|
|
( in millions)
|
|
Maximum potential future payments:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Guarantees(2)
|
|
|
209
|
|
|
25
|
|
|
22
|
|
|
1
|
|
|
14
|
|
|
30
|
|
|
117
|
Contingent government
grants(3)
|
|
|
462
|
|
|
125
|
|
|
40
|
|
|
56
|
|
|
171
|
|
|
30
|
|
|
40
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Total contingencies
|
|
|
671
|
|
|
150
|
|
|
62
|
|
|
57
|
|
|
185
|
|
|
60
|
|
|
157
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
(1)
|
Certain expirations of contingencies that are based on the
achievement of milestones or other events that are not
date-certain are included for purposes of this table based on
estimates of the reasonably likely timing of expirations in the
particular case. Actual outcomes could differ from those
estimates.
|
|
(2)
|
Guarantees are mainly issued for the payment of import duties,
rentals of buildings, and contingent obligations related to
government grants received.
|
|
(3)
|
Contingent government grants refer to amounts previously
received, related to the construction and financing of certain
production facilities, which are not otherwise guaranteed and
could be refundable if the total project requirements are not
met.
|
F-65
Infineon
Technologies AG and Subsidiaries
Notes to the Consolidated Financial Statements
The Company has received government grants and subsidies related
to the construction and financing of certain of its production
facilities. These amounts are recognized upon the attainment of
specified criteria. Certain of these grants have been received
contingent upon the Company maintaining compliance with certain
project-related requirements for a specified period after
receipt. The Company is committed to maintaining these
requirements. Nevertheless, should such requirements not be met,
as of September 30, 2007, a maximum of
462 million of these subsidies could be refundable.
On December 23, 2003, the Company entered into a long-term
operating lease agreement with MoTo Objekt Campeon
GmbH & Co. KG (MoTo) to lease an office
complex constructed by MoTo south of Munich, Germany. The office
complex, called Campeon, enables the Company to centralize the
majority of its Munich-area employees in one central physical
working environment. MoTo was responsible for the construction,
which was completed in the second half of 2005. The Company has
no obligations with respect to financing MoTo and has provided
no guarantees related to the construction. The Company occupied
Campeon under an operating lease arrangement in October 2005 and
completed the gradual move of its employees to this new location
in the 2006 fiscal year. The complex was leased for a period of
20 years. After year 15, the Company has a non-bargain
purchase option to acquire the complex or otherwise continue the
lease for the remaining period of five years. Pursuant to the
agreement, the Company placed a rental deposit of
75 million in escrow, which was included in
restricted cash as of September 30, 2007. Lease payments
are subject to limited adjustment based on specified financial
ratios related to the Company. The agreement was accounted for
as an operating lease, in accordance with SFAS No. 13,
with monthly lease payments expensed on a straight-line basis
over the lease term.
The Company through certain of its sales and other agreements
may, in the normal course of business, be obligated to indemnify
its counterparties under certain conditions for warranties,
patent infringement or other matters. The maximum amount of
potential future payments under these types of agreements is not
predictable with any degree of certainty, since the potential
obligation is contingent on conditions that may or may not occur
in future, and depends on specific facts and circumstances
related to each agreement. Historically, payments made by the
Company under these types of agreements have not had a material
adverse effect on the Companys business, results of
operations or financial condition. A tabular reconciliation of
the changes in the aggregate product warranty liability for the
year ended September 30, 2007 is presented in note 21.
|
|
36.
|
Operating Segment
and Geographic Information
|
The Company has reported its operating segment and geographic
information in accordance with SFAS No. 131,
Disclosure about Segments of an Enterprise and Related
Information.
The Companys current organizational structure became
effective on May 1, 2006, following the legal separation of
its memory products business into the stand-alone legal entity,
Qimonda AG. The results of prior periods have been reclassified
to conform to the current period presentation, as well as to
facilitate analysis of current and future operating segment
information. As a result of the reorganization, certain
corporate overhead expenses are no longer apportioned to Qimonda
and are instead allocated to Infineons logic segments.
The Company operates primarily in three major operating
segments, two of which are application focused: Automotive,
Industrial & Multimarket, and Communication Solutions;
and one of which is product focused: Qimonda. Further, certain
of the Companys remaining activities for product lines
sold, for which there are no continuing contractual commitments
subsequent to the divestiture date, as well as new business
activities also meet the SFAS No. 131 definition of an
operating segment, but do not meet the requirements of a
reportable segment as specified in SFAS No. 131.
Accordingly, these segments are combined and disclosed in the
Other Operating Segments category pursuant to
SFAS No. 131.
F-66
Infineon
Technologies AG and Subsidiaries
Notes to the Consolidated Financial Statements
Following the completion of the Qimonda carve-out the Other
Operating Segments for the 2005, 2006 and 2007 fiscal years
include net sales and earnings that Infineons
200-millimeter production facility in Dresden records from the
sale of wafers to Qimonda under foundry agreements. The
Corporate and Eliminations segment reflects the elimination of
these intra-group net sales and earnings.
The accounting policies of the segments are substantially the
same as described in the summary of significant accounting
policies (see note 2). Each of the segments has a segment
manager reporting directly to the Chief Executive Officer and
Chief Financial Officer, who have been collectively identified
as the Chief Operating Decision Maker (CODM). The
CODM makes decisions about resources to be allocated to the
segments and assesses their performance using revenues and EBIT.
The CODM does not review asset information by segment nor does
he evaluate the segments on these criteria on a regular basis,
except that the CODM is provided information regarding certain
inventories on an operating segment basis. The Company does,
however, allocate depreciation expense to the operating segments
based on production volume and product mix using standard costs.
Information with respect to the Companys operating
segments follows:
Automotive,
Industrial & Multimarket
The Automotive, Industrial & Multimarket segment
designs, develops, manufactures and markets semiconductors and
complete system solutions primarily for use in automotive,
industrial and security applications, and applications with
customer-specific product requirements.
Communication
Solutions
The Communication Solutions segment designs, develops,
manufactures and markets a wide range of ICs, other
semiconductors and complete system solutions for wireline and
wireless communication applications.
Qimonda
Qimonda designs memory technologies and develops, manufactures,
and markets a large variety of memory products on a module,
component and chip level.
Other Operating
Segments
Remaining activities for certain product lines that have been
disposed of, as well as other business activities, are included
in the Other Operating Segments.
Selected segment data for the years ended September 30,
2005, 2006 and 2007 is as follows:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
2005
|
|
|
2006
|
|
|
2007
|
|
|
|
( in millions)
|
|
|
Net sales:
|
|
|
|
|
|
|
|
|
|
|
|
|
Automotive, Industrial & Multimarket
|
|
|
2,516
|
|
|
|
2,839
|
|
|
|
3,017
|
|
Communication
Solutions(1)
|
|
|
1,391
|
|
|
|
1,205
|
|
|
|
1,051
|
|
Other Operating
Segments(2)
|
|
|
285
|
|
|
|
310
|
|
|
|
219
|
|
Corporate and
Eliminations(3)
|
|
|
(258
|
)
|
|
|
(240
|
)
|
|
|
(213
|
)
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Subtotal
|
|
|
3,934
|
|
|
|
4,114
|
|
|
|
4,074
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Qimonda
|
|
|
2,825
|
|
|
|
3,815
|
|
|
|
3,608
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Infineon Group
|
|
|
6,759
|
|
|
|
7,929
|
|
|
|
7,682
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
(1) |
Includes inter-segment sales of 30 million for fiscal
year ended September 30, 2007, none in fiscal years 2005
and 2006, respectively, from sales of wireless communication
applications to Qimonda.
|
F-67
Infineon
Technologies AG and Subsidiaries
Notes to the Consolidated Financial Statements
|
|
(2)
|
Includes inter-segment sales of 273 million,
256 million and 189 million for fiscal
years ended September 30, 2005, 2006 and 2007,
respectively, from sales of wafers from Infineons
200-millimeter facility in Dresden to Qimonda under foundry
agreements.
|
|
(3)
|
Includes the elimination of inter-segment sales of
273 million, 256 million and
219 million for fiscal years ended September 30,
2005, 2006 and 2007, respectively.
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
2005
|
|
|
2006
|
|
|
2007
|
|
|
|
( in millions)
|
|
|
EBIT:
|
|
|
|
|
|
|
|
|
|
|
|
|
Automotive, Industrial & Multimarket
|
|
|
134
|
|
|
|
246
|
|
|
|
300
|
|
Communication Solutions
|
|
|
(295
|
)
|
|
|
(231
|
)
|
|
|
(160
|
)
|
Other Operating Segments
|
|
|
4
|
|
|
|
4
|
|
|
|
(12
|
)
|
Corporate and Eliminations
|
|
|
(137
|
)
|
|
|
(236
|
)
|
|
|
(177
|
)
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Subtotal
|
|
|
(294
|
)
|
|
|
(217
|
)
|
|
|
(49
|
)
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Qimonda(1)
|
|
|
111
|
|
|
|
202
|
|
|
|
(207
|
)
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Infineon Group
|
|
|
(183
|
)
|
|
|
(15
|
)
|
|
|
(256
|
)
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
(1) |
EBIT results of Qimonda for the period following its IPO are
reported net of minority interest results.
|
|
|
|
|
|
|
|
|
|
|
|
|
|
2005
|
|
2006
|
|
2007
|
|
|
( in millions)
|
|
Depreciation and Amortization:
|
|
|
|
|
|
|
|
|
|
Automotive, Industrial & Multimarket
|
|
|
431
|
|
|
411
|
|
|
401
|
Communication Solutions
|
|
|
309
|
|
|
246
|
|
|
186
|
Other Operating Segments
|
|
|
48
|
|
|
45
|
|
|
22
|
Corporate and Eliminations
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Subtotal
|
|
|
788
|
|
|
702
|
|
|
609
|
|
|
|
|
|
|
|
|
|
|
Qimonda
|
|
|
528
|
|
|
703
|
|
|
667
|
|
|
|
|
|
|
|
|
|
|
Infineon Group
|
|
|
1,316
|
|
|
1,405
|
|
|
1,276
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
2005
|
|
|
2006
|
|
|
2007
|
|
|
( in millions)
|
|
Equity in earnings (losses) of Associated Companies:
|
|
|
|
|
|
|
|
|
|
|
|
Automotive, Industrial & Multimarket
|
|
|
|
|
|
|
|
|
|
|
|
Communication Solutions
|
|
|
4
|
|
|
|
(2
|
)
|
|
|
|
Other Operating Segments
|
|
|
(2
|
)
|
|
|
|
|
|
|
|
Corporate and Eliminations
|
|
|
10
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Subtotal
|
|
|
12
|
|
|
|
(2
|
)
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Qimonda
|
|
|
45
|
|
|
|
80
|
|
|
|
117
|
|
|
|
|
|
|
|
|
|
|
|
|
Infineon Group
|
|
|
57
|
|
|
|
78
|
|
|
|
117
|
|
|
|
|
|
|
|
|
|
|
|
|
F-68
Infineon
Technologies AG and Subsidiaries
Notes to the Consolidated Financial Statements
|
|
|
|
|
|
|
|
|
|
|
|
2005
|
|
2006
|
|
2007
|
|
|
( in millions)
|
|
Inventories:
|
|
|
|
|
|
|
|
|
|
Automotive, Industrial & Multimarket
|
|
|
336
|
|
|
365
|
|
|
402
|
Communication Solutions
|
|
|
201
|
|
|
214
|
|
|
243
|
Other Operating Segments
|
|
|
1
|
|
|
1
|
|
|
(47)
|
Corporate and Eliminations
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Subtotal
|
|
|
538
|
|
|
580
|
|
|
598
|
|
|
|
|
|
|
|
|
|
|
Qimonda
|
|
|
484
|
|
|
622
|
|
|
619
|
|
|
|
|
|
|
|
|
|
|
Infineon Group
|
|
|
1,022
|
|
|
1,202
|
|
|
1,217
|
|
|
|
|
|
|
|
|
|
|
As of September 30, 2005, 2006 and 2007, all inventories
were attributed to the respective operating segment, since they
were under the direct control and responsibility of the
respective operating segment managers.
|
|
|
|
|
|
|
|
|
2006
|
|
2007
|
|
|
( in millions)
|
|
Goodwill:
|
|
|
|
|
|
|
Automotive, Industrial & Multimarket
|
|
|
|
|
|
|
Communication Solutions
|
|
|
22
|
|
|
52
|
Other Operating Segments
|
|
|
6
|
|
|
|
Corporate and Eliminations
|
|
|
1
|
|
|
1
|
|
|
|
|
|
|
|
Subtotal
|
|
|
29
|
|
|
53
|
|
|
|
|
|
|
|
Qimonda
|
|
|
72
|
|
|
64
|
|
|
|
|
|
|
|
Infineon Group
|
|
|
101
|
|
|
117
|
|
|
|
|
|
|
|
Certain items are included in Corporate and Eliminations and are
not allocated to the logic segments, consistent with the
Companys internal management reporting. These include
certain corporate headquarters costs, certain incubator and
early stage technology investment costs, non-recurring gains and
specific strategic technology initiatives. Additionally,
restructuring charges and employee stock-based compensation
expense are included in Corporate and Eliminations and not
allocated to the logic segments for internal or external
reporting purposes, since they arise from corporate directed
decisions not within the direct control of segment management.
Furthermore, legal costs associated with intellectual property
and product matters are recognized by the segments when paid,
which can differ from the period originally recognized by
Corporate and Eliminations. The Company allocates excess
capacity costs based on a foundry model, whereby such
allocations are reduced based upon the lead time of order
cancellation or modification. Any unabsorbed excess capacity
costs are included in Corporate and Eliminations. Significant
components of Corporate and Eliminations EBIT for the
years ended September 30, 2005, 2006 and 2007 are as
follows:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
2005
|
|
|
2006
|
|
|
2007
|
|
|
|
( in millions)
|
|
|
Corporate and Eliminations:
|
|
|
|
|
|
|
|
|
|
|
|
|
Unabsorbed excess capacity costs
|
|
|
(12
|
)
|
|
|
(33
|
)
|
|
|
(7
|
)
|
Restructuring charges (note 9)
|
|
|
(78
|
)
|
|
|
(23
|
)
|
|
|
(45
|
)
|
Stock-based compensation expense
|
|
|
|
|
|
|
(25
|
)
|
|
|
(12
|
)
|
Other,
net(1)
|
|
|
(47
|
)
|
|
|
(155
|
)
|
|
|
(113
|
)
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Total
|
|
|
(137
|
)
|
|
|
(236
|
)
|
|
|
(177
|
)
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
(1) |
Includes aggregate charges of approximately
80 million and 84 million in the 2006 and
2007 fiscal years, respectively, incurred primarily in
connection with the issuance and/or sale of Qimonda ADSs.
|
F-69
Infineon
Technologies AG and Subsidiaries
Notes to the Consolidated Financial Statements
The following is a summary of net sales and of property, plant
and equipment by geographic area for the years ended September
30:
|
|
|
|
|
|
|
|
|
|
|
|
2005
|
|
2006
|
|
2007
|
|
|
( in millions)
|
|
Net sales:
|
|
|
|
|
|
|
|
|
|
Germany
|
|
|
1,354
|
|
|
1,327
|
|
|
1,164
|
Other Europe
|
|
|
1,210
|
|
|
1,360
|
|
|
1,218
|
North America
|
|
|
1,504
|
|
|
2,126
|
|
|
1,887
|
Asia/Pacific
|
|
|
2,223
|
|
|
2,498
|
|
|
2,632
|
Japan
|
|
|
332
|
|
|
461
|
|
|
661
|
Other
|
|
|
136
|
|
|
157
|
|
|
120
|
|
|
|
|
|
|
|
|
|
|
Total
|
|
|
6,759
|
|
|
7,929
|
|
|
7,682
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
2005
|
|
2006
|
|
2007
|
|
|
( in millions)
|
|
Property, plant and equipment:
|
|
|
|
|
|
|
|
|
|
Germany
|
|
|
1,625
|
|
|
1,279
|
|
|
1,067
|
Other Europe
|
|
|
516
|
|
|
638
|
|
|
639
|
North America
|
|
|
1,093
|
|
|
1,105
|
|
|
1,100
|
Asia/Pacific
|
|
|
515
|
|
|
737
|
|
|
838
|
Japan
|
|
|
2
|
|
|
4
|
|
|
3
|
Other
|
|
|
|
|
|
1
|
|
|
|
|
|
|
|
|
|
|
|
|
|
Total
|
|
|
3,751
|
|
|
3,764
|
|
|
3,647
|
|
|
|
|
|
|
|
|
|
|
Revenues from external customers are based on the
customers billing location. Regional employment data is
provided in note 8.
Except for sales to Siemens, which are discussed in
note 31, no single customer accounted for more than
10 percent of the Companys sales during the fiscal
year ended September 30, 2005. Sales to Siemens were made
primarily by the logic segments. No single customer accounted
for more than 10 percent of the Companys sales during
the fiscal years ended September 30, 2006 and 2007.
The Company defines EBIT as earnings (loss) before interest and
taxes. The Companys management uses EBIT, among other
measures, to establish budgets and operational goals, to manage
the Companys business and to evaluate its performance. The
Company reports EBIT information because it believes that it
provides investors with meaningful information about the
operating performance of the Company and especially about the
performance of its separate operating segments. Because many
operating decisions, such as allocations of resources to
individual projects, are made on a basis for which the effects
of financing the overall business and of taxation are of
marginal relevance, management finds a metric that excludes the
effects of interest on financing and tax expense useful. In
addition, in measuring operating performance, particularly for
the purpose of making internal decisions, such as those relating
to personnel matters, it is useful for management to consider a
measure that excludes items over which the individuals being
evaluated have minimal control, such as enterprise-level
taxation and financing.
F-70
Infineon
Technologies AG and Subsidiaries
Notes to the Consolidated Financial Statements
For the fiscal years ended September 30, 2005, 2006 and
2007, EBIT is determined as follows from the consolidated
statements of operations:
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
2005
|
|
|
2006
|
|
|
2007
|
|
|
|
( in millions)
|
|
|
Net loss
|
|
|
(312
|
)
|
|
|
(268
|
)
|
|
|
(368
|
)
|
Adjust: Income tax expense
|
|
|
120
|
|
|
|
161
|
|
|
|
79
|
|
Interest expense, net
|
|
|
9
|
|
|
|
92
|
|
|
|
33
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
EBIT
|
|
|
(183
|
)
|
|
|
(15
|
)
|
|
|
(256
|
)
|
|
|
|
|
|
|
|
|
|
|
|
|
|
On October 2, 2007, Sony Corporation and Qimonda announced
that they had signed an agreement to found the joint venture
Qreatic Design. The scope of the joint venture is the design of
high-performance, low power, embedded and customer specific
DRAMs for consumer and graphic applications. According to the
agreement, the 50:50 joint venture is intended to start with up
to 30 specialists from Sony and Qimonda, bringing together their
engineering expertise for the mutual benefit of both companies.
Qreatic Design, which will be located in Tokyo, Japan, is
planned to start operations by the end of calendar year 2007,
subject to regulatory approvals and other closing conditions,
and to substantially expand its capacities by hiring additional
designers.
On October 8, 2007, Qimonda entered into a rental agreement
for a new headquarters office south of Munich, Germany. The
agreement provides for the construction of a building by a
third-party developer-lessor, and includes a 15 year
non-cancelable lease term, which is expected to start in early
2010. Qimonda has an option to extend the lease for two
5 year periods at similar lease terms to the initial
non-cancelable lease term. The minimum rental payments aggregate
96 million over the initial lease term. The lease
provides for rent escalation in line with market-based increases
in rent. The agreement will be accounted for as an operating
lease with monthly lease payments expensed on a straight-line
basis over the lease term (see note 4).
On October 15, 2007, the court entered an order denying the
motions to dismiss in the Unisys and the DRAM Claims Liquidation
Trust cases with prejudice. On October 29, 2007, the
Company answered the Unisys complaint, denying liability and
asserting a number of affirmative defenses. On November 1,
2007, the Company answered the DRAM Claims Liquidation Trust
complaint, denying liability and asserting a number of
affirmative defenses (see note 35).
On October 24, 2007, the Company completed its acquisition
of the mobility products business of LSI (see note 4).
On October 25, 2007, 1.25 million Qimonda ADSs that
had been borrowed by an affiliate of J.P. Morgan Securities
Inc. in connection with the exchangeable subordinated notes due
2010 described in note 23 were returned to the Company.
On October 31, 2007,
Wi-LAN Inc.
filed suit in the U.S. District Court for the Eastern
District of Texas against Westell Technolgies, Inc. and 16 other
defendants, including the Company and Infineon Technologies
North America Corp. The complaint alleges infringement of 3
U.S. patents by certain wireless products compliant with
the IEEE 802.11 standards and certain ADSL products compliant
with the ITU G.992 standards, in each case supplied by certain
of the defendants.
On November 30, 2007, Qimonda cancelled its agreement with
Infineon for the production of wafers at the Infineon
Technologies Dresden GmbH & Co. OHG production
facility. The agreement will terminate on March 1, 2008
(see note 3).
On November 30, 2007, the Company completed the sale of a
40 percent interest in its subsidiary Bipolar to Siemens
(see note 5).
F-71
SIGNATURES
The registrant hereby certifies that it meets all of the
requirements for filing on
Form 20-F
and has duly caused and authorized the undersigned to sign this
annual report on its behalf.
December 7, 2007
Neubiberg, Germany
Infineon Technologies AG
Dr. Wolfgang Ziebart
Member of the Management Board and
Chief Executive Officer
Peter J. Fischl
Member of the Management Board and
Chief Financial Officer
Exhibit Index
|
|
|
|
|
|
|
|
|
|
|
Exhibit
|
|
|
|
|
|
Exhibit
|
|
Filing Date
|
|
SEC File
|
Number
|
|
Description of Exhibit
|
|
Form
|
|
Number
|
|
with SEC
|
|
Number
|
|
1.1
|
|
Articles of Association (as of November 2007) (English
translation)
|
|
Filed herewith.
|
|
|
|
|
|
|
1.2
|
|
Rules of Procedure for the Management Board (as of November
2007) (English translation)
|
|
Filed herewith
|
|
|
|
|
|
|
1.3
|
|
Rules of Procedure for the Supervisory Board (as of November
2007) (English translation)
|
|
Filed herewith
|
|
|
|
|
|
|
1.4
|
|
Rules of Procedure for the Investment Finance and Audit
Committee of the Supervisory Board (as of November 2007)
(English translation)
|
|
Filed herewith
|
|
|
|
|
|
|
2
|
|
The total amount of long-term debt securities of Infineon
Technologies AG authorized under any instrument does not exceed
10% of the total assets of the group on a consolidated basis.
Infineon Technologies AG hereby agrees to furnish to the SEC,
upon its request, a copy of any instrument defining the rights
of holders of long-term debt of Infineon Technologies AG or of
its subsidiaries for which consolidated or unconsolidated
financial statements are required to be filed.
|
|
|
|
|
|
|
|
|
4.3
|
|
Patent Cross License Agreement between Infineon and Siemens AG,
dated as of February 11, 2000
|
|
F-1
|
|
10.7
|
|
February 18, 2000
|
|
333-11508
|
4.9
|
|
Shareholder Agreement of ALTIS Semiconductor between Infineon
Technologies Holding France and Compagnie IBM France, dated as
of June 24, 1999
|
|
F-1
|
|
10.15
|
|
February 18, 2000
|
|
333-11508
|
4.18
|
|
Joint Venture Agreement between Infineon and Nanya Technology
Corporation, executed on November 13, 2002
|
|
20-F
|
|
4.38
|
|
December 4, 2002
|
|
1-15000
|
4.19
|
|
Amendments No 1, 2 and 3 to the Joint Venture Agreement between
Infineon and Nanya Technology Corporation, executed on
November 13, 2002
|
|
20-F
|
|
4.19
|
|
November 23, 2005
|
|
1-15000 |
4.19.1
|
|
Amendment No. 4 to the Joint Venture Agreement between
Infineon and Nanya Technology Corporation, executed on
November 13, 2002
|
|
|
|
|
|
|
|
|
|
|
|
|
Filed as exhibit 10(i)(I) to the registration statement on
form F-1
of Qimonda AG dated August 8, 2006 (file
333-135913)
and incorporated herein by reference
|
4.20
|
|
Terms and Conditions of 5% Guaranteed Subordinated Convertible
Notes due 2010 in the aggregate nominal amount of EUR
700,000,000 (the 2010 Notes) issued on June 5,
2003 by Infineon Technologies Holding B.V.
|
|
20-F
|
|
4.30
|
|
November 21, 2003
|
|
1-15000
|
4.21
|
|
Undertaking for Granting of Conversion Rights from Infineon to
JPMorgan Chase Bank for the benefit of the holders of the 2010
Notes, dated June 2, 2003
|
|
20-F
|
|
4.31
|
|
November 21, 2003
|
|
1-15000
|
4.22
|
|
Subordinated Guarantee of Infineon, as Guarantor, in favor of
the holders of 2010 Notes, dated June 2, 2002
|
|
20-F
|
|
4.32
|
|
November 21, 2003
|
|
1-15000
|
4.23
|
|
Loan Agreement dated June 2, 2003, between Infineon
Technologies Holding B.V., as Issuer, and Infineon
|
|
20-F
|
|
4.33
|
|
November 21, 2003
|
|
1-15000
|
4.24
|
|
Assignment Agreement dated June 2, 2003, among Infineon
Technologies Holding B.V., Infineon and JPMorgan Chase Bank for
the benefit of the holders of the 2010 Notes
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20-F
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4.34
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November 21, 2003
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1-15000
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4.25
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Amendment 1, dated June 26, 2003, to Shareholder Agreement
of ALTIS Semiconductor between Infineon Technologies Holding
France and Compagnie IBM France, dated as of June 24, 1999
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20-F
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4.35
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November 21, 2003
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1-15000
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4.25.1
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Amendment 2 effective as of December 31, 2005 to
Shareholder Agreement of ALTIS Semiconductor between Infineon
Technologies Holding France and IBM XXI SAS dated as of
June 24, 1999.
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20-F
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4.25.1
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November 30, 2006
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1-15000
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4.25.2
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Framework Agreement dated as of August 8, 2007 among
GlobalInformService, International Business Machines Corporation
and Infineon Technologies AG, related to ALTIS Semiconductor
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Filed herewith
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Exhibit
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Exhibit
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Filing Date
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SEC File
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Number
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Description of Exhibit
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Form
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Number
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with SEC
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Number
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4.26
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Real Estate Leasing Contract between MoTo Object CAMPEON
GmbH & Co. KG and Infineon dated as of
December 23, 2003, with Supplementary Agreements No 1 and 2
(English translation)
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20-F
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4.28
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November 26, 2004
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1-15000
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4.27.1
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Contribution Agreement (Einbringungsvertrag) between
Infineon Technologies AG and Qimonda AG, dated as of
April 25, 2006, and addendum thereto, dated as of
June 2, 2006 (English translation).
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Filed as exhibit 10(i)(A) to the registration statement on
form F-1
of Qimonda AG dated August 8, 2006 (file
333-135913)
and incorporated herein by reference
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4.27.2
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Contribution Agreement (Einbringungsvertrag) between
Infineon Holding B.V. and Qimonda AG, dated as of May 4,
2006 (English translation).
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Filed as exhibit 10(i)(B) to the registration statement on
form F-1
of Qimonda AG dated August 8, 2006 (file
333-135913)
and incorporated herein by reference
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4.27.3
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Addenda No. 2 and 3 to Contribution Agreement
(Einbringungsvertrag) between Infineon Technologies AG
and Qimonda AG, dated as of April 25, 2006 (English
translation).
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Filed as exhibit 4(i)(W) to the annual report on
form 20-F
of Qimonda AG dated November 21, 2006 (file 1-32972) and
incorporated herein by reference
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4.27.5
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Master Loan Agreement between Qimonda AG and Infineon
Technologies Holding B.V., dated April 28, 2006.
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Filed as exhibit 10(i)(D) to the registration statement on
form F-1
of Qimonda AG dated August 8, 2006 (file
333-135913)
and incorporated herein by reference
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4.27.6
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Global Services Agreement between Infineon Technologies AG and
Qimonda AG, effective May 1, 2006.
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Filed as exhibit 10(i)(E) to the registration statement on
form F-1
of Qimonda AG dated August 8, 2006 (file
333-135913)
and incorporated herein by reference
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4.27.7
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Master IT Cost Sharing Agreement by and between Infineon
Technologies AG and Qimonda AG, effective May 1, 2006
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Filed as exhibit 10(i)(Q) to the registration statement on
form F-1
of Qimonda AG dated August 8, 2006 (file
333-135913)
and incorporated herein by reference
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4.28.1
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Terms and Conditions of the 1.375% Guaranteed Subordinated Notes
due 2010 in the aggregate nominal amount of EUR 215,000,000 (the
2007/2010 Notes) issued by Infineon Technologies
Investment B.V., on September 26, 2007
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Filed herewith.
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4.28.2
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Subordinated Guarantee by Infineon Technologies AG in Favor of
the Holders of the 2007/2010 Notes
|
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Filed herewith.
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4.29
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Asset Purchase Agreement by and between LSI Corporation and
Infineon Technologies AG dated as of August 20, 2007
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Filed as exhibit 2.1 to the current report on
form 8-K
of LSI Corporation dated October 24, 2007 (file 1-10317)
and incorporated herein by reference. Infineon Technologies AG
agrees to furnish supplementally a copy of any omitted schedule
to the Securities and Exchange Commission upon request.
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8
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List of Significant Subsidiaries and Associated Companies of
Infineon
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See Additional Information Organizational
Structure
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12.1
|
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Certification of chief executive officer pursuant to Exchange
Act
Rule 13a-14(a)
|
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Filed herewith.
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12.2
|
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Certification of chief financial officer pursuant to Exchange
Act
Rule 13a-14(a)
|
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Filed herewith.
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13
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Certificate pursuant to 18 U.S.C. section 1350, as
adopted pursuant to section 906 of the Sarbanes-Oxley Act
of 2002
|
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Filed herewith.
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14.1
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Consent of KPMG Deutsche Treuhand-Gesellschaft AG
|
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Filed herewith
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Confidential treatment requested as
to certain portions, which portions have been filed separately
with the Securities and Exchange Commission
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